IL257205B - Self-directed metrology and example classification - Google Patents
Self-directed metrology and example classificationInfo
- Publication number
- IL257205B IL257205B IL257205A IL25720518A IL257205B IL 257205 B IL257205 B IL 257205B IL 257205 A IL257205 A IL 257205A IL 25720518 A IL25720518 A IL 25720518A IL 257205 B IL257205 B IL 257205B
- Authority
- IL
- Israel
- Prior art keywords
- metrology
- pattern classification
- self directed
- self
- directed
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/24—Classification techniques
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical or photographic arrangements associated with the tube
- H01J37/222—Image processing arrangements associated with the tube
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Quality & Reliability (AREA)
- Data Mining & Analysis (AREA)
- Bioinformatics & Computational Biology (AREA)
- General Engineering & Computer Science (AREA)
- Evolutionary Computation (AREA)
- Evolutionary Biology (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Artificial Intelligence (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562211375P | 2015-08-28 | 2015-08-28 | |
US15/247,774 US10483081B2 (en) | 2014-10-22 | 2016-08-25 | Self directed metrology and pattern classification |
PCT/US2016/049157 WO2017040351A1 (en) | 2015-08-28 | 2016-08-27 | Self directed metrology and pattern classification |
Publications (2)
Publication Number | Publication Date |
---|---|
IL257205A IL257205A (en) | 2018-03-29 |
IL257205B true IL257205B (en) | 2021-01-31 |
Family
ID=58188172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL257205A IL257205B (en) | 2015-08-28 | 2018-01-29 | Self-directed metrology and example classification |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6914249B2 (ko) |
KR (1) | KR102340756B1 (ko) |
CN (1) | CN107924850B (ko) |
IL (1) | IL257205B (ko) |
TW (1) | TWI684225B (ko) |
WO (1) | WO2017040351A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10997710B2 (en) * | 2017-10-18 | 2021-05-04 | Kla-Tencor Corporation | Adaptive care areas for die-die inspection |
US11094053B2 (en) * | 2018-10-08 | 2021-08-17 | Kla Corporation | Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates |
CN116503397B (zh) * | 2023-06-26 | 2023-09-01 | 山东天通汽车科技股份有限公司 | 基于图像数据的车内传输带缺陷检测方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6891167B2 (en) * | 2000-06-15 | 2005-05-10 | Kla-Tencor Technologies | Apparatus and method for applying feedback control to a magnetic lens |
JP4154282B2 (ja) * | 2003-05-14 | 2008-09-24 | 株式会社日立ハイテクノロジーズ | 回路パターンの検査装置 |
US8089058B2 (en) * | 2005-09-01 | 2012-01-03 | Camtek Ltd. | Method for establishing a wafer testing recipe |
KR101613048B1 (ko) * | 2005-11-18 | 2016-04-15 | 케이엘에이-텐코 코포레이션 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
US7570796B2 (en) * | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
US8045786B2 (en) * | 2006-10-24 | 2011-10-25 | Kla-Tencor Technologies Corp. | Waferless recipe optimization |
JP2008235575A (ja) * | 2007-03-20 | 2008-10-02 | Toshiba Corp | パターン測定方法、パターン測定装置およびプログラム |
JP5118872B2 (ja) * | 2007-03-30 | 2013-01-16 | 株式会社日立ハイテクノロジーズ | 半導体デバイスの欠陥観察方法及びその装置 |
JP5408852B2 (ja) * | 2007-08-09 | 2014-02-05 | 株式会社日立ハイテクノロジーズ | パターン測定装置 |
JP5412169B2 (ja) * | 2008-04-23 | 2014-02-12 | 株式会社日立ハイテクノロジーズ | 欠陥観察方法及び欠陥観察装置 |
WO2009152046A1 (en) * | 2008-06-11 | 2009-12-17 | Kla-Tencor Corporation | Systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof |
JP5479782B2 (ja) * | 2009-06-02 | 2014-04-23 | 株式会社日立ハイテクノロジーズ | 欠陥画像処理装置、欠陥画像処理方法、半導体欠陥分類装置および半導体欠陥分類方法 |
JP2012068051A (ja) * | 2010-09-21 | 2012-04-05 | Toshiba Corp | パターン欠陥検査装置およびパターン欠陥検査方法 |
US8656323B2 (en) * | 2011-02-22 | 2014-02-18 | Kla-Tencor Corporation | Based device risk assessment |
JP5948138B2 (ja) * | 2012-05-11 | 2016-07-06 | 株式会社日立ハイテクノロジーズ | 欠陥解析支援装置、欠陥解析支援装置で実行されるプログラム、および欠陥解析システム |
US9189844B2 (en) * | 2012-10-15 | 2015-11-17 | Kla-Tencor Corp. | Detecting defects on a wafer using defect-specific information |
CN102937599B (zh) * | 2012-10-25 | 2015-01-07 | 中国科学院自动化研究所 | 一种通过x射线检测含金属被测物的无损检测系统和方法 |
WO2014149197A1 (en) * | 2013-02-01 | 2014-09-25 | Kla-Tencor Corporation | Detecting defects on a wafer using defect-specific and multi-channel information |
US9619876B2 (en) * | 2013-03-12 | 2017-04-11 | Kla-Tencor Corp. | Detecting defects on wafers based on 2D scatter plots of values determined for output generated using different optics modes |
US9183624B2 (en) * | 2013-06-19 | 2015-11-10 | Kla-Tencor Corp. | Detecting defects on a wafer with run time use of design data |
US10079183B2 (en) * | 2013-06-26 | 2018-09-18 | Kla-Tenor Corporation | Calculated electrical performance metrics for process monitoring and yield management |
JP6792901B2 (ja) * | 2016-03-31 | 2020-12-02 | Hoya株式会社 | 反射型マスクブランクの製造方法、反射型マスクブランク、反射型マスクの製造方法、反射型マスク、及び半導体装置の製造方法 |
-
2016
- 2016-08-26 TW TW105127595A patent/TWI684225B/zh active
- 2016-08-27 JP JP2018510925A patent/JP6914249B2/ja active Active
- 2016-08-27 KR KR1020187007769A patent/KR102340756B1/ko active IP Right Grant
- 2016-08-27 WO PCT/US2016/049157 patent/WO2017040351A1/en active Application Filing
- 2016-08-27 CN CN201680047524.3A patent/CN107924850B/zh active Active
-
2018
- 2018-01-29 IL IL257205A patent/IL257205B/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201727789A (zh) | 2017-08-01 |
JP2018530911A (ja) | 2018-10-18 |
KR102340756B1 (ko) | 2021-12-16 |
CN107924850B (zh) | 2022-06-28 |
WO2017040351A1 (en) | 2017-03-09 |
TWI684225B (zh) | 2020-02-01 |
IL257205A (en) | 2018-03-29 |
KR20180037055A (ko) | 2018-04-10 |
JP6914249B2 (ja) | 2021-08-04 |
CN107924850A (zh) | 2018-04-17 |
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Legal Events
Date | Code | Title | Description |
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FF | Patent granted | ||
KB | Patent renewed |