JP2023115818A - Mounting system and mounting method - Google Patents

Abstract

To provide a mounting system and a mounting method which can determine a positional deviation of a capturing unit while using an imaging unit that moves in synchronization with a mounting head.SOLUTION: In a mounting system 1, an imaging unit 3 moves in synchronization with a mounting head 2 and includes at least a tip of a capturing unit 21 in an imaging region. A reference body 8 is provided as a separate body from the mounting head 2. A determination unit 53 detects a relative position between the tip of the capturing unit 21 and the reference body 8 on the basis of a photographed image obtained by imaging the tip of the capturing unit 21 and the reference body 8 in an imaging region by the imaging unit 3 and determines whether or not the relative position satisfies a prescribed condition. An output unit 54 outputs a signal based on the determination result of the determination unit 53.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to an implementation system and an implementation method.

The component mounting apparatus of Patent Document 1 has a suction head section, a component recognition camera, a board recognition camera, a nozzle recognition camera, and a correction jig.

The suction head unit includes a suction nozzle for sucking a component, moves the suction nozzle up and down in a substantially vertical direction, and rotates the suction nozzle about a vertical axis that substantially coincides with the nozzle axis.

The component recognition camera captures an image of the component sucked by the suction nozzle and recognizes the posture of the component.

The board recognition camera captures an image of a board on which components are mounted and recognizes the layout of the board.

The nozzle recognition camera captures an image of the tip of the suction nozzle at a height position lower than the height position of the suction nozzle when the component recognition camera picks up an image of the component, and the center of the tip of the suction nozzle as the suction nozzle descends. Recognize the amount of horizontal positional deviation.

The correction jig is a transparent jig that is placed above the nozzle recognition camera and has a correction reference mark on the upper surface that serves as a reference for recognizing the amount of deviation.

Then, the component mounting apparatus corrects the amount of horizontal deviation of the tip of the suction nozzle that accompanies the descent of the suction nozzle, and picks up and mounts the component.

In Patent Document 1, the nozzle recognition camera is arranged side by side with the component recognition camera, and is arranged on the side of the component supply section.

JP 2009-117488 A

Also in a mounting system having an imaging section that moves in synchronism with the mounting head, there is a demand for determining the positional deviation of the capturing section.

An object of the present disclosure is to provide a mounting system and a mounting method that can determine positional deviation of a capturing unit while using an imaging unit that moves in synchronization with a mounting head.

A mounting system according to an aspect of the present disclosure mounts a second object on a first object. The mounting system includes a mounting head, an imaging section, a reference body, a determination section, and an output section. The mounting head is movable with a capturing part capable of capturing the second object. The imaging section moves in synchronization with the mounting head, and includes at least the tip of the capturing section in an imaging area. The reference body is provided separately from the mounting head. The determining unit detects a relative position between the tip of the capturing unit and the reference object based on an image captured by the imaging unit including the tip of the capturing unit and the reference object in the imaging area, and It is determined whether or not the relative position satisfies a predetermined condition. The output section outputs a signal based on the determination result of the determination section.

A mounting method according to an aspect of the present disclosure mounts a second object on a first object. The mounting method includes an imaging step, a determination step, and an output step. In the imaging step, an imaging section having a capturing section capable of capturing the second object and moving in synchronization with a movable mounting head is provided separately from the tip of the capturing section and the mounting head. An imaging region including the reference body is imaged. The determining step detects a relative position between the tip of the capturing section and the reference body based on the captured image of the imaging section, and determines whether or not the relative position satisfies a predetermined condition. The output step outputs a signal based on the determination result of the determination step.

The present disclosure has the effect of being able to determine the positional deviation of the capture unit while using the imaging unit that moves in synchronization with the mounting head.

FIG. 1 is a configuration diagram showing a mounting system according to an embodiment. FIG. 2 is a perspective view showing a main part of the mounting system same as the above. FIG. 3 is a block diagram showing the same mounting system. FIG. 4 is a side view showing the vicinity of the capture section and imaging section of the mounting system; 5A to 5D are diagrams showing the operation of the same mounting system. 6A and 6B are diagrams showing determination processing of the same mounting system. FIG. 7 is a perspective view for explaining determination processing of the mounting system; FIG. 8 is another perspective view for explaining the determination processing of the mounting system; FIG. 9 is a flowchart showing a mounting method executed by the mounting system; FIG. 10 is a side view showing a modification of the imaging unit of the mounting system; FIG. 11 is a perspective view showing a modification of the reference body of the mounting system;

The following embodiments generally relate to implementation systems and implementation methods. More specifically, the present invention relates to a mounting system and a mounting method that perform a production operation of mounting a second object on a first object.

A mounting system and a mounting method according to an embodiment will be described in detail below with reference to FIGS. 1 to 10. FIG. However, each drawing described in the following embodiments is a schematic drawing, and the ratio of the size and thickness of each component does not necessarily reflect the actual dimensional ratio. Note that the configurations described in the following embodiments are merely examples of the present disclosure. The present disclosure is not limited to the following embodiments, and various modifications can be made according to design and the like as long as the effects of the present disclosure can be achieved.

In the following description, X-axis, Y-axis, and Z-axis that are orthogonal to each other are defined in FIGS. 1 and 2 unless otherwise specified. In this embodiment, the X and Y axes extend horizontally, and the Z axis extends vertically.

(1) Overview of Mounting System An overview of the mounting system 1 according to this embodiment will be described below.

The mounting system 1, as shown in FIGS. 1 and 5A to 5D, is a mounting apparatus (mounting machine) that mounts a second object T2 on a first object T1. The mounting system 1 is used, for example, in facilities such as factories, research institutes, offices, and educational facilities for manufacturing various products such as electronic devices, automobiles, clothing, foods, medicines, and handicrafts. be done.

In this embodiment, a case where the mounting system 1 is used for manufacturing electronic devices in a factory will be described. A typical electronic device has various circuit blocks such as a power supply circuit and a control circuit. In manufacturing these circuit blocks, for example, a solder application process, a mounting process, and a soldering process are performed in this order. In the solder application process, cream solder is applied (or printed) on a board (including a printed wiring board). In the mounting process, components (including electronic components) are mounted (mounted) on the board. In the soldering process, for example, the board on which the components are mounted is heated in a reflow oven to melt creamy solder for soldering. In the mounting process, the mounting system 1 mounts the component T20, which is the second target T2, on the substrate T10, which is the first target T1. That is, in the mounting system 1 according to this embodiment, the first target T1 is the board T10, and the second target T2 is the component T20 mounted on the board T10.

Thus, the mounting system 1 used for mounting the second object T2 (component T20) on the first object T1 (board T10) includes, as shown in FIG. A unit 4 , a control unit 5 , a base 61 , a conveying device 62 , a plurality of component supply devices 63 and a fixed camera 7 are provided.

The transport device 62 has a pair of conveyor mechanisms 62a extending in the X-axis direction on the base 61, transports the substrate T10, which is the first object T1, in the X-axis direction and positions it in a predetermined mounting space. do.

A plurality of component supply devices 63 have tape feeders mounted side by side in the X-axis direction on a feeder base 65 of a carriage 64 connected to the base 61 . Each component supply device 63 pitch-feeds the carrier tape 67 supplied from the reel 66, and supplies the component T20, which is the second object T2 held on the carrier tape 67, to the component supply port 63a. A reel 66 is held by a carriage 64 . The fixed camera 7 is mounted on the base 61 and images the upper side.

The mounting head 2 is movable along the XY plane and further has a catching section 21 for catching the second object T2. The catching unit 21 is, for example, a suction nozzle capable of stroking to move (up and down) in the vertical direction along the Z-axis.

The mounting system 1 mounts a component T20 (second object T2) on a substrate T10 (first object T1) in the mounting process. Positional control of the catching portion 21 in the mounting process requires high positioning accuracy.

Therefore, the mounting system 1 of the present embodiment includes the mounting head 2, the imaging section 3, the reference body 8, the determination section 53, and the output section . The mounting head 2 has a capture section 21 capable of capturing the component T20. The imaging unit 3 moves in synchronization with the mounting head 2, and includes at least the tip 210 of the capturing unit 21 in the imaging region R1 (see FIG. 4). The reference body 8 is provided separately from the mounting head 2 . The determination unit 53 detects the relative positions of the tip 210 of the capturing unit 21 and the reference body 8 based on the captured image captured by the imaging unit 3 including the tip 210 of the capturing unit 21 and the reference body 8 in the imaging region R1. , determines whether the relative position satisfies a predetermined condition. The output section 54 outputs a signal based on the determination result of the determination section 53 .

The mounting system 1 described above can determine the positional deviation of the capturing section 21 while using the imaging section 3 that moves in synchronization with the mounting head 2 .

(2) Details (2.1) Premises In this embodiment, as an example, a case where the mounting system 1 is used for mounting a component T20 by surface mount technology (SMT) will be described. That is, the component T20 is a component for surface mounting (SMD: Surface Mount Device), and is mounted by being arranged on the mounting surface T11 (front surface) of the substrate T10. However, the mounting system 1 is not limited to this example, and may be used to mount the component T20 by an insertion mount technology (IMT). In this case, the component T20 is a component for insertion mounting having lead terminals, and is mounted on the mounting surface T11 of the substrate T10 by inserting the lead terminals into the holes of the substrate T10.

In addition, the “imaging optical axis” referred to in the present disclosure is an optical axis of an image captured by the imaging unit 3 (captured image of the imaging unit 3), and is an image sensor 31 (see FIG. 3) of the imaging unit 3 It is the optical axis defined by both the optical system 32 (see FIG. 3). In other words, the straight line that connects the center of the light receiving surface of the image pickup device 31 and the part within the image pickup region R1 (see FIG. It becomes the optical axis AX1 (see FIG. 4).

In addition, in the present disclosure, images captured by the imaging unit 3 include still images (still images) and moving images (moving images). Furthermore, "moving image" includes captured images composed of a plurality of still images obtained by frame-by-frame shooting or the like. The image captured by the imaging unit 3 may not be the data output from the imaging unit 3 itself. For example, the image captured by the image capturing unit 3 can be appropriately compressed, converted to another data format, processed to cut out a part of the image captured by the image capturing unit 3, adjusted in focus, adjusted in brightness, or adjusted in contrast. etc. processing may be applied. In this embodiment, as an example, the image captured by the imaging unit 3 is a full-color moving image.

In the following, as an example, three axes, the X-axis, the Y-axis, and the Z-axis, which are orthogonal to each other, are set, and the axes parallel to the mounting surface T11 of the substrate T10 are defined as the "X-axis" and the "Y-axis", and the thickness direction of the substrate T10 Let the axis parallel to be the "Z" axis. Furthermore, one of the two directions along the Z-axis is the upward direction, and the other direction is the downward direction. For example, the substrate T10 is positioned below the capturing portion 21 when the capturing portion 21 faces the mounting surface T11 of the substrate T10. Note that the X-axis, Y-axis, and Z-axis are all virtual axes, and the arrows indicating "X", "Y", and "Z" in the drawings are notated for the sake of explanation. nothing, and none of them involve substance. Moreover, these directions are not meant to limit the directions during use of the mounting system 1 .

Also, the mounting system 1 is connected to a pipe for circulating cooling water, a cable for power supply, a pipe for supplying air pressure (including positive pressure and vacuum), and the like. Illustrations are omitted as appropriate.

(2.2) Overall Configuration Next, the main part of the mounting system 1 according to this embodiment will be described with reference to FIGS. 1 to 4, 5A and 5B.

A mounting system 1 according to this embodiment includes a mounting head 2 , an imaging section 3 , a driving section 4 , a control section 5 and a reference body 8 . Further, in this embodiment, as shown in FIG. 3, the mounting system 1 includes the mounting head 2, the imaging unit 3, the driving unit 4, the control unit 5, and the reference body 8, as well as the conveying device 62 and the component supply device. 63 , and a fixed camera 7 . However, the transport device 62 , the component supply device 63 and the fixed camera 7 are not essential components of the mounting system 1 . That is, all or part of the transport device 62 , the component supply device 63 , and the fixed camera 7 may not be included in the components of the mounting system 1 . 2, only the mounting head 2, the imaging unit 3, the driving unit 4, and the reference body 8 are illustrated, and the other configuration of the mounting system 1 is omitted as appropriate. In addition, FIG. 4 shows the periphery of the mounting head 2 and omits the other configuration of the mounting system 1 as appropriate.

The mounting head 2 has at least one catch 21 . In this embodiment, the mounting head 2 has a head unit 23 and one catching part 21 is attached to the head unit 23 . Then, the mounting head 2 moves the catching portion 21 closer to the substrate T10 while catching the component T20 with the catching portion 21, and mounts the component T20 on the mounting surface T11 of the substrate T10. That is, the mounting head 2 holds the capturing part 21 movably toward the substrate T10.

The imaging section 3 is fixed to the head unit 23 of the mounting head 2 . The imaging unit 3 has an imaging device 31 and an optical system 32 . The imaging unit 3 is, for example, a video camera that captures moving images. The imaging section 3 has an imaging region R1 including at least the tip 210 of the capturing section 21 .

The capturing unit 21 and the imaging unit 3 described above are attached to the head unit 23 , and the capturing unit 21 and the imaging unit 3 move in synchronization with the mounting head 2 .

The control section 5 controls each section of the mounting system 1 . Control unit 5 preferably comprises a computer system. That is, in the control unit 5, a processor such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit) reads and executes a program stored in a memory, thereby performing part or all of the functions of the control unit 5. is realized. The control unit 5 has a processor that operates according to a program as a main hardware configuration. Any type of processor can be used as long as it can implement functions by executing a program. The processor is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or LSI (Large Scale Integration). Here, they are called ICs and LSIs, but the names change depending on the degree of integration, and may be called system LSIs, VLSIs (Very Large Scale Integrations), or ULSIs (Ultra Large Scale Integrations). A field programmable gate array (FPGA), which is programmed after the LSI is manufactured, or a reconfigurable logic device capable of reconfiguring the junction relationships inside the LSI or setting up circuit partitions inside the LSI for the same purpose. can be done. A plurality of electronic circuits may be integrated on one chip or may be provided on a plurality of chips. A plurality of chips may be collectively arranged or distributed.

The control unit 5 is electrically connected to each of the mounting head 2, the imaging unit 3, the driving unit 4, the conveying device 62, the component supply device 63, and the fixed camera 7, for example. The control unit 5 outputs control signals to the mounting head 2 and the driving unit 4, and controls the mounting head 2 and the driving unit 4 so that the component T20 captured by the capturing unit 21 is mounted on the mounting surface T11 of the substrate T10. Control. In addition, the control unit 5 outputs control signals to the imaging unit 3 and the fixed camera 7 to control the imaging unit 3 and the fixed camera 7, and outputs images captured by the imaging unit 3 and the fixed camera 7 to the imaging unit 3. and the fixed camera 7, respectively.

The drive unit 4 is a device that moves the mounting head 2 . In this embodiment, the driving section 4 moves the mounting head 2 within the XY plane. The “XY plane” referred to here is a plane including the X-axis and the Y-axis and perpendicular to the Z-axis. In other words, the driving section 4 moves the mounting head 2 in the X-axis direction and the Y-axis direction. In this embodiment, the imaging unit 3 is fixed to the mounting head 2 , so the driving unit 4 also moves the imaging unit 3 together with the mounting head 2 . In other words, in FIG. 1, the mounting head 2 and the imaging unit 3 are positioned above the substrate T10 positioned in the mounting space of the transport device 62 and above the component supply port 63a of the component supply device 63 by the drive unit 4. move between

Specifically, the driving section 4 has an X-axis driving section 41 and a Y-axis driving section 42, as shown in FIG. The X-axis driving section 41 moves the mounting head 2 straight in the X-axis direction. The Y-axis driving section 42 moves the mounting head 2 straight in the Y-axis direction. The Y-axis drive unit 42 moves the mounting head 2 along the Y-axis together with the X-axis drive unit 41, thereby linearly moving the mounting head 2 in the Y-axis direction. In this embodiment, as an example, each of the X-axis driving section 41 and the Y-axis driving section 42 includes a linear motor, and moves the mounting head 2 by driving force generated by the linear motor upon receiving power supply.

The component supply device 63 supplies the component T20 captured by the capturing section 21 of the mounting head 2 . The component supply device 63 has, for example, a tape feeder that supplies components T20 accommodated in a carrier tape. Alternatively, the component supply device 63 may have a tray on which a plurality of components T20 are placed. The mounting head 2 captures the component T<b>20 from the component supply device 63 with the capturing section 21 .

The transport device 62 is a device that transports the substrate T10. The conveying device 62 is implemented by, for example, a belt conveyor. The transport device 62 transports the substrate T10, for example, along the X-axis. The conveying device 62 conveys the substrate T10 to at least a mounting space below the mounting head 2, that is, a mounting space facing the capturing section 21 in the Z-axis direction. Then, the transport device 62 stops the board T10 in the mounting space until the mounting of the component T20 on the board T10 by the mounting head 2 is completed.

5A to 5D show an outline of production operations performed in the mounting process. First, in FIG. 5A, the capturing portion 21 that does not capture the component T20 is located above the component supply port 63a. Then, the catching unit 21 descends in the vertical direction indicated by the arrow M1 to perform a catching operation of catching (holding) the component T20 positioned at the component supply port 63a. Then, as shown in FIG. 5B, the mounting head 2 moves in the horizontal direction indicated by the arrow M2 so as to approach the substrate T10. That is, the capturing part 21 capturing the component T20 moves closer to the substrate T10. Then, as shown in FIG. 5C, the mounting head 2 stops when the capturing part 21 moves above the substrate T10. Then, as shown in FIG. 5D, the capturing portion 21 descends in the vertical direction indicated by the arrow M3 to perform the mounting operation of mounting the component T20 on the mounting surface T11 of the substrate T10. In addition, in FIG. 5B, the catching part 21 may start to descend while the mounting head 2 is moving in the horizontal direction.

The mounting system 1 may include a backup device, a lighting device, a communication unit, and the like in addition to the above configuration.

The backup device backs up the board T10 transported to the mounting space by the transport device 62 . That is, the substrate T10 transferred to the mounting space by the transfer device 62 is held in the mounting space by the backup device.

The lighting device illuminates the imaging region R<b>1 of the imaging section 3 . The lighting device may be turned on at least at the timing when the image capturing unit 3 captures an image, and for example, emits light in accordance with the image capturing timing of the image capturing unit 3 . In the present embodiment, the image captured by the imaging unit 3 is a full-color moving image, so the illumination device outputs light in the wavelength range of the visible light region, such as white light. In this embodiment, as an example, the illumination device has a plurality of light sources such as LEDs (Light Emitting Diodes). The illumination device illuminates the imaging region R1 of the imaging unit 3 by causing the plurality of light sources to emit light. The illumination device is realized by an appropriate illumination method such as ring illumination or coaxial epi-illumination. The illumination device is fixed to the mounting head 2 together with the imaging unit 3, for example.

The communication unit is configured to communicate with a host system directly or indirectly via a network, repeater, or the like. This allows the mounting system 1 to exchange data with the host system.

(2.3) Mounting Head A more detailed configuration of the mounting head 2 will be described with reference to FIGS. 2, 3, and 4. FIG.

In this embodiment, the mounting head 2 further includes an actuator 22 (see FIG. 3) for moving the catching portion 21, and a head unit 23 for holding the catching portion 21 and the actuator 22, in addition to the catching portion 21. have. In the mounting system 1 according to the present embodiment, one capture section 21 and one actuator 22 are attached to one head unit 23 . Thus, the mounting head 2 can pick up one component T20.

The capture unit 21 is, for example, a suction nozzle. The catching unit 21 is controlled by the control unit 5 and can switch between a catching state of catching (holding) the component T20 and a released state of releasing (releasing the catching) of the component T20. However, the catching unit 21 is not limited to the suction nozzle, and may be configured to catch (hold) the component T20 by pinching (picking) the component T20, for example, like a robot hand.

As for the capturing of the component T20 by the capturing unit 21, the mounting head 2 operates by being supplied with air pressure (vacuum) as power. In other words, the mounting head 2 switches between the captured state and the released state of the capturing section 21 by opening and closing a valve on a pneumatic (vacuum) supply path connected to the capturing section 21 .

The actuator 22 linearly moves the catching portion 21 in the Z-axis direction. Further, the actuator 22 rotates the catching portion 21 in a rotational direction (hereinafter referred to as "the θ direction") about an axis along the Z-axis direction. In this embodiment, as an example, the actuator 22 is driven by a driving force generated by a linear motor to move the catching portion 21 in the Z-axis direction. Regarding the movement of the capturing part 21 in the θ direction, the actuator 22 is driven by a driving force generated by a rotary motor. On the other hand, as described above, the mounting head 2 is linearly moved in the X-axis direction and the Y-axis direction by the drive unit 4 . As a result, the catching portion 21 included in the mounting head 2 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction by the driving portion 4 and the actuator 22 .

As an example, the head unit 23 is made of metal and has a rectangular parallelepiped shape. The head unit 23 holds the capturing part 21 and the actuator 22 by assembling the capturing part 21 and the actuator 22 to the head unit 23 . In this embodiment, the capture section 21 is indirectly held by the head unit 23 via the actuator 22 in a state in which it can move in the Z-axis direction and the θ direction. The mounting head 2 moves within the XY plane by moving the head unit 23 within the XY plane by the drive unit 4 .

According to the above-described configuration, the mounting head 2 moves the catching section 21 that has not caught the component T20 so as to approach the component supply port 63a, and performs a catching operation of catching (holding) the component T20 in the component supply device 63. can be done. In addition, the mounting head 2 moves the catching unit 21 closer to the substrate T10 while the mounting system 1 has captured the component T20, and mounts the component T20 on the mounting surface T11 of the substrate T10. It becomes possible to perform the mounting operation.

(2.4) Imaging Unit A more detailed configuration of the imaging unit 3 will be described with reference to FIGS. 2 to 4. FIG.

In this embodiment, the imaging unit 3 is composed of one moving camera 3a that moves together with the mounting head 2 as shown in FIG. 4. As shown in FIG. have. The optical system 32 forms a captured image of the imaging region R<b>1 on the imaging device 31 .

The imaging device 31 is, for example, an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor). The imaging device 31 converts the image formed on the light receiving surface into an electrical signal and outputs the electrical signal.

Optical system 32 includes one or more lenses, mirrors, and the like. As an example in this embodiment, the optical system 32 is implemented by a combination of a plurality of lenses (lens group). The optical system 32 forms an image of the light from the imaging region R1 on the light receiving surface of the imaging device 31 . Note that the optical system 32 is not limited to the configuration described above.

The imaging section 3 is positioned relative to the catching section 21 so that at least the tip (lower end) 210 (see FIG. 4) of the catching section 21 is included in the imaging region R1. Therefore, at least the tip 210 of the capturing section 21 is captured in the image captured by the imaging section 3 .

Specifically, as shown in FIG. 1, the imaging section 3 is arranged below the head unit 23 and on the side of the capturing section 21 in plan view in the Z-axis direction. In this manner, the imaging section 3 is attached to the head unit 23 together with the catching section 21, and the catching section 21 and the imaging section 3 move simultaneously. Therefore, the mounting system 1 can shorten the time required for mounting and improve productivity compared to a configuration in which the capture unit 21 and the imaging unit 3 are moved separately.

Furthermore, the imaging unit 3 has an imaging optical axis AX1 that intersects the Z axis (vertical direction). In other words, the imaging optical axis AX1 extends obliquely with respect to the vertical direction. That is, the imaging unit 3 is fixed to the head unit 23 so that the imaging direction of the imaging unit 3 intersects the vertical direction, and images the capturing unit 21 from obliquely above. Therefore, the imaging unit 3 can capture the behavior of the capturing unit 21 in the horizontal direction and the behavior of the capturing unit 21 in the vertical direction. The horizontal direction is the direction along the XY plane, and the vertical direction is the direction orthogonal to the horizontal direction (direction along the Z-axis).

(2.5) Fixed Camera A more detailed configuration of the fixed camera 7 will be described with reference to FIG.

The fixed camera 7 takes an image of the mounting head 2 moving between the substrate T10 positioned in the mounting space and the component supply port 63a of the component supply device 63 from below. Therefore, the captured image of the fixed camera 7 shows the component T20 captured by the capture unit 21. As shown in FIG. That is, the image captured by the fixed camera 7 contains information on the mutual positional relationship between the capture unit 21 and the component T20, in other words, information on the displacement of the component T20 with respect to the capture unit 21. FIG.

In addition, it is preferable that the fixed camera 7 images the mounting head 2 moving from the component supply port 63a to the substrate T10 from below. In this case, the fixed camera 7 does not always take an image, but takes an image at the timing when the capture unit 21 capturing the part T20 passes above the fixed camera 7 .

Also, the fixed camera 7 may be installed below the component supply port 63a.

Moreover, the mounting system 1 preferably further includes an illumination device that illuminates the imaging area of the fixed camera 7 .

(2.6) Reference Body The reference body 8 is arranged between the fixed camera 7 and the transport device 62 on the top surface of the base 61 . That is, the reference body 8 is provided separately from the mounting head 2 between the fixed camera 7 and the transport device 62 . The reference body 8 is, for example, a cylindrical rod extending upward from the top surface of the base 61 . A tip surface 81 (upper end surface) of the reference body 8 is circular. Here, the base 61 corresponds to the member on which the reference body 8 is provided.

The reference body 8 has a function of a reference point (or marker) for determining positional deviation of the distal end 210 of the capturing section 21 when the determination section 53 performs determination processing described later.

(2.7) Control Section The control section 5 includes a head control section 51 , an image acquisition section 52 , a determination section 53 and an output section 54 .

(2.7.1) Head Control Unit The head control unit 51 controls the mounting head 2 and the driving unit 4 by outputting control signals to the mounting head 2 and the driving unit 4 .

Specifically, the head control unit 51 outputs a horizontal control signal to the driving unit 4 and controls the driving unit 4 to move the mounting head 2 and the imaging unit 3 within the XY plane. The head control unit 51 also outputs a vertical control signal to the actuator 22 and controls the actuator 22 to move the catching unit 21 along the Z axis. Further, the head control unit 51 outputs a rotation control signal to the actuator 22 and controls the actuator 22 to rotate the catching unit 21 in the θ direction.

In particular, the head control unit 51 feedback-controls the driving unit 4 and the actuator 22 based on the captured image of the imaging unit 3 in the capturing operation of capturing the component T20 and the mounting operation of mounting the component T20. The head control unit 51 corrects the capturing position and the mounting position by feedback-controlling the driving unit 4 and the actuator 22 based on the captured image of the imaging unit 3 . As a result, the mounting system 1 can improve the capturing accuracy in the capturing operation and the mounting accuracy in the mounting operation.

(2.7.2) Image Acquisition Unit The image acquisition unit 52 has a function of a communication interface for acquiring (receiving) captured image data from the imaging unit 3 .

Communication between the imaging unit 3 and the image acquisition unit 52 may be either wireless communication or wired communication. Wireless communication is, for example, Wi-Fi (registered trademark) or wireless communication conforming to standards such as low-power wireless (specified low-power wireless) that does not require a license. Wired communication is wired communication via, for example, a twisted pair cable, a dedicated communication line, or a LAN (Local Area Network) cable.

(2.7.3) Determining Unit The determining unit 53 determines positional deviation of the capturing unit 21 based on the captured image of the imaging unit 3 .

Specifically, the determination unit 53 determines the relative position of the tip 210 of the capturing unit 21 and the reference object 8 based on the captured image captured by the imaging unit 3 including the tip 210 of the capturing unit 21 and the reference object 8 in the imaging region R1. A position is detected, and it is determined whether or not the relative position satisfies a predetermined condition. In this embodiment, the relative position is the displacement of the tip 210 of the capturing part 21 with respect to the position of the reference body 8 . Then, the determination unit 53 determines whether or not the displacement of the distal end 210 is within the allowable range. In this case, the predetermined condition used by the determination unit 53 is "the positional deviation is within the allowable range". The mounting system 1 having such a determination unit 53 can accurately determine the positional deviation of the capture unit 21 .

The determination processing of the determination unit 53 will be described below with reference to FIGS. 6A, 6B, 7 and 8. FIG. Note that this determination process may be performed while the mounting system 1 is performing production operations, or may be performed while the mounting system 1 is performing diagnostic operations for maintenance.

FIG. 6A shows the catch 21 in an open state without capturing the part T20. Then, the head control unit 51 executes a predetermined algorithm to control the driving unit 4 to move the mounting head 2 to the target position on the XY plane. A target position is determined in advance corresponding to the position of the reference body 8 . For example, if the drive unit 4 has an encoder for detecting the position of the mounting head 2, the target position is represented by the count value of the encoder.

FIG. 6B shows the mounting head 2 moved to the target position. At this time, the capturing section 21 is positioned above the reference body 8 and the imaging region R1 of the imaging section 3 includes the tip 210 of the capturing section 21 and the reference body 8 . Then, the determination unit 53 detects the relative position after the mounting head 2 has moved to the target position. Since the imaging unit 3 captures an image of the catching unit 21 from obliquely above, the determination unit 53 determines, based on the image captured by the imaging unit 3, the tip 210 of the catching unit 21 and the reference body 8 on the XY plane. Positional deviation can be detected. In this case, the relative position is the positional deviation on the XY plane between the tip 210 of the catching portion 21 and the reference body 8 . In other words, the relative position is the positional deviation between the tip 210 and the reference body 8 in plan view in the Z-axis direction.

Specifically, the catching portion 21 (see FIG. 6B) positioned above the reference body 8 allows the tip 210 to be misaligned as shown in FIG. It falls within the range G1. The permissible range G1 is the inside of a circle centered on the center P1 of the tip surface 81 on the XY plane and having a radius L1. That is, the positional deviation amount W1 of the tip 210 with respect to the center P1 of the tip surface 81 is equal to or less than the threshold value L1. Note that the positional deviation amount W1 is the distance between the center P1 of the tip surface 81 and the tip 210 of the catching portion 21 in plan view (XY plane) viewed from the Z-axis direction. The threshold value L1 is the dimension of the radius of the circular permissible range G1, and is the upper limit value permissible for the positional deviation amount W1.

When the catching portion 21 (see FIG. 6B) positioned above the reference body 8 is in a bad state, the positional deviation of the tip 210 is within the allowable range G1 as shown in FIG. not settled. That is, the positional deviation amount W1 of the tip 210 with respect to the center P1 of the tip surface 81 is larger than the threshold value L1.

It should be noted that the term "malfunction" includes not only abnormalities but also poor conditions. Specifically, the malfunction is a state in which the accuracy of the position control of the catching unit 21 is lowered, and includes distortion of the shaft of the driving unit 4 due to heat generated by a linear motor or the like provided in the driving unit 4 . Malfunction also includes a state in which the accuracy of position control of the catching portion 21 is degraded due to aged deterioration such as wear and distortion of the mechanical structure. In addition, the malfunction includes foreign matter getting caught in the drive unit 4, lack of lubricant, and the like. Malfunctions also include loose bolts.

"Normal" is a state in which the accuracy of position control of the catching unit 21 can be maintained at a predetermined accuracy or higher.

(2.7.4) Output Unit The output unit 54 outputs a signal based on the determination result of the determination unit 53 .

Specifically, if the determination result of the determination unit 53 is that “the positional deviation is not within the allowable range G1,” the output unit 54 outputs a notification signal that notifies that the behavior of the capture unit 21 is unsatisfactory. . The notification signal includes information such as a warning, a comparison result between the positional deviation amount W1 and the threshold value L1, and the cause of the malfunction.

Specifically, the output unit 54 outputs a notification signal to an information terminal such as an equipment monitor, a personal computer, a tablet terminal, or a smart phone used by the administrator. In this case, the notification signal is a signal containing image information and may further contain audio information. This notification signal is a signal that prompts the administrator to perform maintenance on the mounting system 1 . The administrator sees the image information displayed on the information terminal, grasps the state of malfunction, and performs maintenance of the mounting system 1 . That is, the administrator can take appropriate measures to restore the behavior of the capture unit 21 to normal behavior.

Also, the output unit 54 may output a notification signal to the management system. In this case, the management system updates the maintenance scheduler for maintenance of the mounting system 1 based on the notification signal. In other words, the management system can take appropriate measures to restore the behavior of the capture unit 21 to normal behavior.

It should be noted that the output unit 54 may output a notification signal indicating that the behavior of the capture unit 21 is normal if the determination result of the determination unit 53 is "the positional deviation is within the allowable range G1." good. The notification signal includes information indicating that the behavior is normal, information on the comparison result between the amount of positional deviation W1 and the threshold value L1, and the like.

(3) Advantages As described above, the mounting system 1 determines the positional deviation of the capturing unit 21 based on the captured image of the capturing unit 21 that moves (synchronously) with the mounting head 2 . That is, the mounting system 1 can determine the positional deviation of the capturing section 21 during the production operation or the diagnostic operation while using the imaging section 3 that moves in synchronization with the mounting head 2 . In addition, since the reference body 8 provided in the mounting system 1 is used, there is no need to separately prepare a jig for determining positional deviation.

Further, the mounting system 1 can notify the administrator or the management system that the behavior of the catching unit 21 deviates from the normal behavior (preferred behavior) by notifying the determination result of the positional deviation of the catching unit 21. . The term “malfunction” includes not only abnormalities but also poor conditions. In addition, "normal behavior" is behavior that can maintain the positioning accuracy of the position control of the catching portion 21 at a predetermined accuracy or higher. The manager or management system can take measures to restore the behavior of the capture unit 21 to normal behavior when notified that the behavior is unsatisfactory. As a result, the mounting system 1 can prevent the behavior of the capture unit 21 from deviating from the normal behavior, thereby further improving the accuracy of the operation.

Also, conventionally, maintenance of the mounting system has been carried out periodically at a determined cycle. However, with conventional maintenance methods, the frequency of maintenance cannot be reduced, and the burden on operators such as administrators and workers cannot be reduced. In the conventional maintenance method, the maintenance cycle is set to be shorter than the period during which the performance of the mounting system can be ensured so that maintenance can be performed before the deterioration of the performance of the mounting system becomes unacceptable. Therefore, if the operator decides to change the maintenance execution timing, there is a possibility that the performance of the mounting system cannot be maintained.

On the other hand, the mounting system 1 can detect a sign of malfunction based on the positional deviation of the catching unit 21 and instruct the implementation of maintenance at the timing necessary for the mounting system 1 . As a result, since maintenance can be performed at appropriate timing, the frequency of maintenance can be reduced while maintaining the performance of the mounting system 1, and the operator's workload is reduced. In addition, it is possible to prevent the performance of the mounting system 1 from deteriorating excessively due to delays in maintenance.

(4) Mounting Method The mounting method executed by the mounting system 1 described above is summarized in the flow chart of FIG.

The mounting method is to mount the component T20 on the substrate T10. The mounting method includes an imaging step S1, a determination step S2, and an output step S3. In the imaging step S1, the imaging section 3 having the capturing section 21 capable of capturing the component T20 and moving in synchronization with the movable mounting head 2 is provided separately from the tip 210 of the capturing section 21 and the mounting head 2. An imaging region R1 including the reference body 8 is imaged. In determination step S2, the determination unit 53 detects the relative position between the tip 210 of the capturing unit 21 and the reference body 8 based on the captured image of the imaging unit 3, and determines whether the relative position satisfies a predetermined condition. . In the output step S<b>3 , the output section 54 outputs a signal based on the determination result of the determination section 53 .

The mounting method described above can determine the positional deviation of the capturing section 21 while using the imaging section 3 that moves in synchronization with the mounting head 2 .

Moreover, the implementation method can suppress deviation of the behavior of the capture unit 21 from normal behavior by notifying that the behavior is malfunctioning, and can further improve the accuracy of the operation.

Moreover, the mounting method can reduce the frequency of maintenance while maintaining the performance of the mounting system 1, thereby reducing the workload of the operator. In addition, it is possible to prevent the performance of the mounting system 1 from deteriorating excessively due to delays in maintenance.

(5) First Modification FIG. 10 shows a modification of the imaging section 3 .

The imaging unit 3 in FIG. 10 includes two moving cameras 3b and 3c. The moving cameras 3b and 3c are so-called stereo cameras arranged side by side along the Y-axis direction. Therefore, the imaging unit 3 can capture the behavior of the capturing unit 21 in the horizontal direction and the behavior of the capturing unit 21 in the vertical direction.

(6) Second Modification The mounting system 1 may include a plurality of reference bodies 8 .

The shape of the reference body 8 is not limited to a rod, and may be a sphere, a disk, or other shapes. Also, the reference body 8 may be a mark printed or applied to a member such as the base 61 . A mark is, for example, a dot shape, a specific symbol, or a specific figure.

FIG. 11 shows a reference body 8A that is a modified example of the reference body. In FIG. 11 , a rectangular plate-shaped bar member 68 extending in the horizontal direction is installed on the upper surface (top surface) of the base 61 . The reference body 8A is a circular mark provided on the upper surface of the bar member 68 in the shape of a rectangular plate. The reference body 8A may be any of paint printed or applied on the base 61, and recesses and protrusions formed on the base 61. FIG.

The reference body 8 described above may also serve as a thermal correction pole. The thermal correction pole is a rod for correcting positional deviation of the catching part 21 due to distortion of the shaft axis of the drive part 4 due to heat generated by the linear motor or the like provided in the drive part 4 . In this case, the head control unit 51 of the control unit 5 corrects the position control of the mounting head 2 based on the positional deviation amount W1 of the catching unit 21, thereby suppressing the deterioration of the positioning accuracy of the catching unit 21. .

(7) Third Modification The imaging unit 3 does not have to be fixed to the head unit 23 of the mounting head 2 , and the imaging unit 3 is attached to an imaging moving body that moves in synchronization (interlocking) with the mounting head 2 . It may be fixed. That is, the imaging moving body moves in the same direction, at the same distance, and at the same speed as the mounting head 2 .

The permissible range G1 may be other than circular. For example, the allowable range G1 may have an oval shape or a rectangular shape that is long in the X-axis or the Y-axis.

Also, the relative positions of the capturing part 21 and the first target object T1 such as the substrate T10 are not limited to the configuration in which they face each other in the vertical direction along the Z-axis. That is, the relative positions of the capturing part 21 and the first target object T1 may be other configurations such as a configuration in which they face each other in the horizontal direction.

The configurations described in the above embodiments and modifications can be applied in appropriate combination.

(8) Summary The mounting system (1) of the first aspect according to the embodiment mounts the second object (T2) on the first object (T1). A mounting system (1) includes a mounting head (2), an imaging section (3), a reference body (8, 8A), a determination section (53), and an output section (54). The mounting head (2) is movable with a capturing part (21) capable of capturing the second object (T2). The imaging section (3) moves in synchronization with the mounting head (2), and includes at least the tip (210) of the capturing section (21) in the imaging region (R1). The reference bodies (8, 8A) are provided separately from the mounting head (2). A determination unit (53) determines a capturing unit ( 21) and the reference body (8, 8A) are detected, and it is determined whether or not the relative position satisfies a predetermined condition. The output section (54) outputs a signal based on the determination result of the determination section (53).

The mounting system (1) described above can determine the positional deviation of the capturing section (21) while using the imaging section (3) that moves in synchronization with the mounting head (2).

In the mounting system (1) of the second aspect according to the embodiment, in the first aspect, the relative position is the displacement of the tip (210) of the catching part (21) with respect to the position of the reference body (8, 8A). There is, and it is preferable that the determination unit (53) determines whether or not the positional deviation is within the allowable range (G1).

The mounting system (1) described above can accurately determine the positional deviation of the capturing section (21).

The mounting system (1) of the third aspect according to the embodiment preferably further comprises members (61, 68) provided with the reference bodies (8, 8A) in the first or second aspect.

The mounting system (1) described above can implement the reference bodies (8, 8A) used in the determination processing of the determination unit (53).

A fourth aspect of the mounting system (1) according to the embodiment is, in any one of the first to third aspects, a drive unit that drives the mounting head (2) to move the mounting head (2). (4) is preferably further provided. A determination unit (53) detects the relative position when the mounting head (2) moves to the target position corresponding to the position of the reference bodies (8, 8A).

The mounting system (1) described above can accurately detect the relative position between the tip (210) of the capturing part (21) and the reference body (8, 8A).

A mounting system (1) of a fifth aspect according to the embodiment is a head unit (23) to which a capturing section (21) and an imaging section (3) are attached in any one of the first to fourth aspects. ) is preferably further provided. An imaging optical axis (AX1) of the imaging section (3) extends obliquely with respect to the vertical direction.

The mounting system (1) described above can accurately detect the position of the tip (210) of the capturing part (21).

A sixth aspect of the mounting method according to the embodiment mounts the second object (T2) on the first object (T1). The mounting method includes an imaging step (S1), a determination step (S2), and an output step (S3). In the imaging step (S1), an imaging unit (3) having a capturing unit (21) capable of capturing a second object (T2) and moving in synchronization with a movable mounting head (2) moves the capturing unit An imaging region (R1) including the tip (210) of (21) and the reference bodies (8, 8A) provided separately from the mounting head (2) is imaged. A determination step (S2) detects the relative position between the tip (210) of the capturing section (21) and the reference body (8, 8A) based on the captured image of the imaging section (3), and determines whether the relative position satisfies a predetermined condition. Determine whether or not the conditions are met. The output step (S3) outputs a signal based on the determination result of the determination step (S2).

The mounting method described above can determine the positional deviation of the capturing section (21) while using the imaging section (3) that moves in synchronization with the mounting head (2).

REFERENCE SIGNS LIST 1 mounting system 2 mounting head 21 capturing unit 210 tip 23 head unit 3 imaging unit 4 driving unit 53 determining unit 54 output unit 61 base (member)
68 bar member (member)
8, 8A Reference body T1 First object T2 Second object R1 Imaging area W1 Position shift amount L1 Threshold AX1 Imaging optical axis S1 Imaging step S2 Judging step S3 Output step

Claims (6)

A mounting system for mounting a second object on a first object,
a movable mounting head having a capturing portion capable of capturing the second object;
an imaging unit that moves in synchronization with the mounting head and includes at least the tip of the capturing unit in an imaging area;
a reference body provided separately from the mounting head;
The imaging unit detects a relative position between the tip of the capturing unit and the reference object based on an imaged image captured by including the tip of the capturing unit and the reference object in the imaging area, and the relative position meets a predetermined condition. A determination unit that determines whether or not the condition is satisfied;
and an output unit that outputs a signal based on the determination result of the determination unit. the relative position is a positional deviation of the tip of the capturing part with respect to the position of the reference body;
The mounting system according to claim 1, wherein the determination unit determines whether the positional deviation is within an allowable range. 3. The mounting system according to claim 1, further comprising a member provided with the reference body. further comprising a driving unit for driving the mounting head to move the mounting head,
4. The mounting system according to any one of claims 1 to 3, wherein the determination section detects the relative position when the mounting head moves to a target position corresponding to the position of the reference body. Further comprising a head unit to which the capturing unit and the imaging unit are attached,
5. The mounting system according to any one of claims 1 to 4, wherein an imaging optical axis of said imaging unit extends obliquely with respect to a vertical direction. A mounting method for mounting a second object on a first object,
An imaging unit having a capturing unit capable of capturing the second object and moving in synchronization with a movable mounting head moves a tip of the capturing unit and a reference body provided separately from the mounting head. an imaging step of imaging an imaging region including
a determination step of detecting the relative position between the tip of the capturing section and the reference body based on the captured image of the imaging section and determining whether the relative position satisfies a predetermined condition;
an output step of outputting a signal based on the determination result of the determination step.

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