JP2024066869A - Component mounting method and component mounting system - Google Patents

Abstract

The present invention aims to improve mounting accuracy while miniaturizing a head.
[Solution] The component mounting method performs a capture operation to capture a component 100 supplied from a component supply device 5, and also performs a mounting operation to mount the component 100 captured by the capture operation on a board 200. In the component mounting method, when a head 2 having a capture unit 21 capable of capturing the component 100 moves to at least one of a first operation position to perform the capture operation and a second operation position to perform the mounting operation, an image of an object is captured at a first imaging position by a single imaging unit 22, and an image of the object is captured at a second imaging position. In the component mounting method, the capture unit 21 is moved in a direction approaching the object based on position information of the object acquired from a first captured image at the first imaging position and a second captured image at the second imaging position.
[Selected Figure] Figure 1

Description

This disclosure relates generally to a component mounting method and a component mounting system, and more specifically to a component mounting method and a component mounting system for mounting components on a substrate.

Patent document 1 describes a component mounting device that includes a mounting head and a motor drive unit that drives the mounting head. The mounting head has a suction nozzle, an optical system, and a camera module. The optical system is a stereo optical system. The camera module is a stereo camera that has multiple cameras, and measures the three-dimensional position of the pattern of component mounting positions on a printed circuit board via the stereo optical system with the suction nozzle directly above the component mounting positions. The motor drive unit corrects the position of the mounting head based on the measurement results from the camera module.

JP 2014-216621 A

In the component mounting device (component mounting system) described in Patent Document 1, the camera module is a stereo camera, which improves the mounting accuracy of electronic components on a printed circuit board. However, there is a problem in that the mounting head (head) becomes larger as the camera module (imaging unit) becomes larger.

The objective of this disclosure is to provide a component mounting method and component mounting system that can improve mounting accuracy while miniaturizing the head.

A component mounting method according to one aspect of the present disclosure is a component mounting method that performs a capture operation and a mounting operation. The capture operation is an operation of capturing a component supplied from a component supply device. The mounting operation is an operation of mounting the component captured by the capture operation on a board. When the head moves to at least one of a first operating position and a second operating position, a single imaging unit captures an image of an object at a first imaging position and captures an image of the object at a second imaging position. The head has a capture unit capable of capturing the component. The first operating position is a position at which the capture operation is performed. The second operating position is a position at which the mounting operation is performed. The second imaging position is a position different from the first imaging position. The capture unit is moved in a direction approaching the object based on position information of the object acquired from a first captured image at the first imaging position and a second captured image at the second imaging position.

A component mounting system according to one aspect of the present disclosure is a component mounting system that performs a capture operation and a mounting operation. The capture operation is an operation of capturing a component supplied from a component supply device. The mounting operation is an operation of mounting the component captured by the capture operation on a board. The component mounting system includes a head. The head has a single imaging unit and a capture unit. When the head moves to at least one of a first operating position and a second operating position, the imaging unit captures an image of an object at a first imaging position and captures an image of the object at a second imaging position. The first operating position is a position at which the capture operation is performed. The second operating position is a position at which the mounting operation is performed. The second imaging position is a position different from the first imaging position. The capture unit moves in a direction approaching the object based on position information of the object acquired from a first captured image at the first imaging position and a second captured image at the second imaging position.

The component mounting method and component mounting system according to one aspect of the present disclosure make it possible to improve mounting accuracy while miniaturizing the head.

FIG. 1 is a schematic configuration diagram of a component mounting system according to the first embodiment. FIG. 2 is a perspective view showing a main part of the component mounting system in a capturing operation. FIG. 3 is a perspective view showing a main part of the component mounting system during a mounting operation. FIG. 4 is a block diagram of the component mounting system. 5A and 5B are schematic diagrams showing an example of a first image captured by an imaging unit of the component mounting system according to the first embodiment, and a second image captured by the imaging unit of the component mounting system according to the second embodiment. 6A and 6B are schematic diagrams showing another aspect of the first image captured by the imaging unit of the component mounting system according to the comparative example, and another aspect of the second image captured by the imaging unit of the component mounting system according to the comparative example. 7A and 7B are schematic diagrams showing a first image and a second image captured by the imaging section of the component mounting system, respectively. FIG. 8 is a schematic diagram showing a method for calculating a distance to an object in the component mounting system. FIG. 9 is a flowchart showing the operation of the component mounting system. 10A to 10D are schematic diagrams showing the operation of the component mounting system. 11A to 11D are schematic diagrams showing the operation of the component mounting system according to the second embodiment.

The component mounting method and component mounting system according to the first and second embodiments will be described below with reference to the drawings. The figures described in the first and second embodiments below are schematic diagrams, and the ratios of the sizes and thicknesses of the components do not necessarily reflect the actual dimensional ratios. Furthermore, the configurations described in the first and second embodiments below are merely examples of the present disclosure. The present disclosure is not limited to the first and second embodiments below, and various modifications are possible depending on the design, etc., as long as the effects of the present disclosure can be achieved.

(Embodiment 1)
(1) Overview First, an overview of a component mounting method and a component mounting system 1 according to the first embodiment will be described with reference to FIG.

The component mounting method according to the first embodiment is a method for mounting (attaching) a component 100 captured by a capture unit 21 onto a board 200. More specifically, the component mounting method is a method for performing a capture operation in which the capture unit 21 captures a component 100 supplied from a component supply device 5, and a mounting operation in which the component 100 captured by the capture unit 21 in the capture operation is mounted onto the board 200.

The component mounting method described above is used in the manufacturing of various products such as electronic devices and automobiles in facilities such as factories, laboratories, offices, and educational facilities.

In the field of component mounting (including electronic components) using the component mounting method described above, for example, a stereo camera may be used to improve mounting accuracy. In this case, mounting accuracy can be improved by using a stereo camera to capture images of the target object from multiple directions, but there is a problem in that the head becomes large because multiple cameras are mounted on the head. Furthermore, the movement mechanism for moving the head also becomes large because it requires the driving force and rigidity to move the head, which results in a problem in that the entire device becomes large.

In addition, lasers, for example, may be used to improve mounting accuracy. In this case, for example, mounting accuracy can be improved by measuring the distance to the board at multiple measurement points on the board, but travel time is required for the measurements, which can be a factor in reducing productivity.

In the component mounting method according to the first embodiment, in order to solve the above-mentioned problem, when the head 2 moves to at least one of the first operation position P1 (see FIG. 10A) and the second operation position P2 (see FIG. 10D), the single imaging unit 22 images the target object 20 at the first imaging position P3 (see FIG. 10B) and also images the target object 20 at the second imaging position P4 (see FIG. 10C). The head 2 has a capture unit 21 capable of capturing the component 100. The first operation position P1 is a position where the above-mentioned capture operation is performed. The second operation position P2 is a position where the above-mentioned mounting operation is performed. The second imaging position P4 is a position different from the first imaging position P3. In addition, in the component mounting method, the capture unit 21 is moved in a direction approaching the target object 20 based on the position information of the target object 20 acquired from the first image Im1 (see FIG. 7A) at the first imaging position P3 and the second image Im2 (see FIG. 7B) at the second imaging position P4.

In the component mounting method according to the first embodiment, the first captured image Im1 at the first imaging position P3 and the second captured image Im2 at the second imaging position P4 are acquired by a single imaging unit 22. Therefore, it is possible to reduce the size of the head 2 compared to the case where the first captured image and the second captured image are acquired using a stereo camera, for example. In addition, in the component mounting method according to the first embodiment, the position information of the object 20 is acquired from the first captured image Im1 at the first imaging position P3 and the second captured image Im2 at the second imaging position P4 different from the first imaging position P3. Therefore, it is possible to accurately acquire the position information of the object 20, similar to the case where a stereo camera is used. As a result, it is possible to improve the mounting accuracy of the component 100 on the board 200. That is, according to the component mounting method according to the first embodiment, it is possible to improve the mounting accuracy while miniaturizing the head 2.

The component mounting method according to the first embodiment is executed by a component mounting system 1 as shown in FIG. 1 as an example. In other words, the component mounting system 1 is one aspect for realizing the above-mentioned component mounting method. The component mounting system 1 according to the first embodiment is a system that executes the above-mentioned capture operation and executes the above-mentioned mounting operation. As shown in FIG. 1, the component mounting system 1 includes a head 2. The head 2 has a single imaging unit 22 and a capture unit 21. When the head 2 moves to at least one of the first operation position P1 and the second operation position P2, the imaging unit 22 captures an image of the object 20 (see FIG. 5A) at the first imaging position P3 and captures the object 20 at the second imaging position P4. The capture unit 21 moves in a direction approaching the object 20 based on the position information of the object 20 acquired from the first captured image Im1 at the first imaging position P3 and the second captured image Im2 at the second imaging position P4.

As shown in FIG. 1, the component mounting system 1 used for mounting (mounting) the components 100 on the board 200 includes a head 2, a drive unit 3, a control device 4, a plurality of component supply devices 5, a transport device 6, a fixed camera 7, and a stand 8. The plurality of component supply devices 5 have tape feeders attached in a line in the X-axis direction (perpendicular to the paper surface of FIG. 1) to a feeder base 111 of a dolly 11 connected to the stand 8. Each of the plurality of component supply devices 5 pitch-feeds the carrier tape 121 supplied from the reel 12, and supplies the components 100 held on the carrier tape 121 to the component supply port 51. The reel 12 is held on the dolly 11. The transport device 6 has a pair of conveyor mechanisms 61 extending in the X-axis direction on the stand 8, and transports the board 200 in the X-axis direction to position it in a predetermined mounting space. The fixed camera 7 is attached to the stand 8 and captures an image of the upper side. The stand 8 is fixed to a structure 300. The structure 300 is, for example, the floor surface of a factory.

The head 2 has a capture unit 21 capable of capturing the component 100. The capture unit 21 is, for example, a suction nozzle, and captures the component 100 in a state in which it can be released (i.e., released from capture). The component mounting system 1 lowers the capture unit 21 so that it approaches the component supply port 51 of the component supply device 5, and causes the capture unit 21 to capture the component 100. In addition, with the capture unit 21 capturing the component 100, the component mounting system 1 lowers the capture unit 21 so that it approaches the board 200, and attaches (mounts) the component 100 to the board 200.

Here, component mounting system 1 mainly comprises a computer system having one or more processors and one or more memories. In other words, the component mounting method according to embodiment 1 is used on a computer system (component mounting system 1). In other words, the component mounting method can also be embodied as a program.

(2) Details (2.1) Premise In the first embodiment, a case will be described in which the component mounting system 1 is used for manufacturing electronic devices in a factory. A typical electronic device has various circuit boards, such as a power supply circuit and a control circuit. In manufacturing these circuit boards, as an example, a solder application process, a mounting process, and a soldering process are performed in this order. In the solder application process, cream solder is applied (or printed) to a board (including a printed wiring board). In the mounting process, components (including electronic components) are mounted (attached) to the board. In the soldering process, for example, the board on which the components are mounted is heated in a reflow furnace to melt the cream solder and perform soldering.

In the first embodiment, as an example, a case where the component mounting system 1 is used to mount the component 100 by surface mount technology (SMT) will be described. That is, the component 100 is a surface mount component (SMD: Surface Mount Device), and is mounted by being placed on the mounting surface 201 of the board 200. However, this is not the only example, and the component mounting system 1 may be used to mount the component 100 by insertion mount technology (IMT: Insertion Mount Technology). In this case, the component 100 is a component for insertion mounting having lead terminals, and is mounted on the mounting surface 201 of the board 200 by inserting the lead terminals into holes in the board 200. That is, in this disclosure, "mounting a component on a board" includes placing a component on the mounting surface of the board and inserting the lead terminals of the component into holes in the board.

The "imaging optical axis" in this disclosure is the optical axis for the images (first captured image Im1 and second captured image Im2 described below) captured by the imaging unit 22, and is the optical axis determined by the imaging element and optical system that constitute the imaging unit 22. In other words, the straight line connecting the center of the light receiving surface of the imaging element and the part within the imaging region R1 (see FIG. 5A) that is imaged at the center of the light receiving surface of the imaging element through the optical system is the imaging optical axis Ax1 (see FIGS. 2 and 3) of the imaging unit 22.

In the present disclosure, the captured image of the imaging unit 22 includes a still image (still image) and a video (moving image). Furthermore, "video" includes a captured image composed of a plurality of still images obtained by stop motion photography or the like. The captured image of the imaging unit 22 does not have to be the data output from the imaging unit 22 itself. For example, the captured image of the imaging unit 22 may be appropriately compressed as necessary, converted into another data format, or processed to cut out a portion of the captured image of the imaging unit 22, or to adjust the focus, brightness, or contrast. In the first embodiment, as an example, the captured image of the imaging unit 22 is a full-color video.

In the following, as an example, three mutually orthogonal axes, the X-axis, the Y-axis, and the Z-axis, are set, and the axes parallel to the surface of the substrate 200 are the "X-axis" and "Y-axis", and the axis parallel to the thickness direction of the substrate 200 is the "Z" axis. Furthermore, one of the two directions along the Z-axis is the upward direction, and the other is the downward direction. For example, when the capture unit 21 faces the substrate 200, the substrate 200 is located below the capture unit 21. Note that the X-axis, the Y-axis, and the Z-axis are all imaginary axes, and the arrows indicating "X", "Y", and "Z" in the drawings are merely indicated for the purpose of explanation, and none of them have any substance. Furthermore, these directions are not intended to limit the directions when the component mounting system 1 is in use.

The component mounting system 1 is also connected to pipes for circulating cooling water, cables for supplying power, and pipes for supplying air pressure (including positive pressure and vacuum), but in embodiment 1, these are omitted from the illustration as appropriate.

(2.2) Overall Configuration Next, each component of the component mounting system 1 according to the first embodiment will be described with reference to Fig. 1 to Fig. 6. The component mounting system 1 according to the first embodiment executes a capture operation to capture a component 100 supplied from a component supply device 5, and executes a mounting operation to mount the component 100 captured in the capture operation on a board 200.

As shown in Figs. 1 to 4, the component mounting system 1 according to the first embodiment includes a head 2. The component mounting system 1 further includes a drive unit 3, a control device 4, a plurality of component supply devices 5, a transport device 6, and a fixed camera 7. However, the drive unit 3, the control device 4, the plurality of component supply devices 5, the transport device 6, and the fixed camera 7 are not essential components of the component mounting system 1. In other words, all or some of the drive unit 3, the control device 4, the plurality of component supply devices 5, the transport device 6, and the fixed camera 7 do not have to be included as components of the component mounting system 1.

Furthermore, in Figures 2 and 3, only the head 2 and the drive unit 3 are illustrated, and other components of the component mounting system 1 are omitted as appropriate. Also, in Figures 5A, 5B, 6A, and 6B, the mounting unit 202 as the object 20 is hatched with dots to distinguish it from the other mounting units 202 as the object 20, but these dots do not indicate a cross section. Furthermore, Figures 5A, 5B, 6A, and 6B are images of the images shown in Figures 7A and 7B inverted and viewed from the vertical direction (Z-axis direction).

(2.2.1) Head The head 2 has at least one capturing portion 21. In the first embodiment, the head 2 has one capturing portion 21. The head 2 moves (lowers) the capturing portion 21 so as to approach the capturing position P7 (see FIG. 1), and causes the capturing portion 21 to capture the component 100 located at the capturing position P7. In addition, with the capturing portion 21 capturing the component 100, the head 2 moves (lowers) the capturing portion 21 so as to approach the mounting position P8 (see FIG. 1) on the mounting surface 201 of the board 200, and mounts (mounts) the component 100 at the mounting position P8. In other words, the head 2 holds the capturing portion 21 so as to be movable toward the capturing position P7 and the mounting position P8.

In addition to the capture unit 21, the head 2 further has a single (one) imaging unit 22. That is, the head 2 has a single imaging unit 22 and the capture unit 21. The imaging unit 22 is fixed to the head 2 as shown in Figs. 2 and 3. The imaging unit 22 includes an imaging element and an optical system. The imaging unit 22 is, for example, a video camera that captures moving images. For example, as shown in Figs. 5A and 5B, the imaging unit 22 captures an imaging region R1 including the object 20 at a first imaging position P3, and also captures an imaging region R1 including the object 20 at a second imaging position P4.

More specifically, when the head 2 moves to the second operation position P2 (see FIG. 10D), the imaging unit 22 images the object 20 at the first imaging position P3 and also images the object 20 at the second imaging position P4. The object 20 is the mounting portion 202 on the board 200 on which the component 100 captured by the capture unit 21 is mounted. The mounting portion 202 is, for example, a pad or land formed on the mounting surface 201 of the board 200. When the head 2 moves to the second operation position P2, the imaging unit 22 images the mounting portion 202 at the first imaging position P3 and also images the mounting portion 202 at the second imaging position P4. That is, in the component mounting method according to the first embodiment, when the head 2 moves to the second operation position P2, the imaging unit 22 images the mounting portion 202 at the first imaging position P3 and also images the mounting portion 202 at the second imaging position P4.

2 and 3, the imaging unit 22 is attached to the head body 24 (described later) with its orientation adjusted so that the imaging optical axis Ax1 of the imaging unit 22 is in the vertical direction (Z-axis direction). In other words, the imaging optical axis Ax1 of the imaging unit 22 is parallel to the normal direction (Z-axis direction) of the substrate 200 as shown in FIG. 3.

In addition to the capturing unit 21 and the imaging unit 22, the head 2 further includes an actuator 23 for moving the capturing unit 21, and a head body 24 (see Figures 2 and 3) that holds the capturing unit 21 and the actuator 23. In the first embodiment, one head body 24 holds one each of the capturing unit 21, the imaging unit 22, and the actuator 23. This allows the head 2 to hold one component 100.

The capturing unit 21 is, for example, a suction nozzle. The capturing unit 21 is controlled by the control device 4 and is switchable between a suction state in which the component 100 is suctioned (held) and a release state in which the component 100 is released (released from suction). However, the capturing unit 21 is not limited to a suction nozzle, and may be configured to capture (hold) the component 100 by gripping (picking) it like a robot hand, for example. That is, "capturing a component" in this disclosure includes both suctioning the component and gripping the component.

When the capturing unit 21 captures the part 100, the head 2 operates by receiving air pressure (vacuum) as a power source. In other words, the head 2 switches the capturing unit 21 between an adsorption state and a release state by opening and closing a valve on the air pressure (vacuum) supply path connected to the capturing unit 21.

The capture unit 21 moves in a direction approaching the object 20 based on position information of the object 20 acquired from the first captured image Im1 at the first imaging position P3 and the second captured image Im2 at the second imaging position P4. More specifically, when the head 2 moves to the second operating position P2, the capture unit 21 moves in a direction approaching the mounting unit 202 based on position information of the mounting unit 202 acquired from the first captured image Im1 (see FIG. 7A) captured at the first imaging position P3 and the second captured image Im2 (see FIG. 7B) captured at the second imaging position P4.

The actuator 23 moves the capture unit 21 linearly in the Z-axis direction. Furthermore, the actuator 23 rotates the capture unit 21 in a rotational direction (hereinafter referred to as the "θ direction") around an axis along the Z-axis direction. In the first embodiment, as an example, the actuator 23 drives the capture unit 21 by a driving force generated by a linear motor when moving the capture unit 21 in the Z-axis direction. Furthermore, the actuator 23 drives the capture unit 21 by a driving force generated by a rotary motor when moving the capture unit 21 in the θ direction.

On the other hand, as described below, the head 2 moves linearly in the X-axis direction and the Y-axis direction by the drive unit 3. As a result, the capture unit 21 included in the head 2 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction by the drive unit 3 and the actuator 23.

The head body 24 is, as an example, made of metal and formed into a rectangular parallelepiped shape that is long in the X-axis direction. The capture unit 21, the imaging unit 22, and the actuator 23 are assembled to the head body 24, so that the head body 24 holds the capture unit 21, the imaging unit 22, and the actuator 23. In the first embodiment, the capture unit 21 is indirectly held by the head body 24 via the actuator 23 in a state in which it can move in the Z-axis direction and the θ direction. The head 2 moves within the X-Y plane as the head body 24 is moved within the X-Y plane by the drive unit 3.

According to the above-mentioned configuration, the head 2 can move (lower) the capture portion 21 so as to approach the capture position P7 (see FIG. 1), and can cause the capture portion 21 to capture the component 100 located at the capture position P7. In addition, with the component 100 captured (adsorbed) by the capture portion 21, the head 2 can move (lower) the capture portion 21 so as to approach the mounting position P8 (see FIG. 1) on the mounting surface 201 of the board 200, and can mount (mount) the component 100 at the mounting position P8.

(2.2.2) Driving Unit The driving unit 3 is a device that moves the head 2. In the first embodiment, the driving unit 3 moves the head 2 in the XY plane. The "XY plane" here is a plane that includes the X-axis and the Y-axis and is perpendicular to the Z-axis. That is, the driving unit 3 moves the head 2 in the X-axis and Y-axis directions. In the first embodiment, since the imaging unit 22 is fixed to the head 2, the driving unit 3 also moves the imaging unit 22 together with the head 2 in the X-axis and Y-axis directions. In FIG. 1, the driving unit 3 moves the head 2 between above the component supply port 51 of the component supply device 5 and above the board 200 positioned in the mounting space of the transport device 6.

Specifically, as shown in Figs. 2 to 4, the drive unit 3 has an X-axis drive unit 31 and a Y-axis drive unit 32. The X-axis drive unit 31 moves the head 2 linearly in the X-axis direction. The Y-axis drive unit 32 moves the head 2 linearly in the Y-axis direction. The Y-axis drive unit 32 moves the head 2 linearly in the Y-axis direction by moving the head 2 together with the X-axis drive unit 31 along the Y-axis. In the first embodiment, as an example, each of the X-axis drive unit 31 and the Y-axis drive unit 32 includes a linear motor, and moves the head 2 by a driving force generated by the linear motor when power is supplied.

(2.2.3) Control Device The control device 4 controls each part of the component mounting system 1. The control device 4 can be realized, for example, by a computer system having one or more processors and one or more memories. That is, the control device 4 functions as the control device 4 (including the image processing unit 41 described later) by executing a program recorded in one or more memories of the computer system by one or more processors. The program is pre-recorded in the memory of the control device 4 here, but may be provided through a telecommunication line such as the Internet, or may be recorded and provided in a non-transitory recording medium such as a memory card. The control device 4 includes, for example, an FPGA (Field-Programmable Gate Array). The control device 4 is held on a stand 8 as shown in FIG. 1.

The control device 4 is electrically connected to, for example, each of the head 2, the drive unit 3, the multiple component supply devices 5, the transport device 6, and the fixed camera 7. The control device 4 outputs a control signal to the head 2 and the drive unit 3, and controls the head 2 and the drive unit 3 so that the capture unit 21 captures the component 100 and mounts the component 100 captured by the capture unit 21 on the mounting surface 201 of the board 200. The control device 4 also outputs a control signal to the imaging unit 22 and the fixed camera 7 fixed to the head 2, and controls the imaging unit 22 and the fixed camera 7, and obtains images captured by the imaging unit 22 and the fixed camera 7 from the imaging unit 22 and the fixed camera 7, respectively.

The control device 4 also outputs a control signal to the multiple component supply devices 5, and controls the multiple component supply devices 5 so that the components 100 are positioned at each component supply port 51. The control device 4 also outputs a control signal to the transport device 6, and controls the transport device 6 so that the board 200 is positioned in the mounting space.

As shown in FIG. 4, the control device 4 has an image processing unit 41. The image processing unit 41 processes the first information and the second information. The first information is information included in the first measurement frame F1 (see FIG. 5A) generated in the first captured image Im1, specifically, the position information of the object 20 in the first measurement frame F1. That is, the first measurement frame F1 is an area including the object 20 in the first captured image Im1. The second information is information included in the second measurement frame F2 (see FIG. 5B) generated in the second captured image Im2, specifically, the position information of the object 20 in the second measurement frame F2. That is, the second measurement frame F2 is an area including the object 20 in the second captured image Im2. In the example of FIG. 5A and FIG. 5B, the object 20 is the mounting part 202 on the board 200. And the first information is the position information of the mounting part 202 in the first captured image Im1, and the second information is the position information of the mounting part 202 in the second captured image Im2. The location information includes distance information, which will be described later. Distance information will be explained in more detail in the section "(3) Calculation of Distance Information" below.

The image processing unit 41 extracts the mounting parts 202 as the object 20 based on the first captured image Im1 or the second captured image Im2. More specifically, the image processing unit 41 extracts, for example, the mounting parts 202 whose entire outer edges are detected by edge detection as the object 20. In the example of FIG. 5A, the image processing unit 41 extracts, as the object 20, two mounting parts 202 (parts with dot hatching) that are entirely included among the six mounting parts 202 included in the first captured image Im1.

Here, as shown in FIG. 6A, the image processing unit 41 can extract, as the object 20, two mounting parts 202 that are included in their entirety out of the six mounting parts 202 included in the first captured image Im1. However, as shown in FIG. 6B, if the second captured image Im2 includes the four mounting parts 202 in their entirety, it becomes difficult for the image processing unit 41 to extract the above-mentioned two mounting parts 202 as the object 20.

Therefore, as shown in FIG. 5A and FIG. 5B, it is preferable that the image processing unit 41 generates a first measurement frame F1 in the first captured image Im1 and generates a second measurement frame F2 in the second captured image Im2. That is, it is preferable that the component mounting method generates a first measurement frame F1 and a second measurement frame F2. More specifically, the image processing unit 41 generates the first measurement frame F1 so as to include two mounting parts 202 extracted based on the first captured image Im1 (see FIG. 5A). In addition, the image processing unit 41 generates the second measurement frame F2 in the second captured image Im2 based on the position of the first measurement frame F1 generated in the first captured image Im1 and the movement amount of the head 2 (first distance D1 described later). That is, in the component mounting method according to the first embodiment, the second measurement frame F2 is generated based on the position of the first measurement frame F1 in the first captured image Im1 and the movement amount of the head 2. The movement amount of the head 2 corresponds to the distance between the first captured position P3 and the second captured position P4. The second measurement frame F2 is generated in the second captured image Im2 so as to include the two mounting sections 202, as shown in FIG. 5B.

More specifically, in the example of Figures 5A and 5B, the head 2 including the imaging unit 22 is moving to the right. As a result, the object 20 (the two mounting units 202) imaged by the imaging unit 22 moves to the left in the second captured image Im2. Therefore, the image processing unit 41 generates a second measurement frame F2 in the second captured image Im2 at a position where the first measurement frame F1 in the first captured image Im1 has been moved to the left by the amount of movement of the head 2.

The image processing unit 41 processes the first information as described above. The first information is the coordinates of the center point C1 of the first measurement frame F1 as shown in FIG. 5A. As described above, the first measurement frame F1 is an area including the two mounting parts 202 as the object 20, and the center point C1 is also the center point of the two mounting parts 202. The image processing unit 41 calculates the coordinates of the center point C1 of the first measurement frame F1 as the first information. The center point C1 is the intersection of the center line L1 of the first measurement frame F1 in the first direction and the center line L2 of the first measurement frame F1 in the third direction. The first direction is the movement direction of the head 2, for example, the Y-axis direction. The third direction is a direction perpendicular to the first direction, for example, the X-axis direction.

The image processing unit 41 also processes the second information as described above. The second information is the coordinates of the center point C2 of the second measurement frame F2, as shown in FIG. 5B. As described above, the second measurement frame F2 is an area including the two mounting parts 202 as the object 20, and the center point C2 is also the center point of the two mounting parts 202. The image processing unit 41 calculates the coordinates of the center point C2 of the second measurement frame F2 as the second information. The center point C2 is the intersection of the center line L3 of the second measurement frame F2 in the first direction and the center line L4 of the second measurement frame F2 in the third direction.

Then, the control device 4 moves the capture unit 21 in a direction approaching the target object 20 based on the position information of the target object 20 calculated by the image processing unit 41. That is, in the component mounting method according to the first embodiment, the capture unit 21 is moved in a direction approaching the target object 20 based on the position information of the target object 20 calculated by the image processing unit 41.

(2.2.4) Component Supply Device The component supply device 5 supplies the components 100 captured by the capture unit 21 of the head 2. As an example, the component supply device 5 has a tape feeder that supplies the components 100 accommodated in the pockets 122 (see FIG. 2) of the carrier tape 121. As shown in FIG. 2, the carrier tape 121 is formed in a long strip shape in the Y-axis direction, and a plurality of pockets 122 are provided at equal intervals along the longitudinal direction. Each of the plurality of pockets 122 accommodates one component 100. The component supply device 5 moves the components 100 to the component supply port 51 by feeding the carrier tape 121 in the Y-axis direction by the tape feeder. Note that the component supply device 5 may have a tray on which a plurality of components 100 are placed, instead of or together with the tape feeder. The component supply device 5 may have a bulk feeder instead of or together with the tape feeder.

(2.2.5) Conveying Device The conveying device 6 is a device that conveys the board 200. The conveying device 6 has a pair of conveyor mechanisms 61, for example, as shown in FIG. 1. The conveying device 6 conveys the board 200 in the X-axis direction (a direction perpendicular to the paper surface of FIG. 1) by the pair of conveyor mechanisms 61. The conveying device 6 conveys the board 200 to a mounting space at least below the head 2, that is, facing the capture unit 21 in the Z-axis direction. Then, the conveying device 6 stops the board 200 in the mounting space until the head 2 completes mounting of the components 100 on the board 200.

(2.2.6) Fixed Camera Fixed camera (component recognition camera) 7 captures an image from below of head 2 moving between above component supply port 51 of component supply device 5 and above board 200 positioned in the mounting space. Therefore, the image captured by fixed camera 7 shows component 100 captured by capture unit 21. In other words, the image captured by fixed camera 7 contains information on the relative positions of capture unit 21 and component 100, in other words, information on the deviation of component 100 from capture unit 21.

It is preferable that the fixed camera 7 captures an image of the head 2 moving from the component supply port 51 to the board 200 from below. In this case, the fixed camera 7 does not capture images all the time, but captures images when the capture unit 21 capturing the component 100 passes above the fixed camera 7. The fixed camera 7 may also be installed below the component supply port 51. The component mounting system 1 may further include an illumination device that illuminates the imaging area of the fixed camera 7.

(2.2.7) Others In addition to the above configuration, the component mounting system 1 may include, for example, a lighting device and a communication unit.

The lighting device illuminates the imaging region R1 (see Figs. 5A and 5B) of the imaging unit 22. The lighting device only needs to be turned on at least when the imaging unit 22 captures an image, and for example, emits light in accordance with the imaging timing of the imaging unit 22. In the first embodiment, the captured image of the imaging unit 22 is a full-color video, so the lighting device outputs light in the wavelength range of the visible light region, such as red or blue. In the first embodiment, as an example, the lighting device has multiple light sources such as LEDs (Light Emitting Diodes). The lighting device illuminates the imaging region R1 of the imaging unit 22 by emitting light from these multiple light sources. The lighting device is realized by an appropriate lighting method, such as a diffuse type or oblique type. For example, the lighting device is fixed to the head 2 together with the imaging unit 22.

The communication unit is configured to communicate with the control device 4 directly or indirectly via a network or a repeater, etc. This allows the component mounting system 1 to exchange data with the control device 4.

(3) Calculation of Distance Information Next, a method of calculating distance information based on the first captured image Im1 captured at the first imaging position P3 and the second captured image Im2 captured at the second imaging position P4 will be described with reference to Figs. 7A, 7B, and 8. The distance information is information indicating the distance between the focal positions Fo1 and Fo2 of the imaging unit 22 and the object 20 in the second direction at the first imaging position P3 and the second imaging position P4, and is specifically the fourth distance D4 as shown in Fig. 8. The second direction is a direction perpendicular to the first direction, which is the moving direction of the head 2, and is, for example, the Z-axis direction. That is, the second direction is a direction perpendicular to both the first direction and the third direction.

When the first captured image Im1 (see FIG. 7A) captured at the first imaging position P3 and the second captured image Im2 (see FIG. 7B) captured at the second imaging position P4 are synthesized, a synthesized image Im3 as shown in FIG. 8 is obtained. The first distance D1 in FIG. 8 is the distance between the first imaging position P3 and the second imaging position P4 in the first direction (e.g., the Y-axis direction). In other words, the first distance D1 is the movement distance (movement amount) of the head 2 from the first imaging position P3 to the second imaging position P4. The first distance D1 can be obtained, for example, by a linear encoder attached to the above-mentioned linear motor. The second distance D2 in FIG. 8 is the distance from the imaging unit 22 to the focal positions Fo1 and Fo2 of the imaging unit 22 in the second direction (e.g., the Z-axis direction). The third distance D3 in FIG. 8 is the distance between the object 20 in the first captured image Im1 and the object 20 in the second captured image Im2.

In FIG. 8, the first triangle tr1 and the second triangle tr2 are similar. Therefore, the relationship of equation (1) holds between the first distance D1, the second distance D2, the third distance D3, and the fourth distance D4.

Therefore, the fourth distance D4 is calculated using formula (2).

That is, the fourth distance D4 (distance information) is the product of the first distance D1, which is the distance between the first imaging position P3 and the second imaging position P4 in the first direction, and the second distance D2, which is the distance from the imaging unit 22 to the focal positions Fo1 and Fo2 in the second direction, divided by the third distance D3, which is the distance between the object 20 in the first captured image Im1 and the object 20 in the second captured image Im2.

In this way, according to the component mounting method of embodiment 1, by simply capturing the first captured image Im1 and the second captured image Im2 using a single imaging unit 22, it is possible to accurately calculate the distance from the focal positions Fo1 and Fo2 of the imaging unit 22 to the target object 20, as with a stereo camera.

(4) Component Mounting Method Next, a component mounting method according to the first embodiment will be described with reference to Fig. 9 and Fig. 10A to Fig. 10D. In the first embodiment, the component mounting method is executed by the component mounting system 1 as described above. For this reason, the component mounting method according to the first embodiment will be described below as the operation of the component mounting system 1. Also, the flowchart shown in Fig. 9 is merely an example, and the order of the processes may be changed as appropriate, and processes may be added or deleted as appropriate.

First, as shown in FIG. 10A, the component mounting method involves, with the head 2 positioned at the first operating position P1 where the above-mentioned capturing operation is performed, lowering the capturing unit 21 in the vertical direction indicated by the arrow M11, and capturing the component 100 located at the component supply port 51 with the capturing unit 21.

Next, as shown in FIG. 10B, the component mounting method involves moving the head 2 in the horizontal direction indicated by the arrow M12 toward the target position while the component 100 is captured by the capture unit 21 (step ST1 in FIG. 9). The target position is, for example, the second operation position P2 (see FIG. 10D) where the above-mentioned mounting operation is performed.

The component mounting method determines whether head 2 is approaching the target position while head 2 is moving (step ST2 in FIG. 9). For example, the component mounting method determines that head 2 is approaching the target position if the distance to the target position in the X-Y plane is less than or equal to a predetermined value, and determines that head 2 is not approaching the target position if the distance is greater than the predetermined value.

In the component mounting method, if head 2 is not approaching the target position (step ST2 in FIG. 9: No), head 2 is moved in the horizontal direction indicated by arrow M12 until head 2 approaches the target position (step ST1 in FIG. 9). In the component mounting method, if head 2 is approaching the target position (step ST2 in FIG. 9: Yes), imaging by imaging unit 22 is started (step ST3 in FIG. 9).

As shown in FIG. 10B, the component mounting method captures the first captured image Im1 including the mounting part 202 on the board 200 at the first imaging position P3 by the imaging unit 22 (step ST4 in FIG. 9). At this time, the component mounting method captures the first captured image Im1 continuously at a predetermined interval by the imaging unit 22. Then, the component mounting method generates the first measurement frame F1 in the first captured image Im1 so as to include the object 20 by the image processing unit 41 (step ST5 in FIG. 9), and then acquires the coordinates of the object 20 included in the first measurement frame F1 (step ST6 in FIG. 9). The coordinates of the object 20 are, for example, coordinates in the first captured image Im1, but may also be, for example, coordinates in the X-Y plane (XY coordinates). The component mounting method links the coordinates of the object 20 and the position information of the head 2 (coordinates of the first imaging position P3) and stores them in the memory of the control device 4. The position information of the head 2 is, for example, an encoder value acquired by a linear encoder attached to the above-mentioned linear motor.

Next, as shown in FIG. 10C, the component mounting method moves the head 2 to the second imaging position P4 in the horizontal direction indicated by the arrow M13, and captures the second image Im2 at the second imaging position P4 with the imaging unit 22 (step ST7 in FIG. 9). Even in this case, the component mounting method continuously captures the second image Im2 with the imaging unit 22 at a predetermined interval. Then, the component mounting method generates a second measurement frame F2 in the second image Im2 in the image processing unit 41 based on the position of the first measurement frame F1 in the first image Im1 and the amount of movement of the head 2 from the first imaging position P3 to the second imaging position P4 (step ST8 in FIG. 9). In other words, the component mounting method generates a second measurement frame F2 in the second image Im2 in the image processing unit 41 at a position where the first measurement frame F1 is offset according to the amount of movement of the head 2. Then, the component mounting method acquires the coordinates of the object 20 included in the second measurement frame F2 in the image processing unit 41 (step ST9 in FIG. 9). In the component mounting method, the coordinates of the target object 20 and the position information of the head 2 (the coordinates of the second imaging position P4) are linked and stored in the memory of the control device 4. The amount of movement of the head 2 can be calculated from the above-mentioned linear encoder value acquired when the head 2 is located at the first imaging position P3 and the above-mentioned linear encoder value acquired when the head 2 is located at the second imaging position P4.

When the first captured image Im1 and the second captured image Im2 are captured (step ST10 in FIG. 9), the image processing unit 41 calculates the fourth distance D4 based on the coordinates of the target object 20 and the position information of the head 2, etc. (step ST11 in FIG. 9). Then, the component mounting method corrects the movement amount of the capture unit 21 in the Z-axis direction based on the fourth distance D4 (step ST12 in FIG. 9). Then, as shown in FIG. 10D, with the head 2 positioned at the second operating position P2, the component mounting method lowers the capture unit 21 in the vertical direction indicated by the arrow M14 to mount the component 100 on the mounting unit 202 on the board 200 (step ST13 in FIG. 9).

Here, in the above-described mounting operation, the first imaging position P3 and the second imaging position P4 are each a position before the head 2 reaches the second operating position P2 (see Figures 10B to 10D). Therefore, it is possible to calculate the fourth distance D4 before the head 2 reaches the second operating position P2. As a result, it is possible to shorten the time required for mounting the component 100 compared to the case where the target object 20 is imaged on both sides of the second operating position P2 in the first direction.

(5) Effects In the component mounting method according to the first embodiment, the first image Im1 at the first imaging position P3 and the second image Im2 at the second imaging position P4 are acquired by a single imaging unit 22. Therefore, it is possible to miniaturize the head 2 compared to the case where the first image and the second image are acquired using a stereo camera, for example. In addition, the component mounting method according to the first embodiment acquires position information of the object 20 from the first image Im1 at the first imaging position P3 and the second image Im2 at the second imaging position P4 different from the first imaging position P3. Therefore, it is possible to accurately acquire position information of the object 20, similar to the case where a stereo camera is used. As a result, it is possible to improve the mounting accuracy of the component 100 on the board 200. That is, according to the component mounting method according to the first embodiment, it is possible to improve the mounting accuracy while miniaturizing the head 2.

Furthermore, in the component mounting method according to the first embodiment, the first imaging position P3 and the second imaging position P4 are each a position before the head 2 reaches the second operating position P2. Therefore, it is possible to calculate the fourth distance D4 before the head 2 reaches the second operating position P2. As a result, it is possible to reduce the time (work time) required to mount the component 100 compared to the case where the target object 20 is imaged on both sides of the second operating position P2 in the first direction.

Furthermore, in the component mounting method according to the first embodiment, it is possible to improve mounting accuracy by simply calculating distance information representing the distance between the focal positions Fo1, Fo2 of the imaging unit 22 in the second direction and the target object 20 at the first imaging position P3 and the second imaging position P4. In particular, in the component mounting method according to the first embodiment, it is necessary to find only the first distance D1, the second distance D2, and the third distance D3, and it is possible to calculate the fourth distance D4 based on a simple formula.

Furthermore, in the component mounting method according to the first embodiment, a first measurement frame F1 is generated in the first captured image Im1, and a second measurement frame F2 is generated in the second captured image Im2. This makes it possible to recognize the imaged object within the first measurement frame F1 and the second measurement frame F2 as the object 20. As a result, it is possible to reduce erroneous detection of the object 20.

Furthermore, in the component mounting method according to embodiment 1, the second measurement frame F2 is generated based on the position of the first measurement frame F1 in the first captured image Im1 and the amount of movement of the head 2. This makes it possible to generate the second measurement frame F2 in the second captured image Im2 simply by shifting the position of the first measurement frame F1 in the first captured image Im1 by the amount of movement of the head 2.

Furthermore, in the component mounting method according to the first embodiment, the imaging optical axis Ax1 of the imaging unit 22 is parallel to the normal direction of the board 200. This makes it possible to calculate the fourth distance D4 with greater accuracy than when the imaging optical axis of the imaging unit is inclined with respect to the normal direction of the board.

(Embodiment 2)
Next, a component mounting method and a component mounting system 1 according to a second embodiment will be described with reference to Figures 11A to 11D. Regarding the component mounting method and the component mounting system 1 according to the second embodiment, the same components as those of the component mounting method and the component mounting system 1 according to the first embodiment will be denoted by the same reference numerals and will not be described.

The component mounting method according to the second embodiment differs from the component mounting method according to the first embodiment in that, when the head 2 moves to the first operating position P1, the single imaging unit 22 images the target object 20 at the first imaging position P5 and also images the target object 20 at the second imaging position P6. That is, the component mounting system 1 according to the second embodiment differs from the component mounting system 1 according to the first embodiment in that, when the head 2 moves to the first operating position P1, the single imaging unit 22 images the target object 20 at the first imaging position P5 and also images the target object 20 at the second imaging position P6.

In the component mounting method according to the second embodiment, when the head 2 moves to the first operating position P1, the single imaging unit 22 images the object 20 at the first imaging position P5 and also images the object 20 at the second imaging position P6. That is, when the head 2 moves to the first operating position P1 where the capture operation is performed, the single imaging unit 22 images the object 20 at the first imaging position P5 and also images the object 20 at the second imaging position P6. The object 20 is a component 100 supplied from the component supply device 5. That is, in the component mounting method, when the head 2 moves to the first operating position P1, the imaging unit 22 images the component 100 at the first imaging position P5 and also images the component 100 at the second imaging position P6.

Next, a component mounting method according to the second embodiment will be described with reference to Figs. 11A to 11D. In the second embodiment, the component mounting method is executed by the component mounting system 1, as in the first embodiment. Therefore, hereinafter, the component mounting method according to the second embodiment will be described as the operation of the component mounting system 1.

As shown in FIG. 11A, the component mounting method involves mounting the component 100 on the mounting portion 202 of the board 200 at the second operating position P2, and then raising the capture portion 21 in the vertical direction indicated by the arrow M21.

Next, as shown in FIG. 11B, the component mounting method moves the head 2 toward the target position in the horizontal direction indicated by the arrow M22. The target position is, for example, the first operation position P1 where the above-mentioned capture operation is performed. When the head 2 approaches the target position, the component mounting method starts imaging by the imaging unit 22. As shown in FIG. 11B, the component mounting method captures a first captured image including the component 100 as the target object 20 with the imaging unit 22 while the head 2 is located at the first imaging position P5. Then, in the component mounting method, the image processing unit 41 generates a first measurement frame in the first captured image, and then acquires the coordinates of the target object 20 within the first measurement frame.

Furthermore, as shown in FIG. 11C, the component mounting method moves the head 2 to a second imaging position P6 in the horizontal direction indicated by the arrow M23, and then captures a second image at the second imaging position P6 with the imaging unit 22. Then, the component mounting method generates a second measurement frame in the second captured image with the image processing unit 41, and then acquires the coordinates of the target object 20 within the second measurement frame.

When the first captured image and the second captured image are captured, the component mounting method uses the image processing unit 41 to calculate a fourth distance D4 (see FIG. 8) based on the coordinates of the target object 20 and the position information of the head 2, etc. Then, the component mounting method corrects the amount of movement of the capture unit 21 in the Z-axis direction based on the fourth distance D4. Then, as shown in FIG. 11D, with the head 2 positioned at the first operating position P1, the component mounting method lowers the capture unit 21 in the vertical direction indicated by the arrow M24, and captures the component 100 placed at the component supply port 51 with the capture unit 21.

Here, in the above-mentioned capture operation, the first imaging position P5 and the second imaging position P6 are each a position before the head 2 reaches the first operating position P1 (see Figures 11B to 11D). Therefore, it is possible to calculate the fourth distance D4 before the head 2 reaches the first operating position P1. As a result, it is possible to shorten the time required to capture the part 100 compared to the case where the target object 20 is imaged on both sides of the first operating position P1 in the first direction.

(Modification)
The first and second embodiments are merely one of various embodiments of the present disclosure. Various modifications of the first and second embodiments are possible depending on the design, etc., as long as the object of the present disclosure can be achieved. In addition, functions similar to those of the component mounting methods according to the first and second embodiments may be embodied in a component mounting system 1, a (computer) program, or a non-transitory recording medium on which a program is recorded, etc.

Below, we list some modified examples of the first and second embodiments. The modified examples described below can be combined as appropriate.

The executing entity of the component mounting system 1 or the component mounting method in the present disclosure includes a computer system. The computer system is mainly composed of a processor and a memory as hardware. The processor executes a program recorded in the memory of the computer system to realize the function of the executing entity of the component mounting system 1 or the component mounting method in the present disclosure. The program may be pre-recorded in the memory of the computer system, provided through an electric communication line, or provided by recording it in a non-transitory recording medium such as a memory card, an optical disk, or a hard disk drive that can be read by the computer system. The processor of the computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). The integrated circuits such as IC or LSI referred to here are called different names depending on the degree of integration, and include integrated circuits called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). Furthermore, a field-programmable gate array (FPGA) that is programmed after the manufacture of the LSI, or a logic device that can reconfigure the connection relationship inside the LSI or reconfigure the circuit partition inside the LSI, can also be adopted as a processor. The multiple electronic circuits may be integrated into one chip, or may be distributed across multiple chips. The multiple chips may be integrated into one device, or may be distributed across multiple devices. The computer system referred to here includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.

In addition, it is not essential for the component mounting system 1 that multiple functions are concentrated in one housing, and the components of the component mounting system 1 may be distributed across multiple housings. Furthermore, at least some of the functions of the component mounting system 1, for example, some of the functions of the control device 4, may be realized by the cloud (cloud computing) or the like.

Conversely, in embodiments 1 and 2, at least some of the functions of the component mounting system 1 that are distributed among multiple devices may be consolidated within a single housing. For example, some of the functions of the component mounting system 1 that are distributed among the head 2 and the control device 4 may be consolidated within a single housing.

The use of component mounting system 1 is not limited to the manufacture of electronic devices in a factory. For example, when component mounting system 1 is used to mount mechanical components on a glass plate, component mounting system 1 performs the task of mounting (attaching) the mechanical components to the glass plate.

In the first embodiment, when the head 2 moves to the second operating position P2, the object 20 is imaged at the first imaging position P3, and the object 20 is imaged at the second imaging position P4 (hereinafter referred to as the "first imaging operation"). In the second embodiment, when the head 2 moves to the first operating position P1, the object 20 is imaged at the first imaging position P5, and the object 20 is imaged at the second imaging position P6 (hereinafter referred to as the "second imaging operation"). In contrast, both the first imaging operation and the second imaging operation may be executed. That is, in the component mounting method, when the head 2 moves to at least one of the first operating position P1 and the second operating position P2, the object 20 is imaged at the first imaging position P3 or P5 by the single imaging unit 22, and the object 20 is imaged at the second imaging position P4 or P6.

In the first embodiment, the imaging optical axis Ax1 of the imaging unit 22 is parallel to the normal direction of the substrate 200, but the imaging optical axis of the imaging unit 22 may be inclined with respect to the normal direction of the substrate 200. In other words, the imaging unit 22 may be configured to capture an image from an oblique direction.

(Aspects)
The present specification discloses the following aspects.

The component mounting method according to the first aspect is a component mounting method that performs a capture operation and also performs a mounting operation. The capture operation is an operation of capturing a component (100) supplied from a component supply device (5). The mounting operation is an operation of mounting the component (100) captured by the capture operation on a board (200). In the component mounting method, when the head (2) moves to at least one of the first operating position (P1) and the second operating position (P2), the single imaging unit (22) captures an image of the target object (20) at the first imaging position (P3, P5) and also captures an image of the target object (20) at the second imaging position (P4, P6). The head (2) has a capture unit (21) capable of capturing the component (100). The first operating position (P1) is a position where the capture operation is performed. The second operating position (P2) is a position where the mounting operation is performed. The second imaging position (P4, P6) is a position different from the first imaging position (P3, P5). In the component mounting method, the capture unit (21) is moved in a direction approaching the object (20) based on position information of the object (20) acquired from the first captured image (Im1) at the first imaging position (P3, P5) and the second captured image (Im2) at the second imaging position (P4, P6).

In this aspect, for example, the first captured image (Im1) at the first imaging position (P3) and the second captured image (Im2) at the second imaging position (P4) are acquired by a single imaging unit (22). Therefore, it is possible to reduce the size of the head (2) compared to the case where the first captured image and the second captured image are acquired using a stereo camera. In addition, in this aspect, for example, the position information of the object (20) is acquired from the first captured image (Im1) at the first imaging position (P3) and the second captured image (Im2) at the second imaging position (P4) different from the first imaging position (P3). Therefore, it is possible to accurately acquire the position information of the object (20) in the same way as when a stereo camera is used. As a result, it is possible to improve the mounting accuracy of the component (100) on the board (200). That is, according to this aspect, it is possible to improve the mounting accuracy while miniaturizing the head (2).

In the component mounting method according to the second aspect, in the first aspect, the first imaging position (P5) and the second imaging position (P6) are each positions before the head (2) reaches the first operating position (P1) in the capture operation. The first imaging position (P3) and the second imaging position (P4) are each positions before the head (2) reaches the second operating position (P2) in the mounting operation.

According to this aspect, it is possible to obtain position information of the target object (20) before the head (2) reaches the first operating position (P1) or the second operating position (P2).

In the component mounting method according to the third aspect, in the first or second aspect, the position information includes distance information representing the distance between the focal position (Fo1, Fo2) of the imaging unit (22) and the target object (20) in a second direction (e.g., Z-axis direction) perpendicular to the first direction (e.g., Y-axis direction) which is the movement direction of the head (2) at the first imaging position (P3, P5) and the second imaging position (P4, P6).

According to this aspect, it is possible to correct the amount of movement of the capture unit (21) based on distance information between the focal position (Fo1, Fo2) of the imaging unit (22) in the second direction and the target object (20).

In the component mounting method according to the fourth aspect, in any one of the first to third aspects, the target object (20) is a component (100) supplied from a component supply device (5). In the component mounting method, when the head (2) moves to the first operating position (P1), the imaging unit (22) images the component (100) at the first imaging position (P5) and also images the component (100) at the second imaging position (P6).

According to this aspect, it is possible to correct the amount of movement of the capture section (21) during the capture operation.

In the component mounting method according to the fifth aspect, in any one of the first to third aspects, the target object (20) is a mounting portion (202) on a board (200) to which a component (100) captured by a capture portion (21) is mounted. In the component mounting method, when the head (2) moves to the second operating position (P2), the imaging portion (22) images the mounting portion (202) at the first imaging position (P3) and also images the mounting portion (202) at the second imaging position (P4).

According to this embodiment, it is possible to correct the amount of movement of the capture section (21) during the mounting operation.

In the component mounting method according to the sixth aspect, in the fifth aspect, the capture unit (21) is moved in a direction approaching the object (20) based on position information of the object (20) calculated by an image processing unit (41) that processes the first information and the second information. The first information is information contained in a first measurement frame (F1) generated in the first captured image (Im1). The second information is information contained in a second measurement frame (F2) generated in the second captured image (Im2).

According to this aspect, it is possible to recognize the imaged object within the first measurement frame (F1) and the second measurement frame (F2) as the object (20).

In the component mounting method according to the seventh aspect, in the sixth aspect, the first measurement frame (F1) is an area including the target object (20) in the first captured image (Im1). The second measurement frame (F2) is generated based on the position of the first measurement frame (F1) in the first captured image (Im1) and the amount of movement of the head (2).

According to this aspect, it is possible to generate the second measurement frame (F2) by shifting the position of the first measurement frame (F1) by the amount of movement of the head (2).

In the component mounting method according to the eighth aspect, in any one of the first to seventh aspects, the imaging optical axis (Ax1) of the imaging unit (22) is parallel to the normal direction (e.g., the Z-axis direction) of the substrate (200).

According to this aspect, it is possible to calculate distance information with greater accuracy than when the imaging optical axis of the imaging unit is not parallel to the normal direction of the substrate.

The component mounting system (1) according to the ninth aspect is a component mounting system (1) that performs a capture operation and also performs a mounting operation. The capture operation is an operation of capturing a component (100) supplied from a component supply device (5). The mounting operation is an operation of mounting the component (100) captured by the capture operation on a board (200). The component mounting system (1) includes a head (2). The head (2) has a single imaging unit (22) and a capture unit (21). When the head (2) moves to at least one of the first operating position (P1) and the second operating position (P2), the imaging unit (22) images an object (20) at a first imaging position (P3, P5) and also images the object (20) at a second imaging position (P4, P6). The first operating position (P1) is a position where the capture operation is performed. The second operating position (P2) is a position where the mounting operation is performed. The second imaging position (P4, P6) is a position different from the first imaging position (P3, P5). The capture unit (21) moves in a direction approaching the object (20) based on position information of the object (20) acquired from the first captured image (Im1) at the first imaging position (P3, P5) and the second captured image (Im2) at the second imaging position (P4, P6).

In this aspect, for example, the first captured image (Im1) at the first imaging position (P3) and the second captured image (Im2) at the second imaging position (P4) are acquired by a single imaging unit (22). Therefore, it is possible to reduce the size of the head (2) compared to the case where the first captured image and the second captured image are acquired using a stereo camera. In addition, in this aspect, for example, the position information of the object (20) is acquired from the first captured image (Im1) at the first imaging position (P3) and the second captured image (Im2) at the second imaging position (P4) different from the first imaging position (P3). Therefore, similar to the case where a stereo camera is used, it is possible to accurately acquire the position information of the object (20), and as a result, it is possible to improve the mounting accuracy of the component (100) on the board (200). That is, according to this aspect, it is possible to improve the mounting accuracy while miniaturizing the head (2).

The configurations according to the second to eighth aspects are not essential to the component mounting method and may be omitted as appropriate.

REFERENCE SIGNS LIST 1 Component mounting system 2 Head 5 Component supply device 20 Target object 21 Capture section 22 Imaging section 41 Image processing section 100 Component 200 Board 202 Mounting section Ax1 Imaging optical axis F1 First measurement frame F2 Second measurement frame Fo1, Fo2 Focal position Im1 First captured image Im2 Second captured image P1 First operation position P2 Second operation position P3, P5 First imaging position P4, P6 Second imaging position

Claims (9)

1. A component mounting method comprising: executing a capture operation for capturing a component supplied from a component supply device; and executing a mounting operation for mounting the component captured by the capture operation on a board,
when a head having a capture unit capable of capturing the component moves to at least one of a first operating position where the capture operation is performed and a second operating position where the mounting operation is performed, an image of an object is captured at a first imaging position by a single imaging unit, and an image of the object is captured at a second imaging position different from the first imaging position;
moving the capturing unit in a direction approaching the object based on position information of the object acquired from a first captured image at the first imaging position and a second captured image at the second imaging position;
Component mounting method. Each of the first imaging position and the second imaging position is
In the capture operation, the head is at a position before the head reaches the first operating position,
In the mounting operation, the head is positioned before reaching the second operating position.
The component mounting method according to claim 1 . The position information includes distance information representing a distance between a focal position of the imaging unit and the object in a second direction perpendicular to a first direction that is a moving direction of the head at the first imaging position and the second imaging position.
The component mounting method according to claim 1 or 2. the target object is the part supplied from the part supply device,
When the head moves to the first operating position, the imaging unit captures an image of the component at the first imaging position and captures an image of the component at the second imaging position.
The component mounting method according to claim 1 or 2. the target object is a mounting portion on the board on which the component captured by the capturing portion is to be mounted,
When the head moves to the second operating position, the imaging unit captures an image of the mounting part at the first imaging position and captures an image of the mounting part at the second imaging position.
The component mounting method according to claim 1 or 2. moving the capturing unit in a direction approaching the object based on the position information of the object calculated by an image processing unit that processes first information included in a first measurement frame generated in the first captured image and second information included in a second measurement frame generated in the second captured image;
The component mounting method according to claim 5 . the first measurement frame is a region including the object in the first captured image,
the second measurement frame is generated based on a position of the first measurement frame in the first captured image and a movement amount of the head.
The component mounting method according to claim 6. The imaging optical axis of the imaging unit is parallel to the normal direction of the substrate.
The component mounting method according to claim 1 or 2. 1. A component mounting system that performs a capture operation to capture a component supplied from a component supply device, and a mounting operation to mount the component captured by the capture operation on a board,
Equipped with a head,
The head is
a single imaging unit that images an object at a first imaging position and images the object at a second imaging position different from the first imaging position when the head moves to at least one of a first operating position where the capturing operation is performed and a second operating position where the mounting operation is performed;
a capture unit that moves in a direction approaching the object based on position information of the object acquired from a first captured image at the first imaging position and a second captured image at the second imaging position,
Component mounting system.

Images