JP6987822B2 - 蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法 - Google Patents

蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法 Download PDF

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Publication number
JP6987822B2
JP6987822B2 JP2019176783A JP2019176783A JP6987822B2 JP 6987822 B2 JP6987822 B2 JP 6987822B2 JP 2019176783 A JP2019176783 A JP 2019176783A JP 2019176783 A JP2019176783 A JP 2019176783A JP 6987822 B2 JP6987822 B2 JP 6987822B2
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Japan
Prior art keywords
heater
support member
container
evaporation source
wire
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JP2019176783A
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English (en)
Japanese (ja)
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JP2021055123A (ja
Inventor
良秋 風間
喜成 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Tokki Corp
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Canon Tokki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Canon Tokki Corp filed Critical Canon Tokki Corp
Priority to JP2019176783A priority Critical patent/JP6987822B2/ja
Priority to KR1020200045920A priority patent/KR20210037507A/ko
Priority to CN202011023409.7A priority patent/CN112575295B/zh
Publication of JP2021055123A publication Critical patent/JP2021055123A/ja
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Publication of JP6987822B2 publication Critical patent/JP6987822B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0202—Switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2019176783A 2019-09-27 2019-09-27 蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法 Active JP6987822B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019176783A JP6987822B2 (ja) 2019-09-27 2019-09-27 蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法
KR1020200045920A KR20210037507A (ko) 2019-09-27 2020-04-16 증발원 장치, 성막 장치, 성막 방법 및 전자 디바이스의 제조방법
CN202011023409.7A CN112575295B (zh) 2019-09-27 2020-09-25 蒸发源装置、成膜装置、成膜方法及电子器件的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019176783A JP6987822B2 (ja) 2019-09-27 2019-09-27 蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2021055123A JP2021055123A (ja) 2021-04-08
JP6987822B2 true JP6987822B2 (ja) 2022-01-05

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JP2019176783A Active JP6987822B2 (ja) 2019-09-27 2019-09-27 蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法

Country Status (3)

Country Link
JP (1) JP6987822B2 (ko)
KR (1) KR20210037507A (ko)
CN (1) CN112575295B (ko)

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5164657A (ja) * 1974-12-03 1976-06-04 Kawasaki Heavy Ind Ltd Herikaruchuubugatanetsukokankino dennetsukanshijitai
JPS5399554A (en) * 1977-02-14 1978-08-31 Kawasaki Heavy Ind Ltd Heat conducting pipe supporting system for helical coil type heat exchanger
JPS5814513Y2 (ja) * 1977-09-08 1983-03-23 株式会社東芝 電子管用ヒ−タ−構体
JPS57201522A (en) * 1981-06-01 1982-12-10 Mitsubishi Electric Corp Cell for vacuum deposition
JPS602190U (ja) * 1983-06-17 1985-01-09 三菱重工業株式会社 熱交換器
JPS62169321A (ja) * 1986-01-21 1987-07-25 Hitachi Ltd 真空蒸着用蒸発源
JPH01226795A (ja) * 1988-03-08 1989-09-11 Fujitsu Ltd 分子線源セル
JPH07253276A (ja) * 1994-03-16 1995-10-03 Tokyo Electron Ltd 熱処理炉及びその製造方法
JP3623587B2 (ja) * 1996-02-20 2005-02-23 出光興産株式会社 真空蒸着装置およびその真空蒸着装置を用いた真空蒸着方法
JP2007224393A (ja) * 2006-02-25 2007-09-06 Seiko Instruments Inc 蒸着源セル、薄膜の製造方法、絞り部材、及び蒸着源加熱ヒータ
TWI565367B (zh) * 2010-06-25 2017-01-01 山特維克熱傳動公司 用於加熱元件線圈之支撐結構
JP2013035710A (ja) * 2011-08-05 2013-02-21 Fujitsu Ltd 成膜装置及び成膜方法
KR20130035710A (ko) 2011-09-30 2013-04-09 삼성전기주식회사 릴레이 펀칭 금형 및 릴레이 펀칭 금형을 이용한 펀칭 방법
KR101390413B1 (ko) * 2012-12-27 2014-04-30 주식회사 선익시스템 증발원 가열 장치
KR20140085092A (ko) * 2012-12-27 2014-07-07 주식회사 선익시스템 증발원 가열 장치
KR101967040B1 (ko) * 2017-02-24 2019-04-10 주식회사 야스 고온 증발원용 히터
CN206916211U (zh) * 2017-06-08 2018-01-23 费勉仪器科技（上海）有限公司 一种超高温蒸发源
CN107190237A (zh) * 2017-06-26 2017-09-22 深圳市华星光电技术有限公司 蒸发源加热系统
CN107686968A (zh) * 2017-08-14 2018-02-13 武汉华星光电半导体显示技术有限公司 蒸镀坩埚及蒸镀系统
JP6595568B2 (ja) * 2017-12-12 2019-10-23 キヤノントッキ株式会社 蒸発源装置及び蒸着装置
CN108728801B (zh) * 2018-05-28 2019-11-12 深圳市华星光电技术有限公司 蒸镀装置及蒸镀方法

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Publication number Publication date
CN112575295A (zh) 2021-03-30
CN112575295B (zh) 2023-04-07
JP2021055123A (ja) 2021-04-08
KR20210037507A (ko) 2021-04-06

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