JP6960451B2 - 受発光素子モジュールおよびセンサー装置 - Google Patents
受発光素子モジュールおよびセンサー装置 Download PDFInfo
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- 239000000758 substrate Substances 0.000 claims description 60
- 230000002093 peripheral effect Effects 0.000 claims description 26
- 238000013459 approach Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 description 41
- 238000012544 monitoring process Methods 0.000 description 13
- 239000012535 impurity Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011669 selenium Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
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- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
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Description
図1および図2に、本開示の受発光素子モジュールの一例の概要を示す。図2は、図1に記載の受発光素子モジュールをII−II線で切断したときの断面の図である。
次に、受発光素子5を備えたセンサー装置6について説明する。図15に示したように、本開示のセンサー装置6は、受発光素子モジュール1と、受発光素子モジュール1に電気的に接続された制御用回路7とを有している。制御用回路7は、受発光素子モジュール1を制御することができる。制御用回路7は、例えば、受発光素子5を駆動させるための駆動回路、受発光素子5の電流を処理する演算回路または外部装置と通信するための通信回路などを含んでいる。なお、図15に示した破線の矢印は、発光素子52から出て対象物で反射し、第2受光素子54に入射する光の経路を例示している。
2 配線基板
3 筐体
4 レンズ部材
5 受発光素子
6 センサー装置
7 制御用回路
Claims (15)
- 基板と、
前記基板上に配された発光素子と、
前記基板上に前記発光素子から離れて配された第1受光素子と、
前記基板上に配された、前記発光素子および前記第1受光素子を囲んだ側壁と、
前記基板上に配されて前記側壁で囲まれた第2受光素子と、
前記基板の上方に位置して、前記側壁で囲まれた領域を覆うように配された上壁と、を備え、
前記上壁は、前記発光素子の上方に位置した第1光通過部と、前記第1光通過部に隣接する上面に、前記側壁から前記第1光通過部に向かって下面に近づく傾斜面と、前記傾斜面と前記第1受光素子の受光領域とを結ぶ仮想線上に位置した第1遮光部と、前記第2受光素子の上方に位置した第2光通過部と、前記第1光通過部および前記第2光通過部の間の領域に位置した中間部と、を有しており、
前記中間部の下面の少なくとも一部は、前記発光素子および前記第1受光素子に対向した対向面であり、前記対向面は、前記基板の上面に対して、前記発光素子側に傾斜している、受発光素子モジュール。 - 前記上壁は、前記第2光通過部に隣接する上面に、前記側壁から前記第2光通過部に向かって下面に近づく傾斜面を有している、請求項1に記載の受発光素子モジュール。
- 前記上壁は、前記側壁から前記第2光通過部に向かう前記傾斜面と前記第1受光素子の受光領域とを結ぶ仮想線上に位置した第2遮光部を有している、請求項2に記載の受発光素子モジュール。
- 前記上壁は、前記第1光通過部、前記第2光通過部および前記中間部を囲む周辺部をさらに有し、
前記中間部は、前記周辺部における前記第1光通過部の内面と前記第1受光素子の受光領域とを結ぶ仮想線上に位置した、第3遮光部を有している、請求項1〜3のいずれかに記載の受発光素子モジュール。 - 前記上壁は、前記第1光通過部、前記第2光通過部および前記中間部を囲む周辺部をさらに有し、
前記中間部は、前記周辺部における前記第2光通過部の内面と前記第1受光素子の受光領域とを結ぶ仮想線上に位置した、第4遮光部を有している、請求項1〜3のいずれかに記載の受発光素子モジュール。 - 前記中間部は、前記周辺部における前記第2光通過部の内面と前記第1受光素子の受光領域とを結ぶ仮想線上に位置した、第4遮光部を有している、請求項4に記載の受発光素子モジュール。
- 前記上壁は、前記第1光通過部、前記第2光通過部および前記中間部を囲む周辺部をさらに有し、
前記中間部は、前記周辺部における前記第1光通過部の内面と前記第1受光素子の受光領域とを結ぶ仮想線が下方に傾く角度と、前記第1光通過部の内面に対して同じ角度で上方に傾く仮想線上に位置した第5遮光部を有している、請求項1〜3のいずれかに記載の受発光素子モジュール。 - 前記中間部は、前記周辺部における前記第1光通過部の内面と前記第1受光素子の受光領域とを結ぶ仮想線が下方に傾く角度と、前記第1光通過部の内面に対して同じ角度で上方に傾く仮想線上に位置した第5遮光部を有している、請求項4〜6のいずれかに記載の受発光素子モジュール。
- 前記上壁は、前記第1光通過部、前記第2光通過部および前記中間部を囲む周辺部をさらに有し、
前記中間部は、前記周辺部における前記第2光通過部の内面と前記第1受光素子の受光領域とを結ぶ仮想線が下方に傾く角度と、前記第2光通過部の内面に対して同じ角度で上方に傾く仮想線上に位置した第6遮光部を有している、請求項1〜3のいずれかに記載の受発光素子モジュール。 - 前記中間部は、前記周辺部における前記第2光通過部の内面と前記第1受光素子の受光領域とを結ぶ仮想線が下方に傾く角度と、前記第2光通過部の内面に対して同じ角度で上方に傾く仮想線上に位置した第6遮光部を有している、請求項4〜8のいずれかに記載の受発光素子モジュール。
- 前記中間部の下面は、下方に突出した頂部をさらに有しており、
前記中間部は、前記頂部と前記第1受光素子の受光領域とを結ぶ仮想線上に位置した第7遮光部を有している、請求項1〜10のいずれかに記載の受発光素子モジュール。 - 前記上壁が前記側壁の高さ方向の途中に配されており、
前記側壁は、前記第1光通過部の上端と前記第1受光素子の受光領域とを結ぶ仮想線上に位置している、請求項1〜11のいずれかに記載の受発光素子モジュール。 - 前記上壁が前記側壁の高さ方向の途中に配されており、
前記側壁は、前記第2光通過部の上端と前記第1受光素子の受光領域とを結ぶ仮想線上に位置している、請求項1〜11のいずれかに記載の受発光素子モジュール。 - 前記側壁は、前記第2光通過部の上端と前記第1受光素子の受光領域とを結ぶ仮想線上に位置している、請求項12に記載の受発光素子モジュール。
- 請求項1〜14のいずれかに記載の受発光素子モジュールと、
前記受発光素子モジュールに接続され、前記受発光素子モジュールを制御する制御用回路と、を有するセンサー装置。
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