IL257205B - Self directed metrology and pattern classification - Google Patents

Self directed metrology and pattern classification

Info

Publication number
IL257205B
IL257205B IL257205A IL25720518A IL257205B IL 257205 B IL257205 B IL 257205B IL 257205 A IL257205 A IL 257205A IL 25720518 A IL25720518 A IL 25720518A IL 257205 B IL257205 B IL 257205B
Authority
IL
Israel
Prior art keywords
metrology
pattern classification
self directed
self
directed
Prior art date
Application number
IL257205A
Other languages
Hebrew (he)
Other versions
IL257205A (en
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/247,774 external-priority patent/US10483081B2/en
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of IL257205A publication Critical patent/IL257205A/en
Publication of IL257205B publication Critical patent/IL257205B/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Data Mining & Analysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
IL257205A 2015-08-28 2018-01-29 Self directed metrology and pattern classification IL257205B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562211375P 2015-08-28 2015-08-28
US15/247,774 US10483081B2 (en) 2014-10-22 2016-08-25 Self directed metrology and pattern classification
PCT/US2016/049157 WO2017040351A1 (en) 2015-08-28 2016-08-27 Self directed metrology and pattern classification

Publications (2)

Publication Number Publication Date
IL257205A IL257205A (en) 2018-03-29
IL257205B true IL257205B (en) 2021-01-31

Family

ID=58188172

Family Applications (1)

Application Number Title Priority Date Filing Date
IL257205A IL257205B (en) 2015-08-28 2018-01-29 Self directed metrology and pattern classification

Country Status (6)

Country Link
JP (1) JP6914249B2 (en)
KR (1) KR102340756B1 (en)
CN (1) CN107924850B (en)
IL (1) IL257205B (en)
TW (1) TWI684225B (en)
WO (1) WO2017040351A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10997710B2 (en) * 2017-10-18 2021-05-04 Kla-Tencor Corporation Adaptive care areas for die-die inspection
US11094053B2 (en) * 2018-10-08 2021-08-17 Kla Corporation Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates
CN116503397B (en) * 2023-06-26 2023-09-01 山东天通汽车科技股份有限公司 In-vehicle transmission belt defect detection method based on image data

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001096843A1 (en) * 2000-06-15 2001-12-20 Kla-Tencor, Inc. Apparatus and method for applying feedback control to a magnetic lens
JP4154282B2 (en) * 2003-05-14 2008-09-24 株式会社日立ハイテクノロジーズ Circuit pattern inspection device
EP1928583A4 (en) * 2005-09-01 2010-02-03 Camtek Ltd A method and a system for establishing an inspection recipe
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
KR101885585B1 (en) * 2005-11-18 2018-08-07 케이엘에이-텐코 코포레이션 Methods and systems for utilizing design data in combination with inspection data
US8045786B2 (en) * 2006-10-24 2011-10-25 Kla-Tencor Technologies Corp. Waferless recipe optimization
JP2008235575A (en) * 2007-03-20 2008-10-02 Toshiba Corp Pattern measuring method, pattern measuring device, and program
JP5118872B2 (en) * 2007-03-30 2013-01-16 株式会社日立ハイテクノロジーズ Defect observation method and apparatus for semiconductor device
JP5408852B2 (en) * 2007-08-09 2014-02-05 株式会社日立ハイテクノロジーズ Pattern measuring device
JP5412169B2 (en) * 2008-04-23 2014-02-12 株式会社日立ハイテクノロジーズ Defect observation method and defect observation apparatus
WO2009152046A1 (en) * 2008-06-11 2009-12-17 Kla-Tencor Corporation Systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof
JP5479782B2 (en) * 2009-06-02 2014-04-23 株式会社日立ハイテクノロジーズ Defect image processing apparatus, defect image processing method, semiconductor defect classification apparatus, and semiconductor defect classification method
JP2012068051A (en) * 2010-09-21 2012-04-05 Toshiba Corp Pattern defect inspection device and pattern defect inspection method
US8656323B2 (en) 2011-02-22 2014-02-18 Kla-Tencor Corporation Based device risk assessment
JP5948138B2 (en) * 2012-05-11 2016-07-06 株式会社日立ハイテクノロジーズ Defect analysis support device, program executed by defect analysis support device, and defect analysis system
US9189844B2 (en) * 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
CN102937599B (en) * 2012-10-25 2015-01-07 中国科学院自动化研究所 Non-destructive testing systems and method used for detecting a metal-containing object through X-ray detection
KR102019534B1 (en) * 2013-02-01 2019-09-09 케이엘에이 코포레이션 Detecting defects on a wafer using defect-specific and multi-channel information
US9619876B2 (en) * 2013-03-12 2017-04-11 Kla-Tencor Corp. Detecting defects on wafers based on 2D scatter plots of values determined for output generated using different optics modes
US9183624B2 (en) * 2013-06-19 2015-11-10 Kla-Tencor Corp. Detecting defects on a wafer with run time use of design data
US10079183B2 (en) * 2013-06-26 2018-09-18 Kla-Tenor Corporation Calculated electrical performance metrics for process monitoring and yield management
JP6792901B2 (en) 2016-03-31 2020-12-02 Hoya株式会社 Manufacturing method of reflective mask blank, reflective mask blank, manufacturing method of reflective mask, reflective mask, and manufacturing method of semiconductor device

Also Published As

Publication number Publication date
TWI684225B (en) 2020-02-01
KR102340756B1 (en) 2021-12-16
WO2017040351A1 (en) 2017-03-09
JP2018530911A (en) 2018-10-18
KR20180037055A (en) 2018-04-10
IL257205A (en) 2018-03-29
CN107924850B (en) 2022-06-28
CN107924850A (en) 2018-04-17
JP6914249B2 (en) 2021-08-04
TW201727789A (en) 2017-08-01

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