JP6928597B2 - Copper alloy plate material and its manufacturing method, drawn products, electrical and electronic parts parts, electromagnetic wave shielding materials and heat dissipation parts - Google Patents

Description

The present invention relates to a copper alloy plate material, a method for manufacturing the same, a drawn product, a member for electric / electronic parts, an electromagnetic wave shielding material, and a heat radiating part.

Copper alloy plates, such as connectors for electrical and electronic components, lead frames, relays, switches, sockets, shield cases, shield cans, liquid crystal reinforcing plates, liquid crystal chassis, organic EL display reinforcing plates, and connectors for automobiles. , Copper alloy plates used for shield cases, shield cans, etc. are usually pressed by punching, bending, drawing, overhanging, and the like.

When a conventional copper alloy plate material is used, mechanical and electrical characteristics have to be sacrificed in order to realize a difficult-to-process shape that would otherwise be difficult to realize. The term "difficult-to-process shape" as used herein means, for example, a shape formed when a drawn product is manufactured and processed with a jig such as a punch whose corners and edges have a smaller radius of curvature than usual. do. When manufacturing a drawn product having such a difficult-to-process shape, it cannot be said that the original mechanical and electrical characteristics of the copper alloy plate material are fully utilized. Further, when the mechanical and electrical characteristics of the copper alloy plate material are emphasized, there is no choice but to give up the processing into the desired difficult-to-process shape, and the demand for miniaturization of electronic devices cannot be satisfied. One of the reasons for this is that as a result of having to increase the radius of curvature of the jig (punch) to some extent, the mounting space of the drawn product constituting the electronic component naturally increases. Furthermore, by optimizing the shape of the drawn product, there is room to improve the heat dissipation at the expense of the emphasis on drawing workability, but there is a problem that it is currently difficult to draw to the optimum shape. There is.

In particular, with the recent improvement in the performance of electrical and electronic parts and parts for automobiles, press-processed products, which are one of the components that compose them, have not only mechanical and electrical characteristics and heat dissipation, but also the purpose. In order to enable deformation into a shape, it has been strongly required to have excellent workability even under severe processing conditions. However, the current situation is that the level of drawability required by customers has not been achieved, especially in the process of processing into a difficult-to-process shape, which is the target.

For example, Patent Document 1 contains 0.8 to 4.0 mass% of Ni and Co, 0.2 to 1.0 mass% of Si, and 1 or 2 of Ni and Co. The mass ratio of Si is 3.0 to 7.0, the balance is composed of Cu and unavoidable impurities, the tensile strength in the parallel rolling direction is 570 MPa or more, the strength is 500 MPa or more, the elongation is 5% or more, and the direction perpendicular to rolling. The tensile strength is 550 MPa or more, the strength is 480 MPa or more, the elongation is 5% or more, the conductivity exceeds 35% IACS, the ratio R / t of the bending radius R and the plate thickness t is 0.5, and the bending line is rolled. The bending limit width when bending 90 degrees in the vertical direction is 70 mm or more, the bending limit width when performing close contact bending with the bending line in the rolling vertical direction is 20 mm or more, and the Rankford value is 0.9. As described above, the strength as a structural member, particularly the strength to withstand deformation and drop impact resistance, the moldability such as bending, overhanging and rolling to withstand processing into complicated shapes, and the high heat dissipation to heat from semiconductor elements and the like. A copper alloy plate for heat-dissipating parts is described.

Further, Patent Document 2 contains 0.5 to 3.0% by mass of Co, 0.1 to 2.0% by mass of Ni, and 0.1 to 1.5% by mass of Si in terms of mass ratio. (Ni + Co) / Si is 3 to 5, the balance is composed of copper and unavoidable impurities, 0.2% resistance in the rolling parallel direction is 630 MPa or more, conductivity is 50% IACS or more, and average crystal grains in the rolled parallel cross section. X-ray diffraction integrated intensity I {200} from the {200} crystal plane, X-ray diffraction integrated intensity I {220} from the {220} crystal plane, and {311} crystal with a diameter of 10 to 20 μm. The X-ray diffraction integrated intensity I {311} from the plane satisfies the relationship of (I {220} + I {311}) / I {200} ≧ 5.0, and is 0.2% suitable for use in electronic materials. A copper alloy for electronic materials, which has strength and conductivity and can improve dimensional stability when pressed into a connector shape or the like, is described.

Further, Patent Document 3 contains 1.0 to 3.0% by mass of Ni, contains Si at a concentration of 1/6 to 1/4 with respect to the mass% concentration of Ni, and the balance is Cu and unavoidable. It consists of target impurities, the arithmetic average roughness Ra of the surface is 0.02 to 0.2 μm, and the standard deviation of the absolute value of each peak and valley value with respect to the surface roughness average line is It is 0.1 μm or less, the average value of the aspect ratio (minor axis of crystal grains / major axis of crystal grains) of the crystal grains in the alloy structure is 0.4 to 0.6, and it is equipped with a backscattered electron diffraction image system. The whole crystal of GOS when the orientation of all pixels within the measurement area range is measured by the EBSD method using a scanning electron microscope and the boundary where the orientation difference between adjacent pixels is 5 ° or more is regarded as a grain boundary. The average value in the grain is 1.2 to 1.5 °, and the ratio (Lσ / L) of the total special grain boundary length Lσ of the special grain boundary to the total grain boundary length L of the crystal grain boundary is 60 to 70%. Cu-Ni has a spring limit value of 450 to 600 N / mm ² , good solder heat-resistant peeling resistance at 150 ° C. for 1000 hours, little fluctuation in fatigue resistance characteristics, and excellent deep drawing workability. -Si-based copper alloy (Corson alloy) plates are described.

Although Patent Documents 1 to 3 are inventions relating to a copper alloy sheet material containing at least one of Ni and Co and Si, and have good drawability, the copper alloy Of the steps that make up the sheet metal manufacturing method, especially in the series of steps from the finish cold rolling step to the temper annealing step, control is not performed to suppress the formation of crystal grains that deteriorate the drawability. Especially when the processing conditions are severe when performing a deep drawing test, especially when drawing is performed with a punch with a small radius of curvature R at the corner (for example, radius of curvature R is 0.9 mm or less), the drawing is at a satisfactory level. There is a problem that workability cannot be obtained stably.

Japanese Unexamined Patent Publication No. 2017-89003 Japanese Unexamined Patent Publication No. 2018-62705 International Publication No. 2012/1606684

An object of the present invention is a copper alloy plate material capable of stably obtaining excellent drawing workability even under severe drawing conditions without impairing the basic characteristics (particularly heat dissipation) of the conventional copper alloy plate material. The purpose of the present invention is to provide a method for manufacturing the same, a drawn product, a member for electric / electronic parts, an electromagnetic wave shielding material, and a heat radiating part.

但し、Ｓ_ｃ：Cube方位面積率（％）、σ_ｎは公称応力（ＧＰａ）、ε_ｎは公称歪（％）、そして、ＥＬは破断伸び（％）を表す。

（２）前記算術平均値Ａave.および前記パラメータＡｘの値を下記（３）式に代入して算出されるパラメータＢｘ（ｘ：０°、４５°、９０°）の前記各方向の値Ｂ_０°、Ｂ_４５°およびＢ_９０が、いずれも１０％以下となる、上記（１）に記載の銅合金板材。

（３）エリクセン試験におけるエリクセン値（Er）の板厚（ｔ）に対する比（Er/t比）と、圧延平行方向に引っ張ったときの破断伸びＥＬ（％）とは、下記（４）式の不等式の関係を満たす、上記（１）または（２）に記載の銅合金板材。

（４）前記組成は、さらに、Ｓｎ、Ｍｇ、Ｍｎ、Ｃｒ、Ｚｒ、Ｔｉ、ＦｅおよびＺｎからなる群から選ばれる少なくとも１種の成分を、合計で０．２〜１．２質量％以下含有する上記（１）〜（３）のいずれか１項に記載の銅合金板材。
（５）上記（１）〜（４）のいずれか１項に記載の銅合金板材を絞り加工して得られた絞り加工品。
（６）上記（１）〜（４）のいずれか１項に記載の銅合金板材または上記（５）に記載の絞り加工品を用いて作製された電気・電子部品用部材。
（７）上記（１）〜（４）のいずれか１項に記載の銅合金板材または上記（５）に記載の絞り加工品を用いて作製された電磁波シールド材。
（８）上記（１）〜（４）のいずれか１項に記載の銅合金板材または請求項５に記載の絞り加工品を用いて作製された放熱部品。
（９）上記（１）〜（４）のいずれか１項に記載の銅合金板材の製造方法であって、銅合金素材に、鋳造[工程１]、均質化処理[工程２]、熱間圧延[工程３]、面削[工程４]、冷間圧延[工程５]、溶体化熱処理[工程６]、中間熱処理[工程７]、仕上げ冷間圧延[工程８]、矯正［工程９］、および調質焼鈍[工程１０]を順次施し、前記仕上げ冷間圧延[工程８]における圧延時の材料の最大温度Ｔ_Ｒを、７５℃以上１００℃以下に制御し、前記矯正［工程９］における材料の伸び率δを、０．１〜１．０％とし、そして、前記調質焼鈍［工程１０］の材料温度Ｔ_Ａ（℃）を、前記伸び率δとの関係で下記（５）式に示す不等式の関係を満たすように制御することを特徴とする銅合金板材の製造方法。
５５×δ＋４５０≧Ｔ_Ａ≧５５×δ＋３５０ ・・・（５） In order to achieve the above object, the gist structure of the present invention is as follows.
(1) It has a composition in which one or more of Ni and Co are contained in a total of 1.0 to 5.0% by mass and Si is contained in an amount of 0.1 to 1.5% by mass, and the balance is Cu and unavoidable impurities. It is obtained by performing a tensile test on three types of test pieces cut out in each of the rolling parallel direction, the direction of 45 ° with respect to the rolling direction, and the direction of the rolling vertical direction, each having a conductivity of 38% IACS or more. Substituting the value obtained from the nominal stress-nominal strain curve and the value of the Cube azimuth area ratio obtained by the electron backscatter diffraction (EBSD) method into the following equation (1), the parameter Ax (x: 0 °) , 45 °, 90 °) in each direction A _{0 °} , A _{45 °} and A _{90 °} were obtained, and the obtained values A _{0 °} , A _{45 °} and A _{90 °} in each direction were obtained in (2) below. A copper alloy plate material characterized in that the arithmetic average value Aave. Calculated by substituting it into an equation is in the range of 4.0 to 13.0 GPa ·%.

However, _Sc : Cube azimuth area ratio (%), σ _n represents the nominal stress (GPa), ε _n represents the nominal strain (%), and EL represents the elongation at break (%).

_{(2) The value B 0 of the} parameter Bx (x: 0 °, 45 °, 90 °) calculated by substituting the arithmetic mean value Aave. And the value of the parameter Ax into the following equation (3). The copper alloy plate material according to (1) above, wherein _{° , B 45 °} and B _{90 are all 10% or less.}

(3) The ratio (Er / t ratio) of the Elixin value (Er) to the plate thickness (t) in the Elixin test and the breaking elongation EL (%) when pulled in the rolling parallel direction are calculated by the following equation (4). The copper alloy plate material according to (1) or (2) above, which satisfies the relationship of inequality.

(4) The composition further contains at least one component selected from the group consisting of Sn, Mg, Mn, Cr, Zr, Ti, Fe and Zn in an amount of 0.2 to 1.2% by mass or less in total. The copper alloy plate material according to any one of (1) to (3) above.
(5) A drawn product obtained by drawing the copper alloy plate material according to any one of (1) to (4) above.
(6) A member for electrical / electronic parts manufactured by using the copper alloy plate material according to any one of (1) to (4) above or the drawn product according to (5) above.
(7) An electromagnetic wave shielding material produced by using the copper alloy plate material according to any one of (1) to (4) above or the drawn product according to (5) above.
(8) A heat-dissipating component produced by using the copper alloy plate material according to any one of (1) to (4) above or the drawn product according to claim 5.
(9) The method for producing a copper alloy plate according to any one of (1) to (4) above, wherein the copper alloy material is cast [step 1], homogenized [step 2], and hot. Rolling [process 3], face milling [process 4], cold rolling [process 5], solution heat treatment [process 6], intermediate heat treatment [process 7], finish cold rolling [process 8], straightening [process 9] sequentially subjected and temper annealing [step 10], the maximum temperature T _R of the rolling time of the material in the finish cold rolling [step 8], and controls the 75 ° C. or higher 100 ° C. or less, the correction [step 9] the elongation of the material [delta] in, and 0.1% to 1.0%, and the material temperature _{T a} of the temper annealing [step 10] (° C.) and below in relation to the elongation [delta] (5) A method for producing a copper alloy plate material, which comprises controlling so as to satisfy the relation of inequality shown in the formula.
_{55 × δ + 450 ≧ T A} ≧ 55 × δ + 350 ··· (5)

The copper alloy plate material of the present invention contains one or more of Ni and Co in a total of 1.0 to 5.0% by mass, and Si in an amount of 0.1 to 1.5% by mass, with the balance being Cu and unavoidable impurities. Tensile tests are performed on three types of test pieces that have a certain composition, have a conductivity of 38% IACS or more, and are cut out in each of the rolling parallel direction, the direction of 45 ° with respect to the rolling direction, and the rolling vertical direction. Substituting the value obtained from the nominal stress-nominal strain curve obtained by the above and the value of the Cube azimuth area ratio obtained by the electron backscattering diffraction (EBSD) method into the above equation (1), the parameter Ax _{The values A 0 °} , A _{45 °} and A _{90 °} in each direction of (x: 0 °, 45 °, 90 °) were obtained, and the obtained values A _{0 °} , A _{45 °} and A _{90 °} in each direction were obtained. , The arithmetic average value Aave. Calculated by substituting into the above equation (2) is in the range of 4.0 to 13.0 GPa ·%, so that the basic characteristics (particularly heat dissipation) of the conventional copper alloy plate material can be improved. Excellent drawing workability can be stably obtained even under severe drawing conditions without impairing.

The method for producing a copper alloy plate material of the present invention is to cast [step 1], homogenize treatment [step 2], hot rolling [step 3], face milling [step 4], and cold rolling [step 1] on a copper alloy material. 5], solution heat treatment [step 6], intermediate heat treatment [step 7], finish cold rolling [step 8], straightening [step 9], and temper tempering [step 10] are sequentially performed, and the finish cold rolling is performed. the maximum temperature _{T R} of the rolling time of the material in [step 8], is controlled to 75 ° C. or higher 100 ° C. or less, the correction of elongation of the material δ in [step 9], and 0.1% to 1.0%, then, the material temperature T _a of the temper annealing [step 10] _(° C.), by controlling so as to satisfy the relation of inequality shown in equation (5) in relation to the elongation [delta], described above copper An alloy plate material can be manufactured.

FIG. 1 is a diagram showing, for example, a nominal stress-nominal strain curve obtained by performing a tensile test on a test piece cut out in a rolling parallel direction from a copper alloy plate material according to an embodiment of the present invention. .. FIG. 2 shows breakage when the ratio (Er / t ratio) of the Elixin value (Er) obtained by performing the Elixin test to the plate thickness (t) of various copper alloy plates is pulled in the rolling parallel direction. It is a figure when it is plotted in relation to the elongation EL (%). FIG. 3 conceptually shows a state when the central portion of the test plate material W is pushed in with a punch having a columnar tip and a small radius of curvature R at the corners in order to evaluate drawing workability with a deep drawing tester. It is a figure shown in. FIG. 4 is a diagram conceptually showing a state when the central portion of the test plate material W is pushed by a hemispherical punch at the tip portion in order to obtain the Eriksen value with the Eriksen testing machine.

Hereinafter, preferred embodiments of the copper alloy plate material of the present invention will be described in detail.
The copper alloy plate material according to the present invention contains 1.0 to 5.0% by mass of one or more of Ni and Co in total, and 0.1 to 1.5% by mass of Si, and the balance is Cu and unavoidable impurities. Tension tests are performed on three types of test pieces that have a certain composition, have a conductivity of 38% IACS or more, and are cut out in each of the rolling parallel direction, the direction of 45 ° with respect to the rolling direction, and the rolling vertical direction. Substituting the value obtained from the nominal stress-nominal strain curve obtained by this and the value of the Cube azimuth area ratio obtained by the electron backscatter diffraction (EBSD) method into the following equation (1), the parameter Ax _{The values A 0 °} , A _{45 °} and A _{90 °} in each direction of (x: 0 °, 45 °, 90 °) were obtained, and the obtained values A _{0 °} , A _{45 °} and A _{90 °} in each direction were obtained. , The arithmetic average value Aave. Calculated by substituting into the following equation (2) is in the range of 4.0 to 13.0 GPa ·%.

但し、Ｓ_ｃ：Cube方位面積率（％）、σ_ｎは公称応力（ＧＰａ）、ε_ｎは公称歪（％）、そして、ＥＬは破断伸び（％）を表す。

However, _Sc : Cube azimuth area ratio (%), σ _n represents the nominal stress (GPa), ε _n represents the nominal strain (%), and EL represents the elongation at break (%).

(I) Composition of Copper Alloy Plate First, the reason for limiting the composition of the copper alloy plate of the present invention will be described.
The copper alloy plate material of the present invention contains one or more of Ni and Co in a total amount of 1.0 to 5.0% by mass and Si in an amount of 0.1 to 1.5% by mass.

<A total of 1.0 to 5.0% by mass of one or more of Ni and Co>
Ni (nickel) and Co (cobalt) are elements necessary to increase the strength of the copper alloy plate material, and it is necessary to contain at least one of Ni and Co in a total of 1.0 to 5.0% by mass. Is. If the total content of one or more of Ni and Co is less than 1.0% by mass, the material strength decreases, and the strength required for electronic parts such as shield cases, which are drawn products manufactured by drawing, is obtained. I can't. Further, when the total content of one or more of Ni and Co is more than 5.0% by mass, Ni and Co cannot be completely dissolved in the solution heat treatment [step 6] described later, and the metal structure is formed as the second phase. This is because it remains in the (matrix) and does not contribute to the improvement of the strength that should be exhibited in the intermediate heat treatment [step 7] described later, and also causes an increase in the metal cost. be. Therefore, the total content of one or more of Ni and Co is in the range of 1.0 to 5.0% by mass.

<Si: 0.1 to 1.5% by mass>
Si (silicon) is an element necessary for forming a compound with Ni and Co and increasing the strength of the copper alloy plate material, and it is necessary to contain Si in an amount of 0.1 to 1.5% by mass. This is because if the Si content is less than 0.1% by mass, the amount of the compound formed together with Ni and Co decreases, and the material strength decreases. Further, if the Si content is more than 1.5% by mass, the thermal conductivity of the copper alloy plate material is lowered and the heat dissipation property is deteriorated. Therefore, the Si content is in the range of 0.1 to 1.5% by mass.

The copper alloy plate material of the present invention contains one or more components of Ni and Co and Si as essential basic components, but further, as optional sub-additive components, Sn, Mg, Mn, Cr, Zr, At least one component selected from the group consisting of Ti, Fe and Zn can be contained in an amount of 0.2 to 1.2% by mass or less in total. All of these components are components having an effect of improving the material strength, and in order to exert such an effect, the total content of these components is preferably 0.2% by mass or more. Further, when the total content of these components exceeds 1.2% by mass, the conductivity tends to decrease. Therefore, the total content of the above components is set in the range of 0.2 to 1.2% by mass. It is preferable, and 0.5% by mass to 1.0% by mass is more preferable.

<Sn: 0.1 to 0.45% by mass>
Sn (tin) is an element having a high effect of solid solution strengthening the copper alloy, and it is preferable to add 0.1% by mass or more, but when the addition amount is larger than 0.45% by mass, the conductivity decreases. Tends to let. Therefore, the amount of Si added is preferably in the range of 0.1 to 0.45% by mass.

<Mg: 0.1 to 0.25% by mass>
Mg (magnesium) is an element having a high effect of solidifying and strengthening a copper alloy, and it is preferable to add 0.1% by mass or more, but if the amount added is more than 0.25% by mass, the conductivity decreases. Tends to let. Therefore, the amount of Mg added is preferably in the range of 0.1 to 0.25% by mass.

<Mn: 0.1 to 0.2% by mass>
Mn (manganese) is an element having an effect of solidifying and forging a copper alloy and an effect of improving hot workability, and is preferably added in an amount of 0.1% by mass or more, but more than 0.2% by mass. As the amount increases, the conductivity tends to decrease. Therefore, the amount of Mn added is preferably in the range of 0.1 to 0.2% by mass.

<Cr: 0.1 to 0.25% by mass>
Cr (chromium) has the effect of strengthening the material by forming a second-phase compound containing chromium and silicon, and suppressing the coarsening of the crystal grain size in the solution heat treatment step by the compound. It is desirable to add 1% by mass or more, but if the amount added is more than 0.25% by mass, coarse crystals are formed during casting and easily become a starting point of breakage during press working. Therefore, the amount of Cr added is preferably in the range of 0.1 to 0.25% by mass.

<Zr: 0.05 to 0.15% by mass>
Zr (zirconium) is an element that dissolves in the material and has the effect of suppressing the growth of recrystallized grains in the solution heat treatment by raising the recrystallization temperature of the material, and is added in an amount of 0.05% by mass or more. However, if the amount added is more than 0.15% by mass, coarse crystallization is generated during casting and tends to be a starting point of breakage during press working. Therefore, the amount of Zr added is preferably in the range of 0.05 to 0.15% by mass.

<Ti: 0.02 to 0.1% by mass>
Ti (titanium) is an element that dissolves in the material and has the effect of suppressing the growth of recrystallized grains in the solution heat treatment by raising the recrystallization temperature of the material, and is added in an amount of 0.02% by mass or more. However, if the amount added is more than 0.1% by mass, the conductivity tends to decrease. Therefore, the amount of Ti added is preferably in the range of 0.02 to 0.1% by mass.

<Fe: 0.05 to 0.1% by mass>
Fe (iron) is an element having a high effect of solid solution strengthening a copper alloy, and it is desirable to add 0.05% by mass or more, but if the amount added is more than 0.1% by mass, the conductivity is lowered. Tend. Therefore, the amount of Fe added is preferably in the range of 0.05 to 0.1% by mass.

<Zn: 0.2 to 0.6% by mass>
Zn (zinc) is an element having an action of improving bending workability and improving adhesion and migration characteristics of Sn plating and solder plating. In order to exert such an action, the Zn content is preferably 0.2% by mass or more. However, if the Zn content exceeds 0.6% by mass, sufficient heat dissipation may not be obtained due to a decrease in conductivity. Therefore, the amount of Zn added is preferably in the range of 0.2 to 0.6% by mass.

<Remaining: Cu and unavoidable impurities>
The rest other than the components mentioned above are Cu (copper) and unavoidable impurities. The unavoidable impurities referred to here mean impurities at a content level that can be unavoidably contained in the manufacturing process. Since the unavoidable impurities can be a factor of lowering the conductivity depending on the content, it is preferable to suppress the content of the unavoidable impurities to some extent in consideration of the lowering of the conductivity. Examples of the components listed as unavoidable impurities include Bi, Se, As, Ag and the like. The upper limit of the content of these components may be 0.03% by mass for each of the above components and 0.10% by mass for the total amount of the above components.

(II) Conductivity The copper alloy plate material of the present invention needs to have a conductivity of 38% IACS or more. Thermal conductivity can be calculated from conductivity according to the Wiedemann-Franz law, and if the temperature is constant, it may be proportional to conductivity regardless of the type of metal. Are known. Therefore, the copper alloy plate material of the present invention can have high thermal conductivity by setting the conductivity to 38% IACS or more, and as a result, can have excellent thermal conductivity. The resistivity can be calculated by measuring the specific resistance by the four-terminal method in a constant temperature bath kept at 20 ° C. (± 0.5 ° C.), for example, when the distance between terminals is 100 mm.

(III) Arithmetic mean value Aave. Is in the range of 4.0 to 13.0 GPa ·% The copper alloy plate material of the present invention has an arithmetic mean value Aave. In the range of 4.0 to 13.0 GPa ·%. It is necessary to be. The arithmetic mean value Aave. Is the direction parallel to rolling, the direction 45 ° with respect to the rolling direction (sometimes simply referred to as "45 ° direction"), and the vertical direction of rolling (sometimes simply referred to as "90 ° direction"). The values obtained from the nominal stress-nominal strain curve obtained by performing a tensile test on the three types of test pieces cut out in each of the above directions, and the Cube azimuth area obtained by the electron backscattering diffraction (EBSD) method. By substituting the value of the rate into the following equation (1), the values A _{0 °} , A _{45 °} and A _{90 °} in each direction of the parameters Ax (x: 0 °, 45 °, 90 °) were obtained and obtained. It is calculated by substituting _{the values A 0 °} , A _{45 °} and A _{90 °} in each direction into the following equation (2).

但し、Ｓ_ｃ：Cube方位面積率（％）、σ_ｎは公称応力（ＧＰａ）、ε_ｎは公称歪（％）、そして、ＥＬは破断伸び（％）を表す。

However, _Sc : Cube azimuth area ratio (%), σ _n represents the nominal stress (GPa), ε _n represents the nominal strain (%), and EL represents the elongation at break (%).

The present inventors have obtained the finding that the parameter Aave. Correlates well with the drawability with the material through experiments leading up to the present invention. Conventionally, it has been known that among the crystal orientations of copper and copper alloys, when the Cube orientation is accumulated, the drawability of the material is lowered. However, the quantitative correlation between the degree of integration of the Cube orientation and the drawability and the quantitative evaluation of the drawability using the degree of integration of the Cube orientation have not been performed. In the first place, precipitation-hardened copper alloys, for example, Cu-Ni-Si-based and Cu-Co-Si-based alloys such as the component system of the present invention, are copper and copper alloys conventionally used for drawing, such as pure copper and brass. Compared to pure metals such as Western white and solid solution strengthened types, the effects of manufacturing processes such as the size, abundance density, and abundance ratio of second-phase compounds and rolling processes on the mechanical properties of materials in addition to the material components. Is very large, and because multiple material properties affect each other, it fluctuates at the same time, for example, the abundance ratio of the second phase compound and the material strength fluctuate at the same time. The fact that the influence on the properties cannot be extracted has made it difficult to improve the draw workability of the precipitation-hardened alloy and to evaluate the draw workability.

Therefore, the present inventors have found that the draw workability can be evaluated well by the precipitation-strengthening alloy according to the equation (2), and that there is a correlation between the draw workability and the equation (2). Has led to the invention of a precipitation-strengthening alloy with improved results.

In equation (1), the degree of integration of the Cube orientation, which adversely affects drawability, is expressed so as to have a negative correlation with respect to the parameter Ax, and the larger the integral value of the nominal stress-nominal strain curve, the better the drawability. Since it has a positive effect on, it is expressed so as to have a positive correlation. FIG. 1 is a diagram showing, for example, a nominal stress-nominal strain curve obtained by performing a tensile test on a test piece cut out in a rolling parallel direction from a copper alloy plate material according to an embodiment of the present invention. ..

_{Furthermore, the arithmetic mean value Aave. Calculated by substituting the parameters A 0 °} , A _{45 °} and A _{90 °} in the three directions obtained from Eq. (1) into Eq. (2) is a parameter that correlates well with drawability. I found that. By obtaining this correlation, it became possible to evaluate the drawability by equation (2).

Here, when the arithmetic mean value Aave. Is less than 4.0 GPa ·%, a satisfactory level of drawability cannot be obtained under particularly severe deep drawing conditions, and when it is larger than 13.0 GPa ·%. Then, the elongation of the material becomes large, and the strength, which is a contradictory property, cannot be sufficiently obtained. Therefore, in the present invention, the arithmetic mean value Aave. Is in the range of 4.0 to 13.0 GPa ·%.

The integral value obtained from the nominal stress-nominal strain curve used to calculate the parameter Ax is three types of JIS cut out in each of the rolling parallel direction, 45 ° direction, and 90 ° direction.
Nine (n = 9) test pieces of Z2241 No. 13B were prepared and measured according to JIS Z2241, and when the case with the largest breaking elongation was the first, the breaking elongation was the fifth largest. It is determined using the nominal stress-nominal strain curve when measured using the test piece, and the integrated value shown in Eq. (1) is trapezoidal from the plot of the nominal stress-nominal strain curve obtained above. It can be calculated from the area obtained by approximation. The nominal stress may be measured, for example, every time the nominal strain is 0.001% or more and 0.300% or less.

The Cube azimuth area ratio (%) used to calculate the parameter Ax is continuously obtained by using the EBSD detector attached to the high-resolution scanning analysis electron microscope (manufactured by JEOL Ltd., trade name: JSM-7001FA). It can be calculated from the crystal orientation data measured by using analysis software (manufactured by TSL, trade name: OIM-Anysis). Here, "EBSD" is an abbreviation for Electron Backscatter Diffraction, and is a crystal orientation analysis technique using reflected electron Kikuchi line diffraction generated when a sample is irradiated with an electron beam in a scanning electron microscope (SEM). Yes, and "OIM-Anallysis" is an analysis software for data measured by EBSD.

_{Therefore, the values A 0 °} , A _{45 °,} and A _{90 °} in each direction of the parameter Ax are obtained by substituting the integral value calculated by the above method and the Cube azimuth area ratio (%) into the above equation (1). _{The values A 0 °} , A _{45 °} and A _{90 °} in each direction of the parameter Ax can be calculated, and the arithmetic mean value Aave. Is the calculated A _{0 °} , A _{45 °} and A _{90 °} in Eq. (2). It can be calculated by substituting into.

The drawability is determined after the edge of the test plate material W is tightened between the die 12 and the wrinkle pressing member 16 by a deep drawing tester (for example, a thin plate forming tester manufactured by Ericssen) 10 as shown in FIG. , The central portion of the test plate material W was pushed in with the punch 14 to form a cylindrical cup. The evaluation was made in consideration of the minimum punch corner radius R capable of forming the cylindrical cup without cracking and the difference between the maximum valley depth and the maximum peak height of the swell of the edge of the cylindrical cup at that time. Further, the value of the moving distance (depth of the dent) of the punch until the through crack occurs by the overhang test (Eriksen test), that is, the Eriksen value Er is measured, and in addition to this Eriksen value Er, the thickness of the test plate material W. Comprehensive evaluation was made in consideration of the value (mm), the elongation at break (%) when pulled in the rolling direction, and the result.

_{(IV) The values B 0 °} , B _{45 °} and B ₉₀ in each direction of the parameter Bx (x: 0 °, 45 °, 90 °) shall be 10% or less, respectively. The values of the parameter Bx (x: 0 °, 45 °, 90 °) calculated by substituting the arithmetic mean value Aave. And the value of the parameter Ax into the following equation (3) are 10 in each of the above directions. It is preferably% or less.

_{By controlling the values B 0 °} , B _{45 °} and B ₉₀ of the parameter Bx defined in the above equation (3) in each direction to be as small as 10% or less, the undulation of the edge after drawing can be reduced. It can be stably reduced in size, the shape becomes uniform, and the drawability can be further improved by twisting. _{When the values B 0 °} , B _{45 °} , and B ₉₀ in any direction of the parameter Bx are larger than 10%, the yield in the production of the drawn product tends to decrease. Therefore, the value B in each direction of the parameter Bx _{It is preferable that 0 °} , B _{45 °} and B ₉₀ are all 10% or less.

The parameter Bx can be calculated by substituting the calculated parameter Ax and the arithmetic mean value Aave. In the equation (3) as described above.

(V) The ratio of the Elixin value (Er) to the plate thickness (t) (Er / t ratio) and the breaking elongation EL (%) when pulled in the rolling parallel direction are related to the inequality of the following equation (4). The copper alloy plate material of the present invention has the ratio (Er / t ratio) of the Ericsen value (Er) to the plate thickness (t) in the Elixin test and the breaking elongation EL (%) when pulled in the rolling parallel direction. Satisfies the relation of the inequality of the following equation (4).

The present inventors further determine the ratio (Er / t ratio) of the Eriksen value (Er) obtained by the Eriksen test to the plate thickness (t) and the breaking elongation EL (%) when pulled in the rolling parallel direction. The effect on drawability was investigated. In FIG. 2, the ratio (Er / t ratio) of the Elixin value (Er) to the plate thickness (t) is taken on the vertical axis, and the breaking elongation EL (%) when pulled in the rolling parallel direction is taken on the horizontal axis. It is a plot of the example shown and the comparative example. From the results shown in FIG. 2, it can be seen that all the examples are in the upper region and all the comparative examples are in the lower region with the linear function: Er / t = 1.5EL as a boundary. Therefore, in the present invention, it is possible to determine whether the copper alloy plate material has excellent drawability by satisfying the above equation (4).

As shown in FIG. 4, the Eriksen value (Er value) is determined by tightening the edge portion of the test plate material W between the die 12 and the wrinkle pressing member 16 by the Eriksen tester, and then the central portion of the test plate material W. The value of the moving distance (depth of the dent) of the punch until the tip was pushed in by the hemispherical punch 14A and the through crack occurred was measured, and the value was used as the measured value.

(VI) Method for Producing Copper Alloy Plate Material According to One Example of the Present Invention The above-mentioned copper alloy plate material can be realized by controlling the alloy composition and the production process in combination. Hereinafter, a suitable manufacturing method for the copper alloy plate material of the present invention will be described.

Such a copper alloy plate material according to an embodiment of the present invention is obtained by casting [step 1], homogenizing treatment [step 2], and hot rolling on a copper alloy material having the same composition as the above-mentioned copper alloy plate material. [Step 3], Face milling [Step 4], Cold rolling [Step 5], Solution heat treatment [Step 6], Intermediate heat treatment [Step 7], Finish cold rolling [Step 8], Straightening [Step 9], It is manufactured by sequentially performing tempering and annealing [step 10], and more specifically, by optimizing a series of processes from the finish cold rolling process to the tempering and annealing process, more specifically, finish cooling. the maximum temperature _{T R} of the rolling time of the material during rolling [step 8], and controls the 75 ° C. or higher 100 ° C. or less, correct the elongation of the material δ in [step 9], and 0.1% to 1.0% and temper annealing the material temperature T _a [step 10] _(° C.), by controlling so as to satisfy the relation of inequality shown in the following formula (5) in relation to the elongation [delta], in particular heat radiation It is possible to produce a copper alloy plate material having excellent drawing workability even under severe drawing conditions without impairing the above.

_{55 × δ + 450 ≧ T A} ≧ 55 × δ + 350 ··· (5)

(I) Casting process [Step 1]
In the casting step, the alloy components shown in Table 1 are melted in an air by a high-frequency melting furnace, and the alloy components are cast to produce an ingot having a predetermined shape (for example, thickness 30 mm, width 100 mm, length 150 mm).

(Ii) Homogenization treatment step [Step 2]
In the homogenization treatment step, the homogenization heat treatment [step 2] was performed by heating to a predetermined temperature (for example, 1000 ° C.) for 1 hour in an atmosphere of an inert gas.

(Iii) Hot rolling process [Step 3]
The hot rolling step was performed immediately after the homogenization heat treatment, and was cooled immediately after the plate thickness was adjusted to a predetermined value (for example, 10 mm).

(Iv) Surface cutting step [Step 4]
In the face-cutting step, the surface of the hot-rolled plate was face-cut to a predetermined thickness (for example, about 1 mm to 2 mm) to remove the oxide layer.

(V) Cold rolling process [Step 5]
In the cold rolling step, cold rolling was performed from 1 to 0.25 mm.

(Vi) Solution heat treatment step [Step 6]
In the solution heat treatment step, the temperature is raised at a predetermined heating rate (for example, 900 ° C. to 990 ° C. over 5 seconds to 10 seconds), held for 1 second to 1 hour, and then 250 ° C./s to 500 ° C./s. Cooled at speed.

(Vii) Intermediate heat treatment step [Step 7]
In the intermediate heat treatment step, heat treatment was performed at a predetermined temperature (for example, 300 ° C. to 600 ° C.) for 10 seconds to 10 hours.

(Viii) Finishing cold rolling process [Step 8]
Finish cold rolling step, the processing of the plate thickness of the object, the improvement of material strength, comprising the steps of performing the main purpose of controlling the crystal orientation, the maximum temperature T _R of 75 ° C. or higher 100 ° C. rolling time of the material It is necessary to control the following. By maximum temperature T _R of the rolling when the material is above 75 ° C., crystal rotation is promoted by rolling, the area ratio of the negative impact Cube orientation grains drawability is likely to decrease. However, the maximum temperature T _R of the rolling time of the material becomes higher temperature than is 100 ° C., the rolling viscous processed into lubricating oil used is that decreased, it burns like rolling defects by a surface roughness of the plate material locally in The higher the value, the more likely it is that the drawability will deteriorate, such as becoming the starting point of breakage. Therefore, the maximum temperature _{T R} of the rolling time of the material shall be 75 ° C. or higher 100 ° C. or less.

(Ix) Correction step [Step 9]
The straightening step is a step performed for the purpose of removing and homogenizing the residual stress of the material, and the elongation rate δ of the material at the time of straightening by the tension leveler is in the range of 0.1 to 1.0%. is required. If the elongation rate δ is less than 0.1%, the effect of removing and homogenizing the residual stress is small, and the shape uniformity after drawing is lowered. Further, if the elongation rate δ is larger than 1.0%, the machining strain due to repeated bending of the tension leveler becomes large, and the corner radius of the punch tip that does not crack during drawing cannot be reduced, resulting in severe drawing. The drawability under processing conditions is reduced. Therefore, the elongation rate δ of the material in the straightening step is in the range of 0.1 to 1.0%.

(X) Tempering and annealing step [Step 10]
Temper annealing step, to restore the elongation of the material, a process for reducing the anisotropy of mechanical properties further include elongation, the material temperature T _{A (°} C. temper annealing [step 10] ) Is required to be controlled so as to satisfy the relationship of the inequality shown in Eq. (5) in relation to the elongation rate δ (%) of the material in the straightening step.

_{55 × δ + 450 ≧ T A} ≧ 55 × δ + 350 ··· (5)

By controlling in accordance with the material temperature T _A (5) formula in the temper annealing step, drawing is improved. By recovering the dislocations introduced in the series of steps up to the straightening step by the tempering annealing step, the arithmetic mean value Aave., Which is a parameter of the material, and the Elixin value Er become large. Material temperature T _A in the temper annealing step, (5) falls below the lower limit of the formula, the recovery of dislocations due to rolling (i.e. removal of working strain) is not sufficient. The material temperature T _A in the temper annealing step, when the upper limit of the equation (5), increases the amount of precipitation of the compound of Ni or Co and Si, along with this, the material strength decreases. Therefore, the temper annealing [step 10] the material temperature T _{A (°} C.), in relation to the elongation of the material in the straightening step [delta] (%), to satisfy the relation of inequality shown in (5) ..

(VII) Application of Copper Alloy Plate Material The copper alloy material of the present invention is particularly suitable for use in drawing and producing a drawn product, for example, a member for electric / electronic parts, an electromagnetic wave shielding material, and an electromagnetic wave shielding material. It can be used for heat dissipation parts. For example, connectors for electrical and electronic components, lead frames, relays, switches, sockets, shield cases, shield cans, liquid crystal reinforcing plates, liquid crystal chassis, reinforcing plates for organic EL displays, connectors for automobiles, shield cases, etc. Shield cans and the like can be manufactured.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, but includes all aspects included in the concept of the present invention and the scope of claims, and varies within the scope of the present invention. Can be modified to.

Next, in order to further clarify the effect of the present invention, examples of the present invention and comparative examples will be described, but the present invention is not limited to these examples.

(Examples 1 to 15 and Comparative Examples 1 to 11)
A copper alloy material having the composition shown in Table 1 was melted in an air by a high-frequency melting furnace, and this was cast to obtain an ingot having a thickness of 30 mm, a width of 100 mm, and a length of 150 mm. Next, immediately after the homogenization heat treatment of heating and holding at 1000 ° C. for 1 hour in an inert gas atmosphere, hot rolling was performed to obtain a hot-rolled plate having a plate thickness of 10 mm, and immediately after cooling. Next, face milling and cold rolling were sequentially performed to adjust the plate thickness to 0.25 to 1.0 mm. Then, the solution heat treatment was performed at 800 to 990 ° C. for 1 minute, immediately cooled, and the intermediate heat treatment was performed at 300 ° C. to 600 ° C. for 1 hour. Then, after applying 60% finish cold rolling 0.1% at maximum temperature T _R of the materials shown in Table 3, were corrected with elongation δ shown in Table 3, then, the material temperature T _A shown in Table 3 A copper alloy plate having a plate thickness of 0.25 to 0.3 mm was obtained by tempering and annealing. In Comparative Example 11, since the maximum temperature T _R of the material during finish cold rolling was high, since the failure of the sheet surface caused by seizure can not calculate various parameters, could not even performance evaluation.

[Various measurement and evaluation methods]
The characteristics shown below were evaluated using the copper alloy plate materials according to the above Examples and Comparative Examples. The evaluation conditions for each characteristic are as follows.

[1] Method for measuring the composition of the copper alloy plate The alloy composition was measured by fluorescent X-ray analysis.

[2] Method for measuring conductivity The resistivity was calculated by measuring the specific resistance by the four-terminal method in a constant temperature bath kept at 20 ° C (± 0.5 ° C), for example, when the distance between terminals was 100 mm. ..

[3] Method of calculating the integrated value in the formula (1) The integrated value in the formula (1) is No. 13B of three types of JIS Z2241 cut out in each of the rolling parallel direction, the 45 ° direction and the 90 ° direction, respectively. 9 pieces (n = 9) of each of the test pieces (n = 9) were prepared according to JIS Z2241 and measured. It is determined using the nominal stress-nominal strain curve when measured using, and the integral value shown in Eq. (1) is obtained by trapezoidal approximation from the plot of the nominal stress-nominal strain curve obtained above. Calculated from the area. The nominal stress was measured every 0.01% of the nominal strain.

[4] Method for calculating Cube Orientation Area Ratio The Cube Orientation Area Ratio is continuously measured using the EBSD detector attached to a high-resolution scanning analysis electron microscope (manufactured by JEOL Ltd., trade name: JSM-7001FA). It was calculated from the obtained crystal orientation data using analysis software (manufactured by TSL, trade name: OIM-Anysis).

[5] Calculation method of parameter Bx Parameter Bx is each of parameter Ax obtained by substituting the integral value calculated in the above [3] and the Cube directional area ratio calculated in the above [4] into the equation (1). The directional values A _{0 °} , A _{45 °} and A _{90 °} and the arithmetic mean value Aave. Obtained by substituting these values A _{0 °} , A _{45 °} and A _{90 °} into equation (2) are expressed in the equation. It can be calculated by substituting into (3).

[6] Method for measuring Elixin value Er The Elixin value Er is determined by tightening the edge of the test plate material W between the die 12 and the wrinkle pressing member 16 by an Elixin testing machine as shown in FIG. The central portion of W was pushed in by the punch 14A, and the value of the movement distance (depth of the dent) of the punch until the through crack occurred was measured and used as the measured value.

[7] Evaluation of heat dissipation The heat dissipation was evaluated by the conductivity measured in [2] above. The evaluation criteria for heat dissipation are shown below. In this example, "1" and "2" in the heat dissipation evaluation criteria shown below were regarded as acceptable levels. Table 2 shows the evaluation results of heat dissipation.

<Evaluation criteria for heat dissipation>
1 (excellent): When the conductivity is 50% IACS or more 2 (Good): When the conductivity is 30% IACS or more and less than 50% IACS 3 (impossible): When the conductivity is less than 30% IACS

[8] Evaluation of drawing workability The drawing workability is determined by using a deep drawing tester (for example, a thin plate forming tester manufactured by Ericssen) 10 to press the edge of the test plate material W with a die 12 as shown in FIG. After tightening between the members 16, the central portion of the test plate material W is pushed in by a punch 14 having a columnar tip and a small radius of curvature R at the corner to form a cylindrical cup, and cracks do not occur. Comprehensive evaluation was made from the minimum value of the radius of curvature R at the corner of the tip of the punch and the maximum value of the difference between the maximum peak height and the maximum valley depth of the swell of the cup edge after molding. The evaluation criteria for drawability are shown below. Table 2 shows the evaluation results of drawability. In the above test, the clearance between the punch and the die was set to 2.3 mm, R-303P was used as the lubricating oil applied to the surface of the test plate material W, and the ratio of the punch diameter to the blank diameter (punch diameter / blank diameter). ) Was carried out under the test conditions of 0.64.

(A) Evaluation criteria for the minimum value of the radius of curvature R at the corner of the tip of the punch ◎ (excellent): When the minimum value of the radius of curvature R is 0.5 mm or less ○ (Good): The minimum value of the radius of curvature R is 0 When more than .5 mm and less than 1.0 mm × (impossible): When the minimum value of radius of curvature R is 1.0 mm or more

(B) Evaluation criteria for the maximum value of the difference between the maximum peak height and the maximum valley depth of the swell of the cup edge ◎ (excellent): When the maximum value of the difference is 0.5 mm or less ○ (good): The maximum value of the difference Is more than 0.5 mm and less than 1.0 mm × (impossible): When the maximum value of the difference is 1.0 mm or more

<Evaluation of drawability>
1 (excellent): When both of the evaluations of (a) and (b) are "◎" 2 (good): Both of the evaluations of (a) and (b) are "○" or more. Case 3 (impossible): When at least one of the evaluations of (a) and (b) above is "x".

From the results of Tables 1 to 4, all of the copper alloy plates of Examples 1 to 15 have an alloy composition within the appropriate range of the present invention, a conductivity of 38% IACS or more, and an arithmetic mean value of Aave. Since it is in the range of 0 to 13.0 GPa ·%, it can be seen that both the heat dissipation property and the drawing workability are above the acceptable level. In particular, Examples 3, 6, 8 and 12 have particularly excellent conductivity because the alloy composition and production conditions are appropriate. In Examples 1, 7 and 12, since the conditions from casting to temper annealing were appropriate and the parameters A and B showed good values, the minimum value of the radius of curvature of the corner portion of the punch tip where cracks did not occur. Since the maximum value of the difference between the peaks and valleys of the swell of the cup edge became smaller, the drawability was particularly excellent.

On the other hand, in Comparative Examples 1, 2, 4, 5, and 8, since the amount of Ni + Co or Si was small, the arithmetic mean value Aave. Was out of the appropriate range of the present invention, and thus the drawability was inferior. In Comparative Example 6, the tension leveler was not corrected and the elongation rate was 0%, so that the anisotropy was high, and therefore Bx was out of specification. In Comparative Examples 8 and 10, the arithmetic mean value Aave. Was out of the regulation because the rolling temperature in the finish cold rolling was low and a large amount of Cube orientation remained. In Comparative Example 5, the parameter B _{90 °} was out of specification, and the maximum height difference after drawing was large. In all of Comparative Examples 3, 7 and 9, since the component content was larger than the appropriate range of the present invention, the conductivity was particularly low. In particular, in Comparative Example 7, the elongation in straightening was larger than the specified value, and the Eriksen value / plate thickness value was out of the specified value, so that the drawability was also inferior. In Comparative Example 11, the material temperature during finish rolling became high, seizure occurred between the material and the rolling roll, and defects such as large irregularities occurred on the surface of the material. Therefore, the characteristics were not evaluated, but the drawability was significantly reduced. Was clear.

10 Eriksen tester 12 die 14, 14A punch (punch)
16 Wrinkle holding member W Test plate material R Radius of curvature at the corner of the punch

Claims (7)

It has a composition in which one or more of Ni and Co are contained in a total amount of 1.0 to 5.0% by mass, and Si is contained in an amount of 0.1 to 1.5% by mass, and the balance is Cu and unavoidable impurities.
Conductivity is 38% IACS or higher,
A value obtained from the nominal stress-nominal strain curve obtained by performing a tensile test on three types of test pieces cut out in each of the rolling parallel direction, the direction of 45 ° with respect to the rolling direction, and the rolling vertical direction. And, by substituting the value of the Cube azimuth area ratio obtained by the electron backscatter diffraction (EBSD) method into the following equation (1), in each direction of the parameter Ax (x: 0 °, 45 °, 90 °). The arithmetic average value calculated by obtaining _{the values A 0 °} , A _{45 °} and A _{90 °} and substituting the obtained values A _{0 °} , A _{45 °} and A _{90 °} in each direction into the following equation (2). A copper alloy plate material having Aave. In the range of 4.0 to 13.0 GPa ·%.

However, _Sc : Cube azimuth area ratio (%), σ _n represents the nominal stress (GPa), ε _n represents the nominal strain (%), and EL represents the elongation at break (%).

Claimed that the composition further contains at least one component selected from the group consisting of Sn, Mg, Mn, Cr, Zr, Ti, Fe and Zn in an amount of 0.2 to 1.2% by mass or less in total. copper alloy sheet according to 1. A drawn product obtained by drawing the copper alloy plate material according to claim 1 or 2. A member for electrical / electronic parts manufactured by using the copper alloy plate material according to claim 1 or 2 or the drawn product according to claim 3. An electromagnetic wave shielding material produced by using the copper alloy plate material according to claim 1 or 2 or the drawn product according to claim 3. A heat-dissipating component manufactured by using the copper alloy plate material according to claim 1 or 2 or the drawn product according to claim 3. The method for producing a copper alloy plate according to claim 1 or 2.
Casting [process 1], homogenization treatment [process 2], hot rolling [process 3], face milling [process 4], cold rolling [process 5], solution heat treatment [process 6], Intermediate heat treatment [step 7], finish cold rolling [step 8], straightening [step 9], and temper tempering [step 10] are performed in sequence.
Wherein the maximum temperature T _R of the rolling time of the material in the finish cold rolling [step 8], and controls the 75 ° C. or higher 100 ° C. or less,
The elongation rate δ of the material in the straightening [step 9] is set to 0.1 to 1.0%, and
_A copper alloy plate material characterized in that the material temperature TA (° C.) of the temper annealing [step 10] is controlled so as to satisfy the relationship of the inequality shown in the following equation (5) in relation to the elongation rate δ. Manufacturing method.
_{55 × δ + 450 ≧ T A} ≧ 55 × δ + 350 ··· (5)

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