JP6975349B2 - 表盤に金属装飾を施す方法及びこの方法によって得られた表盤 - Google Patents
表盤に金属装飾を施す方法及びこの方法によって得られた表盤 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
- C23C28/3225—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only with at least one zinc-based layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/003—3D structures, e.g. superposed patterned layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/52—After-treatment of electroplated surfaces by brightening or burnishing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B19/00—Indicating the time by visual means
- G04B19/06—Dials
- G04B19/10—Ornamental shape of the graduations or the surface of the dial; Attachment of the graduations to the dial
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Micromachines (AREA)
- Electroplating Methods And Accessories (AREA)
Description
− 少なくとも1つの面が導電性である基材を用意するステップ
− 基材の導電面に感光性樹脂層を塗布するステップ
− 所望の微細構造の輪郭が定められたマスクを通して樹脂層に対して照射するステップ
− いくつかの箇所において基材の導電面が見えるように感光性樹脂層の非照射領域を溶解させるステップ
− 代わりに、感光性樹脂の上面に実質的に到達し第1の金属と第2の金属の層の積み重なりによって形成されるブロックを形成するように、第1の金属及び少なくとも1つの第2の金属の層を前記導電面上に電気的に堆積させるステップ
− 樹脂層と電着されたブロックを基材から剥離して分離するステップ
− 分離された構造の感光性樹脂層を除去して、このようにして形成された微細構造を解放するステップ
a)基材を用意し、その基材上に感光性樹脂層を堆積させるステップと、
b)前記感光性樹脂層に対して、所望の装飾の輪郭が定められたマスクを通して照射するステップと、
c)装飾の位置において前記基材が見えるように前記感光性樹脂層の前記非光重合領域を溶解させるステップと、
d)蒸着を用いて第1の接着層と第2の導電層を堆積させるステップと、
e)少なくとも前記感光性樹脂の上面に到達する層を形成するように前記導電層上に金属又は金属合金の層を電気的に堆積させるステップと、
f)電気的に堆積された層の余剰分を除去するように表面仕上げと研磨を行うステップと、
g)プラズマエッチングによって残りの感光性樹脂層を除去するステップと、及び
h)湿式エッチングによって前記第1の接着層と前記第2の導電層を除去するステップと
を備える。
− 前記第1の接着層は、Ti、Ta、Cr又はThを主に含有する層である。
− 前記第2の導電層は、Au、Pt、Ag、Cr、Pd、TiN、CrN、ZrN、Niタイプのものである。
− 前記第1の接着層の厚みは、30nm〜80nmである。
− 前記第2の導電層の厚みは、30nm〜80nmである。
− 本方法の1つの代替形態において、ステップg)において、型の高さまで第1の金属が堆積され、ステップi)の前に、当該方法は、堆積された第1の金属を覆う第2の金属を堆積させるステップh’)を備える。
− 絶縁材料によって作られた基材は、セラミックス、サファイア、真珠母材、ガラス、石英、ダイヤモンド、無機物質(花こう岩、大理石など)、ポリマー、複合材料又はエナメルによって作られた非導電性の基材である。
Claims (7)
- 曲がった面があり絶縁材料によって作られた基材(1)上に少なくとも1つの金属装飾を作る方法であって、
a)基材(1)を用意し、その基材(1)上に感光性樹脂層(5)を堆積させるステップと、
b)前記感光性樹脂層(5)に対して、所望の装飾、光重合領域(5a)及び非光重合領域(5b)の輪郭が定められたマスク(6)を通して照射するステップと、
c)装飾の位置において前記基材(1)が見えるように前記感光性樹脂層(5)の前記非光重合領域(5b)を溶解させるステップと、
d)前記基材(1)と前記光重合領域(5a)に対する蒸着を用いて第1の接着層(2)と第2の導電層(3)を堆積させるステップと、
e)前記感光性樹脂(5)の上面に実質的に到達する少なくとも1つのブロック(71、72)を形成するように前記第2の導電層(3)上に金属又は金属合金の層(7)を電気的に堆積させるステップと、
f)電気的に堆積された層の余剰分を除去するように表面仕上げと研磨を行うステップと、
g)プラズマエッチングによって残りの感光性樹脂層(5)を除去するステップと、及び
h)湿式エッチングによって前記第1の接着層(2)と前記第2の導電層(3)を除去するステップと
を備えることを特徴とする方法。 - 前記第1の接着層は、Ti、Ta、Cr又はThタイプの層である
ことを特徴とする請求項1に記載の方法。 - 前記第2の導電層は、Au、Pt、Ag、Cr、Pd、TiN、CrN、ZrN又はNiから選択される物質の層である
ことを特徴とする請求項1又は2に記載の方法。 - 前記第1の接着層(2)の厚みは、30nm〜80nmである
ことを特徴とする請求項1〜3のいずれか一項に記載の方法。 - 前記第2の導電層(3)の厚みは、30nm〜80nmである
ことを特徴とする請求項1〜4のいずれか一項に記載の方法。 - 前記電気的に堆積させるステップe)にて、型の高さまで第1の金属又は金属合金が堆積され、
前記表面仕上げと研磨を行うステップf)の前に、堆積された前記第1の金属又は金属合金を覆う第2の金属又は金属合金を堆積させるステップh’)を備える
ことを特徴とする請求項1〜5のいずれか一項に記載の方法。 - 絶縁材料によって作られた前記基材(1)は、セラミックス、サファイア、真珠母材、石英、ダイヤモンド、無機物質、ポリマー、複合材料、ガラス又はエナメルによって作られた基材である
ことを特徴とする請求項1〜6のいずれか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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EP18174638.9 | 2018-05-28 | ||
EP18174638.9A EP3575447A1 (fr) | 2018-05-28 | 2018-05-28 | Procede de fabrication d'un decor metallique sur un cadran et cadran obtenu selon ce procede |
PCT/EP2019/063357 WO2019228902A1 (fr) | 2018-05-28 | 2019-05-23 | Procede de fabrication d'un decor metallique sur un cadran et cadran obtenu selon ce procede |
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JP2021521343A JP2021521343A (ja) | 2021-08-26 |
JP6975349B2 true JP6975349B2 (ja) | 2021-12-01 |
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Country Status (5)
Country | Link |
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US (1) | US11499242B2 (ja) |
EP (2) | EP3575447A1 (ja) |
JP (1) | JP6975349B2 (ja) |
CN (1) | CN112189063B (ja) |
WO (1) | WO2019228902A1 (ja) |
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EP3786722A1 (fr) | 2019-08-27 | 2021-03-03 | Comadur S.A. | Procede de decoration d'une piece mecanique |
EP3839659B1 (fr) * | 2019-12-16 | 2024-04-03 | Rubattel et Weyermann S.A. | Procédé de décoration d'une pièce mécanique |
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US4058401A (en) | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
JPH0516371A (ja) * | 1991-12-21 | 1993-01-26 | Canon Inc | インクジエツトヘツド |
JPH10268338A (ja) * | 1997-01-23 | 1998-10-09 | Toshiba Corp | 液晶表示装置およびその製造方法 |
EP1548525B2 (fr) * | 2003-12-23 | 2017-08-16 | Rolex Sa | Elément en céramique pour boîte de montre et procédé de fabrication de cet élément |
US7767126B2 (en) * | 2005-08-22 | 2010-08-03 | Sipix Imaging, Inc. | Embossing assembly and methods of preparation |
JP2007180089A (ja) * | 2005-12-27 | 2007-07-12 | Auto Network Gijutsu Kenkyusho:Kk | 回路導体パターンを有する樹脂成形部品の製造方法 |
KR100841170B1 (ko) * | 2007-04-26 | 2008-06-24 | 삼성전자주식회사 | 저저항 금속 배선 형성방법, 금속 배선 구조 및 이를이용하는 표시장치 |
EP2048265A1 (de) * | 2007-10-09 | 2009-04-15 | HDO -Druckguss- und Oberflächentechnik GmbH | Verfahren zur Herstellung eines Bauteils sowie Bauteil |
CH704955B1 (fr) * | 2007-12-31 | 2012-11-30 | Nivarox Sa | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce prodédé. |
CH704572B1 (fr) * | 2007-12-31 | 2012-09-14 | Nivarox Sa | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé. |
EP2383244A1 (fr) * | 2010-04-23 | 2011-11-02 | Omega SA | Elément céramique incrusté d'au moins un décor métallique |
ES2821019T3 (es) * | 2015-07-13 | 2021-04-23 | Crayonano As | Nanocables o nanopirámides cultivados sobre un sustrato grafítico |
FR3050215B1 (fr) * | 2016-04-15 | 2018-04-13 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de modification d'une surface en oxyde conducteur de l'electricite, utilisation pour l'electrodeposition de cuivre sur cette derniere |
EP3339980A1 (fr) * | 2016-12-22 | 2018-06-27 | The Swatch Group Research and Development Ltd | Procédé de réalisation d'un motif sur une pièce horlogère et pièce horlogère |
WO2019067932A2 (en) * | 2017-09-29 | 2019-04-04 | Nike Innovate C.V. | STRUCTURALLY COLORED ARTICLES AND METHODS OF MANUFACTURING AND USING STRUCTURALLY COLORED ARTICLES |
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2018
- 2018-05-28 EP EP18174638.9A patent/EP3575447A1/fr not_active Withdrawn
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2019
- 2019-05-23 CN CN201980033673.8A patent/CN112189063B/zh active Active
- 2019-05-23 WO PCT/EP2019/063357 patent/WO2019228902A1/fr active Search and Examination
- 2019-05-23 EP EP19724880.0A patent/EP3802920B1/fr active Active
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Publication number | Publication date |
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CN112189063B (zh) | 2023-06-16 |
EP3802920B1 (fr) | 2022-04-20 |
WO2019228902A1 (fr) | 2019-12-05 |
US20210054518A1 (en) | 2021-02-25 |
US11499242B2 (en) | 2022-11-15 |
EP3575447A1 (fr) | 2019-12-04 |
EP3802920A1 (fr) | 2021-04-14 |
CN112189063A (zh) | 2021-01-05 |
JP2021521343A (ja) | 2021-08-26 |
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