JP2022175449A - Mounting system, mounting method, and correction system - Google Patents

Abstract

To inhibit occurrence of an interference between a first component and a second component.SOLUTION: A mounting system 1 comprises: a mounting head 2; an imaging apparatus; a determination device 51; a correction device 24; a driving device; and a control apparatus 5. The mounting head 2 includes a capture part 21 that can capture a first component 81 so as to be movable toward an object 9, and mounts the first component 81 to a mounting scheduled position P1 on a mounting surface 911 of the object 9. The imaging apparatus images the object 9 on which a second component has been mounted. The determination device 51 can execute a determination processing for determining whether or not the first component 81 is interfered with the second component on the basis of an imaging result of the imaging apparatus. The correction device 24 can execute a correction processing for moving the second component. The control apparatus 5 moves, by the correction device 24, the second component which is determined, by the determination device 51, to be interfered with the first component 81.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present disclosure relates generally to mounting systems, mounting methods, and remedial systems, and more particularly to mounting systems, mounting methods, and remedial systems for mounting components on mounting surfaces of objects.

Patent Literature 1 describes an electronic component mounting apparatus (mounting system) including a component holding device and a control device.

The component holding device (mounting head) has an imaging device that captures an image of a planned mounting area including a position where the electronic component (first component) is to be mounted on the circuit board (object). The control device determines whether or not an adjacent electronic component (second component) enters the mounting planned area based on the imaging result of the imaging device. When the control device determines that the adjacent electronic component has entered the planned mounting area, it corrects the planned mounting position, and mounts the electronic component held by the component holding device at the corrected planned mounting position.

Japanese Patent Application Laid-Open No. 2002-076693

In the electronic component mounting apparatus described in Patent Literature 1, for example, when there is a mounting deviation in the adjacent electronic component, even if the planned mounting position of the electronic component held by the component holding device is corrected, the electronic component and the adjacent electronic component are not aligned. Parts may interfere.

An object of the present disclosure is to provide a mounting system, a mounting method, and a correction system capable of suppressing interference between a first component and a second component.

A mounting system according to one aspect of the present disclosure includes a mounting head, an imaging device, a determination device, a correction device, a driving device, and a control device. The mounting head movably has a capturing part capable of capturing the first component toward the object, and mounts the first component at a planned mounting position on the mounting surface of the object. The imaging device images the object on which the second component is already mounted. The determination device can execute determination processing for determining whether or not the first component interferes with the second component based on the imaging result of the imaging device. The correction device can perform a correction process of moving the second part. The driving device drives the correction device. The control device controls the driving device so that the correction device can perform the correction processing. The control device causes the correction device to move the second component determined by the determination device to interfere with the first component.

A mounting method according to an aspect of the present disclosure is a mounting method used in a mounting system. The mounting system includes a mounting head, an imaging device, a determination device, a correction device, a driving device, and a control device. The mounting head movably has a capturing part capable of capturing the first component toward the object, and mounts the first component at a planned mounting position on the mounting surface of the object. The imaging device images the object on which the second component is already mounted. The determination device can execute determination processing for determining whether or not the first component interferes with the second component based on the imaging result of the imaging device. The correction device can perform a correction process of moving the second part. The driving device drives the correction device. The control device controls the driving device so that the correction device can perform the correction processing. The implementation method has a control step. The control step is a step of moving the second component determined by the determining device to interfere with the first component by the correcting device.

A correction system according to one aspect of the present disclosure includes a correction device, a drive device, and a control device. When the first component to be mounted at the planned mounting position on the mounting surface of the object interferes with the second component already mounted on the mounting surface of the object, the correction device corrects the second component. Correction processing can be performed to move the part. The driving device drives the correction device. The control device controls the driving device so that the correction device can perform the correction processing.

According to the mounting system, mounting method, and correction system according to one aspect of the present disclosure, it is possible to suppress interference between the first component and the second component.

FIG. 1 is a schematic configuration diagram of a mounting system according to an embodiment. FIG. 2 is a perspective view of a main part of the mounting system same as the above. FIG. 3 is a block diagram of the mounting system same as the above. FIG. 4 is a perspective view of components to be mounted on an object in the same mounting system. FIG. 5 is a side view for explaining mounting of a component on an object in the mounting system; FIG. 6 is a side view for explaining mounting of a component on an object in the mounting system; FIG. 7 is a flowchart showing a mounting method executed by the mounting system; FIG. 8 is a side view for explaining correction processing of the mounting system; FIG. 9 is a side view for explaining correction processing of the mounting system; FIG. 10 is a side view for explaining correction processing of the mounting system; FIG. 11 is a side view for explaining correction processing of the mounting system; FIG. 12 is a side view for explaining correction processing of the mounting system; FIG. 13 is a side view for explaining correction processing of the mounting system; FIG. 14 is a side view for explaining correction processing of the mounting system; 15 is a side view of a main part of a mounting system according to Modification 1 of the embodiment; FIG. 16A to 16C are plan views for explaining correction processing of the mounting system according to Modification 2 of the embodiment.

(embodiment)
Hereinafter, a mounting system, a mounting method, and a correction system according to embodiments will be described with reference to the drawings. Each drawing described in the following embodiments is a schematic drawing, and the ratio of the size and thickness of each component does not necessarily reflect the actual dimensional ratio. Also, the configurations described in the following embodiments are merely examples of the present disclosure. The present disclosure is not limited to the following embodiments, and various modifications can be made according to design and the like as long as the effects of the present disclosure can be achieved.

(1) Overview of Mounting System An overview of the mounting system 1 according to this embodiment will be described below.

A mounting system 1 according to the present embodiment is a mounting apparatus (mounting machine) for mounting a first component 81 on an object 9, as shown in FIG. The mounting system 1 is used, for example, in facilities such as factories, research institutes, offices, and educational facilities for manufacturing various products such as electronic devices, automobiles, clothing, foods, medicines, and handicrafts. be done.

In this embodiment, a case where the mounting system 1 is used for manufacturing electronic devices in a factory will be described. A typical electronic device has various circuit blocks such as a power supply circuit and a control circuit. In manufacturing these circuit blocks, for example, a solder application process, a mounting process, and a soldering process are performed in this order. In the solder application process, cream solder is applied (or printed) on a board (including a printed wiring board). In the mounting process, components (including electronic components) are mounted (mounted) on the board. In the soldering process, for example, the board on which the components are mounted is heated in a reflow oven to melt creamy solder for soldering. In the mounting process, the mounting system 1 mounts the first component 81 on the substrate 91 that is the object 9 .

As shown in FIG. 1, the mounting system 1 used for mounting the first component 81 on the object 9 (board 91) includes the mounting head 2, the imaging device 3 (see FIG. 2), and the determination unit. A device 51 , a correction device 24 , a drive device 4 , a control device 5 , a base 61 , a conveying device 62 , a plurality of component supply devices 63 , and a fixed camera 7 are provided. The transport device 62 has a pair of conveyor mechanisms 62a extending in the X-axis direction on the base 61, transports the substrate 91, which is the object 9, in the X-axis direction and positions it in a predetermined mounting space. A plurality of component supply devices 63 have tape feeders mounted side by side in the X-axis direction on a feeder base 65 of a carriage 64 connected to the base 61 . Each component supply device 63 pitch-feeds the carrier tape 67 supplied from the reel 66, and supplies the first component 81 held on the carrier tape 67 to the component supply port 63a. A reel 66 is held by a carriage 64 . The fixed camera 7 is mounted on the base 61 and images the upper side.

The mounting head 2 has a catching portion 21 for catching the first component 81 . The capturing unit 21 is, for example, a suction nozzle, and captures (holds) the first component 81 in a release (that is, release of capture) state. The mounting system 1 mounts the first component 81 on the mounting surface 911 of the substrate 91 by lowering the capturing portion 21 closer to the substrate 91 while capturing the first component 81 with the capturing portion 21 .

In the field of mounting components using the mounting system 1 described above, particularly in the field of sandwich mounting of electronic components, in recent years, as electronic components have become smaller and more dense, there has been a demand for improving the yield rate of the substrate 91. It is A specific example of the first component 81 is an electronic component having a width of 0.1 mm and a length of 0.2 mm in plan view.

Therefore, in the mounting system 1 , the mounting head 2 has the capturing part 21 capable of capturing the first component 81 so as to be movable toward the object 9 (substrate 91 ), and the first component 81 is mounted on the object 9 . It is mounted at the planned mounting position P1 (see FIG. 2) on the surface 911 . The imaging device 3 images the object 9 on which the second component 82 is already mounted. The determination device 51 can execute determination processing for determining whether or not the first component 81 interferes with the second component 82 based on the imaging result of the imaging device 3 . The correction device 24 can perform correction processing to move the second component 82 . A driving device (actuator 22 , driving device 4 ) drives the correction device 24 . The control device 5 controls the driving device so that the correction device 24 can perform correction processing. Then, the control device 5 causes the correction device 24 to move the second component 82 determined by the determination device 51 to interfere with the first component 81 . The first component 81 is, for example, an electronic component to be mounted on the mounting surface 911 of the substrate 91 as the object 9 . In other words, the first component 81 is an electronic component captured by the capturing portion 21 of the mounting head 2 in order to be mounted on the mounting surface 911 of the substrate 91 . Also, the second component 82 is, for example, an electronic component already mounted on the mounting surface 911 of the substrate 91 .

In such a mounting system 1 , the correcting device 24 moves the mounted second component 82 that is determined to interfere with the first component 81 by the determining device 51 . This makes it possible to suppress interference between the first component 81 and the second component 82 when the first component 81 is mounted. As a result, it becomes possible to reduce the defective rate of the target object 9 on which the first component 81 is mounted, and to improve the yield rate of the target object 9 .

Also, in recent years, there is a demand for coping with even narrower pitch adjacent mounting. For example, as shown in FIG. 4, on the mounting surface 911 of the substrate 91 on which at least one (four in the illustrated example) mounted components (the second component 82 and the third component 83) are already mounted, the first A component 81 may be mounted. At this time, it is required to mount the first component 81 on the mounting surface 911 of the substrate 91 without interfering with the second component 82 . Therefore, conventionally, according to individual dimensional variations of the substrate 91 (accuracy related to the manufacturing of the substrate 91, expansion and contraction due to heat and moisture, etc.) and displacement of the capturing position of the first component 81 by the capturing unit 21, the first The planned mounting position of the component 81 was corrected. However, with the conventional method of correcting the mounting accuracy and the planned mounting position, it becomes difficult to deal with narrow adjacent mounting that satisfies the conditions demanded by the market in the future.

In FIG. 4, second components 821 and 822 are already mounted as mounted components on the mounting surface 911 of the substrate 91 side by side in the Y-axis direction. 822. Each of the first component 81 and the second components 821 and 822 is mounted by solder 93 applied on lands 92 formed on the mounting surface 911 of the substrate 91 at regular intervals along the Y-axis direction. The solder 93 corresponds to a joining member that joins the first component 81 , the second component 82 and the third component 83 to the board 91 .

5 and 6 are side views of the second component 822 and the first component 81, which are mounted components, viewed from the X-axis direction. In the present embodiment, the adjacent pitch Yp in the Y-axis direction preset for the first component 81 and the second component 82 is set to 40 μm. As for the dimensional tolerances of the first part 81 and the second part 82 in the Y-axis direction, the one-side tolerance Yt is +5 μm and the both-side tolerance is ±10 μm. Also, let Yg1 be the dimension (gap dimension) of the gap G1 in the Y-axis direction formed between the first part 81 and the second part 82 .

Ideally, each of the mounted components such as the first component 81, the second component 82 and the third component 83 is placed at a reference position where the center of the land 92 in the Y-axis direction coincides with the center of the mounted component in the Y-axis direction. Preferably implemented. However, due to mechanical accuracy, software processing accuracy, and the like, the mounting position of the mounted component may deviate from the reference position, that is, so-called mounting deviation. Hereinafter, the maximum value (absolute value) of the mounting deviation caused by such mechanical precision and software processing precision will be referred to as a mounting deviation value Ym (see FIG. 6). If the deviation between the actual mounting position of the mounted component and the reference position is equal to or less than a predetermined value, it may be considered that there is no mounting deviation. In this embodiment, the mounting deviation value Ym is set to 20 μm.

In FIG. 5, the Y-axis dimension of the first component 81 includes the one-sided tolerance Yt, and the Y-axis dimension of the second component 822 also includes the one-sided tolerance Yt. Also, there is no mounting deviation between the first component 81 and the second component 822 . In this case, the gap dimension Yg1 is "Yg1=Yp−2·Yt=30 μm", and the first component 81 does not interfere with the second component 822. FIG.

In FIG. 6, the first component 81 and the second component 822 each have a mounting deviation of a mounting deviation value Ym (=20 μm) toward each other in the Y-axis direction. In this case, the gap dimension Yg1 corresponds to the dimension in which the first part 81 and the second part 822 overlap each other. One part 81 interferes with the second part 822 .

Therefore, the mounting system 1 grasps the position of the second component 82 adjacent to the first component 81 during narrow adjacent mounting, and controls the interference between the first component 81 and the second component 82 to suppress interference between the first component 81 and the second component 82 . The second component 82 is moved by the correction device 24 in the direction to eliminate the interference with the first component 81 .

Here, the state where "the first part 81 interferes with the second part 822" is not limited to the state where the first part 81 and the second part 822 overlap each other as shown in FIG. The state of "the first part 81 interferes with the second part 822" is, for example, even if the first part 81 and the second part 822 do not overlap each other, the gap dimension Yg1 is equal to or less than a predetermined dimension (threshold value). including the state where That is, the determination device 51, which will be described later, determines the difference between the first component 81 when the first component 81 is mounted at the planned mounting position P1 and the second component 82 mounted adjacent to the planned mounting position P1. It is determined that the first component 81 interferes with the second component 82 when the dimension of the gap G1 (gap dimension) Yg1 is equal to or less than the threshold. If the gap dimension Yg1 is equal to or smaller than a predetermined dimension, the mounting system 1 determines that the possibility of interference is high, and suppresses the interference with the first component 81 and the second component 82. The second part 82 is moved by the correcting device 24 in the direction to cancel.

(2) Details (2.1) Premises In this embodiment, as an example, a case where the mounting system 1 is used for mounting a component (first component 81) by surface mounting technology (SMT) will be described. That is, the first component 81 is a component for surface mounting (SMD: Surface Mount Device), and is mounted by being arranged on the surface (mounting surface 911) of the substrate 91 as the object 9. FIG. However, the mounting system 1 is not limited to this example, and may be used for mounting the first component 81 by an insertion mount technology (IMT). In this case, the first component 81 is a component for insertion mounting having lead terminals. It is mounted on the mounting surface 911).

The “imaging optical axis” referred to in the present disclosure is an optical axis of an image captured by the imaging device 3 (captured image of the imaging device 3), and is an imaging element 31 (see FIG. 3) of the imaging device 3 described later and It is the optical axis defined by both the optical system 32 (see FIG. 3). In other words, a straight line connecting the center of the light receiving surface of the image pickup device 31 and a portion where an image is formed on the center of the light receiving surface of the image pickup device 31 through the optical system 32 is the imaging optical axis of the image pickup device 3 .

The “imaging result” referred to in the present disclosure is an image captured by the imaging device 3 and includes still images (still images) and moving images (moving images). Furthermore, "moving image" includes captured images composed of a plurality of still images obtained by frame-by-frame shooting or the like. The captured image of the imaging device 3 may not be the data output from the imaging device 3 itself. For example, the captured image of the imaging device 3 can be appropriately compressed, converted to another data format, processed to cut out a part of the captured image of the imaging device 3, adjusted in focus, adjusted in brightness, or adjusted in contrast as necessary. etc. processing may be applied. In this embodiment, as an example, the image captured by the imaging device 3 is a full-color moving image.

"Orthogonal" as used in the present disclosure refers not only to the state in which the angle between the two is strictly 90 degrees, but also to the state in which the angle between the two is substantially perpendicular within the tolerance range where the effect is substantially obtained. It means to include. Similarly, the “parallel” in the present disclosure is not limited to the state where the angle between the two is strictly 0 degrees, but the angle between the two is within the tolerance range where the effect can be substantially obtained. It is meant to include substantially parallel states.

In addition, “to move the second component 82 ” as used in the present disclosure refers to the case where the second component 82 captured by the capturing unit 21 is once removed from the mounting surface 911 of the board 91 and then remounted, and the case where the second component 82 captured by the capturing unit 21 is mounted again When the second component 82 is horizontally moved along the mounting surface 911 of the substrate 91 , and when the second component 82 is horizontally moved along the mounting surface 911 of the substrate 91 while in contact with the side surface of the second component 82 . and including.

In the following, as an example, three axes, the X-axis, the Y-axis, and the Z-axis, which are orthogonal to each other, are set, and the axes parallel to the surface (mounting surface 911) of the substrate 91, which is the object 9, are the "X-axis" and the "Y-axis. ”, and the axis parallel to the thickness direction of the substrate 91 is the “Z” axis. Furthermore, one of the two directions along the Z-axis is the upward direction, and the other direction is the downward direction. For example, the substrate 91 is positioned below the capturing portion 21 when the capturing portion 21 faces the mounting surface 911 of the substrate 91 . The X-axis, Y-axis and Z-axis are all imaginary axes, and the arrows indicating "X", "Y" and "Z" in the drawings are for illustration purposes only. neither is material. Moreover, these directions are not meant to limit the directions during use of the mounting system 1 .

Also, the mounting system 1 is connected to a pipe for circulating cooling water, a cable for power supply, a pipe for supplying air pressure (including positive pressure and vacuum), and the like. Illustrations are omitted as appropriate.

(2.2) Configuration of Mounting System Next, each component of the mounting system 1 according to the present embodiment will be described with reference to FIGS. 1 to 3. FIG.

A mounting system 1 according to the present embodiment includes a mounting head 2, an imaging device 3, a driving device 4, and a control device 5, as shown in FIGS. Further, in this embodiment, as shown in FIG. 3, the mounting system 1 includes the mounting head 2, the imaging device 3, the driving device 4, and the control device 5, as well as the conveying device 62, the component supply device 63, and the fixing device. a camera 7; However, the transport device 62 , the component supply device 63 and the fixed camera 7 are not essential components of the mounting system 1 . That is, all or part of the conveying device 62 , the component supply device 63 and the fixed camera 7 may not be included in the components of the mounting system 1 . Moreover, in FIG. 2, only the mounting head 2, the imaging device 3, and the driving device 4 are illustrated, and the other configuration of the mounting system 1 is omitted as appropriate.

(2.2.1) Mounting Head The mounting head 2 has at least one catching portion 21 . In this embodiment, the mounting head 2 has one catching portion 21 . The mounting head 2 moves the capturing portion 21 closer to the substrate 91 while capturing the first component 81 with the capturing portion 21 , and mounts the first component 81 on the mounting surface 911 of the substrate 91 . In other words, the mounting head 2 holds the capture section 21 movably toward the substrate 91 . In short, the mounting head 2 has the catching portion 21 capable of catching the first component 81 movably toward the object 9, and the first component 81 is placed at the planned mounting position P1 ( (see Figure 2).

In this embodiment, the mounting head 2 includes, in addition to the catching section 21, the correcting device 24, the actuator 22 (see FIG. 3) for moving the catching section 21 and the correcting device 24, the catching section 21, the actuator 22 and the and a head body 23 that holds the correction device 24 . That is, the correction device 24 is provided on the mounting head 2 . In the mounting system 1 according to this embodiment, one head body 23 holds one catching portion 21 , one actuator 22 and one correction device 24 .

The capture unit 21 is, for example, a suction nozzle. The catching unit 21 is controlled by the control device 5 and can switch between a catching state of catching (holding) the first component 81 and a released state of releasing (releasing the catching) of the first component 81 . However, the catching unit 21 is not limited to the suction nozzle, and may be configured to catch (hold) the first component 81 by pinching (picking) the first component 81, for example, like a robot hand.

Regarding the capturing of the first component 81 by the capturing unit 21 , the mounting head 2 operates by being supplied with air pressure (vacuum) as power. In other words, the mounting head 2 switches between the captured state and the released state of the capturing section 21 by opening and closing a valve on a pneumatic (vacuum) supply path connected to the capturing section 21 .

The actuator 22 linearly moves the catching part 21 and the correction device 24 in the Z-axis direction. Further, the actuator 22 rotates the catching part 21 and the correcting device 24 in a rotational direction (hereinafter referred to as "the θ direction") about an axis along the Z-axis direction. In this embodiment, as an example, the actuator 22 is driven by a driving force generated by a linear motor to move the catching part 21 and the correction device 24 in the Z-axis direction. Regarding the movement of the catching part 21 and the correction device 24 in the θ direction, the actuator 22 is driven by a driving force generated by a rotary motor. On the other hand, the mounting head 2 is linearly moved in the X-axis direction and the Y-axis direction by the driving device 4, as will be described later. As a result, the catching part 21 and the correction device 24 included in the mounting head 2 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction and the θ direction by the driving device 4 and the actuator 22 . In the present embodiment, (the actuator 22 of) the mounting head 2 and the driving device 4 constitute a driving device for driving the correction device 24 .

As an example, the head body 23 is made of metal and has a rectangular parallelepiped shape elongated in the X-axis direction. The head body 23 holds the capturing portion 21 , the actuator 22 and the correcting device 24 by assembling the capturing portion 21 , the actuator 22 and the correcting device 24 to the head body 23 . In this embodiment, the catching portion 21 is indirectly held by the head body 23 via the actuator 22 in a state in which it can move in the Z-axis direction and the θ direction. Further, in this embodiment, the correction device 24 is indirectly held by the head body 23 via the actuator 22 in a state in which it can move in the Z-axis direction and the θ direction. The mounting head 2 moves within the XY plane as the head body 23 is moved within the XY plane by the driving device 4 .

The correction device 24 has a contact member 241 as shown in FIG. The contact member 241 is formed in the shape of an elongated round bar along the Z-axis direction. In FIG. 9, the tip portion of the contact member 241 has a tapered shape such that the diameter becomes smaller as it approaches the tip (lower end). The contact member 241 does not have to have a tapered tip as long as it has a size (diameter) that allows it to be inserted between the two second parts 821 and 822 arranged in the Y-axis direction. Moreover, the contact member 241 is not limited to a round bar shape, and may be, for example, a square bar shape or a plate shape. As described above, the correction device 24 is linearly movable in the Z-axis direction and rotatable in the θ direction by the actuator 22 .

The correction device 24 can perform main correction processing and secondary correction processing. The main correction process is a process of moving the second component 82 in a direction to eliminate interference with the first component 81 so that the first component 81 can be mounted on the planned mounting position P1 (see FIG. 2). . The secondary correction process is a process of moving the third part 83 in a direction to eliminate interference with the second part 82 so that the second part 82 does not interfere with the third part 83 when the second part 82 is moved. is. The third component 83 is the same mounted component as the second component 82, and is mounted on the opposite side of the second component 82 from the planned mounting position P1 in the Y-axis direction (see FIG. 4). In FIG. 4 , a third component 831 is mounted on one of the plurality of second components 821 and 822 on the side opposite to the planned mounting position P1 with respect to one second component 821 , and the other second component 822 has On the other hand, the third component 832 is mounted on the side opposite to the planned mounting position P1 side. In this embodiment, the main correction process corresponds to the correction process of moving the second component 82 . In this way, the correction device 24 can perform the correction process of moving the second component 82 .

According to the above-described configuration, the mounting head 2 moves the catching portion 21 closer to the substrate 91 while catching the first component 81 with the catching portion 21 . 911 can be implemented. That is, the mounting head 2 moves the catching portion 21 at least between a lower limit position closer to the substrate 91 and an upper limit position farther from the substrate 91 than the lower limit position. In short, the mounting head 2 mounts the first component 81 on the mounting surface 911 of the substrate 91 by moving the capturing portion 21 that captures the first component 81 from the upper limit position to the lower limit position.

Further, the mounting head 2 can horizontally move the second component 82 and the third component 83 already mounted on the mounting surface 911 of the substrate 91 along the mounting surface 911 of the substrate 91 by the correction device 24 . It becomes possible. More specifically, the mounting head 2 horizontally moves the correction device 24 along the mounting surface 911 of the substrate 91 while the contact member 241 of the correction device 24 is in contact with the side surface of the second component 82 . Thus, it becomes possible to move the second component 82 along the mounting surface 911 of the substrate 91 . Thereby, it is possible to move the second part 82 in the direction to eliminate the interference with the first part 81 . In addition, the mounting head 2 horizontally moves the correction device 24 along the mounting surface 911 of the substrate 91 while keeping the contact member 241 of the correction device 24 in contact with the side surface of the third component 83 . It is possible to move the third component 83 along the mounting surface 911 of 91 . Thereby, it is possible to move the third part 83 in the direction to eliminate the interference with the second part 82 .

(2.2.2) Imaging Device In this embodiment, the mounting system 1 includes a plurality of (two in the illustrated example) imaging devices 3 . Hereinafter, when distinguishing the plurality of imaging devices 3, one of the plurality of imaging devices 3 is referred to as "first imaging device 3A" and the other is referred to as "second imaging device 3B".

A plurality of imaging devices 3 are provided on the mounting head 2 as shown in FIG. Each imaging device 3 has an imaging element 31 and an optical system 32 . Each imaging device 3 is, for example, a video camera that captures moving images. In the present embodiment, as shown in FIG. 8 , the plurality of imaging devices 3 includes a region of the mounting surface 911 of the substrate 91 that faces the trapping portion 21 in the moving direction of the trapping portion 21 (direction approaching the substrate 91). The imaging region R1 is imaged. In short, the plurality of imaging devices 3 images the object 9 (board 91) on which the second component 82 is already mounted. The images captured by the plurality of imaging devices 3 include the planned mounting position P1 of the first component 81, the second components 821 and 822, and the third components 831 and 832. FIG.

The imaging device 31 is, for example, an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor). The imaging device 31 converts the image formed on the light receiving surface into an electrical signal and outputs the electrical signal.

Optical system 32 includes one or more lenses, mirrors, and the like. As an example in this embodiment, the optical system 32 is implemented by a combination of a plurality of lenses (lens group). The optical system 32 forms an image on the light receiving surface of the image sensor 31 from the light from the imaging region R1 as shown in FIG. Note that the optical system 32 is not limited to the configuration described above.

The plurality of imaging devices 3 are fixed to the mounting head 2 by being held by the head body 23 of the mounting head 2 . In this embodiment, the plurality of imaging devices 3 are held by the head body 23 by being fixed to the lower surface of the head body 23 , that is, the surface of the head body 23 facing the substrate 91 . Also, the capture unit 21 is arranged on the lower surface of the head body 23, and the capture unit 21 and the plurality of imaging devices 3 are arranged side by side in the X-axis direction. More specifically, the plurality of imaging devices 3 are arranged on both sides of the capturing section 21 in the X-axis direction.

As shown in FIGS. 8 to 14, the first imaging device 3A has an imaging optical axis Ax1 that is parallel to the vertical line (straight line along the Z-axis) of the mounting surface 911 of the substrate 91. FIG. 8 to 14, the second imaging device 3B has an imaging optical axis Ax2 that is parallel to the vertical line (straight line along the Z-axis) of the mounting surface 911 of the substrate 91. FIG. That is, the first imaging device 3A is fixed to the head body 23 in such a posture that its imaging optical axis Ax1 is parallel to the perpendicular to the mounting surface 911. As shown in FIG. The second imaging device 3B is fixed to the head body 23 in such a posture that its imaging optical axis Ax2 is parallel to the perpendicular to the mounting surface 911. As shown in FIG. As a result, the first imaging device 3A and the second imaging device 3B include an area facing the catching section 21 in the moving direction of the catching section 21 in a state where the catching section 21 is positioned above the planned mounting position P1. An imaging region R1 can be imaged.

Moreover, it is preferable that the plurality of imaging devices 3, when positioned above the substrate 91, capture an image of the entire substrate 91 separately from the imaging region R1. In this case, the control device 5 can correct the planned mounting position P1 based on the dimensional variation of the board 91 using the entire image of the board 91 . Also, the entire image of the substrate 91 may be captured by a camera other than the imaging device 3 .

(2.2.3) Driving Device The driving device 4 is a device that moves the mounting head 2 . In this embodiment, the driving device 4 moves the mounting head 2 within the XY plane. The “XY plane” referred to here is a plane including the X-axis and the Y-axis and perpendicular to the Z-axis. In other words, the driving device 4 moves the mounting head 2 in the X-axis direction and the Y-axis direction. In this embodiment, since the multiple imaging devices 3 are fixed to the mounting head 2 , the driving device 4 also moves the multiple imaging devices 3 together with the mounting head 2 in the X-axis direction and the Y-axis direction. In other words, the driving device 4 moves the mounting head 2 and the plurality of imaging devices 3 within the XY plane. In FIG. 1, the mounting head 2 and the plurality of imaging devices 3 are positioned above the component supply port 63a of the component supply device 63 and above the substrate 91 positioned in the mounting space of the transport device 62 by the driving device 4. move between

Specifically, the driving device 4 has an X-axis driving section 41 and a Y-axis driving section 42, as shown in FIG. The X-axis drive unit 41 moves the mounting head 2 straight in the X-axis direction. The Y-axis driving section 42 moves the mounting head 2 straight in the Y-axis direction. The Y-axis drive unit 42 moves the mounting head 2 along the Y-axis together with the X-axis drive unit 41, thereby linearly moving the mounting head 2 in the Y-axis direction. In this embodiment, as an example, each of the X-axis driving section 41 and the Y-axis driving section 42 includes a linear motor, and moves the mounting head 2 by driving force generated by the linear motor upon receiving power supply.

Here, the mounting head 2 has the correction device 24 as described above. Therefore, the drive device 4 is also a drive device that drives the correction device 24 .

(2.2.4) Control Device The control device 5 controls each part of the mounting system 1 . Controller 5 may be implemented by a computer system having one or more processors and one or more memories. That is, one or more processors execute programs recorded in one or more memories of the computer system, thereby functioning as the control device 5 (including the determination device 51). Although the program is pre-recorded in the memory of the control device 5 here, it may be provided through an electric communication line such as the Internet, or may be provided by being recorded in a non-temporary recording medium such as a memory card.

The control device 5 is electrically connected to each of the mounting head 2, the plurality of imaging devices 3, the driving device 4, the component supply device 63, the conveying device 62, and the fixed camera 7, for example. The control device 5 outputs a control signal to the mounting head 2 and the driving device 4 to cause the mounting head 2 and the driving device 4 to mount the first component 81 captured by the capturing section 21 on the mounting surface 911 of the substrate 91 . to control. Further, the control device 5 outputs control signals to the mounting head 2 and the driving device 4, and controls the mounting head 2 and the driving device 4 so that the correction device 24 can perform correction processing. In short, in this embodiment, the mounting head 2 and the driving device 4 constitute a driving device for driving the correcting device 24 . Further, the control device 5 outputs control signals to the plurality of image pickup devices 3 and the fixed cameras 7 to control the plurality of image pickup devices 3 and the fixed cameras 7 and to The captured image is obtained from each of the plurality of imaging devices 3 and fixed cameras 7 .

The control device 5 has a determination device 51 as shown in FIGS. The determination device 51 can execute determination processing for determining whether or not the first component 81 interferes with the second component 82 based on the imaging results of the plurality of imaging devices 3 . The determination process includes a first determination process and a second determination process. The first determination process is a process of determining whether or not the first component 81 can be mounted at the planned mounting position P1 (see first determination step S5 in FIG. 7). The second determination process is a process of determining whether or not the second component 82 can be moved when it is determined in the first determination process that the first component 81 cannot be mounted (see second determination step S7 in FIG. 7). ).

The determination device 51 executes first determination processing and second determination processing (determination processing) based on the imaging results of the plurality of imaging devices 3 . More specifically, in the first determination process, the determination device 51 determines the position information of the planned mounting position P1 on the mounting surface 911 of the substrate 91 and the position information of the second component 82 based on the imaging results of the plurality of imaging devices 3. , and based on this information, the dimension Ys1 between the planned mounting position P1 and the end surface of the second component 821 on the side of the planned mounting position P1, and the planned mounting position P1 and the planned mounting position P1 of the second component 822 A dimension Ys2 between the side end face is measured (see FIG. 8). Then, the determination device 51 determines that the first part 81 does not interfere with the second part 821 if the dimension Ys1 is equal to or greater than the reference value, and if the dimension Ys1 is less than the reference value, the first part 81 interferes with the second part 821. determined to interfere. If the dimension Ys2 is equal to or greater than the reference value, the determination device 51 determines that the first component 81 does not interfere with the second component 822. If the dimension Ys2 is less than the reference value, the first component 81 interferes with the second component 822. determined to interfere. In addition, even if the first component 81 does not contact the second component 82 (does not overlap in plan view), the determination device 51 determines the first component 81 when the first component 81 is mounted at the planned mounting position P1. If the dimension Yg1 (see FIG. 5) of the gap G1 (see FIG. 5) between and the second part 82 is equal to or smaller than the threshold, it is determined that the first part 81 interferes with the second part 82 . When the determination device 51 determines that the first component 81 interferes with the second component 82 , the control device 5 calculates the amount of movement of the second component 82 . Then, the correction device 24 moves the second component 82 by the amount of movement calculated by the control device 5 in the main correction process.

Further, in the second determination process, the determination device 51 further acquires the position information of the third component 83 on the mounting surface 911 of the board 91 based on the imaging results of the plurality of imaging devices 3, and determines the position of the second component 82. Based on the information and the position information of the third part 83, the dimension of the gap between the second part 82 and the third part 83 is measured. Then, the determination device 51 compares the movement amount of the second component 82 calculated by the control device 5 with the clearance dimension, and if the movement distance of the second component 82 is larger than the clearance dimension, the second component 82 interferes with the third part 83 , and if smaller, it is determined that the second part 82 does not interfere with the third part 83 . When the determination device 51 determines that the second component 82 interferes with the third component 83 , the control device 5 calculates the amount of movement of the third component 83 . Then, the correction device 24 moves the third component 83 by the amount of movement calculated by the control device 5 in the secondary correction process. That is, in the determination process (second determination process), the determination device 51 determines that the second component 82 when the second component 82 is moved by the correction device 24 is mounted adjacent to the second component 82 . It is further determined whether or not there is interference with the three parts 83 .

In addition to the determination process, the determination device 51 also executes a re-determination process. In the re-determination process, it is determined whether or not the first part 81 interferes with the second part 82 based on the captured images captured by the plurality of imaging devices 3 after the correction device 24 moves the second part 82 . It is a process to More specifically, in the re-determination process, the determination device 51 obtains the position information of the planned mounting position P1 on the mounting surface 911 of the substrate 91 and the position information of the second component 82 based on the imaging results of the plurality of imaging devices 3. Based on this positional information, the dimension Ys1 between the planned mounting position P1 and the end surface of the second component 821 on the side of the planned mounting position P1, and the planned mounting position P1 and the planned mounting position P1 of the second component 822 are determined. A dimension Ys2 between the side end face is measured (see FIG. 8). Then, the determination device 51 determines that the first part 81 does not interfere with the second part 821 if the dimension Ys1 is equal to or greater than the reference value, and if the dimension Ys1 is less than the reference value, the first part 81 interferes with the second part 821. determined to interfere. If the dimension Ys2 is equal to or greater than the reference value, the determination device 51 determines that the first component 81 does not interfere with the second component 822. If the dimension Ys2 is less than the reference value, the first component 81 interferes with the second component 822. determined to interfere. Further, in the re-determination process, even if the first component 81 does not contact the second component 82 (does not overlap in plan view), the determination device 51 determines that the first component 81 has been mounted at the planned mounting position P1. Assuming that the dimension Yg1 (see FIG. 5) of the gap G1 (see FIG. 5) between the first part 81 and the second part 82 is equal to or less than the threshold, the first part 81 interferes with the second part 82. Then judge.

When the determination device 51 determines that the first component 81 interferes with the second component 82, the control device 5 causes the correction device 24 to perform the main correction processing. At this time, the correction device 24 moves the second component 82 by the movement amount calculated by the control device 5 . In other words, based on the positional information of the second component 82 based on the imaging results of the plurality of imaging devices 3, the control device 5 determines the direction in which the correction device 24 eliminates the interference with the first component 81 (from the planned mounting position P1 to move the second part 82 in the direction of separation).

Further, when the determination device 51 determines that the second component 82 interferes with the third component 83, the control device 5 causes the correction device 24 to perform the secondary correction process. At this time, the correction device 24 moves the third component 83 by the movement amount calculated by the control device 5 . In other words, the control device 5 determines the direction ( The third part 83 is moved in the direction away from the second part 82 .

In this embodiment, the correction system 10 is configured by the correction device 24 , driving devices (actuator 22 and driving device 4 ), and control device 5 . That is, the correction system 10 includes a correction device 24 , a drive device, and a control device 5 . When the first component 81 to be mounted at the planned mounting position P1 on the mounting surface 911 of the object 9 interferes with the second component 82 already mounted on the mounting surface 911 of the object 9, the correction device 24 In addition, it is possible to execute correction processing to move the second part 82 . The driving device drives the correction device 24 . The control device 5 controls the driving device so that the correction device 24 can perform correction processing. In this embodiment, the determination device 51 is included in the control device 5 and the determination device 51 also constitutes the correction system 10 , but the determination device 51 may not be included in the correction system 10 .

(2.2.5) Component Supplying Device The component supplying device 63 supplies the first component 81 captured by the capturing section 21 of the mounting head 2 . The component supply device 63 has, as an example, a tape feeder that supplies the first component 81 accommodated in a carrier tape. Alternatively, the component supply device 63 may have a tray on which a plurality of first components 81 are placed. The mounting head 2 captures the first component 81 from the component supply device 63 with the capturing section 21 . Note that the component supply device 63 may have both a tape feeder and a tray.

(2.2.6) Transport Device The transport device 62 is a device that transports the substrate 91 as the object 9 . The conveying device 62 is implemented by, for example, a belt conveyor. The transport device 62 transports the substrate 91, for example, along the X-axis. The conveying device 62 conveys the substrate 91 to at least a mounting space below the mounting head 2, that is, a mounting space facing the capturing section 21 in the Z-axis direction. Then, the transport device 62 stops the board 91 in the mounting space until the mounting of the first component 81 on the board 91 by the mounting head 2 is completed.

(2.2.7) Fixed Camera The fixed camera (component recognition camera) 7 moves between above the component supply port 63a of the component supply device 63 and above the board 91 positioned in the mounting space. An image of the mounted mounting head 2 is taken from below. Therefore, the image captured by the fixed camera 7 includes the first component 81 captured by the capture unit 21 . That is, the image captured by the fixed camera 7 contains information on the mutual positional relationship between the capture section 21 and the first component 81 , in other words, information on the displacement of the first component 81 with respect to the capture section 21 .

It is preferable that the fixed camera 7 takes an image of the mounting head 2 moving from the component supply port 63a to the substrate 91 from below. In this case, the fixed camera 7 does not always take an image, but takes an image when the capture unit 21 capturing the first component 81 passes above the fixed camera 7 .

Also, the fixed camera 7 may be installed below the component supply port 63a. Moreover, the mounting system 1 may further include an illumination device that illuminates the imaging area of the fixed camera 7 .

(2.2.8) Others The mounting system 1 includes a mounting head 2, a plurality of imaging devices 3, a driving device 4, a control device 5, a component supply device 63, a conveying device 62, a fixed camera 7, a backup device, and lighting. A device, a communication unit, and the like may be provided.

The backup device backs up the board 91 transported to the mounting space by the transport device 62 . That is, the substrate 91 transferred to the mounting space by the transfer device 62 is held in the mounting space by the backup device.

The lighting device illuminates the imaging region R1 (see FIG. 8) of the imaging device 3 . The illumination device should be turned on at least at the timing when the image capturing device 3 captures an image, and for example, emits light in accordance with the image capturing timing of the image capturing device 3 . In the present embodiment, the image captured by the imaging device 3 is a full-color moving image, so the lighting device outputs light in the wavelength range of the visible light region, such as white light. In this embodiment, as an example, the illumination device has a plurality of light sources such as LEDs (Light Emitting Diodes). The lighting device illuminates the imaging region R1 of the imaging device 3 by causing these light sources to emit light. The illumination device is realized by an appropriate illumination method such as ring illumination or coaxial epi-illumination. The illumination device is fixed to the mounting head 2 together with the imaging device 3, for example.

The communication unit is configured to communicate with a host system directly or indirectly via a network, repeater, or the like. This allows the mounting system 1 to exchange data with the host system.

(3) Mounting Method Next, a mounting method according to this embodiment will be described with reference to FIG.

The mounting method according to this embodiment is a mounting method used in the mounting system 1 . The mounting system 1 includes a mounting head 2 , an imaging device 3 , a determination device 51 , a correction device 24 , driving devices (actuator 22 and driving device 4 ), and a control device 5 . The mounting head 2 has a catching part 21 capable of catching the first component 81 so as to be movable toward the object 9, and mounts the first component 81 at the planned mounting position P1 on the mounting surface 911 of the object 9. . The imaging device 3 images the object 9 on which the second component 82 is already mounted. The determination device 51 can execute determination processing for determining whether or not the first component 81 interferes with the second component 82 based on the imaging result of the imaging device 3 . The correction device 24 can perform correction processing to move the second component 82 . The driving device drives the correction device 24 . The control device 5 controls the driving device so that the correction device 24 can perform correction processing. The implementation method has control steps. The control step is a step of moving the second component 82 determined by the determining device 51 to interfere with the first component 81 by the correcting device 24 .

That is, the mounting method according to this embodiment is a mounting method used in the mounting system 1 according to this embodiment. In this mounting method, the correcting device 24 moves the second component 82 determined by the determining device 51 to interfere with the first component 81 . Therefore, when the first component 81 is mounted at the planned mounting position P1 on the mounting surface 911 of the object 9, interference between the first component 81 and the second component 82 can be suppressed. As a result, it becomes possible to reduce the defective rate of the target object 9 on which the first component 81 is mounted, and to improve the yield rate of the target object 9 .

FIG. 7 is a flowchart showing the overall operation of the mounting system 1 including the mounting method according to this embodiment. The mounting method includes steps S1 to S12 shown in FIG.

First, the control device 5 controls the actuator 22 of the mounting head 2 and the driving device 4 to cause the capturing part 21 to capture the first component 81 of the component supply port 63a (capturing step S1).

Next, the control device 5 controls the drive device 4 to move the mounting head 2 in the X-axis direction and the Y-axis direction to move the catching part 21 above the planned mounting position P1 (moving step S2). ). Specifically, the control device 5 causes the X-axis driving section 41 to move the mounting head 2 linearly in the X-axis direction, and the Y-axis driving section 42 to linearly move the mounting head 2 in the Y-axis direction. At this time, the control device 5 moves the mounting head 2 in the X-axis direction and the Y-axis direction so that the XY coordinates of the first component 81 captured by the capturing unit 21 and the XY coordinates of the planned mounting position P1 match. move to The XY coordinates of the first part 81 correspond to the XY coordinates of the center of the first part 81 in plan view from the Z-axis direction.

As shown in FIG. 8, when the mounting head 2 reaches the position where the XY coordinates of the first component 81 match the XY coordinates of the planned mounting position P1, the control device 5 controls the actuator 22 so that The catching part 21 is lowered toward the lower limit position. Then, the control device 5 activates the multiple imaging devices 3, and the multiple imaging devices 3 capture an image of the imaging region R1 while the capturing unit 21 is moving from the upper limit position to the lower limit position (first imaging step S3). In this embodiment, the images captured by the plurality of imaging devices 3 include the planned mounting position P1 of the first component 81 and the mounted components already mounted on the mounting surface 911 of the substrate 91 (the second component 82 and the third component 83) are included.

Note that the imaging timing of the plurality of imaging devices 3 in the first imaging step S3 may be when the capture unit 21 is positioned at the upper limit position. Further, the imaging timing of the plurality of imaging devices 3 in the first imaging step S3 may be before the mounting head 2 reaches the position where the XY coordinates of the first component 81 match the XY coordinates of the planned mounting position P1. .

Next, the control device 5 corrects the XY coordinates of the planned mounting position P1 based on the overall image of the board 91 captured by the plurality of imaging devices 3 and the captured image captured by the fixed camera 7 (correction step S4). The control device 5 measures the dimensional variation of the board 91 from the entire image of the board 91 and corrects the XY coordinates of the planned mounting position P1 based on the dimensional variation of the board 91 . Further, the control device 5 measures the displacement amount of the first component 81 with respect to the center of the capturing section 21 from the captured image of the fixed camera 7, and corrects the XY coordinates of the planned mounting position P1 based on the displacement amount.

When the correction step S<b>4 is completed, the control device 5 determines that the first component 81 is already mounted on the mounting surface 911 of the substrate 91 when the first component 81 is mounted using the corrected planned mounting position P<b>1 . The determination device 51 is caused to perform determination processing for determining whether or not the two parts 82 interfere with each other. In the first determination process, the determination device 51 determines whether or not the first component 81 can be mounted at the corrected planned mounting position P1 (first determination step S5). In the first determination step S5, when the determination device 51 determines that the first component 81 can be mounted, the control device 5 controls the actuator 22 to place the first component at the corrected mounting planned position P1. 81 is mounted (mounting step S6). In the first determination step S5, when the determination device 51 determines that the first component 81 cannot be mounted, the determination device 51 executes a second determination process.

The determination device 51 determines whether or not the second part 82 can be moved in the second determination process (second determination step S7). In the second determination step S7, when the determination device 51 determines that the second part 82 can be moved, the control device 5 causes the correction device 24 to perform the main correction processing (main correction step S9). In the main correction step S<b>9 , the control device 5 controls the actuator 22 and the driving device 4 to move the second component 82 in the direction in which the interference with the first component 81 is eliminated by the correction device 24 . Further, when the determining device 51 determines that the second part 82 cannot be moved in the second determination step S7, the control device 5 causes the correction device 24 to perform the secondary correction process (sub-correction step S8). In the secondary correction step S8, the control device 5 controls the actuator 22 and the drive device 4 to move the third component 83 in the direction in which the interference with the second component 82 is eliminated by the correction device 24. Thereafter, in the main correction step S9, the control device 5 controls the actuator 22 and the driving device 4 to move the second component 82 in the direction in which the interference with the first component 81 is eliminated by the correction device 24. In short, the control device 5 causes the correction device 24 to move the third component 83 determined by the determination device 51 to interfere with the second component 82 , and then causes the correction device 24 to move the second component 82 . In this case, the control device 5 causes the correction device 24 to move the third component 83 in the direction in which the interference with the second component 82 is eliminated, and then moves the correction device 24 in the direction in which the interference with the first component 81 is eliminated. to move the second part 82 to.

Next, the control device 5 activates the multiple imaging devices 3, and the multiple imaging devices 3 capture an image of the imaging region R1 (second imaging step S10). The determination device 51 executes a re-determination process based on the captured images of the imaging region R1 by the plurality of imaging devices 3 (re-determination step S11). In the re-determination step S11, the determination device 51 determines whether the first component 81 interferes with the second component 82 or not. When the determination device 51 determines that the first component 81 interferes with the second component 82 and the first component 81 cannot be mounted at the planned mounting position P1, the control device 5 can move the second component 82. It is determined whether or not (second determination step S7). In the second determination step S7, when the determination device 51 determines that the second part 82 can be moved, the control device 5 causes the correction device 24 to perform the main correction processing (main correction step S9). When the determination device 51 determines that the first component 81 does not interfere with the second component 82 and that the first component 81 can be mounted, the control device 5 controls the actuator 22 to perform mounting after correction. The first component 81 is mounted at the planned position P1 (mounting step S12).

Here, when it is determined in the re-determining step S11 that the first component 81 can be mounted at the corrected planned mounting position P1, the control device 5 controls each of the two second components 821 and 822 and the first The planned mounting position P1 may be further corrected so that the gaps with the component 81 are equal.

When the determination device 51 determines that the first component 81 cannot be mounted at the planned mounting position P1, the control device 5 determines whether or not the second component 82 can be moved (second determination step S7) may be skipped and the straightening device 24 may perform the main straightening process (main straightening step S9).

(4) Correction Processing Next, the correction processing by the correction device 24 will be described with reference to FIGS. 8 to 14. FIG.

In FIG. 8, the two second components 821 and 822 positioned on both sides of the planned mounting position P1 in the Y-axis direction are shifted toward the planned mounting position P1 with respect to the reference position, and are caught by the holding section 21. When trying to mount the first component 81 at the mounting position P1, the first component 81 interferes with the two second components 821 and 822 . Therefore, the control device 5 causes the correction device 24 to perform correction processing (main correction processing). The control device 5 controls the actuator 22 of the mounting head 2 and the drive device 4 to move the correction device 24 above the planned mounting position P1 and to lower the correction device 24 toward the mounting surface 911 of the substrate 91. (See FIG. 9).

Next, the control device 5 controls the driving device 4 to move the correcting device 24 away from the planned mounting position P1 in the Y-axis direction (to the right in FIG. 10) so that the pressing force from the correcting device 24 to move the second component 821 away from the planned mounting position P1 (see FIG. 10). Further, the control device 5 controls the driving device 4 to move the correcting device 24 to the opposite side (left side in FIG. 11) in the Y-axis direction, and the pressing force from the correcting device 24 moves from the planned mounting position P1. Move the second part 822 away (see FIG. 11). As a result, as shown in FIG. 12, the two second parts 821 and 822 are moved to a position where the first part 81 does not interfere.

Then, the control device 5 controls the actuator 22 and the drive device 4 to raise the correction device 24 to the original height position (the upper limit position of the correction device 24), and then move the first component 81. The catching part 21 that has been caught is moved above the planned mounting position P1 (see FIG. 12). Furthermore, the control device 5 lowers the capturing portion 21 capturing the first component 81 by controlling the actuator 22 to mount the first component 81 at the planned mounting position P1 (see FIG. 13). After mounting the first component 81 at the planned mounting position P<b>1 , the control device 5 cancels the state of capturing the first component 81 by the capturing unit 21 . Then, the control device 5 moves (raises) the catching portion 21 to the upper limit position by controlling the actuator 22 (see FIG. 14).

Note that the secondary correction processing by the correction device 24 is executed in the same procedure as the above-described main correction processing, so the description of the secondary correction processing is omitted here.

(5) Effect In the mounting system 1 according to the present embodiment, when the determination device 51 determines that the first component 81 interferes with the second component 82, the correction device 24 eliminates the interference with the first component 81. , the second part 82 is moved. This makes it possible to suppress interference between the first component 81 and the second component 82 when the first component 81 is mounted at the planned mounting position P1. As a result, it becomes possible to reduce the defective rate of the target 9 (board 91) on which the first component 81 is mounted, and to improve the yield rate of the target 9. FIG.

Further, in the mounting system 1 according to the present embodiment, the determination device 51 includes the first component 81 when the first component 81 is mounted at the planned mounting position P1, and the first component 81 mounted adjacent to the planned mounting position P1. It is determined that the first component 81 interferes with the second component 82 when the dimension (gap dimension) Yg1 of the gap G1 between the two components 82 is equal to or less than the threshold value. This makes it possible to further suppress interference between the first component 81 and the second component 82 . As a result, it becomes possible to further improve the yield rate of the target object 9 .

Further, in the mounting system 1 according to this embodiment, the correcting device 24 is provided in the mounting head 2 . As a result, compared to the case where the correcting device 24 is provided other than the mounting head 2, the working time can be shortened.

Further, in the mounting system 1 according to the present embodiment, the determination device 51 moves the second component 82 by the correcting device 24, and then determines the position of the first component based on the captured images captured by the plurality of imaging devices 3. A re-determination process for determining whether or not the second component 81 interferes with the second part 82 is executed. This makes it possible to further suppress interference between the first component 81 and the second component 82 .

In addition, in the mounting system 1 according to the present embodiment, the determination device 51 causes the second component 82 to be mounted adjacent to the second component 82 when the second component 82 is moved by the correction device 24 in the determination processing. It is further determined whether or not there is interference with the third component 83 (second determination process). When the determination device 51 determines that the second component 82 interferes with the third component 83 , the control device 5 causes the correction device 24 to move the third component 83 , and then moves the second component 82 to the correction device 24 . are moved by This makes it possible to suppress the interference between the first component 81 and the mounted components even when the interference between the first component 81 and the mounted components (the second component 82 and the third component 83) is extensive. .

Moreover, in the mounting system 1 according to this embodiment, the plurality of imaging devices 3 are provided in the mounting head 2 . A plurality of imaging devices 3 capture images of an imaging region R1 including a region of the mounting surface 911 of the substrate 91 that faces the capturing section 21 in the moving direction of the capturing section 21 . As a result, determination processing by the determination device 51 can be executed in a series of operations of picking up the first component 81 , moving the first component 81 , and mounting the first component 81 . It is possible to reduce the number of movements of the mounting head 2 for processing. As a result, production time can be shortened.

(6) Modifications The above-described embodiment is just one of various embodiments of the present disclosure. The above-described embodiments can be modified in various ways according to design and the like as long as the object of the present disclosure can be achieved. Further, functions similar to those of the mounting method according to the above-described embodiments may be embodied by the mounting system 1, (computer) programs, non-temporary recording media recording programs, or the like.

Modifications of the above-described embodiment are listed below. Modifications described below can be applied in combination as appropriate.

(6.1) Modification 1
A mounting system 1 according to Modification 1 will be described with reference to FIG.

As shown in FIG. 15, the mounting system 1 according to Modification 1 differs from the mounting system 1 according to the above embodiment in that the catching unit 21 is also used as the correcting device 24 . Regarding the mounting system 1 according to Modification 1, the same components as those of the mounting system 1 according to the above-described embodiment are denoted by the same reference numerals, and descriptions thereof are omitted.

In the mounting system 1 according to Modification 1, the mounting head 2 has a plurality of (only one is shown in the illustrated example) catching units 21 . In the mounting system 1 according to Modification 1, one of the plurality of catching portions 21 that does not hold the first component 81 is also used as the correcting device 24 . That is, the correction device 24 includes the catching portion 21 that does not hold the first component 81 among the plurality of catching portions 21 .

In the mounting system 1 according to Modification 1, when the determination device 51 determines that the first component 81 interferes with the second component 82, the control device 5 controls the actuator 22 and the driving device 4 of the mounting head 2. As a result, the second component 82 is moved in a direction in which the interference with the first component 81 is eliminated by the catching portion 21 as the correction device 24 . After that, the control device 5 controls the actuator 22 and the drive device 4 to move the catching portion 21 that has captured the first component 81 above the planned mounting position P1, thereby moving the first component 81 to the planned mounting position P1. to implement.

In the mounting system 1 according to Modification 1, of the plurality of catching portions 21 , the catching portion 21 that does not hold the first component 81 is also used as the correcting device 24 . This eliminates the need to provide the correcting device 24 separately from the catching unit 21, making it possible to suppress an increase in the size of the mounting system 1. FIG. Further, in the mounting system 1 according to Modification 1, it is possible to suppress interference between the first component 81 and the second component 82, as in the mounting system 1 according to the above-described embodiment. In short, according to the mounting system 1 according to Modification 1, it is possible to suppress interference between the first component 81 and the second component 82 while suppressing an increase in the size of the mounting system 1 .

In the mounting system 1 according to Modification 1, one capturing unit 21 is also used as the correcting device 24 , but two or more capturing units 21 may also be used as the correcting device 24 .

(6.2) Modification 2
A mounting system 1 according to Modification 2 will be described with reference to FIGS. 16A to 16C.

As shown in FIGS. 16A to 16C, the mounting system 1 according to Modification 2 is similar to the implementation described above in that the catching portion 21 and the first component 81 caught by the catching portion 21 are also used as the correcting device 24. It is different from the mounting system 1 according to the form. Regarding the mounting system 1 according to Modification 2, the same components as those of the mounting system 1 according to the above-described embodiment are denoted by the same reference numerals, and descriptions thereof are omitted.

In the mounting system 1 according to Modification 2, as shown in FIGS. 16A to 16C, the length direction of each of the plurality of second parts 821 and 822 is along the Y-axis direction (horizontal direction in FIGS. 16A to 16C). Then, assume that a plurality of second components 821 and 822 are mounted on the mounting surface 911 of the substrate 91 . Also, assume that the gap between the plurality of second parts 821 and 822 is wider than the width of the first part 81 and narrower than the length of the first part 81 .

In the mounting system 1 according to Modification 2, the mounting head 2 has a plurality of (only one is shown in the illustrated example) catching units 21 . In the mounting system 1 according to Modification 2, the catching portion 21 that holds the first component 81 among the plurality of catching portions 21 and the first component 81 that is held by the catching portion 21 also serve as the correcting device 24 . be done.

In the mounting system 1 according to Modification 2, as described above, since the gap between the plurality of second components 821 and 822 is narrower than the length of the first component 81, the length of the first component along the Y-axis direction 81 cannot be inserted into the gap. Therefore, the control device 5 rotates the catching portion 21 holding the first component 81 by 90 degrees by controlling the actuator 22 of the mounting head 2 . As a result, the orientation of the first component 81 is rotated by 90 degrees, and the width of the first component 81 is along the Y-axis direction (see FIG. 16A). As described above, since the gap between the plurality of second parts 821, 822 is wider than the width of the first part 81, the first part 81 can be inserted into the gap between the plurality of second parts 821, 822. .

Next, the control device 5 controls the driving device 4 to move the catching portion 21 holding the first component 81 in the Y-axis direction so that the pressing force from the first component 81 moves to the planned mounting position. A plurality of second parts 821, 822 are moved away from P1 (see FIG. 16B). This makes it possible to secure a space for mounting the first component 81 between the plurality of second components 821 and 822 (see FIG. 16C).

Next, the control device 5 rotates the catching portion 21 holding the first part 81 by 90 degrees by controlling the actuator 22 . This rotates the orientation of the first component 81 by 90 degrees (see FIG. 16C). Then, the control device 5 mounts the first component 81 on the mounting surface 911 of the substrate 91 by controlling the actuator 22 .

In the mounting system 1 according to Modification 2, the catching portion 21 and the first component 81 held by the catching portion 21 are also used as the correction device 24 . Accordingly, compared to the case where the catching portion 21 that does not hold the first component 81 is also used as the correction device 24, the catching portion 21 that holds the first component 81 and the first component 81 are not held. Replacement work with the catching portion 21 becomes unnecessary, and as a result, it is possible to shorten the work time required for mounting the first component 81 . Further, in the mounting system 1 according to Modification 2, it is possible to suppress interference between the first component 81 and the second component 82, as in the mounting system 1 according to the above-described embodiment. In short, according to the mounting system 1 according to Modification 2, it is possible to suppress interference between the first component 81 and the second component 82 while shortening the work time required for mounting the first component 81 .

(6.3) Other Modifications Other modifications are listed below.

The implementation system 1 in the present disclosure includes a computer system in the control device 5, for example. A computer system is mainly composed of a processor and a memory as hardware. A processor executes a program recorded in the memory of the computer system, thereby realizing the function of the implementation system 1 in the present disclosure. The program may be recorded in advance in the memory of the computer system, may be provided through an electric communication line, or may be recorded in a non-temporary recording medium such as a computer system-readable memory card, optical disk, or hard disk drive. may be provided. A processor in a computer system consists of one or more electronic circuits, including semiconductor integrated circuits (ICs) or large scale integrated circuits (LSIs). The integrated circuit such as IC or LSI referred to here is called differently depending on the degree of integration, and includes integrated circuits called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). In addition, an FPGA (Field-Programmable Gate Array), which is programmed after the LSI is manufactured, or a logic device capable of reconfiguring the bonding relationship inside the LSI or reconfiguring the circuit partitions inside the LSI, shall also be adopted as the processor. can be done. A plurality of electronic circuits may be integrated into one chip, or may be distributed over a plurality of chips. A plurality of chips may be integrated in one device, or may be distributed in a plurality of devices. A computer system, as used herein, includes a microcontroller having one or more processors and one or more memories. Accordingly, the microcontroller also consists of one or more electronic circuits including semiconductor integrated circuits or large scale integrated circuits.

In addition, it is not an essential configuration of the mounting system 1 that a plurality of functions of the mounting system 1 are integrated in one housing. The components of the mounting system 1 may be distributed over a plurality of housings. Furthermore, at least part of the functions of the mounting system 1 may be realized by a cloud (cloud computing) or the like.

Conversely, in the above-described embodiments, at least some of the functions of the mounting system 1 distributed over multiple devices may be integrated into one housing. For example, some functions distributed between the mounting head 2 and the control device 5 may all be integrated into the mounting head 2 .

Applications of the mounting system 1 are not limited to manufacturing electronic devices in factories. For example, when the mounting system 1 is used to mount a mechanical component on a glass plate, the mounting system 1 mounts a mechanical component, which is a first component, on a glass plate, which is an object.

In the above-described embodiment, the imaging optical axis (Ax1, Ax2) of the imaging device 3 is parallel to the perpendicular to the mounting surface 911 of the substrate 91, but the imaging optical axis of the imaging device 3 is, for example, It may be slanted with respect to the 911 normal. That is, the image pickup device 3 may be configured to pick up an image from an oblique direction with respect to the mounting surface 911 of the substrate 91 . Moreover, although the mounting system 1 includes a plurality of imaging devices 3 in the above-described embodiment, the mounting system 1 may include, for example, one imaging device 3 .

In the above-described embodiment, the imaging direction of each of the plurality of imaging devices 3 is fixed. However, for example, at least one of the plurality of imaging devices 3 may be configured to rotate with respect to the mounting head 2. . In this case, the control device 5 controls the actuator 22 of the mounting head 2 and the driving device 4 in consideration of the rotation angle of the rotatable imaging device 3 among the plurality of imaging devices 3 .

In the above-described embodiment, the multiple imaging devices 3 are provided on the mounting head 2, but the multiple imaging devices 3 may be fixed to the base 61 or the like, for example. Also in this case, the plurality of imaging devices 3 are preferably arranged so as to be able to capture an image of the imaging region R1 (see FIG. 8).

Although the correction device 24 is provided in the mounting head 2 in the above-described embodiment, the correction device 24 may be provided in a place other than the mounting head 2 . Further, the correction device 24 is not limited to the mounting device (mounting system 1) including the mounting head 2, and may be provided in a device other than the mounting device, for example.

Although the correction system 10 is provided in the mounting system 1 in the above-described embodiment, it may be provided in a place other than the mounting system 1 . For example, after the mounting process of mounting the second component 82 and the third component 83 and before the mounting process of mounting the first component 81, the mounting state of the second component 82 and the third component 83 (displacement, etc.) ) is provided. In this case, the correction device 24 may be provided in the inspection system that executes the inspection process. In short, the correction device 24 is not limited to being provided in the mounting system 1, but may be provided in the inspection system, or may be provided in a system other than the mounting system 1 and the inspection system.

(Mode)
The following aspects are disclosed from the above-described embodiments, modifications, and the like.

A mounting system (1) according to a first aspect includes a mounting head (2), an imaging device (3), a determination device (51), a correction device (24), a drive device (actuator 22, drive device 4 ) and a controller (5). The mounting head (2) has a capturing part (21) capable of capturing the first part (81) so as to be movable toward the object (9), and the first part (81) is attached to the object (9). It is mounted at the planned mounting position (P1) on the mounting surface (911). An imaging device (3) images an object (9) on which a second component (82) has already been mounted. The determination device (51) can execute determination processing for determining whether or not the first component (81) interferes with the second component (82) based on the imaging result of the imaging device (3). The straightening device (24) is capable of performing a straightening process of moving the second component (82). A drive drives the correction device (24). The control device (5) controls the driving device so that the correction device (24) can perform correction processing. The control device (5) causes the correction device (24) to move the second component (82) determined by the determination device (51) to interfere with the first component (81).

According to this aspect, it is possible to suppress interference between the first part (81) and the second part (82).

In the mounting system (1) according to the second aspect, in the first aspect, the determination device (51) measures the first component (81) when the first component (81) is mounted at the planned mounting position (P1). and the second component (82) mounted adjacent to the planned mounting position (P1), when the dimension (Yg1) of the gap (G1) between the first component (81) and the interferes with the second part (82).

According to this aspect, it is possible to further suppress interference between the first component (81) and the second component (82).

In the mounting system (1) according to the third aspect, in the first or second aspect, the control device (5), based on the position information of the second component (82) based on the imaging result of the imaging device (3) Then, the correction device (24) moves the second part (82) in a direction to eliminate the interference with the first part (81).

According to this aspect, it is possible to suppress interference between the first part (81) and the second part (82).

In the mounting system (1) according to the fourth aspect, in the first to third aspects, the correction device (24) is provided in the mounting head (2).

According to this aspect, the working time can be shortened compared to the case where the correcting device (24) is provided other than the mounting head (2).

In the mounting system (1) according to the fifth aspect, in the fourth aspect, the mounting head (2) has a plurality of catching portions (21). A correction device (24) includes a catching portion (21) that does not hold a first component (81) among a plurality of catching portions (21).

According to this aspect, interference between the first component (81) and the second component (82) can be suppressed while suppressing an increase in size of the mounting system (1).

In the mounting system (1) according to the sixth aspect, in any one of the first to fifth aspects, the imaging device (3) is provided in the mounting head (2), and the object (9) is mounted. An imaging region (R1) including a region facing the capturing part (21) in the direction of movement of the capturing part (21) (the direction of approaching the object 9) on the surface (911) is captured.

According to this aspect, it is possible to improve the mounting accuracy of the first component (81) with respect to the planned mounting position (P1).

In the mounting system (1) according to the seventh aspect, in any one of the first to sixth aspects, the determination device (51) moves the second component (82) by the correction device (24). A re-determination process for determining whether or not the first component (81) interferes with the second component (82) is executed based on the imaging result of the subsequent imaging device (3).

According to this aspect, it is possible to further suppress interference between the first component (81) and the second component (82).

In the mounting system (1) according to the eighth aspect, in any one of the first to seventh aspects, the determination device (51), in the determination process, causes the correction device (24) to It is further determined whether or not the second part (82) when moved interferes with the third part (83) mounted adjacent to the second part (82). The control device (5) causes the correction device (24) to move the third part (83) determined to interfere with the second part (82) by the determination device (51), and then moves the second part (82). It is moved by a correction device (24).

According to this aspect, even if the interference between the first component (81) and the mounted components (the second component 82 and the third component 83) is extensive, the interference between the first component (81) and the mounted components can be prevented. can be suppressed.

In the mounting system (1) according to the ninth aspect, in the eighth aspect, the control device (5) selects the second component (82) and the third component (83) based on the imaging result of the imaging device (3). After moving the third part (83) in the direction to eliminate the interference with the second part (82) by the correcting device (24) based on the position information, the first part (81) is moved by the correcting device (24). The second part (82) is moved in a direction to eliminate the interference with.

According to this aspect, even if the interference between the first component (81) and the mounted components (the second component 82 and the third component 83) is extensive, the interference between the first component (81) and the mounted components can be prevented. can be suppressed.

A mounting method according to a tenth aspect is a mounting method used in the mounting system (1). A mounting system (1) includes a mounting head (2), an imaging device (3), a determination device (51), a correction device (24), a driving device (actuator 22, driving device 4), and a control device ( 5) and The mounting head (2) has a capturing part (21) capable of capturing the first part (81) so as to be movable toward the object (9), and the first part (81) is attached to the object (9). It is mounted at the planned mounting position (P1) on the mounting surface (911). An imaging device (3) images an object (9) on which a second component (82) has already been mounted. The determination device (51) can execute determination processing for determining whether or not the first component (81) interferes with the second component (82) based on the imaging result of the imaging device (3). The straightening device (24) is capable of performing a straightening process of moving the second component (82). A drive drives the correction device (24). The control device (5) controls the driving device so that the straightening device (24) can perform the straightening process. The implementation method has control steps. The control step is a step of moving the second component (82) determined by the determination device (51) to interfere with the first component (81) using the correction device (24).

According to this aspect, it is possible to suppress interference between the first part (81) and the second part (82).

A correction system (10) according to an eleventh aspect comprises a correction device (24), a drive device (actuator 22, drive device 4), and a control device (5). The correction device (24) is configured so that the first component (81) mounted at the mounting planned position (P1) on the mounting surface (911) of the object (9) is mounted on the mounting surface (911) of the object (9). In the case of interference with the second component (82) already mounted on the device, it is possible to perform corrective processing to move the second component (82). A drive drives the correction device (24). The control device (5) controls the driving device so that the straightening device (24) can perform the straightening process.

According to this aspect, it is possible to suppress interference between the first part (81) and the second part (82).

The configurations according to the second to ninth aspects are not essential to the mounting system (1), and can be omitted as appropriate.

1 mounting system 2 mounting head 3 imaging device 4 driving device (driving device)
5 Control device 9 Object 10 Correction system 21 Capture unit 22 Actuator (driving device)
24 correction device 51 determination device 81 first component 82 second component 83 third component 91 substrate 911 mounting surface G1 gap P1 planned mounting position R1 imaging area Yg1 dimensions

Claims (11)

a mounting head having a catching part capable of catching a first component movably toward an object and mounting the first component at a planned mounting position on a mounting surface of the object;
an imaging device that captures an image of the object on which the second component is already mounted;
a determination device capable of executing a determination process for determining whether or not the first component interferes with the second component based on the imaging result of the imaging device;
a straightening device capable of performing a straightening process of moving the second part;
a driving device for driving the correction device;
a control device that controls the drive device so that the correction device can perform the correction process;
The control device causes the correction device to move the second component determined by the determination device to interfere with the first component.
implementation system. The determination device determines that the dimensions of a gap between the first component when the first component is mounted at the planned mounting position and the second component mounted adjacent to the planned mounting position are: If it is equal to or less than a threshold, it is determined that the first part interferes with the second part;
The mounting system according to claim 1. The control device moves the second component in a direction in which interference with the first component is eliminated by the correction device, based on position information of the second component based on imaging results of the imaging device.
The mounting system according to claim 1 or 2. The correction device is provided on the mounting head,
The mounting system according to any one of claims 1 to 3. The mounting head has a plurality of the capturing units,
The correction device includes a catching portion that does not hold the first component among the plurality of catching portions,
The mounting system according to claim 4. The imaging device is provided on the mounting head and captures an imaging region including a region facing the capturing unit in the moving direction of the capturing unit in the mounting surface of the object.
The mounting system according to any one of claims 1-5. The determination device performs re-determination processing for determining whether or not the first component interferes with the second component based on the imaging result of the imaging device after the second component is moved by the correction device. run the
The mounting system according to any one of claims 1-6. In the determination process, the determination device determines whether or not the second component when moved by the correction device interferes with a third component mounted adjacent to the second component. further determine whether
The control device uses the correction device to move the third component determined by the determination device to interfere with the second component, and then moves the second component using the correction device.
The mounting system according to any one of claims 1-7. The control device moves the third component in a direction in which interference with the second component is eliminated by the correcting device based on the position information of the second component and the third component based on the imaging result of the imaging device. After moving, the correction device moves the second part in a direction to eliminate interference with the first part,
The mounting system according to claim 8. a mounting head having a catching part capable of catching a first component movably toward an object and mounting the first component at a planned mounting position on a mounting surface of the object;
an imaging device that captures an image of the object on which the second component is already mounted;
a determination device capable of executing a determination process for determining whether or not the first component interferes with the second component based on the imaging result of the imaging device;
a straightening device capable of performing a straightening process of moving the second part;
a driving device for driving the correction device;
A mounting method used in a mounting system comprising a control device that controls the driving device so that the correction device can perform the correction processing,
A control step of moving the second component determined by the determination device to interfere with the first component by the correction device,
How to implement. When a first component mounted at a planned mounting position on a mounting surface of an object interferes with a second component already mounted on the mounting surface of the object, correction for moving the second component. an orthodontic device capable of performing the treatment;
a driving device for driving the correction device;
a control device that controls the drive device so that the correction device can perform the correction process;
correction system.

Images