CN112189063A - 生产在表盘上的金属装饰物的方法和使用本方法获得的表盘 - Google Patents

生产在表盘上的金属装饰物的方法和使用本方法获得的表盘 Download PDF

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CN112189063A
CN112189063A CN201980033673.8A CN201980033673A CN112189063A CN 112189063 A CN112189063 A CN 112189063A CN 201980033673 A CN201980033673 A CN 201980033673A CN 112189063 A CN112189063 A CN 112189063A
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E·拉福热
S·斯普林格
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Abstract

本发明涉及一种在绝缘材料制成的弧形表盘上生产金属装饰物的方法,其特征在于它包括以下步骤:使用UV LIGA方法形成一个由光敏树脂制成的模具,并从所述导电层开始电沉积至少一种金属层,以便形成基本上达到所述光敏树脂上表面的块。

Description

生产在表盘上的金属装饰物的方法和使用本方法获得的表盘
发明领域
本发明涉及一种通过LIGA型技术生产金属装饰物的方法。特别地,本发明涉及这样一种生产由弧形陶瓷制成的表盘的方法,其中金属装饰物最佳地适应在该表盘上。本发明还涉及由这种方法获得的这样一种表盘。
发明背景
20世纪80年代,德国卡尔斯鲁厄核研究中心(Karlsruhe Nuclear ResearchCenter,Germany)的W.Ehrfeld开发的LIGA(Lithographie Galvanik Abformung)技术被证明在生产高精度金属微结构方面很有意义。
LIGA技术的原理是在导电或涂有导电层的基底上沉积一层光敏树脂,通过与所需微结构轮廓相对应的掩模,借助同步加速器进行X射线照射,显影,即通过物理或化学方法消除光敏树脂层中未被照射的部分,以确定一个具有微结构轮廓的模具,在光敏树脂制成的模具中电沉积金属,通常是镍,然后消除模具以释放微结构。
所得到的微结构的质量高于批评,但由于需要实施昂贵的设备(同步加速器),使得这种技术与必须具有低单位成本的微结构的大规模生产不是很兼容。
这就是为什么在所述LIGA方法的基础上,已经开发出类似的方法,但使用对紫外光敏感的树脂。这样的方法特别描述在CH 704 955号文件中,并且包括以下步骤:
-提供基底,其中至少有一个面是导电的;
-在基底的导电面上施加光敏树脂层;
-通过界定所需微结构轮廓的掩模对树脂层进行照射;
-溶解光敏树脂层的非照射区域,以便适当地(in places)显示出基底的导电面;
-从所述导电面交替地电沉积第一金属层和至少一个第二金属层,以形成基本上达到光敏树脂上表面的块,所述块由第一和第二金属层的堆叠形成;
-通过分层将树脂层和电沉积块从基底上分离;
-消除分层结构的光敏树脂层,以释放这样形成的微结构。
根据现有技术的这种方法通过电沉积制作金属装饰物是在平面上完成的,而其在具有曲面的部件上实施则要复杂得多,部件的曲率使其无法正确地安装装饰物。
发明概述
本发明的目的是为了弥补上述缺点以及其他缺点,其通过提供一种生产符合要装饰的部件的曲率的金属装饰物的方法。
本发明的目的还在于提供这样一种实施起来简单而廉价的方法。
为此,本发明的目的是一种在绝缘材料制成的具有弯曲表面的基底上生产至少一种金属装饰物的方法,包括以下步骤:
a)提供基底并在其上沉积光敏树脂层;
b)通过界定所需装饰物轮廓的掩模对树脂层进行照射;
c)溶解光敏树脂层的非照射区域,以便在装饰物的位置上适当地(in places)显示第三附着层;
d)通过蒸汽沉积法沉积第一附着层和第二导电层;
e)从所述导电面电沉积金属或金属合金层,以形成至少达到光敏树脂上表面的层;
f)进行表面处理和抛光的步骤,以去除电沉积层的多余部分;
g)通过等离子体蚀刻消除剩余的树脂层;
h)通过湿法蚀刻消除第一层和第二层。
因此,该方法使得可以生产陶瓷制成的具有弯曲表面的成品部件,该部件具有完全适合该表面的浮雕金属装饰物。
根据本发明的其它有利变体:
-所述第一附着层为Ti、Ta、Cr或Th型;
-所述第二导电层为Au、Pt、Ag、Cr、Pd、TiN、CrN、ZrN、Ni类型;
-第一附着层的厚度为30nm至80nm;
-第二导电层的厚度为30nm至80nm;
-根据该方法的一种变体,在步骤g)期间,在模具的高度处沉积第一金属,并且在步骤i)之前,该方法包括沉积第二金属的步骤h'),其中所述第二金属覆盖沉积的第一金属;
-由绝缘材料制成的基底,是由陶瓷、蓝宝石、珍珠母、玻璃、石英、金刚石、矿物材料(花岗岩、大理石等)、聚合物、复合材料或搪瓷制成的非导电基底。
最后,本发明涉及一种具有金属装饰物的由绝缘材料制成的弧形表盘,该表盘拟固定在手表壳上,并根据本发明的方法获得,该装饰物是刻度、贴花(applique)和/或标志。
因此可以理解,本发明的方法在生产钟表的装饰件方面找到了特别有利的应用。
附图概述
从下面对根据本发明的方法的一个实施方案的描述中,本发明的其它特征和优点将变得清晰明了,所述实例仅为了纯粹的说明性和非限制性目的,结合其中的附图给出。
-图1a至1f示出了本发明生产带有贴花的表盘的一个实施方案的方法步骤。
优选实施方案的详细描述
在根据本发明的方法的步骤a)中使用的基底1例如是由陶瓷、蓝宝石、搪瓷或其它制成并且具有弯曲表面的基底形成的。在图1所示的第一步a)中,它沉积了一个树脂层。
根据本发明方法的步骤a)中使用的光敏树脂5优选是可从Microchem公司在参考号SU-8下获得的八官能环氧基阴树脂的树脂,光引发剂选自三芳基锍盐,如与专利US 4,058,401中所述的相同。所述树脂在暴露于紫外线照射下时可被光聚合。需要注意的是,已经证明适合所述树脂的溶剂是γ-丁内酯(GBL)。
另外,也可以使用在DNQ(DiazoNaphtoQuinone)光引发剂存在下的线性酚醛清漆(Novolac)型酚醛基树脂。
通过任何合适的方法,通过旋涂、旋涡涂布、或者也可以通过喷涂,将树脂5沉积在基底1上以达到所需厚度。通常树脂厚度为1微米至500微米,更优选为20微米至300微米。根据所需的厚度和使用的沉积技术,树脂5将分一次或多次沉积。
然后,根据沉积的厚度,将树脂5在80至95℃之间加热一段时间,以便抽空溶剂。所述加热使树脂干燥和硬化。
图1b中示出的随后步骤b)包括通过界定所需装饰物,从而界定光聚合区域5a和非光聚合区域5b的轮廓的掩模6借助紫外线照射来照射树脂层5。典型地,所述紫外线照射为200至1,000mJ.cm-2,以365nm的典型波长测量,取决于层的厚度和所选树脂的类型。
如果适用,可能需要对树脂层5进行退火的步骤,以便完成由紫外线照射引起的光聚合。所述退火步骤优选在90℃至95℃之间进行15至30分钟,或者根据厚度甚至更长。光聚合区域5a变得对绝大多数溶剂不敏感。然而,非光聚合区域随后可被溶剂溶解。
图1c中所示的随后步骤c)包括显影光敏树脂层的非光聚合区域5b,以便显示基底1。所述操作通过用合适的溶剂,例如选自GBL(γ-丁内酯)和PGMEA(丙二醇甲醚乙酸酯)溶解非光聚合区域5b来进行。这样就生产出具有装饰物轮廓的光聚合光敏树脂5a制成的模具。
在该方法的步骤d)中,例如通过物理气相沉积(PVD)方法,沉积第一附着层2和第二导电层3,也就是说,沉积能够启动金属电沉积的层。通常,附着层2为Ti、Ta、Cr或Th类型,其厚度为30nm至80nm,导电层3为Au、Pt、Ag、Cr、Pd、TiN、CrN、ZrN、Ni类型(图1a),其厚度也为30nm至80nm。第一和第二附着层可以通过本领域技术人员已知的任何其它方式沉积。
另外,基底可以用不锈钢或能够启动电铸反应(electroforming reaction)的另一种金属生产。在这种情况下,不再需要第一层和第二层。在由不锈钢制成的基底的情况下,所述后者将在使用前进行脱脂,并且后部将用清漆或树脂保护,以防止在所述后部表面上的电沉积。
图1e所示的后续步骤e)包括在模具中从所述导电层3电沉积一层金属,直到形成层7,优选至少达到模具的高度,金属层的厚度在1微米至500微米之间,更优选在20微米至300微米之间。在上下文中,金属当然被理解为包括金属合金。通常,金属将选自包括镍、铜、金或银,以及作为合金的金铜、镍钴、镍铁、镍磷或镍钨的组。
电铸条件,特别是浴液的组成、系统的几何形状、电流电压和密度,是根据电铸技术中众所周知的技术对每种要电沉积的金属或合金选择的(例如参见Di Bari G.A.“Electroforming”Electroplating Engineering Handbook,第4版,由L.J.Durney编写,由Van Nostrand Reinhold Company Inc.出版,N.Y.USA 1984)。
在该方法的步骤f)中,对在前一步骤中电沉积的层进行表面处理和/或抛光,以去除多余的部分并获得清洁的表面。
随后的步骤g)包括通过等离子体蚀刻和/或湿法蚀刻消除树脂层5a、第一附着层2和第二导电层3,这使得能够在不损坏电沉积块71、72的情况下去除所述层。
在该步骤g)结束时,得到在基底1上形成装饰物具有电沉积块71、72的基底1,第一、第二和第三层2、3、4也在消除剩余的树脂后,在基底上适当地存在。
在这一步骤结束时,可对所得到的部件进行清洗,并可任选在机床上重新加工,以便进行机械加工操作或美学处理。在此阶段,部件可直接使用或确实进行各种装饰性和/或功能性处理,通常是物理或化学沉积。
根据本发明的一个替代方案,在步骤e)中,从所述导电层电沉积第一金属层,例如镍,以便形成高度小于或等于树脂高度的层。随后的步骤h)保持一样,并且进行另外的步骤h'),在该步骤中,在第一金属层上电沉积另一金属或合金层,例如贵金属如金。最后,在步骤g)中,通过至少一次湿法蚀刻消除附着层4和导电层3及附着层2。
这样的替代方案成本较低,易于实施,镍的开发比贵金属例如金更容易控制,成本更低。
本发明的方法特别有利地应用于生产钟表的装饰件,特别是非导电材料制成的在其表面上具有金属装饰物的弧形表盘。这些装饰物可以例如是刻度、贴花、标志或品牌名称等。由于这种方法,可以提供具有任何类型金属装饰物的非导电材料制成的弧形表盘,所述金属装饰物完美地适应弧形表盘表面的曲率,具有非常精确的定位,并且以一种多部件的方法,因此具有经济效益。

Claims (9)

1.在绝缘材料制成的具有弯曲表面的基底(1)上生产至少一种金属装饰物的方法,包括以下步骤:
a)提供基底(1)并在其上沉积光敏树脂层(5);
b)通过界定所需装饰物的轮廓的掩模(6)照射树脂层(5);
c)溶解光敏树脂层(5)的非照射区域(5b),以便在装饰物的位置上适当地显示第三附着层(4);
d)通过蒸汽沉积法沉积第一附着层(2)和第二导电层(3);
e)从所述导电面电沉积金属或金属合金层(7),以形成至少一个基本上达到光敏树脂(5)上表面的块(71,72);
f)进行表面处理和抛光的步骤,以去除电沉积层的多余部分;
g)通过等离子体蚀刻消除剩余的树脂层(5);
h)通过湿法蚀刻消除第一层和第二层。
2.根据权利要求1所述的方法,其特征在于,所述第一附着层为Ti、Ta、Cr或Th型。
3.根据权利要求1或2所述的方法,其特征在于,所述第二导电层为Au、Pt、Ag、Cr、Pd、TiN、CrN、ZrN、Ni类型。
4.根据前述权利要求中任一项所述的方法,其特征在于,所述第一附着层(2)具有30nm至80nm的厚度。
5.根据前述权利要求中任一项所述的方法,其特征在于,第二导电层(3)具有30nm至80nm的厚度。
6.根据前述权利要求中任一项所述的方法,其特征在于:
-在步骤g)中,在模具的高度处沉积第一金属;
-在步骤i)之前,所述方法包括沉积第二金属的步骤h'),所述第二金属覆盖沉积的第一金属或金属合金。
7.根据前述权利要求中任一项所述的方法,其特征在于,由绝缘材料制成的基底(1)是由陶瓷、蓝宝石、珍珠母、玻璃、石英、金刚石、矿物材料(花岗岩、大理石等)、聚合物、复合材料、玻璃或搪瓷制成的基底。
8.具有金属装饰物的由绝缘材料制成的弧形表盘,其意欲固定在手表壳上,并根据权利要求1至7中任一项的方法获得。
9.根据权利要求8所述的表盘,其中所述装饰物为刻度、贴花和/或标志。
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