WO2016169357A1 - 蒸镀设备及采用该蒸镀设备的蒸镀方法 - Google Patents

蒸镀设备及采用该蒸镀设备的蒸镀方法 Download PDF

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Publication number
WO2016169357A1
WO2016169357A1 PCT/CN2016/076369 CN2016076369W WO2016169357A1 WO 2016169357 A1 WO2016169357 A1 WO 2016169357A1 CN 2016076369 W CN2016076369 W CN 2016076369W WO 2016169357 A1 WO2016169357 A1 WO 2016169357A1
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WO
WIPO (PCT)
Prior art keywords
cavity
vapor deposition
evaporation
receiving
crucible
Prior art date
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PCT/CN2016/076369
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English (en)
French (fr)
Inventor
赵德江
王浩
藤野诚治
Original Assignee
京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/321,137 priority Critical patent/US10487389B2/en
Publication of WO2016169357A1 publication Critical patent/WO2016169357A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material

Definitions

  • the present disclosure relates to the field of display manufacturing, and more particularly to an evaporation apparatus and an evaporation method using the same.
  • OLED displays have been favored by consumers in the market for their bright colors, low power consumption and thin products. At present, for the fabrication of OLED displays, it is necessary to dispose an organic material in a high-vacuum chamber, and to heat and vapor-deposit organic materials to form an organic film of an OLED display. Therefore, evaporation in an OLED display is an indispensable process.
  • An object of the present disclosure is to provide an evaporation apparatus and an evaporation method using the same, which are used to solve the problem that the vapor deposition equipment of the prior art causes damage to the internal vapor deposition environment when the material is newly added.
  • the present disclosure provides an evaporation apparatus including a main cavity having an internal space and an evaporation mechanism disposed under the main cavity, wherein the evaporation mechanism includes at least two ⁇ receiving cavities; the at least two The ⁇ receiving cavity includes a first ⁇ receiving cavity and a second ⁇ receiving cavity;
  • the evaporation mechanism includes a first state and a second state; in the first state, the first The accommodating cavity is located at an evaporation performing position and communicates with the main cavity to constitute a vacuum space, wherein the sputum holding material in the first enthalpy receiving cavity performs an evaporation process; in the second state, In a vacuum environment, the first cartridge receiving cavity is moved away from the vapor deposition execution position, and the second cartridge receiving cavity is moved to the vapor deposition execution position and communicates with the main cavity.
  • the vapor deposition mechanism further includes a peripheral cavity, wherein each of the buffer receiving cavities is disposed in the peripheral cavity; the vapor deposition mechanism is in the In the second state, a vacuum space is formed in the peripheral cavity.
  • the vapor deposition mechanism further includes a first mounting bracket having a receiving space, and each of the cassette receiving cavities is disposed in the receiving space of the first mounting bracket, and The shape in which the accommodating cavity is combined corresponds to the shape of the accommodating space.
  • the vapor deposition mechanism further includes a driving structure connected to the first mounting bracket for causing the first mounting bracket to perform an up and down lifting motion and a rotating motion; Moving the first cartridge receiving cavity away from the vapor deposition execution position in the second state by driving the first mounting bracket movement, the second cartridge receiving cavity moving to the vapor deposition execution Location.
  • the outer wall of each of the crucible accommodating cavities is covered with a sealing material.
  • the vapor deposition mechanism further includes an evaporation heating member, the vapor deposition heating member is fixedly disposed on a sidewall of the main cavity, and the main cavity
  • One side of the vapor deposition heating member is provided with a through hole structure capable of opening and closing; the side of the ⁇ receiving cavity facing the main cavity is provided with an opening; the ⁇ receiving cavity is located at the side An evaporation performing position, the opening is in close contact with a sidewall of the main cavity, the through hole structure is opposite to the opening, and the ⁇ receiving cavity passes through the through hole structure in an open state
  • the main cavity is in communication, and the vapor deposition heating member is inserted into the inside of the crucible accommodating cavity through the opening.
  • the peripheral cavity is closely connected to the sidewall of the main cavity, and a part of the sidewall of the main cavity is configured to be the peripheral cavity One side wall.
  • a first opening structure capable of opening and closing is disposed on a sidewall of each of the ⁇ receiving cavities, and an opening state of the first opening structure is used for vapor deposition It is possible to enter the interior of the crucible receiving cavity or to be removed from the interior of the crucible receiving cavity.
  • the sidewall of the peripheral cavity is provided with a second opening structure that can be opened and closed, the second opening structure is in a closed state, and the interior of the peripheral cavity is formed.
  • the vapor deposition apparatus further includes:
  • a first vacuuming structure for extracting a vacuum from the main cavity and the crucible receiving cavity communicating with the main cavity;
  • a second evacuation structure for extracting a vacuum from the peripheral cavity.
  • the vapor deposition apparatus includes a plurality of the vapor deposition mechanisms, each of the vapor deposition mechanisms being disposed under the main cavity and surrounding the main cavity The axes in the vertical direction are evenly distributed.
  • the vapor deposition apparatus further includes a second mounting bracket having a receiving space, disposed under the main cavity and connected to the main cavity, each of the vapor deposition The mechanism is installed in the receiving space of the second mounting bracket.
  • the present disclosure also provides an evaporation method using the vapor deposition apparatus according to any one of the above, wherein the evaporation method comprises:
  • the material contained in the first enthalpy receiving cavity performs an evaporation process
  • the first ⁇ receiving cavity When the material contained in the first ⁇ accommodating cavity is exhausted, in a vacuum environment, the first ⁇ receiving cavity is moved away from the vapor deposition execution position, and the second ⁇ receiving cavity is moved. Go to the evaporation execution position and communicate with the main cavity;
  • the material contained in the second accommodating cavity performs an evaporation process.
  • the vapor deposition method in the step of performing the evaporation process in the material contained in the second crucible accommodating cavity, the vapor deposition method further comprises:
  • the crucible in the first crucible receiving cavity is taken out, the material is re-added, and the first crucible receiving cavity is returned.
  • the vapor deposition method further comprises:
  • the first ⁇ receiving cavity and the ⁇ in the second ⁇ receiving cavity are respectively taken out, and the material is newly added and then returned to the first ⁇ receiving cavity and the second ⁇ receiving cavity respectively.
  • the step of performing the evaporation process by the material contained in the first enthalpy receiving cavity comprises:
  • the crucible in the first crucible accommodating chamber is preheated, and when the preheating reaches a preset temperature, the evaporation process is performed until the material in the crucible is used up.
  • the vapor deposition apparatus can directly move the second crucible accommodating cavity to the evaporation execution position to perform steaming in a vacuum environment by providing at least two crucible accommodating cavities after the vapor deposition of the first crucible accommodating cavity is completed.
  • Plating the process does not require vacuum to replace the material, which can achieve the technical effect of saving time and ensuring no pollution.
  • FIG. 1 is a partial cross-sectional structural view showing an evaporation apparatus according to an embodiment of the present disclosure
  • FIG. 2 is a front cross-sectional structural view showing an evaporation device according to an embodiment of the present disclosure
  • FIG. 3 is a front view showing the structure of an evaporation apparatus according to an embodiment of the present disclosure
  • FIG. 4 is a front view showing the structure of a crucible accommodating cavity of the vapor deposition apparatus according to the embodiment of the present disclosure
  • FIG. 5 is a cross-sectional structural view showing a crucible accommodating cavity of the vapor deposition apparatus according to the embodiment of the present disclosure.
  • the vapor deposition apparatus includes a main cavity having an internal space and an evaporation mechanism disposed under the main cavity, wherein the evaporation mechanism includes at least two ⁇ receiving cavities, such as a first ⁇ The receiving cavity and the second weir receiving cavity.
  • the vapor deposition mechanism includes a first state and a second state; in the first state, the first buffer receiving cavity is located at the evaporation execution position, and communicates with the main cavity to form a vacuum space, The first ⁇ accommodating cavity Performing an evaporation process; in the second state, in a vacuum environment, the first cartridge receiving cavity is moved away from the vapor deposition execution position, and the second cartridge receiving cavity is moved to the vapor deposition execution position And communicating with the main cavity.
  • the second crucible accommodating chamber can be directly moved to the steam in a vacuum environment.
  • the plating execution position is carried out by evaporation, and the process does not require vacuum breaking of the material, thereby achieving the technical effect of saving time and ensuring no pollution.
  • FIG. 1 is a partial structural schematic view of an evaporation apparatus according to an embodiment of the present disclosure.
  • the vapor deposition apparatus includes at least two crucible accommodating cavities 10, and each of the crucible accommodating cavities 10 is isolated from each other and combined in a peripheral cavity 20.
  • Each of the crucible accommodating cavities 10 is provided with a crucible holding structure 1 for holding the crucible for vapor deposition.
  • the crucible holding structure 1 is a general structure used in an evaporation apparatus, and the specific structure of the crucible holding structure 1 is not an improvement point of the present disclosure, and will not be described in detail herein.
  • the " ⁇ accommodating cavity”, “peripheral cavity”, and “main cavity” mentioned are each formed into a structure having a cavity inside, including a cavity and a casing structure forming a cavity.
  • the peripheral cavity 20 can be evacuated at the periphery.
  • the first ⁇ receiving cavity moves away from the evaporation execution position
  • the second ⁇ receiving cavity moves to the evaporation execution position, and continues to hold the ⁇ in the second ⁇ accommodating cavity
  • the material performs an evaporation process.
  • the specific arrangement of the accommodating cavity is not limited to the manner in which the above-mentioned combination is disposed in one peripheral cavity, and may also be
  • the individual enthalpy housing chambers are each disposed in a vacuumable chamber.
  • FIG. 2 is a schematic cross-sectional view of the vapor deposition apparatus according to the embodiment of the present disclosure
  • FIG. 3 is a schematic top view of the vapor deposition apparatus according to the embodiment of the present disclosure
  • the main cavity 100 and a plurality of vapor deposition mechanisms 200 disposed under the main cavity 100 are included.
  • Each of the vapor deposition mechanisms 200 is disposed below the main cavity 100 and uniformly distributed around the axis of the main cavity 100 in the vertical direction.
  • six evaporation mechanisms 200 are uniformly disposed around the axis of the main cavity 100 in the vertical direction.
  • each evaporation mechanism 200 includes a peripheral cavity 20 and a plurality of cartridge receiving cavities 10 disposed within the peripheral cavity 20.
  • the peripheral cavity 20 is attached to the side wall of the main cavity 100, and a part of the side wall of the main cavity 100 is formed as a side wall of the peripheral cavity 20 on one side thereof.
  • the number of the accommodating cavities 10 is four, and the cymbal accommodating cavity 10 is disposed on the first mounting bracket 11 having the accommodating space, and the cymbal accommodating cavities 10 are combined in the first In the accommodation space of the mounting bracket 11, the combined shape corresponds to the shape of the accommodation space of the first mounting bracket 11.
  • the receiving space of the first mounting bracket 11 is formed in a cylindrical shape, and the four ⁇ receiving cavities 10 are evenly arranged in the plane of the horizontal plane, and the cross sections in the horizontal direction are respectively formed into a fan shape.
  • the evaporation mechanism 200 further includes a driving structure coupled to the first mounting bracket 11 for causing the first mounting bracket 11 to perform an up and down lifting motion and a rotational motion.
  • a driving structure coupled to the first mounting bracket 11 for causing the first mounting bracket 11 to perform an up and down lifting motion and a rotational motion.
  • the driving structure for driving the operation of the first mounting bracket 11 may include a lifting structure 51 and a rotating structure 53.
  • the lifting structure is vertically disposed on the bottom surface of the peripheral cavity 20;
  • the rotating structure is fixedly disposed on the lifting and lowering Above the structure, and the first mounting bracket 11 is fixedly disposed on the rotating structure;
  • the first mounting bracket 11 is rotated about the axis by the rotating structure, so that different ⁇ receiving cavities 10 in the first mounting bracket 11 can be wound around the shaft center Rotating; driving the rotating structure and the first mounting bracket 11 up and down by the lifting structure, so that the height of the ⁇ receiving cavity 10 from the bottom surface of the peripheral cavity 20 changes while the distance from the sidewall of the main cavity 100 changes.
  • the lifting structure 51 may adopt a cylinder structure, and the piston of the cylinder drives the rotating structure and the first mounting bracket 11 to move up and down; the lifting structure 51 may also adopt a threaded screw pair structure.
  • the rotating structure 53 can be a motor fixedly disposed above the lifting structure 51, and the motor is driven
  • the output shaft is coupled to the first mounting bracket 11.
  • the outer wall of each of the cymbal receiving cavities 10 is covered with a sealing material 12, and the sealing of the accommodating cavity 10 is ensured by the arrangement of the sealing material 12. Sex.
  • a first opening structure capable of opening and closing is disposed on a side wall of each of the accommodating cavities 10, and the evaporating cymbal can enter the ⁇ accommodating cavity by the open state of the first opening structure.
  • the interior of the 10 can be removed from the interior of the raft receiving cavity 10.
  • the first opening structure includes an opening 131 and a switch door 132 disposed on the sidewall of the ⁇ accommodating cavity 10; the switch door 132 is disposed at the opening 131 and is rotatable relative to the opening 131 by using the switch door The relative rotation of 132 causes the switch door 132 to be placed at the opening 131, the opening 131 is closed, or the opening 131 is exposed, and the inside of the accommodating cavity 10 communicates with the peripheral cavity 20.
  • the sidewall of the peripheral cavity 20 is provided with a second opening structure that can be opened and closed.
  • the second opening structure When the second opening structure is in a closed state, the inside of the peripheral cavity 20 forms a closed space; when the second opening structure is in an open state, The accommodating cavity 10 is exposed.
  • the second opening structure includes an opening 211 disposed on a sidewall of the peripheral cavity 20 and a switch door 212 disposed at the opening 211 to be rotatable relative to the opening 211 .
  • the switch door 212 With the relative rotation of the switch door 212, the switch door 212 is covered at the opening 211, the opening 211 is closed; or the opening 211 is exposed, in an open state, and the peripheral cavity 20 communicates with the external space, so that the peripheral cavity 20
  • the sputum can be taken out to facilitate the re-addition of the material for vapor deposition.
  • the vapor deposition mechanism 200 of the vapor deposition apparatus further includes an evaporation heating member 30 fixedly disposed on the sidewall of the main cavity 100, and on the sidewall of the main cavity 100, One side of the vapor deposition heating member 30 is provided with a through hole structure (not shown) capable of opening and closing; and a side of the ⁇ receiving cavity 10 facing the main cavity body 100 is provided with an opening 14 (as shown in FIG. 5);
  • the accommodating cavity 10 is located at the evaporation execution position, and the opening 14 is closely adhered to the sidewall of the main cavity 100 (the vapor deposition mechanism 200 at the left position shown in FIG.
  • the opening 14 is opposed to the upper receiving cavity 10 and communicates with the main cavity 100 through the through hole structure in an open state, and the connected enthalpy receiving cavity 10 and the main cavity 100 form a closed space, and the vapor deposition heating member 30 passes through the opening.
  • the 14 is inserted into the interior of the accommodating cavity 10.
  • the evaporation heating component 30 may include two heating sources, one for the evaporation process before Preheating, one for heating the evaporation material during the evaporation process.
  • the vapor deposition apparatus further includes: a first evacuation structure (not shown) for extracting a vacuum from the main cavity body 100 and the crucible accommodating cavity 10 communicating with the main cavity body 100.
  • the second evacuation structure 40 is for extracting a vacuum from the peripheral cavity 20.
  • the first evacuation structure is connected to the main cavity 100; when the evaporation mechanism on the left side as shown in FIG. 2 is in an evaporation state, the opening 14 of the accommodating cavity 10 and the main cavity 100 are The side walls are closely fitted, and the through hole structure on the main cavity 100 is opposite to the opening 14 of one of the crucible accommodating cavities 10, and the vapor deposition heating member 30 is inserted into the inside of the crucible accommodating cavity 10 through the opening 14.
  • the main cavity body 100 is evacuated by using the first vacuuming structure. Since one of the crucible accommodating cavities 10 in the evaporation mechanism is in communication with the main cavity body 100, a closed space is formed, thereby evacuating the main cavity body 100. At the same time, a crucible accommodating cavity 10 in the evaporation mechanism is evacuated until the same vacuum degree is reached with the main cavity 100.
  • the vapor deposition apparatus of the embodiment of the present disclosure further includes a second mounting bracket 300 having a receiving space, disposed under the main cavity 100 and connected to the main cavity 100, and each of the vapor deposition mechanisms 200 is installed on the first The mounting space of the second mounting bracket 300 is included.
  • a second vacuuming structure 40 is disposed inside the second mounting bracket 300, and the second vacuuming structure 40 is connected to the peripheral cavity 20 of each vapor deposition mechanism 200, when the second vacuuming structure 40 and the periphery When the valves connected between the cavities 20 are opened, the second evacuation structure 40 can evacuate the respective peripheral cavities 20.
  • the main cavity body 100 communicates with the first crucible accommodating cavity to form a closed space, and the vapor deposition heating member 30 is inserted through the opening 14 in the first crucible accommodating cavity. It is arranged to enter the interior of the first ⁇ accommodating cavity, and when the main cavity body 100 and the first ⁇ accommodating cavity are evacuated by the first vacuuming structure, the ⁇ medium material disposed in the first ⁇ accommodating cavity body can be realized.
  • the evaporation process is performed; when the material of the crucible disposed in the first chamber is exhausted, after the evaporation process is finished, the through-hole structure on the main cavity 100 is closed, and the peripheral cavity 20 is evacuated in the peripheral cavity.
  • the vapor deposition process of the material provided in the second crucible receiving chamber can be realized.
  • the switching process of the accommodating cavity does not require vacuuming to re-add the material, that is, the next evaporation process can be performed, and the vacuum environment of the main chamber does not need to be destroyed, thereby saving time, Improve efficiency and reduce the effects of pollution.
  • Another aspect of a specific embodiment of the present disclosure provides an evaporation method of the above vapor deposition apparatus, the evaporation method comprising:
  • the first ⁇ receiving cavity When the material contained in the first ⁇ accommodating cavity is exhausted, in a vacuum environment, the first ⁇ receiving cavity is moved away from the vapor deposition execution position, and the second ⁇ receiving cavity is moved. Go to the evaporation execution position and communicate with the main cavity;
  • An evaporation process is performed on the material contained in the second enthalpy receiving cavity.
  • the evaporation method further includes:
  • the crucible in the first crucible receiving cavity is taken out, the material is re-added, and the first crucible receiving cavity is returned.
  • the material addition process to the first crucible accommodating cavity can be simultaneously performed.
  • the second enthalpy accommodating cavity that is performing the evaporation process is in communication with the main cavity and is completely isolated from the first enthalpy accommodating cavity, the material addition process of the raft in the first accommodating cavity does not affect the second ⁇ accommodating process.
  • the vapor deposition process of the material contained in the cavity can be performed simultaneously, and the evaporation efficiency of the vapor deposition device can be improved.
  • the vapor deposition method further includes: the first enthalpy receiving cavity and the The crucibles in the second crucible receiving chamber are respectively taken out, and the materials are re-added and then returned to the first crucible receiving cavity and the second crucible receiving cavity, respectively.
  • the step of performing an evaporation process on the material contained in the first dove receiving cavity comprises: extracting a vacuum from the main cavity, and the main cavity and the first cavity receiving cavity The body reaches a preset vacuum; the crucible in the first crucible receiving chamber is preheated, and when the preheating reaches a preset temperature, the evaporation process is performed until the material in the crucible is used up.
  • the evaporation method of the vapor deposition apparatus specifically includes:
  • the driving structure connected to the first mounting bracket 11 drives the accommodating cavity 10 to rise, so that the side on which the opening 14 is disposed is closely adhered to the side wall of the main cavity 100 (the left side is vapor-deposited as shown in FIG. 2). a state of the mechanism), the through hole structure on the main cavity 100 is opposite to the opening 14 in the first port receiving cavity, and the vapor deposition heating member 30 is inserted through the opening 14 into the interior of the first port receiving cavity;
  • the vapor deposition heating member 30 performs pre-heating of the crucible in the first crucible accommodating cavity, and then vapor-deposits until the material in the crucible is used up, and closes the through-hole structure of the main cavity body 100 communicating with the crucible accommodating cavity;
  • the second evacuation structure 40 evacuates the peripheral cavity 20 until the same degree of vacuum as the main cavity 100;
  • the driving structure connected to the first mounting bracket 11 drives the cymbal accommodating cavity 10 to be integrally lowered, and the accommodating cavity is separated from the vapor deposition heating member (the state of the vapor deposition mechanism on the right side as shown in FIG. 2);
  • the structure driving the accommodating cavity 10 rotates about the axis to rotate the second ⁇ receiving cavity to correspond to the through hole structure and the vapor deposition heating member 30 on the main cavity 100;
  • the driving structure drives the accommodating cavity 10 to ascend as a whole, so that the side on which the opening 14 is disposed is closely adhered to the side wall of the main cavity 100, and the through hole structure on the main cavity 100 and the second accommodating cavity The opening 14 is opposite, and the vapor deposition heating member 30 is inserted through the opening 14 into the interior of the second cartridge receiving cavity;
  • step 8 when the evaporation process is performed on the material contained in the second accommodating cavity, the material replacement process of the raft in the first accommodating cavity may be simultaneously performed, and the specific steps include:
  • the opening and closing door 212 on the peripheral cavity 20 is opened to release a vacuum
  • the opening and closing door 132 on the first accommodating cavity is opened to release the vacuum; after that, the internal cymbal is taken out, and the material is replaced and returned to the first accommodating cavity.
  • the evaporation process of the material contained in the next ⁇ accommodating cavity may be sequentially performed until the last ⁇ accommodating cavity is used up, and then the periphery is opened.
  • the opening and closing door 212 of the cavity 20 replaces all of the materials in the accommodating cavity.
  • the switching process of the accommodating cavity does not require vacuuming to re-add material, that is, the next evaporation process can be performed, and There is no need to destroy the vacuum environment of the main chamber, which can save time, improve efficiency and reduce pollution.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

一种蒸镀设备及采用该蒸镀设备的蒸镀方法。蒸镀设备包括具有一内部空间的主腔体（100）和设置于主腔体（100）下方的蒸镀机构（200），蒸镀机构（200）包括至少两个坩埚容纳腔体（10）；至少两个坩埚容纳腔体（10）包括第一坩埚容纳腔体和第二坩埚容纳腔体；蒸镀机构包括第一状态和第二状态；在第一状态，第一坩埚容纳腔体位于蒸镀执行位置，且与主腔体（100）之间连通，构成真空空间，对第一坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程；在第二状态，在真空环境下，第一坩埚容纳腔体移离蒸镀执行位置，第二坩埚容纳腔体移动至蒸镀执行位置处，且与主腔体（100）之间连通。

Description

蒸镀设备及采用该蒸镀设备的蒸镀方法
相关申请的交叉引用
本申请主张在2015年4月24日在中国提交的中国专利申请号No.201510201679.5的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示器制造领域，尤其是指一种蒸镀设备及采用该蒸镀设备的蒸镀方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)显示器以其色彩鲜艳、功耗低、产品薄等诸多优点在市场上受到了广大消费者的喜爱。目前对于OLED显示器的制作，需要在高真空腔室中设置有机材料的坩埚，加热坩埚蒸镀有机材料，形成OLED显示器的有机薄膜，因此OLED显示器中蒸镀是必不可少的制程。
相关技术的蒸镀设备中，在蒸镀过程每次材料用尽后都需要破真空，打开真空腔室重新添加材料，该种方式使OLED显示器的制作过程耽误时间，且容易造成污染，因此有必要对用于OLED显示器制作的蒸镀设备进行改进，以达到降低蒸镀制作过程污染的问题。
发明内容
本公开技术方案的目的是提供一种蒸镀设备及采用该蒸镀设备的蒸镀方法，用于解决现有技术的蒸镀设备在重新添加材料时破真空对内部蒸镀环境造成污染以及使OLED显示器的制作效率较低的问题。
本公开提供一种蒸镀设备，包括具有一内部空间的主腔体和设置于主腔体下方的蒸镀机构，其中，所述蒸镀机构包括至少两个坩埚容纳腔体；所述至少两个坩埚容纳腔体包括第一坩埚容纳腔体和第二坩埚容纳腔体；
其中，所述蒸镀机构包括第一状态和第二状态；在第一状态，第一坩埚 容纳腔体位于蒸镀执行位置，且与所述主腔体之间连通，构成真空空间，所述第一坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程；在第二状态，在真空环境下，所述第一坩埚容纳腔体移离所述蒸镀执行位置，第二坩埚容纳腔体移动至所述蒸镀执行位置处，且与所述主腔体之间连通。
可选地，上述所述的蒸镀设备，所述蒸镀机构还包括一个外围腔体，各个所述坩埚容纳腔体均设置于所述外围腔体中；所述蒸镀机构在所述第二状态，所述外围腔体内形成真空空间。
可选地，上述所述的蒸镀设备，所述蒸镀机构还包括具有容纳空间的第一安装支架，各个所述坩埚容纳腔体设置于所述第一安装支架的容纳空间中，且所述坩埚容纳腔体相组合的形状与所述容纳空间的形状相对应。
可选地，上述所述的蒸镀设备，所述蒸镀机构还包括驱动结构，与所述第一安装支架连接，用于使所述第一安装支架进行上、下升降运动以及旋转运动；通过驱动所述第一安装支架运动，在所述第二状态，使所述第一坩埚容纳腔体移离所述蒸镀执行位置，所述第二坩埚容纳腔体移动至所述蒸镀执行位置处。
可选地，上述所述的蒸镀设备，每一所述坩埚容纳腔体的外壁均包覆有密封材料。
可选地，上述所述的蒸镀设备，所述蒸镀机构还包括蒸镀加热部件，所述蒸镀加热部件固定设置于所述主腔体的侧壁上，且所述主腔体的侧壁上、所述蒸镀加热部件的一侧设置有能够开闭的通孔结构；所述坩埚容纳腔体朝向所述主腔体的一侧设置有开口；所述坩埚容纳腔体位于所述蒸镀执行位置，所述开口与所述主腔体的侧壁紧密贴合，所述通孔结构与所述开口相对，所述坩埚容纳腔体通过呈打开状态的所述通孔结构与所述主腔体连通，所述蒸镀加热部件通过所述开口插设进入所述坩埚容纳腔体的内部。
可选地，上述所述的蒸镀设备，所述外围腔体与所述主腔体的侧壁贴合连接，且所述主腔体的侧壁的一部分构成为所述外围腔体在其中一侧面的侧壁。
可选地，上述所述的蒸镀设备，每一所述坩埚容纳腔体的侧壁上设置有能够开闭的第一开口结构，通过所述第一开口结构的打开状态，蒸镀用坩埚 能够进入所述坩埚容纳腔体的内部或者能够从所述坩埚容纳腔体的内部移出。
可选地，上述所述的蒸镀设备，所述外围腔体的侧壁上设置有能够开闭的第二开口结构，所述第二开口结构呈关闭状态，所述外围腔体的内部形成封闭空间；所述第二开口结构呈打开状态，所述坩埚容纳腔体露出。
可选地，上述所述的蒸镀设备，所述蒸镀设备还包括：
第一抽真空结构，用于对所述主腔体和与所述主腔体连通的所述坩埚容纳腔体抽取真空；
第二抽真空结构，用于对所述外围腔体抽取真空。
可选地，上述所述的蒸镀设备，所述蒸镀设备包括多个所述蒸镀机构，各个所述蒸镀机构设置在所述主腔体的下方，且围绕所述主腔体在竖直方向的轴心均匀分布。
可选地，上述所述的蒸镀设备，所述蒸镀设备还包括具有容纳空间的第二安装支架，设置于所述主腔体下方且与所述主腔体连接，各个所述蒸镀机构均安装设置于所述第二安装支架的容纳空间内。
本公开还提供一种采用以上任一项所述蒸镀设备的蒸镀方法，其中，所述蒸镀方法包括：
将所述第一坩埚容纳腔体移动至所述蒸镀执行位置，且使所述第一坩埚容纳腔体与所述主腔体相连通；
所述第一坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程；
所述第一坩埚容纳腔体中的坩埚所盛放材料耗尽时，在真空环境下，所述第一坩埚容纳腔体移离所述蒸镀执行位置，所述第二坩埚容纳腔体移动至所述蒸镀执行位置处，且与所述主腔体之间连通；
所述第二坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程。
可选地，上述所述的蒸镀方法，所述第二坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程的步骤中，所述蒸镀方法还包括：
将所述第一坩埚容纳腔体中的坩埚取出，重新添加材料后放回所述第一坩埚容纳腔体。
可选地，上述所述的蒸镀方法，在所述第二坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程执行完毕后，所述蒸镀方法还包括：
将所述第一坩埚容纳腔体和所述第二坩埚容纳腔体中的坩埚分别取出，重新添加材料后分别放回所述第一坩埚容纳腔体和所述第二坩埚容纳腔体。
可选地，上述所述的蒸镀方法，所述第一坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程的步骤具体包括：
对所述主腔体抽取真空，使所述主腔体和所述第一坩埚容纳腔体均达到预设真空度；
对所述第一坩埚容纳腔体内的坩埚进行预热，预热达到预设温度时，执行蒸镀过程，直到坩埚内的材料用尽。
本公开具体实施例上述技术方案中的至少一个具有以下有益效果：
所述蒸镀设备通过设置至少两个坩埚容纳腔体，在第一坩埚容纳腔体内的坩埚蒸镀完成之后，在真空环境下可以直接将第二坩埚容纳腔体移动至蒸镀执行位置进行蒸镀，该过程无需破真空更换材料，既能够达到节约时间又能够保证不会造成污染的技术效果。
附图说明
图1表示本公开实施例所述蒸镀设备的部分剖面结构示意图；
图2表示本公开实施例所述蒸镀设备的主视剖面结构示意图；
图3表示本公开实施例所述蒸镀设备的主视结构示意图；
图4表示本公开实施例所述蒸镀设备的坩埚容纳腔体的主视结构示意图；
图5表示本公开实施例所述蒸镀设备的坩埚容纳腔体的剖视结构示意图。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合附图及具体实施例对本公开进行详细描述。
本公开实施例所述蒸镀设备，包括具有一内部空间的主腔体和设置于主腔体下方的蒸镀机构，其中所述蒸镀机构包括至少两个坩埚容纳腔体，如第一坩埚容纳腔体和第二坩埚容纳腔体。其中，所述蒸镀机构包括第一状态和第二状态；在第一状态，第一坩埚容纳腔体位于蒸镀执行位置，且与所述主腔体之间连通，构成真空空间，对所述第一坩埚容纳腔体中的坩埚所盛放材 料执行蒸镀过程；在第二状态，在真空环境下，所述第一坩埚容纳腔体移离所述蒸镀执行位置，所述第二坩埚容纳腔体移动至所述蒸镀执行位置处，且与所述主腔体之间连通。
本公开上述实施例的蒸镀设备，通过设置至少两个坩埚容纳腔体，在第一坩埚容纳腔体内的坩埚蒸镀完成之后，在真空环境下可以直接将第二坩埚容纳腔体移动至蒸镀执行位置进行蒸镀，该过程无需破真空更换材料，既能够达到节约时间又能够保证不会造成污染的技术效果。
图1所示为本公开实施例所述蒸镀设备的部分结构示意图。本公开实施例中，所述蒸镀设备包括至少两个坩埚容纳腔体10，且各个坩埚容纳腔体10之间为相互隔离，组合后设置于一外围腔体20中。其中各个坩埚容纳腔体10中设置有坩埚夹持结构1，用于夹持蒸镀用坩埚。该坩埚夹持结构1为蒸镀设备中所使用的通常结构，且坩埚夹持结构1的具体结构并非为本公开的改进重点，在此不详细描述。
另外，本公开中，所提及的“坩埚容纳腔体”、“外围腔体”和“主腔体”均形成为内部具有腔的结构，包括腔和形成腔的壳体结构。
采用上述组合结构的坩埚容纳腔体10和外围腔体20，当第一坩埚容纳腔体10中的坩埚所盛放材料执行蒸镀过程结束后，可以对外围腔体20执行抽真空，在外围腔体20所构成的真空环境下，第一坩埚容纳腔体移离蒸镀执行位置，第二坩埚容纳腔体移动至蒸镀执行位置，继续对第二坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程。因此在第一坩埚容纳腔体内的材料用尽后，不需要破真空重新添加材料，即能够执行下一个的蒸镀过程，而且不需要对主腔室的真空环境进行破坏，能够达到节约时间、提高效率以及降低污染的效果。
当然，为了实现在坩埚容纳腔体的转换过程中，不需要破真空重新添加材料的目的，坩埚容纳腔体的具体设置方式并不限于上述组合后设置于一个外围腔体的方式，也可以由各个独立的坩埚容纳腔体分别设置于一个可抽真空腔体的方式实现。
另外，参阅图2本公开实施例所述蒸镀设备的主视剖面示意图和图3本公开实施例所述蒸镀设备的俯视结构示意图；本公开实施例所述蒸镀设备包 括主腔体100和设置于主腔体100下方的多个蒸镀机构200。各个蒸镀机构200设置在主腔体100的下方，且围绕主腔体100在竖直方向的轴心均匀分布。参阅图3所示，本公开实施例中，围绕主腔体100在竖直方向的轴心，均匀布设有六个蒸镀机构200。通过设置多个蒸镀机构200，可以在同一蒸镀设备上同一时间执行多个蒸镀过程。
结合图1、图2和图4，每个蒸镀机构200包括外围腔体20和设置于外围腔体20内的多个坩埚容纳腔体10。外围腔体20与主腔体100的侧壁贴合连接，且主腔体100的侧壁的一部分构成为外围腔体20在其中一侧面的侧壁。
另外，本公开实施例中，坩埚容纳腔体10设置的数量为四个，且坩埚容纳腔体10设置于具有容纳空间的第一安装支架11上，各个坩埚容纳腔体10相组合设置于第一安装支架11的容纳空间中，相组合的形状与第一安装支架11的容纳空间的形状相对应。
参阅图4，本公开实施例中，第一安装支架11的容纳空间形成为圆柱体形状，四个坩埚容纳腔体10在水平面所在平面内均匀布设，在水平面方向的截面分别形成为扇形。
进一步，结合图1和图2，所述蒸镀机构200还包括驱动结构，与第一安装支架11连接，用于使第一安装支架11进行上、下升降运动以及旋转运动。通过驱动第一安装支架11运动，在蒸镀机构200的第二状态，使第一坩埚容纳腔体移离蒸镀执行位置，第二坩埚容纳腔体移动至蒸镀执行位置处。
具体地，用于驱动第一安装支架11运行的驱动结构可以包括升降结构51和旋转结构53，如图2所示，升降结构竖直设置于外围腔体20的底面；旋转结构固定设置于升降结构的上方，且旋转结构之上固定设置第一安装支架11；通过旋转结构使第一安装支架11绕轴心转动，从而使第一安装支架11中的不同坩埚容纳腔体10能够绕轴心转动；通过升降结构带动旋转结构和第一安装支架11上下移动，从而使坩埚容纳腔体10距离外围腔体20的底面的高度变化，同时距离主腔体100的侧壁的距离变化。
在一些实施例中，升降结构51可以采用气缸结构，利用气缸的活塞带动旋转结构和第一安装支架11上下移动；升降结构51也可以采用螺纹丝杠副结构。旋转结构53可以为固定设置于升降结构51上方的电机，且电机的输 出轴与第一安装支架11连接。可选地，本公开实施例中，如图4所示，每一所述坩埚容纳腔体10的四周外壁均包覆有密封材料12，通过密封材料12的设置保证坩埚容纳腔体10的密封性。
另外，根据图4和图5，每一坩埚容纳腔体10的侧壁上设置有能够开闭的第一开口结构，通过第一开口结构的打开状态，蒸镀用坩埚能够进入坩埚容纳腔体10的内部或者能够从坩埚容纳腔体10的内部移出。本公开实施例中，第一开口结构包括设置于坩埚容纳腔体10侧壁上的开口131和开关门132；开关门132盖设于开口131处，并能够相对于开口131转动，利用开关门132的相对转动，使开关门132盖设于开口131处，开口131被封闭；或者使开口131露出，坩埚容纳腔体10的内部与外围腔体20相连通。
基于以上，外围腔体20的侧壁上设置有能够开闭的第二开口结构，第二开口结构呈关闭状态时，外围腔体20的内部形成封闭空间；第二开口结构呈打开状态时，坩埚容纳腔体10露出。具体地，如图1所示，第二开口结构包括设置于外围腔体20的侧壁上的开口211和盖设于开口211处能够相对于开口211转动的开关门212。利用开关门212的相对转动，使开关门212盖设于开口211处，开口211被封闭；或者使开口211露出，呈打开状态，外围腔体20与外界空间相连通，这样当外围腔体20上的开口211呈打开状态且坩埚容纳腔体10上的开口131也呈打开状态时，能够将坩埚取出，以便于重新添加蒸镀用材料。
参阅图1和图2，蒸镀设备的蒸镀机构200还包括蒸镀加热部件30，蒸镀加热部件30固定设置于主腔体100的侧壁上，且主腔体100的侧壁上、蒸镀加热部件30的一侧设置有能够开闭的通孔结构(图中未显示)；而坩埚容纳腔体10朝向主腔体100的一侧设置有开口14(如图5所示)；坩埚容纳腔体10位于蒸镀执行位置，开口14与主腔体100的侧壁紧密贴合(如图2所示左侧位置的蒸镀机构200)，主腔体100上的通孔结构与开口14相对，坩埚容纳腔体10通过呈打开状态的通孔结构与主腔体100连通，且连通后的坩埚容纳腔体10和主腔体100形成封闭空间，而蒸镀加热部件30通过开口14插设进入坩埚容纳腔体10的内部。
可选地，蒸镀加热部件30可以包括两个加热源，一个用于蒸镀过程之前 的预热，一个用于蒸镀过程中加热蒸发材料。
进一步，参阅图2所示，所述蒸镀设备还包括：第一抽真空结构(图中未显示)，用于对主腔体100和与主腔体100连通的坩埚容纳腔体10抽取真空；第二抽真空结构40，用于对外围腔体20抽取真空。
本公开实施例中，第一抽真空结构与主腔体100连接；当处于如图2所示左侧的蒸镀机构处于蒸镀状态，坩埚容纳腔体10的开口14与主腔体100的侧壁紧密贴合，且主腔体100上的通孔结构与其中一个坩埚容纳腔体10的开口14相对，蒸镀加热部件30通过开口14插设进入该坩埚容纳腔体10的内部时，利用第一抽真空结构对主腔体100进行抽真空，由于该蒸镀机构中一个坩埚容纳腔体10与主腔体100相连通，组合形成封闭空间，由此对主腔体100的抽真空，同时使该该蒸镀机构中一个坩埚容纳腔体10实现抽真空，直至与主腔体100达到相同的真空度。
根据图2，本公开实施例所述蒸镀设备还包括具有容纳空间的第二安装支架300，设置于主腔体100下方且与主腔体100连接，各个蒸镀机构200均安装设置于第二安装支架300的容纳空间内。
另外，在该第二安装支架300的内部设置有第二抽真空结构40，第二抽真空结构40与每一蒸镀机构200的外围腔体20相连接，当第二抽真空结构40与外围腔体20之间相连接的阀门打开时，第二抽真空结构40可以对相应的外围腔体20进行抽真空处理。
采用上述结构的蒸镀设备，当进行蒸镀时，主腔体100与第一坩埚容纳腔体相连通，形成封闭空间，且蒸镀加热部件30通过第一坩埚容纳腔体上的开口14插设进入第一坩埚容纳腔体的内部，当利用第一抽真空结构对主腔体100和第一坩埚容纳腔体抽真空后，即能够实现对该第一坩埚容纳腔体内所设置坩埚中材料的蒸镀过程；而当第一坩埚容纳腔体内所设置坩埚的材料用尽，结束蒸镀过程后，关闭主腔体100上的通孔结构，对外围腔体20抽真空，在外围腔体20形成真空环境下，转动设置坩埚容纳腔体的第一安装支架11，使第二坩埚容纳腔体转动至与主腔体100上的通孔结构和蒸镀加热部件30相对，再次对主腔体100进行抽真空处理后，即能够实现对第二坩埚容纳腔体内坩埚所设置材料的蒸镀过程。
因此，材料用尽后，坩埚容纳腔体的切换过程，不需要破真空重新添加材料，即能够执行下一个蒸镀过程，而且不需要对主腔室的真空环境进行破坏，能够达到节约时间、提高效率以及降低污染的效果。
本公开具体实施例的另一方面提供一种上述蒸镀设备的蒸镀方法，所述蒸镀方法包括：
将所述第一坩埚容纳腔体移动至所述蒸镀执行位置，且使所述第一坩埚容纳腔体与所述主腔体相连通；
对所述第一坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程；
所述第一坩埚容纳腔体中的坩埚所盛放材料耗尽时，在真空环境下，所述第一坩埚容纳腔体移离所述蒸镀执行位置，所述第二坩埚容纳腔体移动至所述蒸镀执行位置处，且与所述主腔体之间连通；
对所述第二坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程。
具体地，在对所述第二坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程的步骤中，所述蒸镀方法还包括：
将所述第一坩埚容纳腔体中的坩埚取出，重新添加材料后放回所述第一坩埚容纳腔体。
采用本公开实施例所述蒸镀设备的蒸镀方法，在对第二坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程时，可以同时执行对第一坩埚容纳腔体的材料添加过程。由于正在执行蒸镀过程的第二坩埚容纳腔体与主腔体连通，而与第一坩埚容纳腔体完全隔离，因此第一坩埚容纳腔体内坩埚的材料添加过程，并不影响第二坩埚容纳腔体内坩埚所盛放材料的蒸镀过程，两个过程可以同时执行，能够提高蒸镀设备的蒸镀效率。
对于组合设置的多个坩埚容纳腔体，除上述可以对一个坩埚容纳腔体执行蒸镀过程的同时，对另一个坩埚容纳腔体执行材料更换过程的方式外，也可以采用在所有坩埚容纳腔体均执行一次蒸镀过程材料用尽后，一次性更换所有蒸镀容纳腔体内坩埚所盛放材料的方式。也即，具体地：在所述第二坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程执行完毕后，所述蒸镀方法还包括：将所述第一坩埚容纳腔体和所述第二坩埚容纳腔体中的坩埚分别取出，重新添加材料后分别放回所述第一坩埚容纳腔体和所述第二坩埚容纳腔体。
另外，对所述第一坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程的步骤具体包括：对所述主腔体抽取真空，使所述主腔体和所述第一坩埚容纳腔体均达到预设真空度；对所述第一坩埚容纳腔体内的坩埚进行预热，预热达到预设温度时，执行蒸镀过程，直到坩埚内的材料用尽。
结合图1至图5，采用本公开实施例所述蒸镀设备的蒸镀方法具体包括：
1)将第一安装支架11上的各个坩埚容纳腔体10中的坩埚均添加用于蒸镀的材料；
2)与第一安装支架11相连接的驱动结构驱动坩埚容纳腔体10上升，使上方设置开口14的一侧与主腔体100的侧壁紧密贴合(如图2所示左侧蒸镀机构的状态)，主腔体100上的通孔结构与第一坩埚容纳腔体上的开口14相对，蒸镀加热部件30通过开口14插设进入第一坩埚容纳腔体的内部；
3)使主腔体100上的通孔结构呈打开状态，使主腔体100与第一坩埚容纳腔体相连通；第一抽真空结构对主腔体100抽真空，直到主腔体100与第一坩埚容纳腔体内部真空度相同且达到工艺要求；
4)蒸镀加热部件30对第一坩埚容纳腔体内的坩埚预热之后进行蒸镀，直到坩埚内的材料用尽后，关闭主腔体100上与坩埚容纳腔体相连通的通孔结构；
5)第二抽真空结构40对外围腔体20抽真空，直至和主腔体100的真空度相同；
6)与第一安装支架11相连接的驱动结构驱动坩埚容纳腔体10整体下降，坩埚容纳腔体脱离蒸镀加热部件(如图2所示右侧的蒸镀机构的状态)；之后使驱动结构驱动坩埚容纳腔体10绕轴心转动，使第二坩埚容纳腔体转动至与主腔体100上的通孔结构和蒸镀加热部件30相对应；
7)驱动结构驱动坩埚容纳腔体10整体上升，使上方设置开口14的一侧与主腔体100的侧壁紧密贴合，主腔体100上的通孔结构与第二坩埚容纳腔体上的开口14相对，蒸镀加热部件30通过开口14插设进入第二坩埚容纳腔体的内部；
8)使主腔体100上的通孔结构呈打开状态，使主腔体100与第二坩埚容纳腔体相连通；第二抽真空结构对主腔体100抽真空，直到主腔体100与第 二坩埚容纳腔体内部真空度相同且达到工艺要求，之后完成第二坩埚容纳腔体内坩埚所盛放材料的蒸镀过程。
上述步骤8)对第二坩埚容纳腔体内坩埚所盛放材料执行蒸镀过程时，可以同时进行对第一坩埚容纳腔体内坩埚的材料更换过程，具体步骤包括：
外围腔体20上的开关门212打开放真空；
第一坩埚容纳腔体上的开关门132打开放真空；之后取出内部的坩埚，进行材料更换后重新放回第一坩埚容纳腔体。
此外，也可以在执行步骤8)之后，依次执行下一个坩埚容纳腔体中坩埚所盛放材料的蒸镀过程，直到最后一个坩埚容纳腔体中坩埚所盛放材料用尽后，再打开外围腔体20的开关门212，更换所有坩埚容纳腔体中的材料。
采用上述蒸镀设备和蒸镀方法，其中一坩埚容纳腔体中的材料用尽后，坩埚容纳腔体的切换过程，不需要破真空重新添加材料，即能够执行下一个的蒸镀过程，而且不需要对主腔室的真空环境进行破坏，能够达到节约时间、提高效率以及降低污染的效果。
以上所述仅是本公开的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (16)

  1. 一种蒸镀设备，包括具有一内部空间的主腔体和设置于主腔体下方的蒸镀机构，其中，所述蒸镀机构包括至少两个坩埚容纳腔体；所述至少两个坩埚容纳腔体包括第一坩埚容纳腔体和第二坩埚容纳腔体；
    其中，所述蒸镀机构包括第一状态和第二状态；在第一状态，第一坩埚容纳腔体位于蒸镀执行位置，且与所述主腔体之间连通，构成真空空间，所述第一坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程；在第二状态，在真空环境下，所述第一坩埚容纳腔体移离所述蒸镀执行位置，第二坩埚容纳腔体移动至所述蒸镀执行位置处，且与所述主腔体之间连通。
  2. 如权利要求1所述的蒸镀设备，其中，所述蒸镀机构还包括一个外围腔体，各个所述坩埚容纳腔体均设置于所述外围腔体中；所述蒸镀机构在所述第二状态，所述外围腔体内形成真空空间。
  3. 如权利要求1所述的蒸镀设备，其中，所述蒸镀机构还包括具有容纳空间的第一安装支架，各个所述坩埚容纳腔体设置于所述第一安装支架的容纳空间中，且所述坩埚容纳腔体相组合的形状与所述容纳空间的形状相对应。
  4. 如权利要求3所述的蒸镀设备，其中，所述蒸镀机构还包括驱动结构，与所述第一安装支架连接，用于使所述第一安装支架进行上、下升降运动以及旋转运动；通过驱动所述第一安装支架运动，在所述第二状态，使所述第一坩埚容纳腔体移离所述蒸镀执行位置，所述第二坩埚容纳腔体移动至所述蒸镀执行位置处。
  5. 如权利要求1至4中任何一项所述的蒸镀设备，其中，每一所述坩埚容纳腔体的外壁均包覆有密封材料。
  6. 如权利要求2所述的蒸镀设备，其中，所述蒸镀机构还包括蒸镀加热部件，所述蒸镀加热部件固定设置于所述主腔体的侧壁上，且所述主腔体的侧壁上、所述蒸镀加热部件的一侧设置有能够开闭的通孔结构；所述坩埚容纳腔体朝向所述主腔体的一侧设置有开口；所述坩埚容纳腔体位于所述蒸镀执行位置，所述开口与所述主腔体的侧壁紧密贴合，所述通孔结构与所述开口相对，所述坩埚容纳腔体通过呈打开状态的所述通孔结构与所述主腔体连 通，所述蒸镀加热部件通过所述开口插设进入所述坩埚容纳腔体的内部。
  7. 如权利要求2所述的蒸镀设备，其中，所述外围腔体与所述主腔体的侧壁贴合连接，且所述主腔体的侧壁的一部分构成为所述外围腔体在其中一侧面的侧壁。
  8. 如权利要求1至4中任何一项所述的蒸镀设备，其中，每一所述坩埚容纳腔体的侧壁上设置有能够开闭的第一开口结构，通过所述第一开口结构的打开状态，蒸镀用坩埚能够进入所述坩埚容纳腔体的内部或者能够从所述坩埚容纳腔体的内部移出。
  9. 如权利要求2所述的蒸镀设备，其中，所述外围腔体的侧壁上设置有能够开闭的第二开口结构，所述第二开口结构呈关闭状态，所述外围腔体的内部形成封闭空间；所述第二开口结构呈打开状态，所述坩埚容纳腔体露出。
  10. 如权利要求2所述的蒸镀设备，其中，所述蒸镀设备还包括：
    第一抽真空结构，用于对所述主腔体和与所述主腔体连通的所述坩埚容纳腔体抽取真空；
    第二抽真空结构，用于对所述外围腔体抽取真空。
  11. 如权利要求1所述的蒸镀设备，其中，所述蒸镀设备包括多个所述蒸镀机构，各个所述蒸镀机构设置在所述主腔体的下方，且围绕所述主腔体在竖直方向的轴心均匀分布。
  12. 如权利要求11所述的蒸镀设备，其中，所述蒸镀设备还包括具有容纳空间的第二安装支架，设置于所述主腔体下方且与所述主腔体连接，各个所述蒸镀机构均安装设置于所述第二安装支架的容纳空间内。
  13. 一种采用权利要求1至12任一项所述蒸镀设备的蒸镀方法，所述蒸镀方法包括：
    将所述第一坩埚容纳腔体移动至所述蒸镀执行位置，且使所述第一坩埚容纳腔体与所述主腔体相连通；
    对所述第一坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程；
    所述第一坩埚容纳腔体中的坩埚所盛放材料耗尽时，在真空环境下，所述第一坩埚容纳腔体移离所述蒸镀执行位置，所述第二坩埚容纳腔体移动至所述蒸镀执行位置处，且与所述主腔体之间连通；
    对所述第二坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程。
  14. 如权利要求13所述的蒸镀方法，其中，在对所述第二坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程的步骤中，所述蒸镀方法还包括：
    将所述第一坩埚容纳腔体中的坩埚取出，重新添加材料后放回所述第一坩埚容纳腔体。
  15. 如权利要求13所述的蒸镀方法，其中，在对所述第二坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程执行完毕后，所述蒸镀方法还包括：
    将所述第一坩埚容纳腔体和所述第二坩埚容纳腔体中的坩埚分别取出，重新添加材料后分别放回所述第一坩埚容纳腔体和所述第二坩埚容纳腔体。
  16. 如权利要求13所述的蒸镀方法，其中，对所述第一坩埚容纳腔体中的坩埚所盛放材料执行蒸镀过程的步骤具体包括：
    对所述主腔体抽取真空，使所述主腔体和所述第一坩埚容纳腔体均达到预设真空度；
    对所述第一坩埚容纳腔体内的坩埚进行预热，预热达到预设温度时，执行蒸镀过程，直到坩埚内的材料用尽。
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