JP6916877B2 - 貼り合わせウエハの計測 - Google Patents

貼り合わせウエハの計測 Download PDF

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Publication number
JP6916877B2
JP6916877B2 JP2019524901A JP2019524901A JP6916877B2 JP 6916877 B2 JP6916877 B2 JP 6916877B2 JP 2019524901 A JP2019524901 A JP 2019524901A JP 2019524901 A JP2019524901 A JP 2019524901A JP 6916877 B2 JP6916877 B2 JP 6916877B2
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Japan
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wafer
edge profile
line segment
vertical line
image
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Japanese (ja)
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JP2019537263A5 (https=
JP2019537263A (ja
Inventor
カウシック サー
カウシック サー
トマス クラー
トマス クラー
シーファン リー
シーファン リー
ハイコ アイゼンバッハ
ハイコ アイゼンバッハ
モリッツ ストーリング
モリッツ ストーリング
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KLA Corp
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KLA Corp
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Publication of JP2019537263A5 publication Critical patent/JP2019537263A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2433—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures for measuring outlines by shadow casting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20048—Transform domain processing
    • G06T2207/20061—Hough transform
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Manufacturing & Machinery (AREA)
JP2019524901A 2016-11-29 2017-11-27 貼り合わせウエハの計測 Active JP6916877B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662427373P 2016-11-29 2016-11-29
US62/427,373 2016-11-29
US15/627,834 2017-06-20
US15/627,834 US10540759B2 (en) 2016-11-29 2017-06-20 Bonded wafer metrology
PCT/US2017/063310 WO2018102260A1 (en) 2016-11-29 2017-11-27 Bonded wafer metrology

Publications (3)

Publication Number Publication Date
JP2019537263A JP2019537263A (ja) 2019-12-19
JP2019537263A5 JP2019537263A5 (https=) 2021-01-14
JP6916877B2 true JP6916877B2 (ja) 2021-08-11

Family

ID=62190293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019524901A Active JP6916877B2 (ja) 2016-11-29 2017-11-27 貼り合わせウエハの計測

Country Status (7)

Country Link
US (1) US10540759B2 (https=)
EP (1) EP3507826B1 (https=)
JP (1) JP6916877B2 (https=)
KR (1) KR102301552B1 (https=)
CN (1) CN109964307B (https=)
TW (1) TWI731197B (https=)
WO (1) WO2018102260A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4657010A1 (en) 2023-03-14 2025-12-03 Kobelco Research Institute, Inc. Device and method for measuring positional displacement amount of laminated substrate, and semiconductor manufacturing device

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CN110488751B (zh) * 2018-08-29 2022-08-19 中山大学 一种自动化工艺线的石墨料盘视觉定位系统
KR102840203B1 (ko) 2020-09-01 2025-08-01 삼성전자주식회사 기판 정렬 장치 및 이를 구비하는 기판 본딩 설비
JP7682654B2 (ja) * 2021-03-11 2025-05-26 株式会社岡本工作機械製作所 半導体装置の製造方法及び製造装置
IL304714B2 (en) * 2021-04-19 2025-03-01 Kla Corp Edge profile inspection for delamination defects
US12131454B2 (en) * 2021-09-15 2024-10-29 Onto Innovation, Inc. Substrate mapping using deep neural-networks
CN115661143B (zh) * 2022-12-14 2023-05-30 惠州威尔高电子有限公司 用于MiniLED晶圆缺陷的快速检测系统
CN116313971B (zh) * 2023-05-17 2023-10-20 拓荆键科(海宁)半导体设备有限公司 通过边缘检测来进行晶圆键合对准的方法
US20250086780A1 (en) * 2023-09-12 2025-03-13 Kla Corporation Concentricity offset measurement for hybrid bonding

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US6901171B1 (en) 1999-04-30 2005-05-31 Cognex Technology And Investment Corporation Methods and apparatuses for refining groupings of edge points that represent a contour in an image
JP2002050749A (ja) * 2000-07-31 2002-02-15 Canon Inc 複合部材の分離方法及び装置
JP4533563B2 (ja) * 2001-07-13 2010-09-01 株式会社東芝 パターン評価方法，位置合わせ方法、検査装置の検査方法，半導体製造工程の管理方法
JP3629244B2 (ja) 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
WO2004104566A1 (de) 2003-05-19 2004-12-02 Micro-Epsilon Messtechnik Gmbh & Co. Kg Verfahren und vorrichtung zur optischen qualitätsprüfung von objekten mit vor­zugsweise kreisförmig umlaufendem rand
US7340087B2 (en) 2003-07-14 2008-03-04 Rudolph Technologies, Inc. Edge inspection
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JP4585926B2 (ja) 2005-06-17 2010-11-24 株式会社日立ハイテクノロジーズ パターンレイヤーデータ生成装置、それを用いたパターンレイヤーデータ生成システム、半導体パターン表示装置、パターンレイヤーデータ生成方法、及びコンピュータプログラム
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4657010A1 (en) 2023-03-14 2025-12-03 Kobelco Research Institute, Inc. Device and method for measuring positional displacement amount of laminated substrate, and semiconductor manufacturing device

Also Published As

Publication number Publication date
EP3507826B1 (en) 2025-05-28
US20180150952A1 (en) 2018-05-31
JP2019537263A (ja) 2019-12-19
KR20190082947A (ko) 2019-07-10
EP3507826A1 (en) 2019-07-10
KR102301552B1 (ko) 2021-09-13
CN109964307A (zh) 2019-07-02
TW201828254A (zh) 2018-08-01
TWI731197B (zh) 2021-06-21
EP3507826A4 (en) 2020-04-15
US10540759B2 (en) 2020-01-21
CN109964307B (zh) 2023-03-10
WO2018102260A1 (en) 2018-06-07

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