JP6972928B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6972928B2 JP6972928B2 JP2017211338A JP2017211338A JP6972928B2 JP 6972928 B2 JP6972928 B2 JP 6972928B2 JP 2017211338 A JP2017211338 A JP 2017211338A JP 2017211338 A JP2017211338 A JP 2017211338A JP 6972928 B2 JP6972928 B2 JP 6972928B2
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- JP
- Japan
- Prior art keywords
- conductive plate
- electrode
- outer peripheral
- protective film
- metal film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
上記の半導体装置1と従来の半導体装置について、試験例と比較例を用いて試験を行った。試験例1−3では上記の半導体装置1を用いた。上記の半導体装置1では、導電板3の裏面37に凹部32が形成されている。試験例1−3では、導電板3の外周端36と導電板3の中心部30との中間31よりも外周端36側の位置に凹部32が形成されている。試験例1−3では、図3に示す導電板3の外周端36から凹部32までの距離Lが異なっている。試験例1−3における距離Lは、表1に示す通りである。
2 :半導体基板
3 :導電板
4 :表面電極
5 :保護膜
6 :金属膜
7 :裏面電極
30 :中心部
31 :中間
32 :凹部
36 :外周端
37 :裏面
81 :表面側放熱板
82 :裏面側放熱板
90 :封止樹脂
91 :はんだ
92 :はんだ
93 :はんだ
101 :接触点
Claims (1)
- 半導体基板と、
前記半導体基板の表面を覆っている表面電極と、
前記表面電極の表面の外周部を覆っている保護膜と、
前記保護膜に覆われていない前記表面電極の表面の内側部を覆っている金属膜と、
前記金属膜の表面に接合材を介して固定されている導電板と、を備えており、
前記表面電極の前記表面の前記外周部と前記内側部との境界において、前記表面電極と前記保護膜と前記金属膜の三者が互いに接触する接触点を有しており、
前記導電板の裏面には、前記導電板の外周端と前記導電板の中心部との中間よりも前記外周端側の位置に凹部が形成されており、前記凹部に前記接合材が充填されている、半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017211338A JP6972928B2 (ja) | 2017-10-31 | 2017-10-31 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017211338A JP6972928B2 (ja) | 2017-10-31 | 2017-10-31 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019083297A JP2019083297A (ja) | 2019-05-30 |
JP6972928B2 true JP6972928B2 (ja) | 2021-11-24 |
Family
ID=66671175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2017211338A Active JP6972928B2 (ja) | 2017-10-31 | 2017-10-31 | 半導体装置 |
Country Status (1)
Country | Link |
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JP (1) | JP6972928B2 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5056105B2 (ja) * | 2007-03-27 | 2012-10-24 | 株式会社デンソー | 半導体装置およびその製造方法 |
JP6114149B2 (ja) * | 2013-09-05 | 2017-04-12 | トヨタ自動車株式会社 | 半導体装置 |
JP6249933B2 (ja) * | 2014-12-10 | 2017-12-20 | 三菱電機株式会社 | 半導体素子、半導体装置および半導体素子の製造方法 |
-
2017
- 2017-10-31 JP JP2017211338A patent/JP6972928B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2019083297A (ja) | 2019-05-30 |
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