JP6935132B2 - 静電チャックプレートの製造方法 - Google Patents

静電チャックプレートの製造方法 Download PDF

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Publication number
JP6935132B2
JP6935132B2 JP2017141864A JP2017141864A JP6935132B2 JP 6935132 B2 JP6935132 B2 JP 6935132B2 JP 2017141864 A JP2017141864 A JP 2017141864A JP 2017141864 A JP2017141864 A JP 2017141864A JP 6935132 B2 JP6935132 B2 JP 6935132B2
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JP
Japan
Prior art keywords
conductor film
resin sheet
electrostatic chuck
electrode pattern
chuck plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017141864A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019021867A (ja
Inventor
健次 古田
健次 古田
百合子 里
百合子 里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017141864A priority Critical patent/JP6935132B2/ja
Priority to TW107119942A priority patent/TWI766037B/zh
Priority to CN201810714545.7A priority patent/CN109285806B/zh
Priority to KR1020180081785A priority patent/KR102533799B1/ko
Publication of JP2019021867A publication Critical patent/JP2019021867A/ja
Application granted granted Critical
Publication of JP6935132B2 publication Critical patent/JP6935132B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2017141864A 2017-07-21 2017-07-21 静電チャックプレートの製造方法 Active JP6935132B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017141864A JP6935132B2 (ja) 2017-07-21 2017-07-21 静電チャックプレートの製造方法
TW107119942A TWI766037B (zh) 2017-07-21 2018-06-11 靜電吸盤板的製造方法
CN201810714545.7A CN109285806B (zh) 2017-07-21 2018-07-03 静电卡盘板的制造方法
KR1020180081785A KR102533799B1 (ko) 2017-07-21 2018-07-13 정전 척 플레이트의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017141864A JP6935132B2 (ja) 2017-07-21 2017-07-21 静電チャックプレートの製造方法

Publications (2)

Publication Number Publication Date
JP2019021867A JP2019021867A (ja) 2019-02-07
JP6935132B2 true JP6935132B2 (ja) 2021-09-15

Family

ID=65185506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017141864A Active JP6935132B2 (ja) 2017-07-21 2017-07-21 静電チャックプレートの製造方法

Country Status (4)

Country Link
JP (1) JP6935132B2 (zh)
KR (1) KR102533799B1 (zh)
CN (1) CN109285806B (zh)
TW (1) TWI766037B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7159942B2 (ja) * 2019-03-28 2022-10-25 株式会社村田製作所 外観検査装置
JP7426833B2 (ja) 2020-01-15 2024-02-02 日本特殊陶業株式会社 シート体の製造方法
JP2021111744A (ja) * 2020-01-15 2021-08-02 日本特殊陶業株式会社 導電層の製造方法、配線基板の製造方法及びヒータ装置の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11297805A (ja) * 1998-04-13 1999-10-29 Tomoegawa Paper Co Ltd 静電チャック装置、静電チャック用積層シート、および静電チャック用接着剤
JP4465954B2 (ja) * 2002-10-31 2010-05-26 ソニー株式会社 透明導電膜を有する表示装置の製造方法
JP2004235563A (ja) * 2003-01-31 2004-08-19 Tomoegawa Paper Co Ltd 静電チャック装置用電極シート及びこれを用いた静電チャック装置
JPWO2008108146A1 (ja) * 2007-03-01 2010-06-10 株式会社クリエイティブ テクノロジー 静電チャック
US7929269B2 (en) * 2008-09-04 2011-04-19 Momentive Performance Materials Inc. Wafer processing apparatus having a tunable electrical resistivity
DE102011014162B4 (de) * 2011-03-16 2019-12-05 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Verfahren zur Herstellung eines Trägers eines elektrostatischen Clamps
JP2013152514A (ja) * 2012-01-24 2013-08-08 Toppan Printing Co Ltd タッチパネルセンサー装置の製造方法及びタッチパネルセンサー装置
GB2509985A (en) * 2013-01-22 2014-07-23 M Solv Ltd Method of forming patterns on coatings on opposite sides of a transparent substrate
JP6576019B2 (ja) * 2014-02-14 2019-09-18 Ｎｉｓｓｈａ株式会社 透明電極フィルムの製造方法およびレーザー加工機
JP6433204B2 (ja) 2014-09-01 2018-12-05 株式会社ディスコ 静電支持プレート及び静電支持プレートの製造方法
JP6463936B2 (ja) * 2014-10-01 2019-02-06 日本特殊陶業株式会社 半導体製造装置用部品の製造方法
JP6519277B2 (ja) * 2015-03-31 2019-05-29 日本電気硝子株式会社 透明導電膜付基板
WO2016195945A1 (en) * 2015-06-04 2016-12-08 Applied Materials, Inc. Transparent electrostatic carrier

Also Published As

Publication number Publication date
CN109285806A (zh) 2019-01-29
TWI766037B (zh) 2022-06-01
KR102533799B1 (ko) 2023-05-17
CN109285806B (zh) 2023-12-19
TW201917815A (zh) 2019-05-01
KR20190010445A (ko) 2019-01-30
JP2019021867A (ja) 2019-02-07

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