JP6939679B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6939679B2
JP6939679B2 JP2018064209A JP2018064209A JP6939679B2 JP 6939679 B2 JP6939679 B2 JP 6939679B2 JP 2018064209 A JP2018064209 A JP 2018064209A JP 2018064209 A JP2018064209 A JP 2018064209A JP 6939679 B2 JP6939679 B2 JP 6939679B2
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JP
Japan
Prior art keywords
heat radiating
heat sink
heat
sealing resin
radiating portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018064209A
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English (en)
Japanese (ja)
Other versions
JP2019176058A5 (enrdf_load_stackoverflow
JP2019176058A (ja
Inventor
領二 上瀧
領二 上瀧
大輔 福岡
大輔 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2018064209A priority Critical patent/JP6939679B2/ja
Priority to PCT/JP2019/003057 priority patent/WO2019187608A1/ja
Publication of JP2019176058A publication Critical patent/JP2019176058A/ja
Publication of JP2019176058A5 publication Critical patent/JP2019176058A5/ja
Application granted granted Critical
Publication of JP6939679B2 publication Critical patent/JP6939679B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2018064209A 2018-03-29 2018-03-29 半導体装置 Active JP6939679B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018064209A JP6939679B2 (ja) 2018-03-29 2018-03-29 半導体装置
PCT/JP2019/003057 WO2019187608A1 (ja) 2018-03-29 2019-01-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018064209A JP6939679B2 (ja) 2018-03-29 2018-03-29 半導体装置

Publications (3)

Publication Number Publication Date
JP2019176058A JP2019176058A (ja) 2019-10-10
JP2019176058A5 JP2019176058A5 (enrdf_load_stackoverflow) 2020-03-05
JP6939679B2 true JP6939679B2 (ja) 2021-09-22

Family

ID=68058784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018064209A Active JP6939679B2 (ja) 2018-03-29 2018-03-29 半導体装置

Country Status (2)

Country Link
JP (1) JP6939679B2 (enrdf_load_stackoverflow)
WO (1) WO2019187608A1 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7467854B2 (ja) 2019-09-26 2024-04-16 船井電機株式会社 照明装置および表示装置
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置
JP7452233B2 (ja) * 2020-05-01 2024-03-19 株式会社デンソー 半導体装置および電力変換装置
JP7517143B2 (ja) 2020-12-28 2024-07-17 トヨタ自動車株式会社 リアクトルユニット

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7049683B1 (en) * 2003-07-19 2006-05-23 Ns Electronics Bangkok (1993) Ltd. Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound
JP2015018860A (ja) * 2013-07-09 2015-01-29 株式会社デンソー 半導体パッケージの製造方法
JP6578900B2 (ja) * 2014-12-10 2019-09-25 株式会社デンソー 半導体装置及びその製造方法
JP6485397B2 (ja) * 2016-04-04 2019-03-20 株式会社デンソー 電子装置及びその製造方法

Also Published As

Publication number Publication date
WO2019187608A1 (ja) 2019-10-03
JP2019176058A (ja) 2019-10-10

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