JP6979265B2 - A method and a winding device for winding a long substrate, and a surface treatment device for a long substrate provided with the winding device. - Google Patents

A method and a winding device for winding a long substrate, and a surface treatment device for a long substrate provided with the winding device. Download PDF

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JP6979265B2
JP6979265B2 JP2015210653A JP2015210653A JP6979265B2 JP 6979265 B2 JP6979265 B2 JP 6979265B2 JP 2015210653 A JP2015210653 A JP 2015210653A JP 2015210653 A JP2015210653 A JP 2015210653A JP 6979265 B2 JP6979265 B2 JP 6979265B2
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film
winding
resin film
metal film
roll
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JP2017081679A (en
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裕規 丹波
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Sumitomo Metal Mining Co Ltd
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Priority to KR1020187010067A priority patent/KR102679374B1/en
Priority to PCT/JP2016/080885 priority patent/WO2017073411A1/en
Priority to CN201680060570.7A priority patent/CN108367873B/en
Priority to TW105134022A priority patent/TWI754620B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00Winding webs
    • B65H18/28Wound package of webs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04Kinds or types
    • B65H75/08Kinds or types of circular or polygonal cross-section
    • B65H75/10Kinds or types of circular or polygonal cross-section without flanges, e.g. cop tubes
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00Handling processes for sheets or webs
    • B65H2301/50Auxiliary process performed during handling process
    • B65H2301/51Modifying a characteristic of handled material
    • B65H2301/511Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5114Processing surface of handled material upon transport or guiding thereof, e.g. cleaning coating
    • B65H2301/51145Processing surface of handled material upon transport or guiding thereof, e.g. cleaning coating by vapour deposition

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Winding Of Webs (AREA)

Description

本発明は、ロールツーロールで搬送される長尺基板を巻取コアに巻き取る巻取方法及び巻取装置、並びに該巻取装置を備えたロールツーロールスパッタリング装置などの長尺基板の表面処理装置に関する。 INDUSTRIAL APPLICABILITY The present invention relates to a winding method and a winding device for winding a long substrate conveyed by roll-to-roll to a winding core, and surface treatment of a long substrate such as a roll-to-roll sputtering device provided with the winding device. Regarding the device.

液晶パネルなどのディスプレイパネル、ノートパソコン、デジタルカメラ、携帯電話等には、樹脂フィルム上に配線回路を備えたフレキシブル配線基板が用いられている。かかるフレキシブル配線基板は、樹脂フィルムの片面若しくは両面に金属膜を有する金属膜付樹脂フィルムをパターニング加工することによって作製することができる。近年、上記したフレキシブル配線基板の配線パターンはますます繊細化、高密度化する傾向にあり、これに伴って金属膜付樹脂フィルムには平滑で外観上シワや縞のないものが求められている。 A flexible wiring board having a wiring circuit on a resin film is used for a display panel such as a liquid crystal panel, a notebook computer, a digital camera, a mobile phone, and the like. Such a flexible wiring board can be manufactured by patterning a resin film with a metal film having a metal film on one side or both sides of the resin film. In recent years, the wiring pattern of the above-mentioned flexible wiring board has tended to become more delicate and denser, and along with this, a resin film with a metal film is required to be smooth and have no wrinkles or stripes in appearance. ..

上記の金属膜付樹脂フィルムの製造方法として、従来、金属箔を接着剤により樹脂フィルムに貼り付けて製造する方法(3層基板の製造方法)、金属箔に樹脂溶液をコーティングした後、乾燥させて製造する方法(キャスティング法)、樹脂フィルムに真空成膜法単独で、又は真空成膜法と湿式めっき法との併用で金属膜を成膜して製造する方法(メタライジング法)等が知られている。また、メタライジング法に用いる真空成膜法としては、真空蒸着法、スパッタリング法、イオンプレーティング法、イオンビームスパッタリング法等がある。 Conventionally, as a method for manufacturing a resin film with a metal film, a method of sticking a metal foil to a resin film with an adhesive (a method of manufacturing a three-layer substrate), a method of coating a metal foil with a resin solution, and then drying the film. (Casting method), a method of forming a metal film on a resin film by the vacuum film forming method alone, or by using a vacuum film forming method and a wet plating method in combination (metalizing method). Has been done. Further, as the vacuum film forming method used for the metallizing method, there are a vacuum vapor deposition method, a sputtering method, an ion plating method, an ion beam sputtering method and the like.

メタライジング法について、例えば特許文献1には、ポリイミド絶縁層上にクロム層をスパッタリング成膜した後、銅層をスパッタリング成膜して導体層を形成する方法が記載されている。かかるスパッタリングによる成膜は、一般に密着力に優れる反面、真空蒸着法に比べて基材としての樹脂フィルムに与える熱負荷が大きいといわれている。そして、成膜の際に樹脂フィルムに大きな熱負荷がかかると、フィルムにシワが発生し易くなることも知られている。 Regarding the metallizing method, for example, Patent Document 1 describes a method in which a chromium layer is sputtered and formed on a polyimide insulating layer and then a copper layer is sputtered and formed to form a conductor layer. Although the film formation by such sputtering is generally excellent in adhesion, it is said that the heat load applied to the resin film as a base material is larger than that of the vacuum vapor deposition method. It is also known that when a large heat load is applied to the resin film during film formation, wrinkles are likely to occur on the film.

そこで、ポリイミドフィルムなどの樹脂フィルムに対してスパッタリングにより成膜を行って金属膜付樹脂フィルムを作製する工程では、キャンロールを備えたスパッタリングウェブコーターが一般的に使用されている。この装置は、特許文献2に記載されているように、内部に冷媒を循環させたキャンロールにロールツーロールで搬送される長尺の樹脂フィルムを巻き付けながらスパッタリング成膜を行うものであり、樹脂フィルムの表面側の成膜によって該樹脂フィルムに生じる熱をその裏面側から直ぐに除熱することができるため、スパッタリング成膜の際の熱負荷の悪影響を抑えてシワの発生を効果的に防ぐことができる。 Therefore, in a step of forming a resin film such as a polyimide film by sputtering to produce a resin film with a metal film, a sputtering web coater provided with a can roll is generally used. As described in Patent Document 2, this apparatus performs sputtering film formation while winding a long resin film conveyed by roll-to-roll around a can roll in which a refrigerant is circulated inside. Since the heat generated in the resin film by the film formation on the front surface side of the film can be immediately removed from the back surface side thereof, the adverse effect of the heat load during the sputtering film formation can be suppressed and the occurrence of wrinkles can be effectively prevented. Can be done.

ところで、ディスプレイパネルのタッチパネルセンサーに用いられる導電性基板では、大型化や応答の高速化の為、従来のITO電極に代えて微細な金属配線を配した透明な樹脂フィルムを用いることが試みられている。かかる導電性基板も上記したフレキシブル配線基板と同様に金属膜付樹脂フィルムから作製することができるが、金属配線に銅を用いた場合、銅は金属光沢を有しているため、反射によりディスプレイの視認性が低下する問題を生じることがある。そこで、金属配線の表面に黒色の黒化層を設けることがある。例えば特許文献3には黒化層を備えたタッチセンサーパネルが開示されている。 By the way, in the conductive substrate used for the touch panel sensor of the display panel, it has been attempted to use a transparent resin film in which fine metal wiring is arranged instead of the conventional ITO electrode in order to increase the size and speed up the response. There is. Such a conductive substrate can also be manufactured from a resin film with a metal film in the same manner as the flexible wiring substrate described above, but when copper is used for the metal wiring, the copper has a metallic luster, so that the display can be displayed by reflection. It may cause a problem of reduced visibility. Therefore, a black blackening layer may be provided on the surface of the metal wiring. For example, Patent Document 3 discloses a touch sensor panel provided with a blackening layer.

特開平2−98994号公報Japanese Unexamined Patent Publication No. 2-98994 特開昭62−247073号公報Japanese Unexamined Patent Publication No. 62-247073 特開2013−225276号公報Japanese Unexamined Patent Publication No. 2013-225276

上記のメタライジング法では、真空チャンバー内などの減圧雰囲気下においてロールツーロールで搬送される長尺基板を円筒状の巻取コアに巻き取ると、巻き取られた長尺基板の両端部分に縞状の模様が生じることがある。特に、銅層の表面に黒色の化学的に不定比の金属の酸化物などからなる黒化層を設けた金属膜付樹脂フィルムでは、縞状の模様が生じると外観不良となって製品価値が損なわれてしまう。本発明は上記した従来技術の問題に鑑みてなされたものであり、巻き取られた長尺基板の両端部分に縞状の模様が発生しにくい巻取方法及び巻取装置を提案することを目的としている。 In the above metallizing method, when a long substrate conveyed by roll-to-roll in a vacuum chamber or the like is wound around a cylindrical winding core, stripes are formed on both ends of the wound long substrate. A pattern may occur. In particular, in a resin film with a metal film provided with a blackening layer made of a black chemically indefinite ratio metal oxide on the surface of the copper layer, if a striped pattern occurs, the appearance will be poor and the product value will be high. It will be damaged. The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to propose a winding method and a winding device in which striped patterns are less likely to occur at both ends of a wound long substrate. It is supposed to be.

上記目的を達成するため、本発明が提供する金属膜付長尺樹脂フィルムの巻取方法は、減圧雰囲気下において、ロールツーロールで搬送され、黒化層が成膜された厚み5〜100μmで且つ幅20〜80cmの金属膜付長尺樹脂フィルムを外径8〜25cmの円筒状の巻取コアに巻き取る金属膜付長尺樹脂フィルムの巻取方法であって(該金属膜付長尺樹脂フィルムを加熱しながら該巻取コアにロール状に巻き取るものを除く)、該巻取コアに金属膜付長尺樹脂フィルムを巻き取る際に、前記巻取コアの外周面に接して最初に巻き取られる金属膜付長尺樹脂フィルムの先端部では、その幅方向両端部がその幅方向中央部よりも該巻取コアの回転中心軸に対して50〜200μm遠くに位置させることで、金属膜付長尺樹脂フィルムの幅方向両端部が幅方向中央部よりも該巻取コアの回転中心軸に対してより遠くに位置するように、外周面のうち金属膜付長尺樹脂フィルムの幅方向両端部が巻き付けられる箇所で且つ該金属膜付長尺樹脂フィルムの両縁部の間に納まる部分にのみ、それぞれ周方向に連続して延在する段差50〜200μmで且つ幅10mm以下の凸状の段差部が設けられている該巻取コアに巻き取っていくことを特徴としている。 In order to achieve the above object, the method for winding a long resin film with a metal film provided by the present invention has a thickness of 5 to 100 μm in which a blackened layer is formed by being conveyed by roll-to-roll under a reduced pressure atmosphere. Moreover, it is a method of winding a long resin film with a metal film by winding a long resin film with a metal film having a width of 20 to 80 cm on a cylindrical winding core having an outer diameter of 8 to 25 cm (the long resin film with a metal film). (Except for those that are wound into a roll around the winding core while heating the resin film ), when the long resin film with a metal film is wound around the winding core, it first comes into contact with the outer peripheral surface of the winding core. At the tip of a long resin film with a metal film to be wound around, both ends in the width direction are positioned 50 to 200 μm farther from the center of rotation of the winding core than the center in the width direction. Of the outer peripheral surface of the long resin film with a metal film so that both ends in the width direction of the long resin film with a metal film are located farther from the center axis of rotation of the winding core than the central part in the width direction. A step of 50 to 200 μm and a width of 10 mm or less, which extends continuously in the circumferential direction, only at the place where both ends in the width direction are wound and between both edges of the long resin film with a metal film. It is characterized in that it is wound around the winding core provided with a convex stepped portion.

また、本発明が提供する金属膜付長尺樹脂フィルムの巻取装置は、減圧雰囲気下において、ロールツーロールで搬送され、黒化層が成膜された厚み5〜100μmで且つ幅20〜80cmの金属膜付長尺樹脂フィルムを外径8〜25cmの円筒状の巻取コアに巻き取る金属膜付長尺樹脂フィルムの巻取装置であって(該金属膜付長尺樹脂フィルムを加熱しながら該巻取コアにロール状に巻き取るものを除く)、該巻取コアの外周面のうち金属膜付長尺樹脂フィルムの幅方向両端部が巻き付けられる箇所で且つ該金属膜付長尺樹脂フィルムの両縁部の間に納まる部分にのみ、それぞれ周方向に連続して延在する段差50〜200μmで且つ幅10mm以下の凸状の段差部が設けられていることを特徴としている。 Further, the winding device for a long resin film with a metal film provided by the present invention is conveyed by roll-to-roll under a reduced pressure atmosphere, and has a thickness of 5 to 100 μm and a width of 20 to 80 cm in which a blackened layer is formed. a a metal film with elongated resin film winding device of the cylindrical reeling metal film with elongated resin film winding core outer diameter 8~25Cm (heating the metal film with elongated resin film while excluding those for winding into a roll in the winding preparative core), take-preparative and the metal film with elongated resin at the point where both widthwise ends of the metal film with elongated resin film of the outer peripheral surface of the core is wound It is characterized in that a convex step portion having a step length of 50 to 200 μm and a width of 10 mm or less, which extends continuously in the circumferential direction, is provided only in a portion that fits between both edges of the film.

本発明によれば、表面処理された長尺基板を巻取コアに巻き取る際に生じやすい幅方向両端部分における縞状模様の生成をほぼ無くすことができるので、長尺基板の表面処理の歩留まりを高めることができる。 According to the present invention, it is possible to almost eliminate the generation of striped patterns at both ends in the width direction, which tends to occur when the surface-treated long substrate is wound around the take-up core, so that the yield of the surface treatment of the long substrate can be eliminated. Can be enhanced.

本発明に係る巻取装置が好適に使用される真空成膜装置の一具体例を示す正面図である。It is a front view which shows a specific example of the vacuum film forming apparatus in which the winding apparatus which concerns on this invention is preferably used. 長尺基板を巻取コアに巻き取る際に生じる長手方向の張力を模式的に示す斜視図である。It is a perspective view which shows typically the tension in the longitudinal direction generated when a long substrate is wound around a winding core. 本発明に係る巻取装置の一具体例を示す斜視図である。It is a perspective view which shows a specific example of the winding apparatus which concerns on this invention. 本発明の実施例の巻取装置を示す正面図である。It is a front view which shows the winding apparatus of the Example of this invention.

先ず、図1を参照しながら、本発明の長尺基板の巻取装置が好適に使用される表面処理装置の具体例として、真空雰囲気下においてロールツーロール方式で搬送される長尺基板に対して熱負荷の掛かる成膜処理を連続的に効率よく施すことが可能な真空成膜装置について説明する。なお、以下の説明では長尺基板の一例として長尺樹脂フィルム基板を用い、熱負荷の掛かる成膜処理の一例としてスパッタリング成膜処理を行う場合を例に挙げて説明する。 First, referring to FIG. 1, as a specific example of a surface treatment apparatus in which the winding apparatus for a long substrate of the present invention is preferably used, for a long substrate conveyed by a roll-to-roll method in a vacuum atmosphere. A vacuum film forming apparatus capable of continuously and efficiently performing a film forming process under a heat load will be described. In the following description, a case where a long resin film substrate is used as an example of a long substrate and a sputtering film forming process is performed as an example of a film forming process under a heat load will be described as an example.

この図1に示す長尺樹脂フィルム基板F(以下、単に長尺基板Fとも称する)の真空成膜装置10はスパッタリングウェブコーターとも称され、巻出室11内に設けられた巻出手段としての巻出コア14から巻き出した長尺基板Fを成膜室12内に設けられたキャンロール20の外周面に巻きつけて冷却しながら熱負荷のかかる表面処理手段としてのスパッタリング機構により成膜処理を施した後、巻取室13内に設けられた巻取手段としての巻取コア26で巻き取るようになっている。 The vacuum film forming apparatus 10 of the long resin film substrate F (hereinafter, also simply referred to as the long substrate F) shown in FIG. 1 is also referred to as a sputtering web coater, and serves as an unwinding means provided in the unwinding chamber 11. The long substrate F unwound from the unwinding core 14 is wound around the outer peripheral surface of the can roll 20 provided in the film forming chamber 12 to cool the film, and the film forming process is performed by a sputtering mechanism as a surface processing means for applying a heat load. After the above, the winding core 26 as a winding means provided in the winding chamber 13 is used for winding.

具体的に説明すると、巻出コア14から巻取コア26までの長尺基板Fのロールツーロール搬送経路のうち、巻出コア14からキャンロール20までの間に、長尺基板Fを案内するフリーロール16、17と、長尺基板Fの張力の測定を行う張力センサーロール15、18と、キャンロール20のすぐ上流側に設けられたモータ駆動の前フィードロール19とがこれらの符号順に配置されている。 Specifically, among the roll-to-roll transport paths of the long substrate F from the unwinding core 14 to the take-up core 26, the long substrate F is guided between the unwinding core 14 and the can roll 20. The free rolls 16 and 17, the tension sensor rolls 15 and 18 for measuring the tension of the long substrate F, and the motor-driven front feed roll 19 provided immediately upstream of the can roll 20 are arranged in the order of these codes. Has been done.

前フィードロール19は、張力センサーロール18から送り出されてキャンロール20に向かう長尺基板Fの速度を、キャンロール20の周速度に対して調整する役割を担っており、これにより、内部に水などの冷媒が循環しているキャンロール20の外周面に、連続的に搬送される長尺基板Fを確実に密着させて効率よく冷却することが可能になる。 The front feed roll 19 plays a role of adjusting the speed of the long substrate F sent out from the tension sensor roll 18 toward the can roll 20 with respect to the peripheral speed of the can roll 20, thereby causing water inside. The long substrate F, which is continuously conveyed, is surely brought into close contact with the outer peripheral surface of the can roll 20 in which the refrigerant such as the above is circulated, and can be efficiently cooled.

キャンロール20から巻取コア26までの搬送経路も、上記した巻出コア14からキャンロール20までの搬送経路と同様に、キャンロール20の周速度に対する調整を行うモータ駆動の後フィードロール21、長尺基板Fの張力の測定を行う張力センサーロール22、25、及び長尺基板Fを案内するフリーロール23、24がこれらの符号順に配置されている。 The transport path from the can roll 20 to the take-up core 26 is also the same as the transport path from the unwind core 14 to the can roll 20 described above, the motor-driven rear feed roll 21 that adjusts the peripheral speed of the can roll 20. Tension sensor rolls 22 and 25 for measuring the tension of the long substrate F, and free rolls 23 and 24 for guiding the long substrate F are arranged in the order of these codes.

上記巻出コア14及び巻取コア26では、各々パウダークラッチ等によるトルク制御によって長尺基板Fの張力バランスが保たれている。また、キャンロール20の回転とこれに連動して回転するモータ駆動の前フィードロール19及び後フィードロール21により、巻出コア14から長尺基板Fが巻き出されて巻取コア26に巻き取られるようになっている。 In the unwinding core 14 and the winding core 26, the tension balance of the long substrate F is maintained by torque control by a powder clutch or the like. Further, the long substrate F is unwound from the unwinding core 14 by the rotation of the can roll 20 and the motor-driven front feed roll 19 and the rear feed roll 21 that rotate in conjunction with the rotation of the can roll 20, and the long substrate F is unwound to the winding core 26. It is supposed to be.

キャンロール20の周りには、キャンロール20の外周面上に画定される搬送経路に沿って板状の4つのマグネトロンスパッタリングカソード30、31、32及び33が、当該外周面に巻き付けられる長尺基板Fに対向するように設けられている。なお、金属膜のスパッタリング成膜の場合は、板状のターゲットを使用することができるが、板状ターゲットを用いた場合、ターゲット上にノジュール(異物の成長)が発生することがある。これが問題になる場合は、ノジュールが発生しにくく、ターゲットの使用効率も高い円筒形のロータリーターゲットを使用することが好ましい。 Around the canroll 20, four plate-shaped magnetron sputtering cathodes 30, 31, 32 and 33 are wound around the outer peripheral surface along a transport path defined on the outer peripheral surface of the canroll 20. It is provided so as to face F. In the case of sputtering film formation of a metal film, a plate-shaped target can be used, but when a plate-shaped target is used, nodules (growth of foreign matter) may occur on the target. If this is a problem, it is preferable to use a cylindrical rotary target that is less prone to nodules and has higher target utilization efficiency.

上記した真空成膜装置10には、更に長尺基板Fの搬送方向を変えるためのフリーロール(図示せず)や、真空チャンバー内を減圧してその状態を維持するためのドライポンプ、ターボ分子ポンプ、クライオコイル等の真空排気設備(図示せず)が設けられている。この真空排気設備により、真空成膜装置10の成膜室12は、到達圧力10−4Pa程度までの減圧と、その後のスパッタリングガスの導入による0.1〜10Pa程度の圧力調整が行われ、この圧力条件の下でスパッタリング成膜が行われる。スパッタリングガスにはアルゴンなど公知のガスが使用され、目的に応じてさらに酸素などのガスが添加される。なお、真空チャンバーの形状や材質は、上記の減圧状態に耐え得るものであれば特に限定はなく、種々のものを使用することができる。 The vacuum film forming apparatus 10 described above includes a free roll (not shown) for changing the transport direction of the long substrate F, a dry pump for depressurizing the inside of the vacuum chamber and maintaining the state, and a turbo molecule. Vacuum exhaust equipment (not shown) such as pumps and cryocoils is provided. With this vacuum exhaust facility, the film forming chamber 12 of the vacuum film forming apparatus 10 is depressurized to an ultimate pressure of about 10 -4 Pa, and then pressure is adjusted to about 0.1 to 10 Pa by introducing a sputtering gas. Sputtering film formation is performed under this pressure condition. A known gas such as argon is used as the sputtering gas, and a gas such as oxygen is further added depending on the purpose. The shape and material of the vacuum chamber are not particularly limited as long as they can withstand the above-mentioned decompression state, and various ones can be used.

上記したような真空成膜装置10を用いたメタライジング法により、例えば長尺樹脂フィルムの表面にNi系合金等の膜とCu膜とをスパッタリングで連続的に積層することができ、その際、スパッタリングカソードに大電力を投入して長尺樹脂フィルムに高い熱負荷をかけてもキャンロール20で直ぐに除熱することができるので高速成膜が可能になる。従って、シワのない高品質の金属膜付樹脂フィルムを高い生産性で製造することができ、コストダウンが可能になる。 By the metallizing method using the vacuum film forming apparatus 10 as described above, for example, a film such as a Ni-based alloy and a Cu film can be continuously laminated by sputtering on the surface of a long resin film. Even if a large amount of power is applied to the sputtering cathode and a high heat load is applied to the long resin film, the heat can be immediately removed by the canroll 20, so that high-speed film formation becomes possible. Therefore, it is possible to manufacture a high-quality resin film with a metal film without wrinkles with high productivity, and it is possible to reduce the cost.

上記Ni合金等からなる膜はシード層と呼ばれ、金属膜付樹脂フィルムの電気絶縁性や耐マイグレーション性等の所望の特性によりその組成が選択される。このシード層には、Ni−Cr合金、インコネル、コンスタンタン、モネル等の各種公知の合金を用いることができ、その膜厚は一般に3〜100nmである。また、上記シード層の上に積層したCu膜などの金属膜を更に50nm〜12μm程度厚くしたい場合は、上記の真空成膜処理の後処理として、一般的な湿式めっき処理を行ってもよい。この後処理としての湿式めっき処理は、電気めっき処理だけで金属膜を厚くする場合と、めっき条件の異なる複数の湿式めっき法の組み合わせで厚くする場合とがある。後者の場合としては、例えば一次めっきとして無電解めっき処理を行い、二次めっきとして電解めっき処理を行う方法を挙げることができる。 The film made of the Ni alloy or the like is called a seed layer, and its composition is selected according to desired characteristics such as electrical insulation and migration resistance of the resin film with a metal film. Various known alloys such as Ni—Cr alloy, Inconel, Constantan, and Monel can be used for this seed layer, and the film thickness is generally 3 to 100 nm. Further, when it is desired to further increase the thickness of the metal film such as the Cu film laminated on the seed layer by about 50 nm to 12 μm, a general wet plating treatment may be performed as a post-treatment of the vacuum film formation treatment. In the wet plating treatment as the post-treatment, there are cases where the metal film is thickened only by electroplating treatment and cases where the metal film is thickened by a combination of a plurality of wet plating methods having different plating conditions. Examples of the latter case include a method in which electroless plating is performed as primary plating and electrolytic plating is performed as secondary plating.

なお、上記長尺樹脂フィルム基板には、Ni−Cr合金やCu等の金属膜に代えて、あるいは、該金属膜に加えて酸化物膜や窒化物膜などを成膜することもある。これら酸化物膜や窒化物膜の種類や膜厚は目的に応じて適宜定められ、化学的に不定比の膜も含まれる。これら酸化物膜(化学的に不定比の場合も含む)や窒化物膜(化学的に不定比の場合も含む)の膜厚は一般に3〜100nmの範囲内が好ましい。 In addition, on the long resin film substrate, an oxide film, a nitride film, or the like may be formed in place of a metal film such as a Ni—Cr alloy or Cu, or in addition to the metal film. The types and film thicknesses of these oxide films and nitride films are appropriately determined according to the purpose, and chemically indefinite ratio films are also included. The film thickness of these oxide films (including chemically indefinite ratios) and nitride films (including chemically indefinite ratios) is generally preferably in the range of 3 to 100 nm.

上記の方法で作製された金属膜付樹脂フィルムは、次にサブトラクティブ法やセミアディティブ法によって金属膜に対してパターニング加工を行うことで配線回路が形成される。ここで、サブトラクティブ法とは、金属膜付樹脂フィルムの表面をレジストで覆い、金属膜(例えば、上記Cu膜)のうち配線として残存させたい部分以外のレジストを除去して開口部を設け、この開口部から露出する金属膜をエッチング処理して配線基板を作製する方法である。 The resin film with a metal film produced by the above method is then subjected to patterning processing on the metal film by a subtractive method or a semi-additive method to form a wiring circuit. Here, in the subtractive method, the surface of the resin film with a metal film is covered with a resist, and the resist other than the portion of the metal film (for example, the above Cu film) that is desired to remain as wiring is removed to provide an opening. This is a method of manufacturing a wiring substrate by etching a metal film exposed from this opening.

一方、セミアディティブ法とは、金属膜付樹脂フィルムの表面をレジストで覆い、金属膜のうち配線として膜厚化したい部分のレジストを除去して開口部を設け、この開口部から露出する金属膜の上に電気めっきで膜厚の配線を形成し、レジストを除去した後に全体をエッチングして不要部分の金属膜を除去し、配線基板を作製する方法である。従って、上記したフレキシブル配線基板の製造方法により金属膜付樹脂フィルムの金属膜の膜厚は異なる。一般的にはサブトラクティブ法を採用する場合の金属膜の膜厚は5〜12μmであり、セミアディティブ法を採用する場合の金属膜の膜厚は5μm以下である。 On the other hand, in the semi-additive method, the surface of a resin film with a metal film is covered with a resist, the resist of the portion of the metal film to be thickened as wiring is removed to provide an opening, and the metal film exposed from this opening is provided. This is a method in which a wiring having a film thickness is formed on the surface by electroplating, the resist is removed, and then the whole is etched to remove an unnecessary metal film to prepare a wiring substrate. Therefore, the film thickness of the metal film of the resin film with the metal film differs depending on the method for manufacturing the flexible wiring board described above. Generally, the film thickness of the metal film when the subtractive method is adopted is 5 to 12 μm, and the film thickness of the metal film when the semi-additive method is adopted is 5 μm or less.

上記金属膜付樹脂フィルムに用いる樹脂フィルムとしては、例えば、ポリイミド系フィルム、ポリアミド系フィルム、ポリエステル系フィルム、ポリテトラフルオロエチレン系フィルム、ポリフェニレンサルファイド系フィルム、ポリエチレンナフタレート系フィルム又は液晶ポリマー系フィルムなどの樹脂フィルムを挙げることができる。これら材料は、金属膜付樹脂フィルムに要求されるフレキシブル基板としての柔軟性、実用上必要な強度、配線材料としての好適な電気絶縁性等を有しているので好ましい。また、樹脂フィルムは厚みが5〜100μm、幅が20〜80cm程度であれば取り扱い易く、良好にスパッタリング成膜処理できるので望ましい。 Examples of the resin film used for the resin film with a metal film include a polyimide film, a polyamide film, a polyester film, a polytetrafluoroethylene film, a polyphenylene sulfide film, a polyethylene naphthalate film, and a liquid crystal polymer film. Resin film can be mentioned. These materials are preferable because they have the flexibility as a flexible substrate required for a resin film with a metal film, the strength required for practical use, and the suitable electrical insulation as a wiring material. Further, it is desirable that the resin film has a thickness of 5 to 100 μm and a width of about 20 to 80 cm because it is easy to handle and can be satisfactorily sputtered.

ところで、タッチパネルセンサー用部材として用いられる導電性基板では、上記したCu膜などの金属膜の反射を目立たなくするために、金属膜の表面に化学的に不定比の金属酸化物などからなる黒色の黒化層を設けることがある。黒化層は、銅、ニッケル、タングステンなどの不定比の酸化物などからなり、目視では黒色に見える。これらの化学的に不定比の膜は、上記したスパッタリング成膜の際のスパッタリングガスに酸素ガスや窒素ガスを適宜添加することで作製することができる。 By the way, in a conductive substrate used as a member for a touch panel sensor, in order to make the reflection of a metal film such as the above-mentioned Cu film inconspicuous, the surface of the metal film is chemically composed of an indefinite ratio of metal oxide or the like in black. A blackening layer may be provided. The blackened layer is composed of an indefinite ratio of oxides such as copper, nickel, and tungsten, and appears black to the naked eye. These chemically indefinite ratio films can be produced by appropriately adding oxygen gas or nitrogen gas to the sputtering gas at the time of the above-mentioned sputtering film formation.

しかし、金属膜の表面に黒化層を成膜してから巻取コアで巻き取ると、巻き取った金属膜付樹脂フィルムの幅方向両端部に目視で確認できる縞が生じることがある。特に、黒化層を設けた金属膜(例えばCu膜)の膜厚が5μm以下の場合に黒化層に目視で顕著に確認できる縞が生じることがある。この縞は、長尺基板が巻取コアに巻き取られる際、幅方向の両端部と中央部とで金属膜が不均一に巻き締められることで発生する変質によるものと推定される。もちろん、金属膜(例えばCu膜)の表面に黒化層を設けない場合であっても、目視で縞は確認できないものの、上記したように不均一に巻き締められることによる金属膜の変質は発生していると考えられる。 However, when a blackened layer is formed on the surface of the metal film and then wound by the winding core, fringes that can be visually confirmed may occur at both ends of the wound resin film with the metal film in the width direction. In particular, when the film thickness of the metal film (for example, Cu film) provided with the blackened layer is 5 μm or less, the blackened layer may have fringes that can be clearly confirmed visually. It is presumed that this fringe is due to alteration caused by uneven winding of the metal film at both ends and the center in the width direction when the long substrate is wound around the winding core. Of course, even when the blackening layer is not provided on the surface of the metal film (for example, Cu film), the stripes cannot be visually confirmed, but the deterioration of the metal film occurs due to uneven winding as described above. it seems to do.

上記の縞の発生は減圧雰囲気下で長尺基板を巻き取るときに特に顕著になる。その理由は、大気圧下で長尺基板を巻取コアに巻き取ると、巻き取られた長尺基板の間に大気が巻き込まれるため、巻き込まれた大気が巻取時に長尺基板に働くその長手方向(搬送方向)の張力を緩和するように作用するからである。一方、減圧雰囲気下で長尺基板を巻取コアに巻き取ると、巻き取られた長尺基板の間には気体がほとんど巻き込まれないので、上記した巻取時の長手方向の張力により長尺基板は巻き締められる。その際、図2において黒矢印で示すように、上記した張力の長尺基板Fの幅方向の分布は、幅方向中央部が最も強く、幅方向両端部が最も弱くなる。 The occurrence of the above-mentioned stripes becomes particularly remarkable when the long substrate is wound under a reduced pressure atmosphere. The reason is that when a long substrate is wound around a winding core under atmospheric pressure, the atmosphere is entrained between the wound long substrates, and the entrained air acts on the long substrate during winding. This is because it acts to relieve the tension in the longitudinal direction (transportation direction). On the other hand, when the long substrate is wound around the winding core under a reduced pressure atmosphere, almost no gas is entrained between the wound long substrates. The substrate is rolled up. At that time, as shown by the black arrow in FIG. 2, the distribution of the tension in the width direction of the long substrate F is the strongest in the central portion in the width direction and the weakest in both ends in the width direction.

そこで、本発明の一具体例においては、図3に示すように、巻取コア26の外周面のうち長尺基板Fの幅方向両端部が巻き付けられる箇所に、それぞれ周方向に連続して延在する凸状の段差部26aを設けている。これにより、長尺基板Fの幅方向の両端部における長手方向の張力を高めに調整することができ、巻取コア26での巻取りの際の幅方向中央部の張力と幅方向両端部の張力とをほぼ同等にすることができる。その結果、長尺基板Fの変質を抑えることができるので、幅方向両端部における縞状模様の生成をほぼ無くすことができる。 Therefore, in a specific example of the present invention, as shown in FIG. 3, on the outer peripheral surface of the take-up core 26, both ends in the width direction of the long substrate F are continuously extended in the circumferential direction. The existing convex step portion 26a is provided. As a result, the tension in the longitudinal direction at both ends of the long substrate F in the width direction can be adjusted to be higher, and the tension in the center portion in the width direction and the tension in both ends in the width direction during winding by the winding core 26 can be adjusted. The tension can be made almost equal. As a result, deterioration of the long substrate F can be suppressed, so that the generation of striped patterns at both ends in the width direction can be almost eliminated.

すなわち、上記の凸状段差部26aを設けることにより、巻取コア26の外周面のうち長尺基板Fの幅方向両端部に接する部分は長尺基板Fの幅方向中央部が接する部分より外径が大きくなり、つまり外周が長くなるので、長尺基板Fの幅方向両端部が幅方向中央部よりも巻取コア26の回転中心軸Oに対してより遠くに位置するように巻き取られていく。その結果、長尺基板Fが巻取コア26の回転に追従して巻き取られる際に長尺基板Fの幅方向の両端部は、凸状段差部26aにより長手方向に伸ばされる力が働くので、その分長手方向に張力がかかることになる。これにより、長尺基板Fの幅方向の両端部で不足する長手方向の張力を補えるので、部分的な巻締り(巻締りの偏り)を防止することができ、結果的に金属膜付樹脂フィルムの幅方向両端部の縞の発生を防ぐことができる。 That is, by providing the convex step portion 26a, the portion of the outer peripheral surface of the winding core 26 that is in contact with both ends in the width direction of the long substrate F is outside the portion that is in contact with the central portion in the width direction of the long substrate F. Since the diameter becomes large, that is, the outer circumference becomes long, both ends in the width direction of the long substrate F are wound so as to be located farther from the rotation center axis O of the winding core 26 than the center portion in the width direction. To go. As a result, when the long substrate F is wound following the rotation of the take-up core 26, both ends of the long substrate F in the width direction are stretched in the longitudinal direction by the convex step portion 26a. Therefore, tension is applied in the longitudinal direction by that amount. As a result, the tension in the longitudinal direction that is insufficient at both ends of the long substrate F in the width direction can be supplemented, so that partial winding (biased winding) can be prevented, and as a result, a resin film with a metal film can be prevented. It is possible to prevent the occurrence of stripes at both ends in the width direction.

本発明の一具体例の巻取コア26は、外径が8〜25cm程度であるのが好ましく、長さは巻き取る長尺基板Fの幅より長ければ特に制約はない。この巻取コア26の外周面のうち長尺基板Fの幅方向両端部にそれぞれ接触する箇所に設ける1対の周方向に連続する凸状段差部26aは、段差が50〜200μmであるのが好ましい。この段差が200μmを超えると、巻取コア26に巻き取られた長尺基板Fの隣接する層同士の擦れにより帯電しやすくなり、帯電により生じた電位差により放電が発生して製品の外観を損なう放電跡が生じるおそれがある。一方、段差が50μm未満では、上記した巻き取りの際の縞の発生を防止することが難しくなる。 The winding core 26 of a specific example of the present invention preferably has an outer diameter of about 8 to 25 cm, and is not particularly limited as long as the length is longer than the width of the long substrate F to be wound. A pair of convex stepped portions 26a continuous in the circumferential direction provided at locations of the outer peripheral surface of the winding core 26 in contact with both ends in the width direction of the long substrate F have a stepped step of 50 to 200 μm. preferable. If this step exceeds 200 μm, it becomes easy to be charged by rubbing between adjacent layers of the long substrate F wound around the winding core 26, and the potential difference generated by the charging causes discharge to spoil the appearance of the product. Discharge marks may occur. On the other hand, if the step is less than 50 μm, it becomes difficult to prevent the occurrence of the above-mentioned fringes during winding.

長尺基板Fがその幅方向において各凸状段差部26aと重なる長さは10mm以下が望ましい。例えば、長尺基板Fの両縁部の間に1対の凸状段差部26aが納まる場合は、各凸状段差部26aは10mm以下の幅を有しているのが好ましい。なお、各凸状段差部26aは、長尺基板Fと重なる部分にのみ配してもよいし、長尺基板Fと重なる位置から巻取コア26の縁部にまで至っていてもよい。また、各凸状段差部26aは、巻取コア26の平坦な外周面に段差を生じるように帯状の樹脂フィルムや金属箔を貼りつけてもよいし、凸状の段差部が形成されるように円筒部材から削り出してもよい。 It is desirable that the length of the long substrate F overlapping with each convex step portion 26a in the width direction is 10 mm or less. For example, when a pair of convex step portions 26a fits between both edges of the long substrate F, it is preferable that each convex step portion 26a has a width of 10 mm or less. In addition, each convex step portion 26a may be arranged only in the portion overlapping with the long substrate F, or may reach from the position overlapping with the long substrate F to the edge portion of the winding core 26. Further, each convex step portion 26a may be attached with a band-shaped resin film or metal leaf so as to generate a step on the flat outer peripheral surface of the winding core 26, or the convex step portion may be formed. It may be machined from a cylindrical member.

なお、上記したように巻取コア26に凸状段差部26aを設けなくても、長尺基板Fの搬送経路上で、巻取コアに最も隣接するガイドロールの外周面に上記したような凸状の段差部を設けても、同様の効果が得られるとも考えられる。すなわち、外周面に凸状段差部を有するガイドロールを用いても上記の巻取コア26の場合と同様に長尺基板Fの幅方向の両端部において長手方向の張力を高めることが可能になるが、その後、巻取コアの外周面に巻き付けた際に長尺基板Fの幅方向の両端部において長手方向に収縮する力が働くため、長尺基板Fの幅方向の両端部が擦れて帯電しやすくなり、結果的に放電が発生する問題が生ずることが確認された。 As described above, even if the winding core 26 is not provided with the convex step portion 26a, the convex step portion 26a as described above is formed on the outer peripheral surface of the guide roll most adjacent to the winding core on the transport path of the long substrate F. It is considered that the same effect can be obtained even if a stepped portion is provided. That is, even if a guide roll having a convex step portion on the outer peripheral surface is used, it is possible to increase the tension in the longitudinal direction at both ends in the width direction of the long substrate F as in the case of the winding core 26 described above. However, after that, when the winding core is wound around the outer peripheral surface, a force that contracts in the longitudinal direction acts on both ends in the width direction of the long substrate F, so that both ends in the width direction of the long substrate F are rubbed and charged. It was confirmed that the problem of discharge was caused as a result.

以上、本発明の一具体例の巻取コア及びこれを有する巻取装置を説明したが、本発明はかかる一具体例に限定されるものではなく、本発明の主旨から逸脱しない範囲内で様々な態様で実施することができる。例えば、図1の真空成膜装置10は、熱負荷の掛かる処理としてスパッタリング成膜処理を施すものであるため、マグネトロンスパッタリングカソードが図示されているが、熱負荷の掛かる処理がCVD(化学蒸着)や蒸着処理などの他の表面処理である場合は、板状ターゲットに代えて他の真空成膜手段が設けられる。 Although the winding core of one specific example of the present invention and the winding device having the same have been described above, the present invention is not limited to such a specific example and varies within the range not deviating from the gist of the present invention. It can be carried out in various embodiments. For example, since the vacuum film forming apparatus 10 of FIG. 1 performs a sputtering film forming process as a process to which a heat load is applied, a magnetron sputtering cathode is shown, but the process to which a heat load is applied is CVD (chemical vapor deposition). In the case of other surface treatments such as vapor deposition and vapor deposition, other vacuum film forming means are provided in place of the plate-shaped target.

また、減圧雰囲気下での長尺樹脂フィルムの成膜装置を例にあげて説明してきたが、減圧雰囲気下に限定されるものではなく、例えば、大気圧中の加熱ヒーターによる乾燥装置においても本発明に係る巻取コアや巻取装置を好適に用いることができる。この場合に使用される長尺基板には、ポリエチレンテレフタレート(PET)フィルムのような樹脂フィルムやポリイミドフィルムのような樹脂フィルムのほか、金属箔や金属ストリップを使用することができる。 Further, although the description has been given by taking as an example a film forming apparatus for a long resin film under a reduced pressure atmosphere, the present invention is not limited to a reduced pressure atmosphere, and for example, a drying apparatus using a heater in atmospheric pressure is also used. The take-up core and take-up device according to the present invention can be preferably used. As the long substrate used in this case, a resin film such as a polyethylene terephthalate (PET) film or a resin film such as a polyimide film, as well as a metal foil or a metal strip can be used.

[実施例1]
図1に示す成膜装置(スパッタリングウェブコータ)を用い、反応性ガスに酸素ガスを用いて金属膜付樹脂フィルムを作製した。具体的には、キャンロール20には、外径600mm、幅750mmのステンレス製のロール本体表面にハードクロムめっきを施したものを用い、その内部に冷媒を循環させて約0℃に温度制御した。マグネトロンスパッタリングカソード30、31には金属層用のCuターゲットを、マグネトロンスパッタリングカソード32、33には黒化層用のCu−Niターゲットを取り付けた。
[Example 1]
Using the film forming apparatus (sputtering web coater) shown in FIG. 1, a resin film with a metal film was produced by using oxygen gas as the reactive gas. Specifically, for the can roll 20, a stainless steel roll body having an outer diameter of 600 mm and a width of 750 mm was plated with hard chrome, and a refrigerant was circulated inside the roll body to control the temperature to about 0 ° C. .. A Cu target for a metal layer was attached to the magnetron sputtering cathodes 30 and 31, and a Cu-Ni target for a blackening layer was attached to the magnetron sputtering cathodes 32 and 33.

巻取コア26には図4に示すような外径180mm、長さ700mmの円筒部材を用い、その両端部に各々厚さ75μm、幅8mmの帯状の樹脂フィルムを全周に亘って貼りつけて、段差75μmの1対の凸状段差部26aを設けた。長尺基板Fには、厚さ50μm、幅600mmで長さ1200mのPETフィルムを用いた。これにより、各凸状段差部26aとPETフィルムの幅方向の重なりは8mmとなった。 A cylindrical member having an outer diameter of 180 mm and a length of 700 mm as shown in FIG. 4 is used for the winding core 26, and a strip-shaped resin film having a thickness of 75 μm and a width of 8 mm is attached to both ends thereof over the entire circumference. , A pair of convex step portions 26a having a step of 75 μm were provided. For the long substrate F, a PET film having a thickness of 50 μm, a width of 600 mm, and a length of 1200 m was used. As a result, the overlap between each convex step portion 26a and the PET film in the width direction became 8 mm.

真空チャンバー10を複数台のドライポンプにより5Paまで排気した後、更に、複数台のターボ分子ポンプとクライオコイルを用いて3×10−3Paまで排気した。そして、搬送速度2m/分でPETフィルムを搬送しながら、カソード30と31については、膜厚80nmのCu膜が得られるように電力制御で成膜を行い、カソード32と33については、アルゴンガス500sccmと酸素ガス50sccmとの混合ガスを導入し、黒化層として膜厚30nmの化学的に不定比のNi−Cu酸化膜が得られるように電力制御で成膜を行った。この状態でPETフィルムを1200m成膜した。成膜後に巻取コア26に巻き取られた金属膜付樹脂フィルムを目視で確認したところ、その両端部には縞が生じていなかった。 The vacuum chamber 10 was exhausted to 5 Pa by a plurality of dry pumps, and then further exhausted to 3 × 10 -3 Pa by using a plurality of turbo molecular pumps and cryocoils. Then, while transporting the PET film at a transport speed of 2 m / min, the cathodes 30 and 31 are formed with power control so that a Cu film having a film thickness of 80 nm can be obtained, and the cathodes 32 and 33 are formed with argon gas. A mixed gas of 500 sccm and 50 sccm of oxygen gas was introduced, and a film was formed under power control so that a chemically indefinite ratio Ni—Cu oxide film having a film thickness of 30 nm could be obtained as a blackening layer. In this state, a PET film was formed to form a film of 1200 m. When the resin film with a metal film wound around the winding core 26 after the film formation was visually confirmed, no stripes were formed at both ends thereof.

[実施例2]
凸状段差部26aの段差を180μmとした以外は実施例1と同様にして金属薄膜付樹脂フィルムを作製した。PETフィルムを1200m成膜した後に巻取コア26に巻き取られた金属膜付樹脂フィルムを目視で確認したところ、その両端部には縞が生じていなかった。
[Example 2]
A resin film with a metal thin film was produced in the same manner as in Example 1 except that the step of the convex step portion 26a was set to 180 μm. When the resin film with a metal film wound on the winding core 26 after forming a film of 1200 m of the PET film was visually confirmed, no stripes were generated at both ends thereof.

[比較例1]
凸状段差部26aのない平坦な巻取コアを用いた以外は実施例1と同等にして金属薄膜付樹脂フィルムを作製した。PETフィルムを1200m成膜した後に巻取コアに巻き取られた金属膜付樹脂フィルムを目視で確認したところ、両端部に縞が生じていた。
[Comparative Example 1]
A resin film with a metal thin film was produced in the same manner as in Example 1 except that a flat take-up core having no convex step portion 26a was used. When the resin film with a metal film wound on the winding core after forming a film of 1200 m of the PET film was visually confirmed, stripes were found at both ends.

[参考例]
巻取コア26の直ぐ上流側にガイドロールを設け、その外周面の両端部にもPETフィルムと各々8mm重なるように段差75μmの凸状段差部を設けた以外は実施例1と同様にして金属薄膜付樹脂フィルムを作製した。PETフィルムを1200m成膜した後に巻取コア26に巻き取られた金属膜付樹脂フィルムを目視で確認したところ、両端部に縞状模様はほとんど生じていなかったが、巻取コア26の両端部の帯電によると思われる放電痕が生じていた。
[Reference example]
A guide roll is provided immediately upstream of the take-up core 26, and a convex step portion having a step of 75 μm is provided at both ends of the outer peripheral surface thereof so as to overlap with the PET film by 8 mm, respectively. A resin film with a thin film was produced. When the resin film with a metal film wound around the take-up core 26 was visually confirmed after forming a PET film for 1200 m, almost no striped pattern was generated at both ends, but both ends of the take-up core 26 were formed. There was a discharge mark that was thought to be due to the charge of the film.

F 長尺基板
O 回転中心軸
10 真空成膜装置
11 巻出室
12 成膜室
13 巻取室
14 巻出コア
16、17、23、24 フリーロール
15、18、22、25 張力センサーロール
19 前フィードロール
20 キャンロール
21 後フィードロール
26 巻取コア
26a 凸状の段差部
30、31、32、33 マグネトロンスパッタリングカソード


F Long substrate O Rotation center axis 10 Vacuum film forming apparatus 11 Unwinding chamber 12 Film forming chamber 13 Winding chamber 14 Unwinding core 16, 17, 23, 24 Free roll 15, 18, 22, 25 Tension sensor roll 19 In front Feed roll 20 Can roll 21 After feed roll 26 Winding core 26a Convex stepped portion 30, 31, 32, 33 Magnetron sputtering cathode


Claims (5)

減圧雰囲気下において、ロールツーロールで搬送され、黒化層が成膜された厚み5〜100μmで且つ幅20〜80cmの金属膜付長尺樹脂フィルムを外径8〜25cmの円筒状の巻取コアに巻き取る金属膜付長尺樹脂フィルムの巻取方法であって(該金属膜付長尺樹脂フィルムを加熱しながら該巻取コアにロール状に巻き取るものを除く)、該巻取コアに金属膜付長尺樹脂フィルムを巻き取る際に、前記巻取コアの外周面に接して最初に巻き取られる金属膜付長尺樹脂フィルムの先端部では、その幅方向両端部がその幅方向中央部よりも該巻取コアの回転中心軸に対して50〜200μm遠くに位置させることで、金属膜付長尺樹脂フィルムの幅方向両端部が幅方向中央部よりも該巻取コアの回転中心軸に対してより遠くに位置するように、外周面のうち金属膜付長尺樹脂フィルムの幅方向両端部が巻き付けられる箇所で且つ該金属膜付長尺樹脂フィルムの両縁部の間に納まる部分にのみ、それぞれ周方向に連続して延在する段差50〜200μmで且つ幅10mm以下の凸状の段差部が設けられている該巻取コアに巻き取っていくことを特徴とする金属膜付長尺樹脂フィルムの巻取方法。 A long resin film with a metal film having a thickness of 5 to 100 μm and a width of 20 to 80 cm, which is conveyed by roll-to-roll under a reduced pressure atmosphere and has a blackened layer formed therein, is wound into a cylindrical shape having an outer diameter of 8 to 25 cm. wound on the core to a winding method of the metal film with elongated resin film (excluding those for winding into a roll in the winding preparative core while heating the metal film with elongated resin film), the winding preparative core to the time of winding the metal film with elongated resin film, the distal end portion of the first winding metal film with elongated resin film taken in contact with the outer peripheral surface of the winding core, the widthwise end portions the width direction By locating the take-up core 50 to 200 μm away from the center axis of rotation of the take-up core, both ends of the long resin film with a metal film in the width direction rotate the take-up core more than the center part in the width direction. At the outer peripheral surface where both ends in the width direction of the long resin film with a metal film are wound so as to be located farther from the central axis, and between both edges of the long resin film with a metal film. A metal characterized in that it is wound around the winding core provided with a convex step portion having a step of 50 to 200 μm and a width of 10 mm or less, which extends continuously in the circumferential direction only in the fitting portion. How to wind a long resin film with a film. 減圧雰囲気下において、ロールツーロールで搬送され、黒化層が成膜された厚み5〜100μmで且つ幅20〜80cmの金属膜付長尺樹脂フィルムを外径8〜25cmの円筒状の巻取コアに巻き取る金属膜付長尺樹脂フィルムの巻取装置であって(該金属膜付長尺樹脂フィルムを加熱しながら該巻取コアにロール状に巻き取るものを除く)、該巻取コアの外周面のうち金属膜付長尺樹脂フィルムの幅方向両端部が巻き付けられる箇所で且つ該金属膜付長尺樹脂フィルムの両縁部の間に納まる部分にのみ、それぞれ周方向に連続して延在する段差50〜200μmで且つ幅10mm以下の凸状の段差部が設けられていることを特徴とする金属膜付長尺樹脂フィルムの巻取装置。 A long resin film with a metal film having a thickness of 5 to 100 μm and a width of 20 to 80 cm, which is conveyed by roll-to-roll under a reduced pressure atmosphere and has a blackened layer formed therein, is wound into a cylindrical shape having an outer diameter of 8 to 25 cm. A winding device for a long resin film with a metal film to be wound around a core (excluding a device that winds the long resin film with a metal film into a roll while heating the winding core). Only in the outer peripheral surface where both ends of the long resin film with a metal film are wound and which fits between both edges of the long resin film with a metal film , each is continuous in the circumferential direction. A winding device for a long resin film with a metal film, characterized in that a convex step portion having an extending step of 50 to 200 μm and a width of 10 mm or less is provided. 前記巻取コアの外周面は、前記凸状の段差部を除いて略同一の外径を有していることを特徴とする、請求項2に記載の金属膜付長尺樹脂フィルムの巻取装置。 The winding of a long resin film with a metal film according to claim 2, wherein the outer peripheral surface of the winding core has substantially the same outer diameter except for the convex stepped portion. Device. 真空チャンバー内においてロールツーロールで搬送される長尺樹脂フィルムに表面処理を施す表面処理手段と、表面処理された長尺樹脂フィルムを巻き取る円筒状のコアからなる巻取手段とを備えた長尺樹脂フィルムの表面処理装置であって、前記巻取手段が請求項2又は3に記載の金属膜付長尺樹脂フィルムの巻取装置であることを特徴とする長尺樹脂フィルムの表面処理装置。 A length provided with a surface treatment means for surface-treating a long resin film conveyed by roll-to-roll in a vacuum chamber and a winding means consisting of a cylindrical core for winding the surface-treated long resin film. a surface treatment apparatus of the continuous resin film, a surface treatment apparatus of the long resin film, wherein the winding means, characterized in that a winding device of a metal film with elongated resin film according to claim 2 or 3 .. 請求項4に記載の表面処理手段がスパッタリングカソードであることを特徴とするロールツーロールスパッタリング装置。 A roll-to-roll sputtering apparatus according to claim 4, wherein the surface treatment means is a sputtering cathode.
JP2015210653A 2015-10-27 2015-10-27 A method and a winding device for winding a long substrate, and a surface treatment device for a long substrate provided with the winding device. Active JP6979265B2 (en)

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