JP6916972B1 - 太陽電池およびその製造方法、太陽電池モジュール - Google Patents
太陽電池およびその製造方法、太陽電池モジュール Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000002161 passivation Methods 0.000 claims abstract description 303
- 238000000034 method Methods 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 67
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 51
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000010410 layer Substances 0.000 claims description 302
- 230000008569 process Effects 0.000 claims description 46
- -1 hydrogen ions Chemical class 0.000 claims description 30
- 238000006243 chemical reaction Methods 0.000 claims description 28
- 229910052739 hydrogen Inorganic materials 0.000 claims description 22
- 239000001257 hydrogen Substances 0.000 claims description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- 229910052757 nitrogen Inorganic materials 0.000 claims description 15
- 150000002500 ions Chemical class 0.000 claims description 14
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 11
- 238000000137 annealing Methods 0.000 claims description 11
- 150000004767 nitrides Chemical class 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 abstract description 14
- 229910020286 SiOxNy Inorganic materials 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 29
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 230000007547 defect Effects 0.000 description 14
- 239000010408 film Substances 0.000 description 14
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 13
- 238000009792 diffusion process Methods 0.000 description 11
- 238000005137 deposition process Methods 0.000 description 10
- 239000005388 borosilicate glass Substances 0.000 description 9
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 8
- 230000006798 recombination Effects 0.000 description 8
- 238000005215 recombination Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 6
- 229910052796 boron Inorganic materials 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 229910001415 sodium ion Inorganic materials 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 239000000969 carrier Substances 0.000 description 5
- 125000004433 nitrogen atom Chemical group N* 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 2
- 230000032900 absorption of visible light Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006388 chemical passivation reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- UIPVMGDJUWUZEI-UHFFFAOYSA-N copper;selanylideneindium Chemical compound [Cu].[In]=[Se] UIPVMGDJUWUZEI-UHFFFAOYSA-N 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000010952 in-situ formation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
- 238000009279 wet oxidation reaction Methods 0.000 description 1
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- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
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Abstract
Description
Claims (15)
- N型ベース及び前記N型ベースの前面に形成されるP型エミッタと、
前記N型ベースの前面において前記P型エミッタから離れる方向に順次設置されている、第1酸窒化ケイ素SiOxNy(x>y、x/yである第1比の値は、1.53〜2.58である)材料を含む第1パッシベーション層、第1窒化ケイ素SimNn(m>n、m/nである第2比の値は、3.12〜5.41である)材料を含む第2パッシベーション層、及び第2酸窒化ケイ素SiOiNj(i/jである第3比の値は、0.97〜7.58である)材料を含む第3パッシベーション層と、
前記N型ベースの裏面に位置するパッシベーションコンタクト構造であって、前記パッシベーションコンタクト構造は、少なくとも、前記N型ベースから離れる方向において順次設置された界面パッシベーション層とフィールドパッシベーション層とを含んでいるパッシベーションコンタクト構造と、
を備えることを特徴とする太陽電池。 - 前記N型ベースに垂直な方向において、前記第1パッシベーション層の厚さは、8nm〜20nmである、
ことを特徴とする請求項1に記載の太陽電池。 - 前記N型ベースに垂直な方向において、前記第2パッシベーション層の厚さは、40nm〜60nmである、
ことを特徴とする請求項1または2に記載の太陽電池。 - 前記N型ベースに垂直な方向において、前記第3パッシベーション層の厚さは、50nm以下である、
ことを特徴とする請求項1に記載の太陽電池。 - 前記N型ベースに垂直な方向において、前記第3パッシベーション層の厚さは、10nm〜20nmである、
ことを特徴とする請求項4に記載の太陽電池。 - 前記第2パッシベーション層の第2屈折率は、前記第1パッシベーション層の第1屈折率及び前記第3パッシベーション層の第3屈折率よりも大きい、
ことを特徴とする請求項1に記載の太陽電池。 - 前記第1屈折率は1.61〜1.71であり、前記第2屈折率は1.98〜2.2であり、前記第3屈折率は1.56〜1.87である、
ことを特徴とする請求項6に記載の太陽電池。 - 前記パッシベーションコンタクト構造における前記N型ベースから離反する表面を覆う第4パッシベーション層をさらに備え、
前記第4パッシベーション層の材料は、第2窒化ケイ素SiaNb(a/bである第4比の値は、3.82〜6.37である)材料を含む、
ことを特徴とする請求項1に記載の太陽電池。 - 前記第4パッシベーション層の屈折率は、2.04〜2.2であり、
前記N型ベースの裏面に垂直な方向において、前記第4パッシベーション層の厚さは、60nm〜100nmである、
ことを特徴とする請求項8に記載の太陽電池。 - 請求項1〜9のいずれか1項に記載の太陽電池を備えることを特徴とする太陽電池モジュール。
- 太陽電池の製造方法において、
N型ベース及び前記N型ベースの前面に形成されるP型エミッタを提供することと、
前記N型ベースの前面において前記P型エミッタから離れる方向に、第1酸窒化ケイ素SiOxNy(x>y、x/yである第1比の値は、1.53〜2.58である)材料を含む第1パッシベーション層、第1窒化ケイ素SimNn(m>n、m/nである第2比の値は、3.12〜5.41である)材料を含む第2パッシベーション層、及び第2酸窒化ケイ素SiOiNj(i/jである第3比の値は、0.97〜7.58である)材料を含む第3パッシベーション層が、順に設けられることと、
前記N型ベースの裏面にパッシベーションコンタクト構造を形成することであって、前記パッシベーションコンタクト構造は、少なくとも、前記N型ベースから離れる方向において順次設置された界面パッシベーション層とフィールドパッシベーション層とを含んでいることと、
を含むことを特徴とする太陽電池の製造方法。 - 前記第2パッシベーション層を形成する前に、前記第1パッシベーション層に水素イオンを注入するように、反応チャンバー内にアンモニアガスを導入してイオン化し、
そのうち、アンモニアガスの流量は6000sccm〜8000sccmであり、アンモニアガスの導入時間は5min〜10minであり、イオン化するためのRFパワーは4000W〜8000Wである、
ことを特徴とする請求項11に記載の太陽電池の製造方法。 - 前記水素イオンを注入した後に、前記第1パッシベーション層に対して光アニール処理を行い、
そのうち、光アニール処理のアニール温度は150℃〜400℃であり、光アニール処理の光強度は1〜6倍の太陽光強度であり、光アニール処理のアニール時間は1min〜6minである、
ことを特徴とする請求項12に記載の太陽電池の製造方法。 - 同一のプロセスステップにおいて、前記第1パッシベーション層に窒素イオン及び前記水素イオンを注入し、前記第1パッシベーション層における前記N型ベースから離れる表層の窒素イオン濃度が、前記N型ベースに近寄る表層の窒素イオン濃度よりも大きい、
ことを特徴とする請求項12に記載の太陽電池の製造方法。 - 前記第1パッシベーション層を形成するプロセス装置と、前記第2パッシベーション層を形成するプロセス装置とは、同じである、
ことを特徴とする請求項11に記載の太陽電池の製造方法。
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