JP6967252B2 - 電子部品の製造方法、及び電子部品 - Google Patents

電子部品の製造方法、及び電子部品 Download PDF

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Publication number
JP6967252B2
JP6967252B2 JP2017216616A JP2017216616A JP6967252B2 JP 6967252 B2 JP6967252 B2 JP 6967252B2 JP 2017216616 A JP2017216616 A JP 2017216616A JP 2017216616 A JP2017216616 A JP 2017216616A JP 6967252 B2 JP6967252 B2 JP 6967252B2
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Japan
Prior art keywords
plating
plating layer
layer
nickel
phosphorus
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JP2017216616A
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English (en)
Japanese (ja)
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JP2019085631A5 (https=
JP2019085631A (ja
Inventor
怜史 大矢
由加利 小野
早紀 中木原
廣一 志方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualtec Co Ltd
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Qualtec Co Ltd
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Publication date
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Priority to JP2017216616A priority Critical patent/JP6967252B2/ja
Publication of JP2019085631A publication Critical patent/JP2019085631A/ja
Publication of JP2019085631A5 publication Critical patent/JP2019085631A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

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  • Chemically Coating (AREA)
  • Die Bonding (AREA)
JP2017216616A 2017-11-09 2017-11-09 電子部品の製造方法、及び電子部品 Active JP6967252B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017216616A JP6967252B2 (ja) 2017-11-09 2017-11-09 電子部品の製造方法、及び電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017216616A JP6967252B2 (ja) 2017-11-09 2017-11-09 電子部品の製造方法、及び電子部品

Publications (3)

Publication Number Publication Date
JP2019085631A JP2019085631A (ja) 2019-06-06
JP2019085631A5 JP2019085631A5 (https=) 2020-11-26
JP6967252B2 true JP6967252B2 (ja) 2021-11-17

Family

ID=66763946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017216616A Active JP6967252B2 (ja) 2017-11-09 2017-11-09 電子部品の製造方法、及び電子部品

Country Status (1)

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JP (1) JP6967252B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7306712B2 (ja) * 2019-07-26 2023-07-11 株式会社クオルテック ヒータチップ及び接合層評価装置
CN112259383B (zh) * 2020-10-19 2022-02-22 南京工程学院 一种包覆钼酸镍铜复合膜的电极原位制备方法
JP2023079124A (ja) 2021-11-26 2023-06-07 国立大学法人東北大学 パワー半導体素子及びパワー半導体モジュール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3910363B2 (ja) * 2000-12-28 2007-04-25 富士通株式会社 外部接続端子
EP2023384A4 (en) * 2006-05-29 2013-01-02 Nec Corp ELECTRONIC COMPONENT, SEMICONDUCTOR SEALING AND ELECTRONIC ARRANGEMENT
JP5450192B2 (ja) * 2010-03-24 2014-03-26 日立オートモティブシステムズ株式会社 パワーモジュールとその製造方法
JP6569511B2 (ja) * 2015-12-17 2019-09-04 三菱マテリアル株式会社 接合体、冷却器付きパワーモジュール用基板、冷却器付きパワーモジュール用基板の製造方法

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JP2019085631A (ja) 2019-06-06

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