JP6984106B2 - Position adjustment of component carrier structure by evaluation by combining pad type alignment marker and hole type alignment marker - Google Patents

Description

The present invention relates to a method for locating a component carrier structure, a component carrier structure, a device for locating a component carrier structure, a computer-readable medium, a program element, and a lot consisting of a component carrier.

In the context of improving the product functionality of component carriers with one or more electronic components, increasing the miniaturization of such electronic components, and increasing the number of electronic components mounted on component carriers such as printed circuit boards. An increasingly powerful array-like component or package with several electronic components is utilized. They have multiple contacts or connections, and the spacing between these contacts is even smaller. Removing the heat generated by such electronic components and the component carriers themselves during operation has become an increasingly significant challenge. At the same time, the component carrier should be mechanically robust and electrically reliable so that it can be operated under harsh conditions.

In addition, proper alignment of the components of the component carrier is an issue during manufacturing. For example, when exposing a dry film for patterning the layer structure of a component carrier in production, proper alignment accuracy is important.

An object of the present invention is to enable processing of component carrier structures with high spatial accuracy.

It consists of a method for locating a component carrier structure, a component carrier structure, a device for locating a component carrier structure, a computer-readable medium, a program element, and a component carrier in order to achieve the purpose defined above. Lots are offered.

According to an exemplary embodiment of the invention, a method of locating a component carrier structure is provided with the steps of forming one or more padded alignment markers on and / or inside the component carrier structure. , The stage of forming one or more hole-type alignment markers on and / or inside the component carrier structure, and the alignment information derived based on one or more pad-type alignment markers and one or more hole-type alignment markers. By combining the above, it is provided with a stage of determining the alignment information for adjusting the position of the component carrier structure.

According to another exemplary embodiment of the invention, a component carrier structure is provided, wherein the component carrier structure is a stack (particularly a laminated layer), a stack comprising at least one conductive layer structure and at least one insulating layer structure. It comprises one or more pad-type alignment markers on and / or inside, and one or more hole-type alignment markers on and / or inside the stack.

According to yet another exemplary embodiment of the invention, a device for locating a component carrier structure is provided, the device comprising one or more padded alignment markers on and / or inside the component carrier structure. A detection unit configured to detect and detect one or more hole-type alignment markers on and / or inside the component carrier structure, and one or more pad-type alignments detected. It comprises a marker and a decision unit that determines alignment information based on the detected hole-type alignment marker.

According to yet another exemplary embodiment of the invention, program elements (eg, source code or software routines of executable code) are provided, which may be executed by a processor (such as a microprocessor or CPU). , Adapted to control or execute the method with the above features.

According to yet another exemplary embodiment of the invention, a computer readable medium (eg, CD, DVD, USB stick, floppy disk or hard disk) is provided, which may be executed by a processor (such as a microprocessor or CPU). If so, a computer program adapted to control or execute the method having the above features is stored.

According to yet another exemplary embodiment of the invention, lots are provided that are manufactured on the basis of a component carrier structure consisting of a plurality of component carriers, particularly positioned by the method having the features described above. At least 90% of the lot's component carriers differ by less than 75 μm, especially less than 50 μm, with respect to the distance between the edge pads.

Data processing that can be performed according to embodiments of the present invention can be performed by computer programs, i.e. software, or by using one or more special electronic optimization circuits, i.e. hardware, or hybrid formation, i.e. software components and hardware. It can be achieved by a component.

In the context of the present application, the term "component carrier" refers to any support structure capable of accommodating one or more components on and / or inside to provide mechanical support and / or electrical connectivity. Can be particularly shown. In other words, the component carrier can be configured as a mechanical and / or electronic carrier of the component. In particular, the component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) board. The component carrier can also be a hybrid board that combines different components of the above types.

In the context of the present application, the term "component carrier structure" refers to the component carrier itself (such as a printed circuit board or IC board), or a large body of multiple component carriers (such as a panel or array) or a preform (eg, component carrier) thereof. Can be specifically indicated as either individually obtained during the manufacture of the product or semi-finished product obtained during batch processing.

In the context of the present application, the term "layer structure" may specifically refer to a continuous layer, a patterned layer, or multiple discontinuous islands in a common plane. The layered structure can be insulating and / or conductive.

In the context of the present application, the term "alignment marker" may specifically indicate a structural or physical feature of a component carrier structure, which is the surface of a component carrier structure (particularly a preform of a component carrier such as a printed circuit board). It can be detected, optically inspected, or visually visible on the surface in the area or inside. Alignment markers can be used as the basis for the alignment performed by processing machines that may use the alignment markers, especially in spatial orientation, with respect to the processing of component carrier structures. For example, such alignment markers are optically inspected above and / or inside the component carrier structure to determine the position and / or orientation of the component carrier structure, such as the preform of the component carrier (eg, panel). It can be a through hole or a blind hole or a pad that can be. For example, the number of such holes and pads may be provided as an alignment marker in the edge region of a rectangular component carrier structure such as a panel. Alignment markers may be provided on one or both of the opposing main surfaces and / or inside of the component carrier structure.

In the context of the present application, the term "pad-type alignment marker" is detectable from the outside of the component carrier structure and is formed as a patterning layer element different from the surrounding component carrier structural material, especially in terms of optical properties, on the component carrier structure. Can specifically show the physical structure of. The pad-type alignment marker can be, for example, a separated piece of continuous planar material that can be formed, for example, on an insulating layer structure, eg, based on the patterning of a metal foil and a plated metal layer. In particular, the pad-type alignment marker can be part of a patterned copper layer, such as a patterned copper film on an insulating layer structure such as a prepreg layer (particularly comprising a resin, more specifically optionally reinforced particles. Includes epoxy resin with, more specifically comprising glass fiber or glass spheres). In contrast to the vertical through connections used as vertical conductive paths in component carriers, padded alignment markers can be electrically unconnected, i.e., vertical, such as copper-filled laser vias. It can be formed without connecting to a conductive element that expands to. For example, the pad-type alignment marker can be formed as a reference pattern and, more specifically, can be generated by laser direct imaging (LDI).

In the context of the present application, the term "hole-type alignment marker" may specifically indicate an alignment structure with blind holes or through holes formed in one or more layers or also formed throughout the component carrier structure. .. The hole may be surrounded by a component carrier structural material, the latter of which may form a ring or ring around the hole. Such one or more hole-type alignment markers may be completely empty and covered with an inner surface having a circumferential layer, or may be completely filled with another material. For example, the hole-type alignment marker can be formed as a reference hole surrounded by an annular structure or the like, and more specifically, it can be formed at least partially by laser direct imaging (LDI).

In the context of the present application, the term "lot" may specifically refer to a set of component carriers, some component carriers, or multiple component carriers, all manufactured as part of a batch of component carriers. Such lots can consist of component carriers (such as printed circuit boards) that are all integrally connected in a common panel during the manufacture of lots of component carriers. In another embodiment, the lot's component carriers may be formed on the basis of different panels or as part of different manufacturing batches, but both pad-type alignment markers and hole-type alignment markers. Considering the alignment process performed during the manufacture of the component carriers of the lot to be used, it may have a central tolerance between very small edge pads.

According to an exemplary embodiment of the invention, very high accuracy not only performs the alignment of the component carrier structure as a preform of the component carrier during the manufacturing process based on one type of alignment marker. In contrast, this can be achieved during the manufacture of component carriers by specifically combining the concept of pad-type alignment markers with the concept of hole-type alignment markers. Due to the unique characteristics of the formation and detection of pad-type alignment markers and hole-type alignment markers, the combination of alignment information derived from individual pad-type alignment markers and hole-type alignment markers is synergistically combined and overall. Alignment accuracy can be surprisingly increased.

As a result of such an alignment architecture using complementary alignment information derived from pads and holes, it may be possible to manufacture component carriers with very small tolerances, eg, with respect to the center distance between edge pads. .. The center distance between the edge pads can be expressed as the spatial distance between the edges of each component carrier and the center of the pads formed above and / or inside such component carriers. When combining pad alignments and hole alignments according to an exemplary embodiment of the invention, all or at least the majority of component carriers in lots have very stringent requirements for component carrier accuracy and tolerance of distance between edge pads. But it can be guaranteed to meet.

The alignment architecture described has significant advantages. In particular, if the component carrier structure is a panel for the manufacture of component carriers (such panels may generally have dimensions of 18 x 24 square inches), then the operation or processing of such component carrier structures. Can show significant warpage and other board deformations (eg, sizes of about 100 μm and above), but nevertheless, with the combined use of pad-type alignment markers and hole-type alignment markers for alignment purposes. It may be possible to have high precision. In addition, the position adjustment architecture described may allow the use of appropriate panels. Further, in the case of processing such as X-ray processing, laser processing, and photo processing, high capacity can be obtained. In particular, high accuracy can be combined with the use of high component carrier structures (particularly panels).

Further exemplary embodiments of methods, component carriers, devices, computer-readable media, and program elements are described below.

In a preferred embodiment, the method comprises deriving preliminary alignment information based solely on one or more pad-type alignment markers, or based solely on one or more hole-type alignment markers. Subsequently, the preliminary alignment information may be advantageously improved based on one or more hole-type alignment markers and one or more pad-type alignment markers.

In one alternative of the aforementioned embodiment, the method derives preliminary alignment information only based on one or more pad-type alignment markers, followed by preliminary based on one or more hole-type alignment markers. It has a stage to improve the accuracy of alignment information. Very advantageously, the alignment may be performed primarily on the basis of one or more pad-type alignment markers and, when used alone, may provide higher accuracy than one or more hole-type alignment markers. After completing this determination of alignment information based solely on the padded alignment marker, the alignment accuracy is significantly improved by additionally considering the complementary alignment information derived from one or more hole alignment markers. obtain. Therefore, when the pad-type alignment marker is used alone, relatively rough alignment may be possible, and subsequently this accuracy may be significantly reduced by considering one or more hole-type alignment markers as well. ..

In another alternative of the aforementioned embodiment, the method derives preliminary alignment information only based on one or more hole-type alignment markers, followed by preliminary based on one or more pad-type alignment markers. It has a stage to improve the accuracy of alignment information. In such an embodiment, it may be possible to obtain guidelines for alignment by first adjusting the position based on one or more hole-type alignment markers. To improve accuracy, the results of this first stage alignment can then be improved by also considering complementary alignment information derived from one or more padded alignment markers.

In one embodiment, the method is alignment information derived from one or more pad-type alignment markers (eg, alignment coordinates) and alignment information derived from one or more hole-type alignment markers (eg, alignment coordinates). It is provided with a step of deriving the alignment information by averaging and. It has been found that the alignment accuracy can also be improved by calculating the alignment information derived only from the pad-type alignment and particularly from the hole-type alignment, especially the average of the alignment positions.

In one embodiment, the method derives alignment information as a weighted composite of alignment information derived from one or more pad-type alignment markers and alignment information derived from one or more hole-type alignment markers. Be prepared. Weighting individual alignment results (eg, alignment coordinates) from pad-type and hole-type alignments can further improve accuracy. In particular, it has been found that pad-type alignments, when used alone, can have higher alignment accuracy than hole-type alignments when used alone. This fact can be reflected by weighting the pad alignment and the alignment information derived from the hole alignment, for example, by weighting the pad-type alignment information that is stronger than the hole-type alignment. For example, the weighting factor for pad-type alignment information can be in the range of 60% to 80%, and the weighting factor for hole-type alignment can be in the range of 20% to 40% (where the sum of the weighting factors). Is 1).

In one embodiment, the method comprises forming a pad-type alignment marker and / or a hole-type alignment marker into each of a plurality of layer structures of a stack of component carrier structures, in particular each of the stacked layer structures of the component carrier structure. .. In particular, the pads used as pad-type alignment markers can be individually formed in each layer or at least a plurality of different layers. Therefore, the formation of pad-type alignment markers may continue after stacking additional layered structures on the stack. Hole-type alignment markers can also be formed individually in each layer, while forming one hole-type alignment marker that extends through multiple layers, or forms a stack of the entire layer of component carrier structure to be processed. Such hole formation can be performed by mechanical drilling, laser drilling, etc., in contrast to pad formation, where one or more pad-type alignment markers. It can be performed by attaching the conductive layer to the insulating layer structure and patterning the conductive layer to remove its material so as to maintain.

In one embodiment, at least a portion of the pad-type alignment marker and / or at least a portion of the hole-type alignment marker is formed in the corners of the component carrier structure to determine alignment information for the entire component carrier structure. If the pads and / or holes used for alignment are formed in the corners of the component carrier structure, their mutual distance is large and the derivable alignment information can be accurate. In addition, the multiple corners of the component carrier structure can often be sufficiently separated from the active area (ie, the area of the component carrier structure corresponding to the actually manufactured component carrier at the completion of the manufacturing procedure), resulting in , High yields can be combined with high precision. Given the alignment markers at multiple corners of the overall component carrier structure (eg, a rectangular component carrier structure such as a panel), global alignment can be performed by the combination of pad and hole alignments described.

In one embodiment, at least a portion of the pad-type alignment marker and / or at least a portion of the hole-type alignment marker is a component carrier structure partition, particularly a component carrier, in order to determine alignment information regarding only the component carrier structure partition. It is formed at multiple corners of a quarter of the structure. Therefore, the concept of the combination of pad alignment and hole alignment described can be applied in favor of the concept of partition alignment. In such a concept, the component carrier structure can be effectively classified into a plurality of spatial parts such as four quarters of the panel type component carrier structure. Pad-type alignment markers and hole-type alignment markers can also be formed in the corner areas of each partition, i.e., within the entire component carrier structure. Thus, alignment may also be performed specifically for a particular region of the component carrier structure currently being processed, or specifically for a particularly critical region of the component carrier structure.

In one embodiment, the alignment marker is located outside the active region of the component carrier structure. In the context of the present application, the term "active region" of a component carrier structure may refer to a region of the component carrier structure that corresponds to an easily manufactured component carrier. For example, when manufacturing a PCB type component carrier, the panels may be classified into a plurality of arrays, and each array may be classified into a plurality of printed circuit boards. When the pad-type alignment marker and the hole-type alignment marker are formed outside the region corresponding to the finally obtained PCB type component carrier, in contrast to this, for example, in the frame structure of the panel, the component carrier. Production yields are not reduced by the alignment concept, so high precision and high throughput can be combined.

In one embodiment, the method comprises the steps of repositioning and processing the component carrier structure based on the determined alignment information. Accordingly, the device may include a processing unit configured to process the component carrier structure based on the determined alignment information. In other words, detecting the alignment marker may make it possible to determine location information regarding the component carrier structure. This information, which may be shown as alignment information, is then, for example, the formation of conductive tracks in the horizontal plane of the component carrier structure and / or (eg, copper foil lamination, copper foil patterning, via formation, and eg plating, etc. Can be used to accommodate subsequent processing of component carrier structures, such as the formation of vertical conductive through-connections (formed by a combination of via filling with conductive materials).

In one embodiment, the processing of the component carrier structure is at least one in the group consisting of imaging (particularly photoimaging), solder masking, screen printing, and mechanical processing of the component carrier structure (particularly the assembly process). To prepare for. These and other procedures require a strict alignment of the component carrier structure being processed.

In one embodiment, the treatment is a feature of the component carrier structure formed based on the determined alignment information (especially the diameter of the pad and / or the edge pad between the edge of the component carrier structure and the center of the pad. The stage of detecting (eg, optically) and / or storing (eg, in a database) data about (distance between) and the formed features are at least one predetermined geometric reference (eg, eg). The result of the step of deciding (eg, based on an algorithm that can implement an artificial intelligence element) and the step of deciding whether or not to meet the acceptable dimensions (having dimensions within a predetermined target range). Prepare for the stage of taking appropriate measures accordingly. For example, taking appropriate action implements a self-learning algorithm to increase the probability that at least one predetermined geometric criterion will be met or adhered to in future steps to form a feature. To increase the probability that at least one predetermined geometric criterion will be met or adhered to, to stop the manufacturing procedure, output a warning, in future procedures to form the feature, and. It may be equipped with at least one of a group consisting of providing suggestions to be made to. With such an architecture, proper alignment can be combined with increased accuracy or reliability of manufactured component carriers.

In one embodiment, the component carrier structure is selected from a group consisting of a panel for manufacturing component carriers, an array of multiple component carriers or a preform thereof, and a component carrier holding at least one component. In a preferred embodiment, the PCB panel can be processed with the alignment concept described. If the tendency of the panel to warp and deform frequently is high, it can be dealt with by an appropriate combination of pad-type alignment markers and hole-type alignment markers.

In one embodiment, the device forms one or more pad-type alignment markers on and / or inside the component carrier structure and one or more hole-type alignment markers on and / or inside the component carrier structure. It comprises an alignment marker forming unit configured to perform and to form. According to such an embodiment, the formation of a pad-type alignment marker is to connect a conductive layer (eg, a laminate of copper foil or plating of a copper layer) to a stack of component carrier structural materials, in particular an insulating layer structure such as a prepreg layer. Can be performed by. The conductive layer is then patterned, thereby forming one or more pad-type alignment markers. Vertical blind holes or through holes may be mechanically cut, laser cut, or etched into a stack of component carrier structure layers to form a hole-type alignment marker. ..

In one embodiment, the method is a step of forming a respective cord structure in each of the plurality of layer structures of the component carrier structure, and each of the cord structures is provided with information indicating the manufacturing characteristics of the assigned layer structure. At least one step of forming, and one step of reading at least one of the code structures of at least one previously processed layer structure before processing the individual layer structures of the plurality of layer structures. A step of processing an individual layer structure among a plurality of layer structures is provided in consideration of reading information indicating the manufacturing characteristics of the previously processed layer structure. For example, each code structure may be a QR code (registered trademark) formed by patterning a copper layer constituting one of the above conductive layer structures. For example, the same conductive layer can be used to form cord structures, alignment markers, and functional structures of manufactured component carriers. Information about the manufacturing process of the layered structure of the component carrier structure to which each code structure belongs may be encoded directly in the code structure and / or contains a dataset that can be retrieved from the database based on the code structure. It may be stored in the database. Therefore, by reading the code structure of each layer structure, it is possible to obtain information about the manufacturing process of this layer structure. When subsequently processing another layer structure, information about the previous manufacturing process of the previously produced layer structure can be used to process another layer structure with higher accuracy. Therefore, manufacturing component carriers (eg, printed circuit boards) obtained by separating easily processed component carrier structures can be improved using traceability systems. For such traceability systems, the stored information about the pre-processed layer structure can be encoded in the code structure assigned to each layer structure. For example, in a software-based scheme, the stored information about a pre-manufactured layer structure may be processed in such a way that the current processed layer structure can be manufactured with the pre-manufactured layer structure in mind. Therefore, the entire system can be more precisely aligned and manufactured.

In one embodiment, the method comprises the step of processing an individual layer structure of a plurality of layer structures using the alignment information. In other words, the step of processing the later processed layer structure is from one or more earlier processed layer structures and the above alignment structure derived from the combination of hole-type alignment and pad-type alignment. It can be carried out in consideration of the manufacturing process information of. This may make it possible to obtain excellent accuracy in the conductive and / or insulating structures of easily manufactured component carriers.

In one embodiment, the method is performed using a laser direct imaging (LDI) device. For example, the LDI device may form an alignment marker forming unit or may form a part thereof. At least one of the alignment markers can be formed to include patterning the conductive layer structure. For example, this may be achieved preferably by laser direct imaging (LDI) or by alternative photoimaging. The LDI may use a component carrier structure with a photosensitive surface that is placed under a controllable laser. The control unit scans the component carrier structure into a raster image. Matching a raster image with a predetermined metal pattern corresponding to each alignment marker in the component carrier structure allows the laser to be manipulated to generate an image directly on the component carrier structure. Advantageously, highly accurate alignment markers can be formed by LDI even in harsh environments.

In one embodiment, one or more additional types of alignment markers may be added, such as skiving marks, corners (eg, rectangular electrical devices), and laser targets. This can further improve the alignment accuracy. The alignment marker can be any reference used as a reference point or measurement point, i.e., any object placed in the field of view of the imaging system seen in the generated image. It can be placed in or over the imaged object. Such alignment markers can also be used to adjust the processing device to the component carrier structure being processed.

In one embodiment, the component carrier structure comprises a stack of at least one insulating layer structure and at least one conductive layer structure. For example, the component carrier structure can be a laminate of the mentioned insulating layer structure and conductive layer structure specifically formed by applying mechanical pressure and / or thermal energy. The stacks mentioned can provide a plate-shaped component carrier structure that can provide a large mounting surface for additional components, but nevertheless be very thin and compact.

In one embodiment, the component carrier structure is formed as a plate. This contributes to a compact design, but nevertheless, the component carrier structure provides a great basis for mounting components on it. Moreover, as an example of electronic components specifically incorporated, bare dies can be easily incorporated into thin plates such as printed circuit boards due to their small thickness. Also, the plate-shaped component carrier structure ensures a short electrical connection path and thus suppresses signal distortion during transport.

In one embodiment, the component carrier generated based on the component carrier structure is configured as one of a group consisting of a printed circuit board, a board (particularly an IC board), and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) is formed by laminating several conductive layer structures with several insulating layer structures, eg, by applying pressure and / or supplying thermal energy. The plate-shaped component carriers to be made may be particularly indicated. As a preferred material for PCB technology, the conductive layer structure may be made of copper, while the insulating layer structure may comprise a resin and / or glass fiber, a so-called prepreg or FR4 material. Various conductive layer structures are formed by forming through-holes through the laminate, for example by laser drilling or mechanical drilling, and filling them with a conductive material (particularly copper), thereby forming vias as through-hole connections. By doing so, they can be connected to each other in the desired way. Apart from one or more components that can be incorporated into a printed circuit board, the printed circuit board is typically configured to contain one or more components on one or both of the opposing surfaces of a plate-shaped printed circuit board. Will be done. These can be connected to their respective main surfaces by soldering. The dielectric portion of the PCB may be made of a resin containing reinforcing fibers (such as glass fiber).

In the context of the present application, the term "board" may specifically refer to a small component carrier having substantially the same size as the components (especially electronic components) mounted on it. More specifically, the substrate is an electrical connection or network carrier, and a component carrier equivalent to a printed circuit board (PCB), however, for connections that are laterally and / or vertically arranged. It can be understood as being extremely dense. The lateral connection may be, for example, a conductive electrical path, while the vertical connection may be, for example, a perforated hole. These lateral and / or vertical connections are located within the board and are particularly electrical to the contained or uncontained components of an IC chip with a printed circuit board or intermediate printed circuit board (such as an exposed die). Can be used to provide a positive and / or mechanical connection. Therefore, the term "board" also includes "IC board". The dielectric portion of the substrate may be made of a resin containing reinforcing particles (such as a reinforcing sphere, particularly a glass sphere).

The substrate or interposer may be at least a glass layer, a silicon (Si) layer, or a photoimaging or dryetchable organic material layer, such as an epoxy-based build-up material (such as an epoxy-based build-up film), or. , Polyimide, polybenzoxazole, or a layer of a polymer compound such as benzocyclobutene, or may consist of them.

In one embodiment, each of the above one or more insulating layer structures is a resin (such as a reinforced or non-reinforced resin, eg an epoxy resin or a bismaleimide triazine resin), a cyanate ester, a polyphenylene derivative, a glass (particularly,). Glass fiber, multi-layer glass, materials such as glass), prepreg materials (FR-4 or FR-5, etc.), polyimides, polyamides, liquid crystal polymers (LCPs), epoxy build-up films, polytetrafluoroethylene (Teflon) It comprises at least one of the group consisting of (registered trademark)), ceramics, and metal oxides. For example, reinforcing materials such as webs, fibers or spheres made of glass (multilayer glass) can be used as well. Prepregs, especially FR4, are usually preferred for rigid PCBs, but other materials, especially epoxy-based build-up films for substrates, may be used as well. For high frequency applications, high frequencies such as polytetrafluoroethylene, liquid crystal polymers and / or cyanate ester resins, low temperature cofired ceramics (LTCC) or other low DK materials, ultra-low DK materials, or ultra-low DK materials. The material can be mounted on the component carrier as an insulating layer structure.

In one embodiment, each of the above one or more conductive layer structures comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium and tungsten. Copper is usually preferred, but other materials or their coatings, in particular those coated with superconducting materials such as graphene, are possible as well.

At least one component may be surface mounted and / or incorporated into the component carrier structure, in particular non-conductive inlays, conductive inlays (with metal inlays, preferably copper or aluminum), and the like. It can be selected from the group consisting of heat transfer units (eg, heat tubes), light guide elements (eg, optical waveguides or optical conductor connections), electronic components, or combinations thereof. For example, components include active electronic components, passive electronic components, electronic chips, storage devices (eg DRAM or other data memory), filters, integrated circuits, signal processing components, power management components, optoelectronic interface elements, light emitting diodes, photo Couplers, voltage converters (eg DC / DC converters or AC / DC converters), crypto components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, micro electromechanical systems (MEMS), micros. It can be a processor, a capacitor, a resistor, an inductance, a battery, a switch, a camera, an antenna, a logic chip, and an energy acquisition unit. However, other components may be incorporated into the component carrier. For example, the magnetic element can be used as a component. Such a magnetic element may be a permanent magnet element (ferromagnetic element, antiferromagnetic element, multiferromagnetic element, ferrimagnetic element, for example, a ferrite core) or a paramagnetic element. However, the component may be a board, an interposer, or, for example, an additional component carrier in a board-in-board configuration. The component may be surface mounted on the component carrier and / or embedded within it. In addition, other components, in particular those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment, can also be used as components.

In one embodiment, the component carrier structure is a laminated component carrier. In such embodiments, the component carrier structure is a compound having a plurality of layers that are laminated and connected together by applying pressing force and / or heat.

The above defined and further aspects of the invention are evident from the examples of embodiments described below and are described with reference to these examples of embodiments.

A cross-sectional view of a component carrier structure configured as a panel for manufacturing a PCB type component carrier according to an exemplary embodiment of the present invention is shown, while performing a method of positioning the component carrier structure during processing. It is a figure which shows the pad type alignment marker and the hole type alignment marker generated and detected in. FIG. 1 is a plan view showing a component carrier structure according to an exemplary embodiment of the present invention as shown in FIG. It is a top view which shows the component carrier structure divided into four partitions as shown in FIG. It is a figure which shows the via-pad arrangement of the component carrier structure manufactured by the alignment procedure which concerns on an exemplary embodiment of this invention. It is a figure which shows the increase in density in the alignment of a component carrier structure which concerns on an exemplary embodiment of this invention. It is a figure which shows the increase of the alignment accuracy in the alignment of a component carrier structure which concerns on an exemplary embodiment of this invention. It is a figure which shows the reduction of the footprint in the alignment of a component carrier structure which concerns on an exemplary embodiment of this invention. It is a figure which shows the increase of the alignment accuracy in the alignment of a component carrier structure which concerns on an exemplary embodiment of this invention. It is a figure which shows the apparatus which processes and positions the component carrier structure which concerns on an exemplary embodiment of this invention. It is a figure which shows the lot which has the plurality of component carriers manufactured according to the exemplary embodiment of this invention. FIG. 3 is a cross-sectional view of a component carrier structure according to an exemplary embodiment of the invention, which corresponds to FIG. 1 but additionally includes a cord structure relating to a layered structure for improving the manufacturing process. It is a figure which shows the processing flow of the manufacturing process which uses the cord structure corresponding to FIG. 11 which concerns on an exemplary embodiment of this invention.

The illustration in the drawings is a schematic diagram. Similar or identical elements are provided with the same reference numerals in different drawings.

Before the exemplary embodiments are described in more detail with reference to the drawings, some basic considerations are summarized based on what exemplary embodiments of the invention have been developed. To.

According to an exemplary embodiment of the invention, the determination of alignment information based on pad-type alignment markers is synergistically combined with the determination of alignment information based on one or more hole-type alignment markers.

In a particularly preferred embodiment, the findings are used according to whether the pad alignment when used alone is more accurate than the hole alignment. As a result, the pad alignment can be used alone, i.e., in this first step, according to an exemplary embodiment of the invention to derive preliminary alignment information without considering hole-type alignment markers. Subsequently, the alignment information may be made more accurate and rigorous, or may be improved by considering additional information from the additionally formed hole-type alignment marker. The alignment method also improves the accuracy of the alignment by first determining preliminary alignment information based solely on the hole-type alignment marker and then considering additional pad-type alignment markers, i.e., in reverse order. May be executed.

It has been found that this combination of different types of alignment markers takes into account complementary alignment information and can increase overall accuracy. In other words, hole alignment can be used to protect or verify the results derived from pad alignment and vice versa. As a result of such an improved alignment concept, it may be possible to reduce the tolerance of the critical dimensions of the component carrier, such as the distance from the pad to the edge.

Exemplary embodiments of the present invention provide hybrid alignment methods that can be used particularly favorably in laser direct imaging (LDI) and laser processes. A preferred embodiment provides two different alignment methods, i.e., a combination of pad-type alignment and hole-type alignment, thereby providing a multi-alignment method with excellent alignment accuracy. Such a multi-alignment method may be applied for top-to-bottom alignment or layer-to-layer alignment. By utilizing this means, it may be possible to improve the alignment accuracy by combining hole alignment and pattern alignment with smaller annular rings, where top-to-bottom alignment is also achieved with high accuracy. obtain. As a further advantage, the technique of combining padded alignments with holed alignments further increases density and design flexibility while reducing or even minimizing the footprint of alignment markers on component carrier structures such as PCB panels. I can let you.

An exemplary embodiment of the invention has the advantage that the layer-to-layer alignment tolerance can be obtained with high accuracy, generally between 15 μm and 25 μm. In addition, top-to-bottom alignment can be controlled simultaneously (eg, within 75 μm). In addition, footprints can be reduced or even minimized, and density and design flexibility can be increased. In particular, it may be possible to obtain high accuracy of layer-to-layer alignment and proper top-to-bottom alignment. Very advantageous, the alignment can be performed using an LDI exposure machine.

In particular, the effect of the combination of pad alignment and hole alignment can be particularly significant for RF (radio frequency) component carriers and modular component carriers.

According to embodiments, alignment is performed using a reference hole or hole-type alignment marker (to obtain alignment guidelines) and further position-adjusted with a reference pad or pad-type alignment marker to improve accuracy. good. In particular, layer-to-layer alignment may be performed on the basis of a reference pad or pad-type alignment marker to obtain high accuracy. Hole-type alignment can be applied to ensure that the obtained range does not deviate from the setting.

FIG. 1 shows a cross-sectional view of a component carrier structure 100 configured as a panel for manufacturing a PCB (printed circuit board) type component carrier according to an exemplary embodiment of the present invention, showing a component carrier structure 100 during processing. It is a figure which shows the pad type alignment marker 102 and the hole type alignment marker 104 obtained when performing the method of adjusting the position.

The cross-sectional view of the component carrier structure 100 of FIG. 1 shows a laminated stack 110 composed of a plurality of conductive layer structures 106 and a plurality of insulating layer structures 108. The conductive layer structure 106 may consist of a patterned metal layer (particularly formed on the basis of a laminated copper foil and / or a plated copper layer) and a vertical through connection (such as a copper-filled laser via). By utilizing this means, virtually any desired conductive path can be formed within the component carrier structure 100. The insulating layer structure 108 comprises a resin such as an epoxy resin and may optionally include a reinforcing structure such as glass fiber or glass spheres. As is similarly understood from FIG. 1, the center of the laminated stack 110 is a fully cured prepreg with a core 189, i.e., both of its opposing main surfaces covered with corresponding subsets of layered structures 106, 108. It can be formed by the central structure formed of the material. The stack 110 shown in FIG. 1 can be formed by subsequent lamination of layered structures 106, 108, material removal procedures such as mechanical perforation or copper perforation, and plating procedures to plate the formed holes with copper material.

More generally, the manufacturing procedure for the component carrier structure 100 may comprise an additive method, a subtractive method, a semi-additive method (SAP), and / or an improved semi-additive method (mSAP).

It may be necessary to recognize the exact positioning, dimensions and orientation of the stack 110 in order to perform these and other stages of processing. For example, it is possible that the PCB panel forming the component carrier structure 100 may be subject to solder masking or any other type of alignment that is important. Also, for this purpose, a machine or the like performing a solder mask task strictly recognizes where and in what orientation the component carrier structure 100 is located so that the processing can be performed very accurately. Can be very important.

For this purpose, the pad-type alignment marker 102 is formed based on patterning a metal layer that can be formed as described above. This can be done layer by layer. In other words, each pad-type alignment marker 102 can be formed by patterning each conductive layer structure 106 on each of the insulating layer structures 108 connected by lamination. The individual pad-type alignment marker 102 can be an unconnected metal dot, i.e., a separated metal island surrounded by the dielectric material of the insulating layer structure 108.

The hole-type alignment marker 104 may be formed so that both can be inspected from both the opposing main surfaces 191 and 193 of the component carrier structure 100 by forming through holes 197 that penetrate the entire stack 110. Subsequently, the resulting through-holes 197 can be covered with a copper circumferential hollow cylindrical layer 195. At each layer level, the through holes 197 with the circumferential hollow cylindrical layer 195 may or may not be connected to an optional planar annular layer structure 199 made of, for example, copper.

FIG. 1 shows how the final outer layer is aligned, and each inner layer, including the core layer, can be formed by applying the corresponding alignment method.

To allow for very tight alignment, exemplary embodiments of the invention use a combination of alignments based on the pad-type alignment marker 102 and the hole-type alignment marker 104. As shown in the cross-sectional view of FIG. 1, the pad-type alignment marker 102 and the hole-type alignment marker 104 are attached to the plurality of conductive layer structures 106 and the insulating layer structure 108 of the stacked stack 110 of the component carrier structure 100, and the same thereof. Formed as part. The step of positioning the component carrier structure 100, preferably during the manufacturing process, is at least partially simultaneous with the step of forming the pad-type alignment marker 102 on and / or inside the component carrier structure 100 (eg, a patterning procedure). It is preferred that the component carrier structure 100 may be provided with a step of forming a hole-type alignment marker 104 on and / or inside the component carrier structure 100 (shared).

Then, by combining the alignment information derived based on the pad-type alignment marker 102 and the hole-type alignment marker 104, it may be possible to determine the alignment information for adjusting the position of the component carrier structure 100. A camera or the like may detect the pad-type alignment marker 102 and the hole-type alignment marker 104 on the respective main surfaces 191 and / or 193. The resulting detection data can then be used to determine alignment information.

For example, it may be possible to derive preliminary alignment information based solely on detecting the padded alignment marker 102 (eg, with a camera or the like) and evaluating the detected information or data. Subsequently, the preliminary alignment information obtained can be improved based on detecting the Hall-type alignment marker 104 (eg, with a camera or the like) and evaluating the detected information or data. The detection of the pad-type alignment marker 102 and the hole-type alignment marker 104 may be executed at the same time.

Alternatively, preliminary alignment information is derived based solely on the detection of the hole-type alignment marker 104, followed by consideration of the alignment information obtained by detecting and evaluating the pad-type alignment marker 102. It may also be possible to improve the accuracy of the alignment information.

Therefore, a hierarchical two-step alignment procedure can be performed. Here, only one of the alignment markers 102 or 104 is used to obtain the rough alignment data, subsequently the rough alignment data is the alignment information from the other of the alignment markers 104 or 102 that provides complementary information. The accuracy can be improved or made more accurate by also considering. Compared to conventional methods, such a hierarchical two-step alignment procedure has been found to provide superior results in terms of alignment accuracy.

In yet another embodiment, the method averages the alignment information derived from the pad-type alignment marker 102 and the alignment information derived from the hole-type alignment marker 104 (eg, pad-type alignment and hole-type alignment). By calculating the arithmetic mean of the alignment coordinates obtained from), a step of deriving the alignment information is provided. A further improved alignment method may include deriving the alignment information as a weighted composition of the alignment information derived from the pad-type alignment marker 102 and the alignment information derived from the hole-type alignment marker 104. Since pad alignment when used alone can be considered more accurate than hole alignment, it may be possible to reflect these different individual accuracy levels in different weighting factors for pad alignment and hole alignment. For example, the weighting factor of the alignment information derived from the one or more pad-type alignment markers 102 may be larger than the weighting coefficient (for example, 1/3) of the alignment information derived from the one or more hole-type alignment markers 104. (For example, 2/3).

In FIG. 1, the top-to-bottom alignment is schematically indicated by reference numeral 161. Further, FIG. 2 schematically shows the layer-to-layer alignment by reference numeral 163. Using the alignment architecture described, from layer to layer with high precision (eg, within the range of 1 μm to 30 μm, specifically within the range of 5 μm to 25 μm, more specifically within the range of 15 μm to 25 μm). It may be possible to obtain an alignment tolerance of. In addition, top-to-bottom alignment can be controlled simultaneously (eg, within 75 μm). It may also be possible to significantly reduce the footprint involved in the formation of alignment markers 102, 104 while increasing density and design flexibility.

In one embodiment, an alignment procedure may be performed that implements one, more than, or more than one of the following measurements.

1. 1. First, position adjustment is performed using the reference hole, that is, one or more hole-type alignment markers 104 (to obtain guidelines for position adjustment), and the reference pad, that is, one or more pad-type alignment markers 102 is also positioned. Adjust (to improve accuracy).

2. 2. Multiple calculations may be performed based on hole alignments, ie, alignments using one or more hole-type alignment markers 104, and pattern alignments, ie, alignments using one or more pad-type alignment markers 102 (eg,). By one scan).

3. 3. Layer-to-layer alignment can be achieved on the basis of a reference pad (to obtain high accuracy), ie, one or more pad-type alignment markers 102.

4. Hole alignment, i.e., alignment using one or more hole-type alignment markers 104, may be applied to ensure that the range does not deviate from the setting.

By implementing a multi-alignment method, in particular using an LDI or laser machine, more specifically, the combination of hole alignment and pattern alignment can significantly improve overall alignment accuracy.

After determining the alignment information considering the combination of pad alignment and hole alignment, the dimensional position and orientation of the component carrier structure 100 was determined with high accuracy. Based on this alignment information, the method may continue to process the component carrier structure 100 with respect to the component carrier manufacturing process based on the determined alignment information. For example, such further processing may refer to photoimaging, solder masking, screen printing, mechanical processing in the assembly process, etc. for the component carrier structure 100.

In FIG. 1, the total alignment tolerance is indicated by D, while the layer-to-layer alignment tolerance is indicated by d.

FIG. 2 is a plan view showing a component carrier structure 100 according to an exemplary embodiment as shown in FIG.

FIG. 2 shows that the component carrier structure 100 was divided into four different partitions 114. Dividing the component carrier structure 100 into four partitions 114 can be performed by determining a virtual vertical dividing line 115 and a virtual horizontal dividing line 117, i.e., two orthogonal dividing lines 115 and 117. The dividing lines 115 and 117 are determined to extend outside the active region 116 of the component carrier structure 100, i.e., the region in which the component carrier 150 is formed. Preferably, the alignment is performed individually for each of the partitions 114 and may be referred to as a partition alignment. By utilizing this means, local peculiarities such as local warpage or deformation of the component carrier structure 100 can be considered strictly and individually for each partition 114. However, in addition or alternatives, the alignment as a whole can also be performed on the entire component carrier structure 100 and can be referred to as a global alignment.

As can be seen from FIG. 2, a portion of the pad-type alignment marker 102 and a portion of the hole-type alignment marker 104 are formed at the corner 112 of the component carrier structure 100. Such alignment markers 102, 104 can be used to determine alignment information for the component carrier structure 100 as a whole, i.e., for global alignment.

However, part of the pad-type alignment marker 102 and part of the hole-type alignment marker 104 are formed in the corner 112'of each partition 114 of the component carrier structure 100, where the corner 112'is the component carrier structure as a whole. Not 100 corners. In the embodiments shown, each partition 114 may be associated with a quarter of the component carrier structure 100 and may be represented by a quarter panel. The alignment markers 102, 104 referred to as the latter can be used to determine alignment information for each partition 114 of the component carrier structure 100 only, i.e., for partition alignment.

The alignment markers 102, 104 are located outside the active region 116 of the component carrier structure 100, i.e., after the component carrier structure 100 (eg, the PCB panel) is separated into separate component carriers 150 (compared to the example of FIG. 10) and later. The component carrier 150 (for example, PCB) is arranged in a portion of the component carrier structure 110 to be formed.

FIG. 2 specifically shows the concept of global alignment. In such a concept, two different types of alignment markers 102, 104 are formed inside the corner 112 of the component carrier structure 100, and inside. However, the active region 116 corresponding to the easily manufactured component carrier 150 (eg, the printed circuit board individualized from the panel-type component carrier 100 shown) yields without the alignment markers 102, 104. Can be increased.

FIG. 3 is a plan view showing the component carrier structure 100 divided into four partitions 114 (for example, represented by reference numeral 192 in FIG. 2).

In contrast to FIG. 2, FIG. 3 shows the concept of a divided alignment in which the paneled component carrier 100 shown in FIG. 2 can be effectively separated into different partitions 114, eg, four quarters of a panel. The alignment can then be performed on a partition basis based on the alignment markers 102, 104 at the corner 112'of the partition 114 in order to specifically and locally increase the alignment accuracy for the critical parts of the component carrier structure 100.

The alignment line of the virtual straight line may be determined during the alignment procedure and is shown in FIG. 3 with reference numeral 165.

FIG. 4 is a diagram showing a via-pad arrangement of a component carrier structure 100 manufactured by an alignment procedure according to an exemplary embodiment of the present invention. Vias are designated by reference numeral 167. Corresponding pads are indicated by reference numeral 169. Hole alignment is indicated by reference numeral 171 and pattern alignment is indicated by reference numeral 173.

A hybrid alignment method for laser direct imaging and a laser process according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 4. More specifically, the procedure for calculating the alignment will be described. Before explaining this alignment procedure in more detail, the partition 114 divided into four partitions according to reference numeral 192 in FIG. 2 may be referred to as a reference hole, and the distance parameters X1 and X2 between the respective hole-type alignment markers 104 may be shown. , Y1 and Y2 are referred to again with reference to FIG. More specifically, X1 indicates the horizontal distance between the two upper hole-type alignment markers 104. Accordingly, X2 indicates the horizontal distance between the two lower hole-type alignment markers 104. Further, Y1 indicates the vertical distance between the two hole-type alignment markers 104 on the left side. Accordingly, Y2 indicates the vertical distance between the two hole-type alignment markers 104 on the right side. C1 indicates an intersection between two straight diagonal lines connecting the upper left and lower right hole alignment markers 104 and connecting the upper right and lower left hole alignment markers 104, respectively. Accordingly, C2 indicates (in certain embodiments) an intersection between two straight diagonal lines connecting the upper left and lower right pad type alignment markers 102 and connecting the upper right and lower left pad type alignment markers 102, respectively. .. Details 194 in FIG. 3 show a circle centered on C1 and having a radius of, for example, 50 μm (or any other threshold) around C1.

In component carrier manufacturing techniques, patterning can occur for each layer and via between layers. Alignment addresses challenges to ensure that the pattern is aligned with other layers.

In order to achieve alignment, it is possible to proceed with pattern exposure with reference to the same reference (ie, reference hole or hole-type alignment marker 104). It states that the layer can be positioned within some accuracy, however, the mechanical accuracy is not good enough to meet the requirements for high accuracy (eg, tolerances greater than 50 μm may remain). Can bring results.

It is also possible to refer to patterning from the previous layer (ie, reference pad or pad-type alignment marker 102) to achieve proper alignment. By utilizing this means, relatively high accuracy can be obtained by achieving good alignment (eg, having a tolerance greater than 10 μm) using higher precision CCD equipment. However, it is difficult to ensure what the alignment is for each layer.

Traditionally, pattern alignment requires one of the above methods to be selected, thereby focusing on high precision from layer to layer or total alignment for all layers. If the pattern is not aligned or has a large tolerance, it may be necessary to increase the buffer for the design (eg, larger annual rings, wider lines or spaces).

To overcome such drawbacks, an exemplary embodiment of the invention may combine alignments using both a reference hole or hole-type alignment marker 104 and a reference pad or pad-type alignment marker 102. When executing the calculation method according to the exemplary embodiment of the present invention, the following processing can be executed.

a) The machine can read the reference hole or hole-type alignment marker 104, calculate the distances X1, X2, Y1, Y2 between them and determine the center C1 (as defined above). ..

b) Further, the machine can read the pad-type alignment marker 102 and determine the center C2.

c) When performing this hybrid method of combining hole alignment and pattern alignment, C2 can be within the tolerance of C1 ± 50 μm (which can be defined). The manufacturing method can then proceed to exposure.

In an alternative embodiment, the procedure involving the processes a), b), c) can be calculated as described in process b), where the center C2 determines the center C1 in the process a). It can be performed according to the difference (ie, using the horizontal and vertical distances between the padded alignment markers 102).

FIG. 5 is a diagram showing an increase in density in the alignment of the component carrier structure 100 according to an exemplary embodiment of the invention (see arrow 177). Due to the high accuracy, it is possible to reduce the pad size for via connection. Therefore, a denser buildup can be achieved, resulting in a reduction in the total layer count and / or total size of the board.

FIG. 6 is a diagram showing an increase in alignment accuracy (compared to reference numeral 179) in the alignment of the component carrier structure 100 according to an exemplary embodiment of the present invention. It also shows the shading and protection of the signal.

FIG. 7 is a diagram showing a reduction in footprint in the alignment of the component carrier structure 100 according to an exemplary embodiment of the invention. Reference numeral 181 is referenced.

FIG. 8 is a diagram showing an increase in alignment accuracy during alignment of the component carrier structure 100 according to an exemplary embodiment of the present invention. Reference numeral 183 is referred to. With the via configuration of FIG. 8, a reliable design can be obtained.

FIG. 9 is a diagram showing a device 120 for adjusting the position of a panel-type component carrier structure 100 according to an exemplary embodiment of the present invention. The component carrier structure 150 shown comprises a plurality of further integrally connected component carriers 150 (eg, a printed circuit board) or a preform thereof.

The device 120 includes an alignment marker forming unit 126 configured to form a pad-type alignment marker 102 and a hole-type alignment marker 104 of the component carrier structure 100. For example, the alignment marker forming unit 126 may include an LDI device for forming the alignment markers 102, 104 by laser direct imaging (LDI). An additional or alternative lithography exposure machine may be implemented.

Further, the device 120 includes a detection unit 122 configured to detect the pad-type alignment marker 102 and the hole-type alignment marker 104 of the component carrier structure 100. For example, the detection unit 122 can be a camera such as a CCD camera or a CMOS camera.

The determination unit 124, which may be the processor 130 or a part thereof, may be configured to determine the alignment information based on the detected pad-type alignment marker 102 and the detected hole-type alignment marker 104. For this purpose, the determination unit 124 may be provided with the detection data captured by the detection unit 122. To identify the pad-type alignment marker 102 and the hole-type alignment marker 104 in one or more images captured by the detection unit 122, the determination unit 124 contains a database containing available data and the pad-type alignment marker 102 and holes. Processing resources capable of determining the type alignment marker 104 in consideration of their characteristic shape and / or contrast characteristics may be provided. To this end, a pattern recognition algorithm and / or other image processing algorithm may be implemented in a determination unit 124 specifically adapted for identification of both the pad-type alignment marker 102 and the hole-type alignment marker 104.

Further, the apparatus 120 includes a processing unit 128 which may be a processor 130 or a part thereof, which is configured to process the component carrier structure 100 based on the determined alignment information. In other words, the processing unit 128 may control further manufacturing of the component carrier 150 at the panel level based on the determined alignment information.

Therefore, FIG. 9 shows how alignment can be performed during the processing of component carrier structure 100. In order to realize this, the alignment marker forming unit 126 forms both the hole type alignment marker 104 and the pad type alignment marker 102 as described above. Subsequently, the detection unit 122, which may be a camera, may capture images of the main surface 191 above the component carrier structure 110, or may capture images of both the opposing main surfaces 191 and 193. The corresponding image or the corresponding image may be fed to a processing unit 124 capable of determining the position of the alignment markers 102, 104 on the upper main surface of the component carrier structure 100. This information can be used for subsequent determination of alignment information, i.e., information about the positioning and orientation of the component carrier structure 100, eg, for processing equipment that processes the component carrier structure 100. This information can then be used by the processing unit 128 to perform subsequent processing (eg, cavity formation, pad formation, patterning, etc.).

FIG. 10 is a diagram showing a lot 160 with a plurality of component carriers 150 manufactured according to an exemplary embodiment of the present invention.

Lot 160 consists of a plurality of component carriers 150 that may be manufactured based on the component carrier structure 100 positioned by the method described above. For example, all component carriers 150 in lot 160 can be separated from the common component carrier structure 100, separated from different component carrier structures 100 for the same batch of common manufacturing processes, or include both pad alignment and hole alignment. It can be processed based on the alignment architecture described above. Given the high alignment accuracy obtained by such an alignment architecture, at least 90% of the component carriers 150 of the lot 160 can differ by less than 75 μm, especially less than 50 μm, with respect to the distances d1, d2, ... dn between the edge pads. .. In particular, the difference between the maximum distance between the edge pads between the 90% or more component carriers 150 and the minimum distance between the edge pads between the 90% or more component carriers 150 can be less than 75 μm, especially less than 50 μm. .. The distance between the edge pads can be defined as the horizontal distance between the center 123 of each pad 152 and the closest edge 121 of the component carrier 150 (compare FIG. 10).

After completing the manufacture of the component carrier structure 100 (eg, the panel), the panel may be individualized, thereby obtaining a plurality of individual component carriers 150, such as a printed circuit board or an IC (integrated circuit) board. Given the high spatial accuracy of the alignment, it is possible to obtain very small tolerances for the center distances d1, d2, dn from the edges of the individual component carriers 150 to the pads 152. In addition, the location and dimensions of the cavities 155 of the individual component carriers 150 may also have high accuracy as a result of the combination of pad alignment and hole alignment, as described above. In each cavity 155, the corresponding component 154 may be incorporated. Optionally, using, for example, a self-learning algorithm, the data is the pad size (ie, in particular the diameter of the pad 152) and / or the distance between the edge pads for each layer and / or each buildup of the component carrier 150. It can be detected and / or stored in the database to optimize d1, d2, ... dn. In such embodiments, the software may output a warning if the designed pad size and / or distance between the edge pads is too small or too large, or deviates from a predetermined target range. , The process may be stopped. Additional or alternative, the software may provide suggestions to reduce or increase the pad size and / or to control another entity (component carrier manufacturing procedure, for example, to optimize the task. This information can be transferred to a controller, etc.). With such an algorithm, it may be possible to significantly increase the signal quality, especially for HF (radio frequency) applications, as the diameter of the signal path can be implemented in a more balanced manner.

FIG. 11 is a cross-sectional view of a component carrier structure 100 according to an exemplary embodiment of the present invention, which corresponds to FIG. 1 but additionally includes a cord structure 200 relating to a layered structure for improving the manufacturing process. Is.

For example, each of the cord structures 200 is a copper layer copper material that is also used to form each of the conductive layer structure 106, the pad-type alignment marker 102 and the hole-type alignment marker 104 at each level of the component carrier structure 100. It can be formed as a QR code (registered trademark) consisting of. Each of the code structures 200 comprises or encodes information indicating the manufacturing characteristics of the assigned layer structures 106, 108, respectively. For example, any problems, errors or other events that occur during the manufacture of the respective layer structures 106, 108 may be stored directly in the assigned code structure 200, or the information read from the respective code structure 200. May be derived from the database when accessing the dataset of such a database using. Before processing the individual layer structures of the layer structures 106, 108, at least one of the code structures 200 of the previously processed layer structures 106, 108 is read (eg, optically) first. It is possible to derive information about at least one manufacturing process of the processed layer structures 106, 108. The processing of the layer structure 106 is read from one or more code structures 200 indicating the manufacturing characteristics of at least one previously processed layer structure 106, 108 with respect to one or more previously processed layer structures 106, 108. It can be executed in consideration of the information provided. Next, the processing of the individual layer structure 104 among the plurality of layer structures is executed using the past manufacturing information regarding the previously processed layer structures 106 and 108, and the alignment information derived according to FIG. obtain.

By utilizing this means, the dimension "d" can be further reduced and, as a result, the dimension "D" can be further reduced, so that the manufacturing process can be carried out more accurately.

FIG. 12 is a diagram showing a processing flow of a manufacturing process using the code structure 200 according to FIG. 11 according to an exemplary embodiment of the present invention.

With reference to block 202, a panel (eg, component carrier structure 100) having an identifier code (with respect to code structure 200) of inner layer structures 106, 108 can be analyzed first.

With reference to block 204, the LDI (Laser Direct Imaging) machine can read and encode the panel identifier.

With reference to block 206, the LDI machine can read the reference hole and reference pad (ie, the hole alignment marker 104 and the pad alignment marker 102) and calculate the exposure data.

With reference to block 208, all information can be stored in the LDI machine database.

With reference to block 210, panels having an identifier code (with respect to code structure 200) on the following outer layer structures 106, 108 can be analyzed.

With reference to block 212, the LDI machine may read and encode the panel identifier.

With reference to block 214, the LDI machine can read reference holes and reference pads (ie, hole-type alignment markers 104 and pad-type alignment markers 102) and calculate exposure data. In this context, it is also possible to add middle layer data (scale values, previous compensation values for the outer layer, etc.).

With reference to block 216, all information can be stored in the LDI machine database.

This process described for the two continuous layer structures 106, 108 can be repeated any desired number of times.

With reference to block 218, the LDI machine may proceed to exposure, taking into account the results from blocks 208 and 216 and optionally taking into account the results for additional layer structures 106, 108.

Note that the term "provides" does not exclude other elements or steps, and the "a" or "an" does not exclude multiple. In addition, elements described in relation to different embodiments may be combined.

It should also be noted that the reference code in the claims is not construed as limiting the scope of the claims.

The implementation of the present invention is shown in the figure and is not limited to the preferred embodiment described above. Alternatively, numerous modifications are possible using the solutions shown and the principles according to the invention, even in the case of radically different embodiments.

Claims (19)

It is a method of adjusting the position of the component carrier structure, and the above method is
At the stage of forming one or more pad-type alignment markers on and / or inside the component carrier structure,
At the stage of forming one or more hole-type alignment markers on and / or inside the component carrier structure,
A step of determining the alignment information for adjusting the position of the component carrier structure by combining the alignment information derived based on the one or more pad-type alignment markers and the one or more hole-type alignment markers .
A step of forming each of the plurality of layer structures of the component carrier structure, each of which includes information indicating the manufacturing characteristics of the assigned layer structure. ,
A step of reading at least one of the code structures of the previously processed layer structure before processing the individual layer structure of the plurality of layer structures.
Taking into account the reading information indicating the manufacturing characteristics of at least one previously processed layer structure, and using the alignment information to process the individual layer structure of the plurality of layer structures. How to prepare. The method is
A step of deriving preliminary alignment information based solely on the one or more pad-type alignment markers, or based solely on the one or more hole-type alignment markers.
The first aspect of claim 1, further comprising a step of improving the accuracy of the preliminary alignment information based on the other of the one or more hole-type alignment markers and the one or more pad-type alignment markers. Method. The method is a step of deriving the alignment information by averaging the alignment information derived from the one or more pad-type alignment markers and the alignment information derived from the one or a plurality of hole-type alignment markers. The method according to claim 1 or 2, wherein the method comprises. The method comprises a step of deriving the alignment information as a weighted composition of the alignment information derived from the one or more pad-type alignment markers and the alignment information derived from the one or a plurality of hole-type alignment markers. The method according to claim 1 or 2. In the method, the one or more pad-type alignment markers and / or the one or a plurality of hole-type alignment markers are combined into a plurality of layer structures of a stack of the component carrier structures, particularly a laminated layer structure of the component carrier structure. The method according to any one of claims 1 to 4, comprising a step of forming each of the above. At least a portion of the one or more pad-type alignment markers and / or at least a portion of the one or more hole-type alignment markers are corners of the component carrier structure to determine alignment information for the entire component carrier structure. The method according to any one of claims 1 to 5, which is formed in 1. At least a portion of the one or more pad-type alignment markers and / or at least a portion of the one or more hole-type alignment markers are the component carriers to determine alignment information for only partitions of the component carrier structure. The method according to any one of claims 1 to 6, which is formed in the partition of the structure, particularly in a plurality of corners of a quarter of the component carrier structure. The method according to any one of claims 1 to 7, wherein the one or more pad-type alignment markers and the one or more hole-type alignment markers are arranged outside the active region of the component carrier structure. The method according to any one of claims 1 to 8, wherein the method comprises a step of positioning and processing the component carrier structure based on the determined alignment information. 9. The process comprises at least one of a group consisting of imaging (particularly photoimaging), solder masking, screen printing, and mechanical processing of the component carrier structure (particularly assembly process). The method described. The above processing
With respect to the features of the component carrier structure formed based on the determined alignment information (particularly the diameter of the pad and / or the distance between the edge pad between the edge of the component carrier structure and the center of the pad). At the stage of detecting and / or storing data,
A step of determining whether the formed feature meets at least one predetermined geometric criterion.
The method of claim 9 or 10, comprising a step of taking appropriate action depending on the outcome of said step to determine. Taking appropriate action is to run a self-learning algorithm to increase the probability that the at least one predetermined geometric criterion will be met in a future procedure for forming the feature, a manufacturing procedure. A group consisting of stopping, issuing a warning, and providing suggestions to increase the probability that the at least one predetermined geometric criterion will be met in future procedures for forming the feature. 11. The method of claim 11, comprising at least one of the above. The component carrier structure is selected from a group consisting of a panel for manufacturing a component carrier, an array of a plurality of component carriers or a preform thereof, and a component carrier holding at least one component, claims 1 to 12. The method described in any one of the above. The method according to any one of claims 1 to 13, wherein the method is performed using a laser direct imaging (LDI) device. A device for adjusting the position of a component carrier structure, in which a cord structure is formed in each of a plurality of layer structures of the component carrier structure, and each of the cord structures exhibits manufacturing characteristics of the assigned layer structure. The device contains information and the device
Detecting one or more pad-type alignment markers on and / or inside the component carrier structure and detecting one or more hole-type alignment markers on and / or inside the component carrier structure. With a detection unit configured to do
A determination unit that determines alignment information based on the detected one or more pad-type alignment markers and the detected one or more hole-type alignment markers .
A reading unit that reads at least one of the code structures of the previously processed layer structure before processing the individual said layer structure of the plurality of layer structures.
With a processing unit that processes the individual layer structure of the plurality of layer structures, taking into account the reading information indicating the manufacturing characteristics of at least one previously processed layer structure, and using the alignment information. A device equipped with <br/>. Forming the one or more pad-type alignment markers on and / or inside the component carrier structure, and forming the one or more hole-type alignment markers on and / or inside the component carrier structure. 15. The apparatus of claim 15, comprising an alignment marker forming unit configured to perform. 13. A computer-readable medium containing a computer program for adjusting the position of a component carrier structure, wherein the computer program is executed by one or more processors, according to any one of claims 1 to 14. A computer-readable medium adapted to allow the one or more processors to perform or control the method of. A program for adjusting the position of a component carrier structure, wherein the program is executed by one or more processors, the method according to any one of claims 1 to 14 is carried out by the one or more processors. A program that is adapted to run or control. A lot, the plurality of component carriers of said lot, comprising a plurality of component carriers, particularly manufactured on the basis of a component carrier structure whose position is adjusted by the method according to any one of claims 1 to 14. At least 90% of the lots differ by less than 75 μm, especially less than 50 μm, with respect to the distance between the edge pads.

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