JP6914249B2 - 自発的計測法及びパターン分類 - Google Patents

自発的計測法及びパターン分類 Download PDF

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Publication number
JP6914249B2
JP6914249B2 JP2018510925A JP2018510925A JP6914249B2 JP 6914249 B2 JP6914249 B2 JP 6914249B2 JP 2018510925 A JP2018510925 A JP 2018510925A JP 2018510925 A JP2018510925 A JP 2018510925A JP 6914249 B2 JP6914249 B2 JP 6914249B2
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Japan
Prior art keywords
sample
design
defect
area
measurement
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Japanese (ja)
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JP2018530911A (ja
Inventor
アレン パーク
アレン パーク
アジャイ グプタ
アジャイ グプタ
ジャン ラウバー
ジャン ラウバー
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KLA Corp
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KLA Corp
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Priority claimed from US15/247,774 external-priority patent/US10483081B2/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Data Mining & Analysis (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Artificial Intelligence (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2018510925A 2015-08-28 2016-08-27 自発的計測法及びパターン分類 Active JP6914249B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562211375P 2015-08-28 2015-08-28
US62/211,375 2015-08-28
US15/247,774 2016-08-25
US15/247,774 US10483081B2 (en) 2014-10-22 2016-08-25 Self directed metrology and pattern classification
PCT/US2016/049157 WO2017040351A1 (en) 2015-08-28 2016-08-27 Self directed metrology and pattern classification

Publications (2)

Publication Number Publication Date
JP2018530911A JP2018530911A (ja) 2018-10-18
JP6914249B2 true JP6914249B2 (ja) 2021-08-04

Family

ID=58188172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018510925A Active JP6914249B2 (ja) 2015-08-28 2016-08-27 自発的計測法及びパターン分類

Country Status (6)

Country Link
JP (1) JP6914249B2 (ko)
KR (1) KR102340756B1 (ko)
CN (1) CN107924850B (ko)
IL (1) IL257205B (ko)
TW (1) TWI684225B (ko)
WO (1) WO2017040351A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10997710B2 (en) * 2017-10-18 2021-05-04 Kla-Tencor Corporation Adaptive care areas for die-die inspection
US11094053B2 (en) * 2018-10-08 2021-08-17 Kla Corporation Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates
CN116503397B (zh) * 2023-06-26 2023-09-01 山东天通汽车科技股份有限公司 基于图像数据的车内传输带缺陷检测方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6891167B2 (en) * 2000-06-15 2005-05-10 Kla-Tencor Technologies Apparatus and method for applying feedback control to a magnetic lens
JP4154282B2 (ja) * 2003-05-14 2008-09-24 株式会社日立ハイテクノロジーズ 回路パターンの検査装置
US8089058B2 (en) * 2005-09-01 2012-01-03 Camtek Ltd. Method for establishing a wafer testing recipe
KR101613048B1 (ko) * 2005-11-18 2016-04-15 케이엘에이-텐코 코포레이션 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8045786B2 (en) * 2006-10-24 2011-10-25 Kla-Tencor Technologies Corp. Waferless recipe optimization
JP2008235575A (ja) * 2007-03-20 2008-10-02 Toshiba Corp パターン測定方法、パターン測定装置およびプログラム
JP5118872B2 (ja) * 2007-03-30 2013-01-16 株式会社日立ハイテクノロジーズ 半導体デバイスの欠陥観察方法及びその装置
JP5408852B2 (ja) * 2007-08-09 2014-02-05 株式会社日立ハイテクノロジーズ パターン測定装置
JP5412169B2 (ja) * 2008-04-23 2014-02-12 株式会社日立ハイテクノロジーズ 欠陥観察方法及び欠陥観察装置
WO2009152046A1 (en) * 2008-06-11 2009-12-17 Kla-Tencor Corporation Systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof
JP5479782B2 (ja) * 2009-06-02 2014-04-23 株式会社日立ハイテクノロジーズ 欠陥画像処理装置、欠陥画像処理方法、半導体欠陥分類装置および半導体欠陥分類方法
JP2012068051A (ja) * 2010-09-21 2012-04-05 Toshiba Corp パターン欠陥検査装置およびパターン欠陥検査方法
US8656323B2 (en) * 2011-02-22 2014-02-18 Kla-Tencor Corporation Based device risk assessment
JP5948138B2 (ja) * 2012-05-11 2016-07-06 株式会社日立ハイテクノロジーズ 欠陥解析支援装置、欠陥解析支援装置で実行されるプログラム、および欠陥解析システム
US9189844B2 (en) * 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
CN102937599B (zh) * 2012-10-25 2015-01-07 中国科学院自动化研究所 一种通过x射线检测含金属被测物的无损检测系统和方法
WO2014149197A1 (en) * 2013-02-01 2014-09-25 Kla-Tencor Corporation Detecting defects on a wafer using defect-specific and multi-channel information
US9619876B2 (en) * 2013-03-12 2017-04-11 Kla-Tencor Corp. Detecting defects on wafers based on 2D scatter plots of values determined for output generated using different optics modes
US9183624B2 (en) * 2013-06-19 2015-11-10 Kla-Tencor Corp. Detecting defects on a wafer with run time use of design data
US10079183B2 (en) * 2013-06-26 2018-09-18 Kla-Tenor Corporation Calculated electrical performance metrics for process monitoring and yield management
JP6792901B2 (ja) * 2016-03-31 2020-12-02 Hoya株式会社 反射型マスクブランクの製造方法、反射型マスクブランク、反射型マスクの製造方法、反射型マスク、及び半導体装置の製造方法

Also Published As

Publication number Publication date
TW201727789A (zh) 2017-08-01
IL257205B (en) 2021-01-31
JP2018530911A (ja) 2018-10-18
KR102340756B1 (ko) 2021-12-16
CN107924850B (zh) 2022-06-28
WO2017040351A1 (en) 2017-03-09
TWI684225B (zh) 2020-02-01
IL257205A (en) 2018-03-29
KR20180037055A (ko) 2018-04-10
CN107924850A (zh) 2018-04-17

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