JP6969923B2 - 基材コーティング装置 - Google Patents
基材コーティング装置 Download PDFInfo
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- JP6969923B2 JP6969923B2 JP2017147094A JP2017147094A JP6969923B2 JP 6969923 B2 JP6969923 B2 JP 6969923B2 JP 2017147094 A JP2017147094 A JP 2017147094A JP 2017147094 A JP2017147094 A JP 2017147094A JP 6969923 B2 JP6969923 B2 JP 6969923B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3492—Variation of parameters during sputtering
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/32779—Continuous moving of batches of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
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- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
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- Physical Vapour Deposition (AREA)
Description
12 基材
14 真空チャンバ
16 テーブル
18 ドア
20 冷却ドラム
22 ターゲット材
24 真空チャンバの内壁
26 加熱体
28 加熱又は冷却パネル
30 温度センサ
32 温度制御モジュール
34 冷却パネル
36 冷却ドラム
38 凹部
40 リフティングチャンバ
42 リニアアクチュエータ
44 開口
46 ベース
48 上部ラック
50 ロッド
52 モータ
54 シャッターアセンブリ
56 真空ポンプ
58 ピストン
60 シリンダ
62 接続部材
64 蓋部
66 ギアホイール
67 モータ
68 歯付きラック
X 中心軸
Claims (14)
- 基材(12)をコーティングする装置(10)であって、
それを通して基材(12)を収容することができる開口(44)と、前記開口(44)を密閉するように構成されたドア(18)とを有する真空チャンバ(14)と、
前記真空チャンバ(14)内に配置された1つ又は複数のターゲット材(22)と、
前記基材(12)を冷却するように構成された冷却ユニット(20,34,36)及び/又は前記基材(12)を加熱するように構成された加熱ユニット(26)と、
前記1つ又は複数のターゲット材(22)と、前記冷却ユニット(20,34,36)及び/又は前記加熱ユニット(26)とに対して基材(12)を回転させるように構成された回転手段と、
前記真空チャンバ(14)の内部に連通し、前記冷却ユニット(20,34,36)及び/又は前記加熱ユニット(26)を収容するように構成されたリフティングチャンバ(40)とを有し、
前記真空チャンバ(14)は、前記冷却ユニット(20,34,36)及び/又は前記加熱ユニット(26)と、前記リフティングチャンバ(40)とが、それに沿って配置されるリフティング軸(X)を画定し、
前記装置(10)は、前記冷却ユニット(20,34,36)及び/又は前記加熱ユニット(26)を、前記真空チャンバ(14)と前記リフティングチャンバとの間で前記リフティング軸に沿って変位させるように構成された変位手段(42,66,68)をさらに有する
基材コーティング装置(10)。 - 前記変位手段(42,66,68)は、前記冷却ユニット(20,34,36)及び/又は前記加熱ユニット(26)を、前記リフティング軸(X)の周りを回転させないように前記リフティング軸(X)に沿って変位させるように構成されている
請求項1に記載の装置(10)。 - 前記冷却ユニット(20,34,36)と、前記加熱ユニット(26)とを有し、
前記変位手段(42,66,68)は、前記冷却ユニット(20,34,36)及び前記加熱ユニット(26)の両方を変位させるように構成されている
請求項1又は2に記載の装置(10)。 - 前記変位手段(42,66,68)は、前記冷却ユニット(20,34,36)および前記加熱ユニット(26)の一方を他方から独立して変位させるように構成されている
請求項3に記載の装置(10)。 - 前記冷却ユニット(20)は、前記加熱ユニット(26)を囲むように構成された中空体を画定する
請求項3又は4に記載の装置(10)。 - 前記冷却ユニット(20,36)は、冷媒が通過するように構成された少なくとも1つの冷却通路を有する
請求項1ないし5の何れかに記載の装置(10)。 - 前記冷却ユニット(20,36)は、水冷ドラムを含む
請求項6に記載の装置(10)。 - 前記真空チャンバ(14)の内壁に配置された1つ又は複数の補助加熱体(28)及び/又は前記真空チャンバ(14)の内壁に配置された1つ又は複数の補助冷却体(28)、特に、冷却パネルをさらに有する
請求項1ないし7の何れかに記載の装置(10)。 - 前記基材(12)の温度を検出するように構成され、前記加熱ユニット(26)及び前記冷却ユニット(20,34,36)のうちの少なくとも1つの動作を制御するように構成された温度制御モジュール(32)に接続された温度センサ(30)をさらに有する
請求項1ないし8の何れかに記載の装置(10)。 - 前記変位手段(42)は、前記真空チャンバ(14)の前記リフティング軸(X)に平行に配置された1つ又は複数のリニアアクチュエータを含む
請求項1ないし9の何れかに記載の装置(10)。 - 前記変位手段は、前記真空チャンバ(14)の前記リフティング軸(X)に平行に配置され、前記冷却ユニット(20,34,36)又は前記加熱ユニット(26)に接続された1つ又は複数のレール(68)と、前記リフティングチャンバ(40)内に配置された1つ又は複数のガイド体(66)とを含み、前記ガイド体(66)は、前記レール(68)と協働するように構成され、モータ(67)によって駆動される
請求項1ないし10の何れかに記載の装置(10)。 - 前記変位手段(42,66,68)は、前記リフティングチャンバ(40)及び/又は前記真空チャンバ(14)の内部に配置されている
請求項1ないし11の何れかに記載の装置(10)。 - 前記加熱ユニット(26)及び/又は前記冷却ユニット(20,34,36)を前記変位手段(42)に接続するように構成された1つ又は複数の接続部材(62)をさらに有し、前記変位手段(42)は、前記真空チャンバ(14)及び前記リフティングチャンバ(14)の外側に配置されている
請求項1ないし11の何れかに記載の装置(10)。 - 前記回転手段は、個々の基材(12)がロッド(50)上にそれぞれ支持され、個々の基材(12)が前記真空チャンバ(14)のリフティング軸(X)及びロッド(50)の両方の周りを回転可能な遊星歯車配列を含む
請求項1ないし13の何れかに記載の装置(10)。
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Application Number | Priority Date | Filing Date | Title |
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EP16182561.7 | 2016-08-03 | ||
EP16182561.7A EP3279364B1 (en) | 2016-08-03 | 2016-08-03 | Apparatus for coating substrates |
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JP2018040051A JP2018040051A (ja) | 2018-03-15 |
JP6969923B2 true JP6969923B2 (ja) | 2021-11-24 |
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US (1) | US11131019B2 (ja) |
EP (1) | EP3279364B1 (ja) |
JP (1) | JP6969923B2 (ja) |
KR (1) | KR102385751B1 (ja) |
CN (1) | CN107686978B (ja) |
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CN109161866B (zh) * | 2018-09-17 | 2023-06-13 | 东莞市汇成真空科技有限公司 | 一种真空镀膜机 |
KR102225985B1 (ko) * | 2019-04-26 | 2021-03-10 | 주식회사 테토스 | 자동화된 기판 측면부 증착 장치 |
US11133205B2 (en) * | 2019-05-24 | 2021-09-28 | Applied Materials, Inc. | Wafer out of pocket detection |
CN110131537B (zh) * | 2019-05-28 | 2021-04-02 | 南京托尔真空科技有限公司 | 一种真空高偏压转架 |
WO2021188754A1 (en) * | 2020-03-18 | 2021-09-23 | Richard Devito | Deposition system with integrated cooling on a rotating drum |
CN111455341B (zh) * | 2020-06-18 | 2020-09-08 | 上海陛通半导体能源科技股份有限公司 | 基于磁耦合旋转的物理气相沉积设备 |
CN113652666A (zh) * | 2021-08-18 | 2021-11-16 | 杨智仁 | 具有冷却装置的真空镀膜系统 |
CN114457315B (zh) * | 2021-12-28 | 2023-07-25 | 凯盛信息显示材料(洛阳)有限公司 | 一种玻璃磁控溅射镀膜系统 |
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- 2017-07-28 JP JP2017147094A patent/JP6969923B2/ja active Active
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CN107686978B (zh) | 2021-02-12 |
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EP3279364B1 (en) | 2021-10-06 |
US20180037986A1 (en) | 2018-02-08 |
KR102385751B1 (ko) | 2022-04-11 |
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CN107686978A (zh) | 2018-02-13 |
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