CN109964307B - 接合晶片计量 - Google Patents

接合晶片计量 Download PDF

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Publication number
CN109964307B
CN109964307B CN201780070558.9A CN201780070558A CN109964307B CN 109964307 B CN109964307 B CN 109964307B CN 201780070558 A CN201780070558 A CN 201780070558A CN 109964307 B CN109964307 B CN 109964307B
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wafer
edge profile
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vertical line
line segment
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CN201780070558.9A
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Chinese (zh)
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CN109964307A (zh
Inventor
K·沙赫
T·克拉
李诗芳
H·艾森巴赫
M·施特林
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KLA Corp
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KLA Tencor Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2433—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures for measuring outlines by shadow casting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20048—Transform domain processing
    • G06T2207/20061—Hough transform
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Manufacturing & Machinery (AREA)
CN201780070558.9A 2016-11-29 2017-11-27 接合晶片计量 Active CN109964307B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662427373P 2016-11-29 2016-11-29
US62/427,373 2016-11-29
US15/627,834 2017-06-20
US15/627,834 US10540759B2 (en) 2016-11-29 2017-06-20 Bonded wafer metrology
PCT/US2017/063310 WO2018102260A1 (en) 2016-11-29 2017-11-27 Bonded wafer metrology

Publications (2)

Publication Number Publication Date
CN109964307A CN109964307A (zh) 2019-07-02
CN109964307B true CN109964307B (zh) 2023-03-10

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CN201780070558.9A Active CN109964307B (zh) 2016-11-29 2017-11-27 接合晶片计量

Country Status (7)

Country Link
US (1) US10540759B2 (https=)
EP (1) EP3507826B1 (https=)
JP (1) JP6916877B2 (https=)
KR (1) KR102301552B1 (https=)
CN (1) CN109964307B (https=)
TW (1) TWI731197B (https=)
WO (1) WO2018102260A1 (https=)

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CN110488751B (zh) * 2018-08-29 2022-08-19 中山大学 一种自动化工艺线的石墨料盘视觉定位系统
KR102840203B1 (ko) 2020-09-01 2025-08-01 삼성전자주식회사 기판 정렬 장치 및 이를 구비하는 기판 본딩 설비
JP7682654B2 (ja) * 2021-03-11 2025-05-26 株式会社岡本工作機械製作所 半導体装置の製造方法及び製造装置
IL304714B2 (en) * 2021-04-19 2025-03-01 Kla Corp Edge profile inspection for delamination defects
US12131454B2 (en) * 2021-09-15 2024-10-29 Onto Innovation, Inc. Substrate mapping using deep neural-networks
CN115661143B (zh) * 2022-12-14 2023-05-30 惠州威尔高电子有限公司 用于MiniLED晶圆缺陷的快速检测系统
JP2024130368A (ja) * 2023-03-14 2024-09-30 株式会社コベルコ科研 貼合せ基板の位置ずれ量測定装置および該方法ならびに半導体製造装置
CN116313971B (zh) * 2023-05-17 2023-10-20 拓荆键科(海宁)半导体设备有限公司 通过边缘检测来进行晶圆键合对准的方法
US20250086780A1 (en) * 2023-09-12 2025-03-13 Kla Corporation Concentricity offset measurement for hybrid bonding

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JP2003031469A (ja) * 2001-07-13 2003-01-31 Toshiba Corp パターン評価方法，位置合わせ方法、検査装置の検査方法，半導体製造工程の管理方法
US6901171B1 (en) * 1999-04-30 2005-05-31 Cognex Technology And Investment Corporation Methods and apparatuses for refining groupings of edge points that represent a contour in an image
JP2010238970A (ja) * 2009-03-31 2010-10-21 Yamatake Corp 円盤状部材の中心位置推定方法及び画像処理装置
CN103403620A (zh) * 2010-10-13 2013-11-20 尤利塔股份公司 用于印制周期图案的方法和设备
TWI447842B (zh) * 2010-12-13 2014-08-01 Ｅｖ集團Ｅ塔那有限公司 判定對準誤差的裝置、器件和方法

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JP2002050749A (ja) * 2000-07-31 2002-02-15 Canon Inc 複合部材の分離方法及び装置
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WO2004104566A1 (de) 2003-05-19 2004-12-02 Micro-Epsilon Messtechnik Gmbh & Co. Kg Verfahren und vorrichtung zur optischen qualitätsprüfung von objekten mit vor­zugsweise kreisförmig umlaufendem rand
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JP4500157B2 (ja) 2004-11-24 2010-07-14 株式会社神戸製鋼所 形状計測装置用光学系
JP4585926B2 (ja) 2005-06-17 2010-11-24 株式会社日立ハイテクノロジーズ パターンレイヤーデータ生成装置、それを用いたパターンレイヤーデータ生成システム、半導体パターン表示装置、パターンレイヤーデータ生成方法、及びコンピュータプログラム
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US6901171B1 (en) * 1999-04-30 2005-05-31 Cognex Technology And Investment Corporation Methods and apparatuses for refining groupings of edge points that represent a contour in an image
JP2003031469A (ja) * 2001-07-13 2003-01-31 Toshiba Corp パターン評価方法，位置合わせ方法、検査装置の検査方法，半導体製造工程の管理方法
JP2010238970A (ja) * 2009-03-31 2010-10-21 Yamatake Corp 円盤状部材の中心位置推定方法及び画像処理装置
CN103403620A (zh) * 2010-10-13 2013-11-20 尤利塔股份公司 用于印制周期图案的方法和设备
TWI447842B (zh) * 2010-12-13 2014-08-01 Ｅｖ集團Ｅ塔那有限公司 判定對準誤差的裝置、器件和方法

Also Published As

Publication number Publication date
EP3507826B1 (en) 2025-05-28
US20180150952A1 (en) 2018-05-31
JP2019537263A (ja) 2019-12-19
KR20190082947A (ko) 2019-07-10
EP3507826A1 (en) 2019-07-10
KR102301552B1 (ko) 2021-09-13
JP6916877B2 (ja) 2021-08-11
CN109964307A (zh) 2019-07-02
TW201828254A (zh) 2018-08-01
TWI731197B (zh) 2021-06-21
EP3507826A4 (en) 2020-04-15
US10540759B2 (en) 2020-01-21
WO2018102260A1 (en) 2018-06-07

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