JP6913879B2 - Dicing device - Google Patents

Description

The present invention relates to a dicing apparatus, and more particularly to a dicing apparatus for cutting a work by a blade while relatively moving a work such as a semiconductor wafer and a rotating blade.

In the semiconductor manufacturing process, the surface of a semiconductor wafer is subjected to various treatments to manufacture a plurality of semiconductor elements having electronic devices. Each chip of the semiconductor element is inspected for electrical characteristics by an inspection device, and then divided into chips by a high-speed rotating blade of the dicing device.

The blade wears over time and is replaced with a new blade. Further, when the type of work is changed, it may be replaced with another type of blade corresponding to the work. When the blades are replaced in this way, the shapes of the blades before and after the replacement are different, so that the work of registering the blade information regarding the shape of the blades after the replacement in the dicing device is performed. The dicing apparatus controls the cutting depth of the blade with respect to the work based on the registered blade information after replacement, and continues the cutting process.

Patent Document 1 discloses a dicing device (processing device) that performs blade replacement work using an operation screen for blade replacement. In this dicing device, when the blade is replaced, information such as lot ID, new / old information, blade outer diameter, blade thickness, flange outer diameter, etc. is input as blade information according to the display on the displayed operation screen. It has become like.

Further, as the blade, a diamond abrasive grain or an electrodeposition blade in which CBN (Cubic Boron Nitride) abrasive grains are electrodeposited with nickel is known, and a metal resin bond blade or the like bonded with a resin mixed with metal powder or the like. It has been known. The size of the blade is variously selected depending on the processing content, but when dicing a normal semiconductor wafer, one having a diameter of φ50 to 60 mm and a thickness of about 30 μm is used.

JP-A-2009-194326

However, in the dicing device disclosed in Patent Document 1, the operator must input the blade information using the operation screen each time the blade is replaced, and the dicing device must be stopped during the input work. I don't get it.

In addition, when reusing a blade, the latest blade information (blade outer diameter, blade thickness, etc.) must be acquired using another detection device, and the latest acquired blade information must be input. Work is also required.

As described above, in the conventional dicing apparatus, there is a problem that the overall throughput is lowered because it takes time and effort to input the blade information when the blade is replaced or reused.

The present invention has been made in view of such circumstances, and it is possible to reduce the labor and time required for inputting blade information when replacing or reusing blades, and to prevent a decrease in overall throughput. It is an object of the present invention to provide a dicing apparatus.

In order to achieve the above object, one aspect of the dicing apparatus according to the present invention is a processing portion for cutting a work by a blade while relatively moving the work and the blade, and an RFID tag provided on the blade. The read / write means that can read and write information and the machined part are controlled based on the blade information read by the read / write means, and the blade information created or updated by the cutting process by the machined part is transmitted through the read / write means. It is provided with a control means for writing on the RFID tag.

In one aspect of the dicing apparatus according to the present invention, the blade information includes at least one of information on the outer diameter of the blade portion, the thickness of the blade portion, and the protrusion amount of the blade portion.

In one aspect of the dicing apparatus according to the present invention, a determination means for determining whether or not the blade can be used is provided based on the blade information read by the read / write means.

According to the present invention, it is possible to reduce the labor and time required for inputting blade information when replacing or reusing blades, and to prevent a decrease in overall throughput.

Overall perspective view showing the dicing apparatus of this embodiment Perspective view showing the structure of the processed portion of the dicing apparatus shown in FIG. (A) is a plan view of the blade, and (B) is a cross-sectional view of the blade. Block diagram showing the configuration of the dicing apparatus of this embodiment The figure which showed an example of the blade information stored in the RFID tag A flowchart showing an example of the operation of the dicing apparatus of the present embodiment. A flowchart showing another example of the operation of the dicing apparatus of the present embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, the dicing apparatus 10 of the present embodiment will be described. FIG. 1 is an overall perspective view showing the dicing apparatus 10 of the present embodiment.

As shown in FIG. 1, the dicing device 10 of the present embodiment is a dicing device called a twin spindle dicer in which a pair of blades 12, 12 are arranged so as to face each other. The dicing device 10 includes a pair of spindles 14 with a built-in high-frequency motor in which a blade 12 is mounted at the tip thereof, and a work table 16 on which a semiconductor wafer W as a work is placed and sucks and holds the semiconductor wafer W. The processing portion 18 to be provided is provided. The processing unit 18 cuts the semiconductor wafer W by the blade 12 while relatively moving the semiconductor wafer W and the blade 12.

Further, the dicing apparatus 10 has a cleaning unit 20 for spin-cleaning the processed semiconductor wafer W, a load port 22 on which a cassette containing a plurality of semiconductor wafers W is placed, and a transfer for transporting the semiconductor wafer W. The device 24 and each are arranged at predetermined positions. Further, the dicing device 10 has a built-in control unit (control means) 26 that comprehensively controls the operation of each member of the dicing device 10.

FIG. 2 is a perspective view showing the structure of the processed portion 18.

As shown in FIG. 2, the processing unit 18 includes an X table 34. The X table 34 is guided by the X guides 30 and 30 provided on the X base 28, and is driven by the linear motor 32 in the X direction indicated by the arrows XX. Further, a rotary table 36 that rotates in the θ direction is fixed on the upper surface of the X table 34, and the work table 16 is provided on the rotary table 36. Therefore, the work table 16 is moved in the X direction by the X table 34 and rotated in the θ direction by the rotary table 36.

Further, the processing portion 18 includes a Y base 38 configured in a gate shape so as to straddle the X base 28. A pair of Y tables 42, 42 are provided on the wall surface of the Y base 38. The pair of Y tables 42, 42 are guided by Y guides 40, 40 fixed to the wall surface of the Y base 38, and are driven in the Y direction indicated by arrows YY by a drive device including a stepping motor and a ball screw (not shown). Will be done.

The Y tables 42 and 42 are provided with Z tables 44 and 44, respectively. The Z tables 44 and 44 are guided by a Z guide (not shown) provided on the Y table 42, and are driven in the Z direction indicated by arrows ZZ by a driving device including a stepping motor (not shown) and a ball screw (not shown). The spindles 14 and 14 are fixed to the Z tables 44 and 44 in a state of facing each other, and the blades 12 and 12 mounted on the tips of the spindles 14 and 14 are arranged so as to face each other.

According to the configuration of the processing portion 18, the blades 12 and 12 are index-fed in the Y direction and cut-fed in the Z direction, and the work table 16 is cut-fed in the X direction and rotated in the θ direction. These operations are controlled by the control unit 26 (see FIG. 1). In particular, the cutting amount in the Z direction is controlled according to the protrusion amount of the blade portion of the blade 12, so that the cutting amount is newly added with the replacement of the blade 12. The amount of protrusion of the blade portion is always input to the control unit 26 of the dicing device 10. The amount of protrusion of the blade portion of the blade 12 will be described later.

The X direction described above refers to one direction in the horizontal direction, and the Y direction refers to a direction orthogonal to the X direction in the horizontal direction. Further, the Z direction refers to a vertical direction orthogonal to the X direction and the Y direction, respectively, and the θ direction refers to a rotation direction centered on the vertical axis.

FIG. 3A is a front view of the blade 12, and FIG. 3B is a cross-sectional view of the blade 12.

As shown in FIGS. 3A and 3B, the blade portion 48 has a blade portion 48 attached to the outer peripheral edge portion of one end surface of a hub (also referred to as a flange) 50 made of an aluminum alloy or the like. It is composed. The blade portion 48 is provided on the hub 50 by electroforming abrasive grains such as diamond. Further, a mounting hole 46 for mounting the blade 12 on the spindle 14 of the dicing device 10 is provided in the central portion of the hub 50.

The blade portion 48 is a portion to be cut with respect to the semiconductor wafer W. The thickness t (also referred to as the blade thickness) of the blade portion 48 is formed to be at least thinner than the thickness of the semiconductor wafer W. For example, when cutting a semiconductor wafer W having a thickness of 100 μm, the thickness t of the blade portion 48 is preferably 50 μm or less, more preferably 30 μm or less, still more preferably 10 μm or less. Further, the cross-sectional shape of the blade portion 48 may be a straight shape having a uniform thickness, or a tapered shape in which the thickness gradually decreases toward the outer periphery.

Here, the value obtained by dividing the value obtained by subtracting the outer diameter φ2 of the hub 50 from the outer diameter φ1 of the blade portion 48 by 2 ((φ1-φ2) / 2) is the protrusion amount a of the blade portion 48 described above. The protrusion amount a of the blade portion 48 is a value that decreases with the lapse of machining time, and is reset to the dicing device 10 every time the blade 12 is replaced with a new blade 12.

Since the protruding amount a of the blade portion 48 is a large element for controlling the cutting amount in the Z direction as described above, the detection device that detects the position of the cutting edge of the blade 12 even during machining with the same blade 12 , The protruding amount a of the blade portion is indirectly measured, and the measured protruding amount a is updated to the control unit 26 of the dicing device 10. Further, when the blade 12 is replaced, the protruding amount a of the blade portion 48 of the blade 12 after the replacement is reset to the control unit 26. In the case of a new blade 12, the protrusion amount a of the blade portion 48 is specified as a catalog value.

By the way, as shown in FIG. 3A, the blade 12 in the present embodiment is provided with an RFID (Radio Frequency Identifier) tag 52. The RFID tag 52 is a readable and writable storage medium and is provided on the surface of the blade 12.

The dicing device 10 of the present embodiment has the following configuration for reading and writing blade information to the RFID tag 52 provided on the blade 12.

FIG. 4 is a block diagram showing a configuration for reading and writing the RFID tag 52 provided on the blade 12 of the dicing device 10 of the present embodiment.

As shown in FIG. 4, the dicing device 10 of the present embodiment has a reader / writer (read / write means) 54 that reads / writes blade information to an RFID tag 52 provided on the blade 12, and blade information read by the reader / writer 54. The processing unit 18 is controlled based on the above, and the control unit 26 is provided to control the latest blade information to be written to the RFID tag 52 via the reader / writer 54.

The control unit 26 includes a RAM (Random Access Memory) 56 that stores blade information read by the reader / writer 54. The control unit 26 controls the processing unit 18 described above with reference to the blade information stored in the RAM 56.

Further, the RAM 56 stores blade information (latest blade information) created or updated in association with cutting by the processing unit 18, and as will be described later, the control unit 26 stores the latest blade information stored in the RAM 56. The blade information of the above is written on the RFID tag 52 by the reader / writer 54.

FIG. 5 is a diagram showing an example of blade information stored in the RFID tag 52.

As shown in FIG. 5, the blade information stored in the RFID tag 52 includes at least the outer diameter φ1, the thickness t, and the protrusion amount a of the blade portion 48 of the blade 12. In addition to these, the type of abrasive grains of the blade 12, the particle size (count) of the abrasive grains, the degree of concentration (content rate), the type of binder, and the like may also be included. The blade information may be a catalog value or detailed information actually measured after the blade 12 is manufactured.

Next, the operation of the dicing device 10 of the present embodiment will be described.

FIG. 6 is a flowchart showing an example of the operation of the dicing device 10 of the present embodiment.

As shown in FIG. 6, in the dicing device 10, the blade information stored in the RFID tag 52 is read by the reader / writer 54 before the blade 12 is mounted on the spindle 14 or after the blade 12 is mounted on the spindle 14. (Step S100). At this time, the blade information read by the reader / writer 54 is stored in the RAM 56 of the control unit 26.

Next, the control unit 26 controls the processing unit 18 based on the blade information read by the reader / writer 54 (specifically, the blade information stored in the RAM 56) (step S110).

The specific control of the processing unit 18 by the control unit 26 is the blade information read from the RFID tag 52 when the processing unit 18 is driven in the Y direction or the Z direction, that is, the blade portion outer diameter φ1 and the blade portion thickness. The movement amount in the Y direction or the Z direction is adjusted mainly with reference to t and the blade protrusion amount a. As a result, cutting processing specialized for the blade 12 becomes possible.

Next, the control unit 26 controls the reader / writer 54 at the end of processing or during processing by the processing unit 18 to write the latest blade information in the RFID tag 52 (step S120). The blade information written in the RFID tag 52 is read again by the reader / writer 54 when the blade 12 is reused, and the control unit 26 controls the processing unit 18 based on the read information.

In step S120, as the blade information to be written to the RFID tag 52, as described above, in addition to the information regarding the shape of the blade 12, the history information of the process of using the blade 12 (use time, identification for identifying the dicing device used). Symbols, error information of dicing equipment), etc. are included. Information regarding the shape of the blade 12 is written from the reader / writer 54 to the RFID tag 52 when the blade 12 is removed from the spindle 14 or when the processing by the processing unit 18 is completed. For example, when the dicing device 10 is provided with a detection device for detecting the position of the cutting edge of the blade 12, the outer diameter φ1 and the protrusion amount a of the blade portion 48 are calculated from the detection result of the detection device, and are the latest. It is written on the RFID tag 52 as blade information. As a result, the latest outer diameter φ1 and protrusion amount a are updated and written on the RFID tag 52 of the blade 12 at any time. Further, the RFID tag 52 of the blade 12 may be written while keeping the history of the outer diameter φ1 and the protrusion amount a for each processing completion. As a result, it is possible to grasp the number of times the blade 12 is replaced, the amount of wear of the blade 12 due to one use, and the like, and it is possible to utilize this information for maintenance of the blade 12.

In the dicing device 10 of the present embodiment, the latest blade information is stored in the RFID 52 of the blade 12, so that the latest blade information is stored based on the blade information read by the reader / writer 54 without using another detection device. It is possible to instantly determine whether or not the blade 12 can be used.

FIG. 7 is a flowchart showing another example of the operation of the dicing device 10 of the present embodiment, and shows a process of determining whether or not the blade 12 can be used based on the blade information read by the reader / writer 54. It is a thing. It is assumed that the dicing device 10 is preset with a minimum value (minimum protrusion amount) of the protrusion amount a of the blade portion 48 as a reference value (threshold value) for determining whether or not the blade 12 can be used. The minimum value of the protrusion amount a of the blade portion 48 may be set by the user via an input portion (not shown).

As shown in FIG. 7, first, the blade information stored in the RFID tag 52 is read by the reader / writer 54 before the blade 12 is mounted on the spindle 14 or after the blade 12 is mounted on the spindle 14 (step). S200). At this time, the blade information read by the reader / writer 54 is stored in the RAM 56 of the control unit 26.

Next, the control unit 26 functions as a determination means of the present invention, and compares the protrusion amount (current protrusion amount) a of the blade portion 48 included in the blade information read by the reader / writer 54 with the above-mentioned minimum protrusion amount. By comparison, it is determined whether or not the current protrusion amount a is larger than the minimum protrusion amount (S210).

In step S210, when the control unit 26 determines that the current protrusion amount a is larger than the minimum protrusion amount, the control unit 26 determines that the blade 12 can be used (step S220). In this case, the processing by the processing unit 18 is set to a feasible state. On the other hand, when it is determined that the current protrusion amount a is smaller than the minimum protrusion amount (or less than or equal to the minimum protrusion amount), it is determined that the blade 12 cannot be used (step S230). In this case, the processing by the processing unit 18 is set to a state in which processing cannot be performed, and a message indicating that the blade 12 needs to be replaced is displayed on the monitor (not shown).

As a result, the process shown in the flowchart is completed.

As described above, according to the dicing device 10 of the present embodiment, the RFID tag 52 is provided on the blade 12, and the blade information (outer diameter φ1, thickness t, protrusion amount a of the blade portion 48) stored in the RFID tag 52 is provided. Etc.) are automatically read, and processing is performed based on the read blade information. Further, since the latest blade information is written in the RFID tag 52 of the blade 12, it is not necessary to acquire the latest blade information again when the blade 12 is reused as a used blade. Therefore, it is possible to reduce the labor and time required for inputting the blade information when replacing or reusing the blade 12, and it is possible to prevent a decrease in throughput due to the replacement of the blade 12. As a result, the operating time of the dicing apparatus 10 can be increased, and the overall throughput can be improved.

Further, in the dicing device 10 of the present embodiment, since the latest blade information is stored in the RFID 52 of the blade 12, the blade information read by the reader / writer 54 can be used without using another detection device. Based on this, it is possible to instantly determine whether or not the blade 12 can be used. That is, since the dicing device 10 automatically determines whether or not the blade 12 can be used, the burden of the user's confirmation work can be reduced.

Further, in the dicing device 10 of the present embodiment, since the RFID tag 52 is provided on the blade 12 as a readable and writable storage medium, the blade information includes the outer diameter φ1, the thickness t, the protrusion amount a, etc. of the blade portion 48. In addition, history information of the usage process (usage time, identification code for identifying the dicing device used, defect information of the dicing device) can be written on the RFID tag 52.

Further, since the RFID tag 52 can read and write blade information in a non-contact manner by the reader / writer 54, the blade information can be read and written even in an environment where cutting water, cooling water, and cutting powder are scattered.

W ... Work, 10 ... Dicing device, 12 ... Blade, 14 ... Spindle, 16 ... Work table, 18 ... Machining section, 20 ... Cleaning section, 22 ... Load port, 24 ... Conveyor device, 26 ... Control section, 28 ... X Base, 30 ... X guide, 32 ... Linear motor, 34 ... X table, 36 ... Rotating table, 38 ... Y base, 40 ... Y guide, 42 ... Y table, 44 ... Z table, 46 ... Mounting hole, 48 ... Blade Department, 50 ... hub, 52 ... RFID tag, 54 ... reader / writer, 56 ... RAM

Claims (2)

A machined portion that cuts the work with the blade while moving the work and the blade relative to each other.
A read / write means capable of reading and writing the amount of protrusion of the blade portion on the RFID tag provided on the blade, and
The processing portion is controlled based on the protrusion amount read by the read / write means, and the latest protrusion amount is applied to the latest protrusion amount via the read / write means at the end or in the middle of the cutting process by the processing portion. Control means to write to
A dicing device equipped with. A determination means for determining whether or not the blade can be used based on the protrusion amount read by the read / write means is further provided.
The dicing apparatus according to claim 1.

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