JP2020074413A - Dicing device - Google Patents

Abstract

To provide a dicing device capable of preventing deterioration in the entire throughput by reducing labor and time required for inputting of blade information at an exchange or reuse of the blade.SOLUTION: A dicing device includes: a processing unit 18 for cutting a workpiece with a blade 12 while relatively moving the workpiece and the blade 12; a reader/writer 54 which can read and write blade information from/into an RFID tag 52 provided in the blade 12; and a control unit 26 for controlling the processing unit 18 on the basis of the blade information read by the reader/writer 54, and writing the latest blade information into the RFID tag 52 through the reader/writer 54 at the end or in the middle of cutting by the processing unit 18.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a dicing device, and more particularly to a dicing device that cuts a work by a blade while relatively moving a work such as a semiconductor wafer and a rotating blade.

  In the semiconductor manufacturing process, various treatments are performed on the surface of a semiconductor wafer to manufacture a plurality of semiconductor elements having electronic devices. After the electrical characteristics of each chip of the semiconductor element are inspected by an inspection device, the chips are divided into each chip by a blade of a dicing device that rotates at high speed.

  The blade is worn out over the processing time and is replaced with a new blade. Further, when the type of work is changed, it may be replaced with a blade of another type corresponding to the work. When the blades are replaced in this way, the shapes of the blades before and after the replacement are different, so that the blade information regarding the shape of the blades after the replacement is registered in the dicing device. The dicing device controls the cutting depth of the blade with respect to the workpiece based on the registered blade information after replacement, and continues the cutting process.

  Patent Document 1 discloses a dicing device (processing device) that performs blade replacement work using an operation screen for blade replacement. In this dicing device, when the blade is replaced, the lot ID, new / old information, blade outer diameter, blade thickness, flange outer diameter, and other information are input as blade information according to the displayed operation screen. It is like this.

  Further, as the blade, an electrodeposition blade in which diamond abrasive grains or CBN (Cubic Boron Nitride) abrasive grains are electrodeposited with nickel is known, and a metal resin bond blade joined with a resin mixed with metal powder, etc. It has been known. Although the size of the blade is variously selected depending on the processing content, when dicing a normal semiconductor wafer, a blade having a diameter of 50 to 60 mm and a thickness of about 30 μm is used.

JP, 2009-194326, A

  However, in the dicing device disclosed in Patent Document 1, the operator must input the blade information using the operation screen every time the blade is replaced, and the dicing device must be stopped during the input work. I don't get it.

  Also, when reusing a blade, the latest blade information (blade outer diameter, blade thickness, etc.) must be acquired using another detection device, and the latest blade information input It also requires work.

  As described above, in the conventional dicing apparatus, it takes time and labor to input blade information when exchanging or reusing a blade, and thus there is a problem that the overall throughput is reduced.

  The present invention has been made in view of such circumstances, and it is possible to reduce the time and effort required to input blade information when replacing or reusing a blade, and to prevent a decrease in overall throughput. An object is to provide a dicing device.

  In order to achieve the above object, one aspect of a dicing apparatus according to the present invention is a processing unit that cuts a work by a blade while relatively moving the work and the blade, and a blade on an RFID tag included in the blade. The read / write means that can read and write information, and the processing unit is controlled based on the blade information read by the read / write means, and the blade information created or updated by cutting processing by the processing unit is read and written via the read / write means. And a control means for writing in the RFID tag.

  In one aspect of the dicing apparatus according to the present invention, the blade information includes at least any one information of the outer diameter of the blade portion of the blade, the thickness of the blade portion, and the protrusion amount of the blade portion.

  In one aspect of the dicing apparatus according to the present invention, it is provided with a determination unit that determines whether or not the blade is usable based on the blade information read by the read / write unit.

  According to the present invention, it is possible to reduce the labor and time required for the blade information input operation when exchanging or reusing a blade, and to prevent the overall throughput from decreasing.

Overall perspective view showing the dicing device of the present embodiment 1 is a perspective view showing a structure of a processing portion of the dicing device shown in FIG. (A) is a plan view of the blade, (B) is a sectional view of the blade Block diagram showing the configuration of the dicing apparatus of the present embodiment The figure which showed an example of the blade information memorize | stored in an RFID tag. Flowchart showing an example of the operation of the dicing apparatus of the present embodiment Flowchart showing another example of the operation of the dicing apparatus of the present embodiment

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  First, the dicing apparatus 10 of this embodiment will be described. FIG. 1 is an overall perspective view showing a dicing apparatus 10 of this embodiment.

  As shown in FIG. 1, the dicing apparatus 10 of the present embodiment is a dicing apparatus called a twin spindle dicer in which a pair of blades 12, 12 are arranged so as to face each other. The dicing device 10 includes a pair of high-frequency motor built-in spindles 14 each having a blade 12 mounted on a tip thereof, and a work table 16 on which a semiconductor wafer W, which is a work, is mounted and suction-holds the semiconductor wafer W. The processing unit 18 having the processing unit 18 is provided. The processing unit 18 cuts the semiconductor wafer W with the blade 12 while relatively moving the semiconductor wafer W and the blade 12.

  Further, the dicing device 10 includes a cleaning unit 20 for spin cleaning the processed semiconductor wafer W, a load port 22 on which a cassette accommodating a plurality of semiconductor wafers W is placed, and a transfer for transferring the semiconductor wafer W. The device 24 and the device 24 are arranged at predetermined positions. Further, the dicing apparatus 10 has a built-in control unit (control means) 26 that integrally controls the operation of each member of the dicing apparatus 10.

  FIG. 2 is a perspective view showing the structure of the processing section 18.

  As shown in FIG. 2, the processing unit 18 includes an X table 34. The X table 34 is guided by the X guides 30 and 30 provided on the X base 28, and is driven by the linear motor 32 in the X direction indicated by the arrow XX. A rotary table 36 that rotates in the θ direction is fixed to the upper surface of the X table 34, and the work table 16 is provided on the rotary table 36. Therefore, the work table 16 is moved in the X direction by the X table 34 and is rotated in the θ direction by the rotary table 36.

  The processing unit 18 also includes a Y base 38 configured in a gate shape so as to straddle the X base 28. A pair of Y tables 42, 42 are provided on the wall surface of the Y base 38. The pair of Y tables 42, 42 is guided by Y guides 40, 40 fixed to the wall surface of the Y base 38, and is driven in the Y direction shown by the arrow YY by a driving device (not shown) including a stepping motor and a ball screw. To be done.

  Z tables 44 and 44 are provided on the Y tables 42 and 42, respectively. The Z tables 44, 44 are guided by a Z guide (not shown) provided on the Y table 42, and are driven in a Z direction indicated by an arrow Z-Z by a driving device (not shown) including a stepping motor and a ball screw. The Z tables 44, 44 are fixed with the spindles 14, 14 facing each other, and the blades 12, 12 mounted on the tip ends of the spindles 14, 14 are arranged facing each other.

  With the configuration of the processing unit 18 described above, the blades 12 and 12 are index-fed in the Y direction and are cut and fed in the Z direction, and the work table 16 is cut and fed in the X direction and rotated in the θ direction. These operations are controlled by the control unit 26 (see FIG. 1), and in particular, the cutting amount in the Z direction is controlled according to the protrusion amount of the blade portion of the blade 12, so that a new one is required when the blade 12 is replaced. The protrusion amount of the blade is always input to the control unit 26 of the dicing device 10. The amount of protrusion of the blade portion of the blade 12 will be described later.

  The X direction mentioned above refers to one direction in the horizontal direction, and the Y direction refers to a direction orthogonal to the X direction in the horizontal direction. Further, the Z direction refers to the vertical direction orthogonal to the X direction and the Y direction, and the θ direction refers to the rotation direction with the vertical axis as the central axis.

  3A is a front view of the blade 12, and FIG. 3B is a cross-sectional view of the blade 12.

  As shown in FIGS. 3A and 3B, the blade 12 has a blade portion 48 attached to an outer peripheral edge portion of one end surface of a hub (also called a flange) 50 made of an aluminum alloy or the like. Composed. The blade portion 48 is provided on the hub 50 by electroforming abrasive grains such as diamond. Further, a mounting hole 46 for mounting the blade 12 on the spindle 14 of the dicing device 10 is provided at the center of the hub 50.

  The blade portion 48 is a portion cut into the semiconductor wafer W. The thickness t (also referred to as the blade thickness) of the blade portion 48 is configured to be at least thinner than the thickness of the semiconductor wafer W. For example, when cutting the semiconductor wafer W having a thickness of 100 μm, the thickness t of the blade portion 48 is preferably 50 μm or less, more preferably 30 μm or less, and further preferably 10 μm or less. Further, the cross-sectional shape of the blade portion 48 may be a straight shape having a uniform thickness or a tapered shape in which the thickness gradually decreases toward the outer circumference.

  Here, a value obtained by subtracting a value obtained by subtracting the outer diameter φ2 of the hub 50 from the outer diameter φ1 of the blade portion 48 by 2 ((φ1−φ2) / 2) is the protrusion amount a of the blade portion 48 described above. The protrusion amount a of the blade portion 48 is a value that decreases with the lapse of processing time, and is reset to the dicing device 10 every time the blade 12 is replaced with a new blade 12.

  Since the protrusion amount a of the blade portion 48 is a large factor for controlling the cutting amount in the Z direction as described above, even during processing with the same blade 12, a detecting device that detects the position of the blade edge of the blade 12 is used. The protrusion amount a of the blade is indirectly measured, and the measured protrusion amount a is updated to the control unit 26 of the dicing device 10. Also, when the blade 12 is replaced, the protrusion amount a of the blade portion 48 of the blade 12 after the replacement is reset by the control unit 26. In the case of a new blade 12, the protrusion amount a of the blade portion 48 is specified as a catalog value.

  By the way, the blade 12 in the present embodiment is provided with an RFID (Radio Frequency Identifier) tag 52, as shown in FIG. The RFID tag 52 is a readable / writable storage medium and is provided on the surface of the blade 12.

  The dicing device 10 of the present embodiment has the following configuration for reading and writing blade information on the RFID tag 52 provided on the blade 12.

  FIG. 4 is a block diagram showing a configuration for reading and writing the RFID tag 52 provided on the blade 12 of the dicing device 10 of the present embodiment.

  As shown in FIG. 4, the dicing apparatus 10 of the present exemplary embodiment includes a reader / writer (read / write means) 54 that reads and writes blade information from the RFID tag 52 provided on the blade 12, and blade information read by the reader / writer 54. The control unit 26 controls the processing unit 18 based on the above, and controls the writing of the latest blade information to the RFID tag 52 via the reader / writer 54.

  The control unit 26 includes a RAM (Random Access Memory) 56 that stores the blade information read by the reader / writer 54. The control unit 26 controls the above-described processing unit 18 with reference to the blade information stored in the RAM 56.

  Further, the RAM 56 stores blade information (latest blade information) created or updated along with the cutting process by the processing unit 18, and as described later, the control unit 26 controls the latest blade information stored in the RAM 56. This blade information is written in the RFID tag 52 by the reader / writer 54.

  FIG. 5 is a diagram showing an example of blade information stored in the RFID tag 52.

  As shown in FIG. 5, the blade information stored in the RFID tag 52 includes at least the outer diameter φ1, the thickness t, and the protrusion amount a of the blade portion 48 of the blade 12. In addition to these, the type of abrasive grains of the blade 12, the grain size (count) of the abrasive grains, the degree of concentration (content rate), the type of binder, and the like may be included. The blade information may be a catalog value or detailed information that is actually measured after the blade 12 is manufactured.

  Next, the operation of the dicing apparatus 10 of this embodiment will be described.

  FIG. 6 is a flowchart showing an example of the operation of the dicing device 10 of this embodiment.

  As shown in FIG. 6, in the dicing device 10, the blade information stored in the RFID tag 52 is read by the reader / writer 54 before the blade 12 is mounted on the spindle 14 or after the blade 12 is mounted on the spindle 14. (Step S100). At this time, the blade information read by the reader / writer 54 is stored in the RAM 56 of the control unit 26.

  Next, the control unit 26 controls the processing unit 18 based on the blade information (specifically, the blade information stored in the RAM 56) read by the reader / writer 54 (step S110).

  The specific control of the processing unit 18 by the control unit 26 is performed by driving the processing unit 18 in the Y direction or the Z direction, that is, blade information read from the RFID tag 52, that is, blade outer diameter φ1, blade thickness. The amount of movement in the Y direction or the Z direction is adjusted mainly with reference to t and the blade portion protrusion amount a. As a result, the cutting work specialized for the blade 12 is possible.

  Next, the control unit 26 controls the reader / writer 54 to write the latest blade information to the RFID tag 52 when the processing by the processing unit 18 is completed or during the processing (step S120). The blade information written in the RFID tag 52 is read again by the reader / writer 54 when the blade 12 is reused, and the control unit 26 controls the processing unit 18 based on the read information.

  In step S120, as the blade information to be written in the RFID tag 52, as described above, in addition to the information on the shape of the blade 12, history information on the use process of the blade 12 (use time, identification for identifying the used dicing device). Symbols, error information of the dicing device), etc. are included. Information regarding the shape of the blade 12 is written from the reader / writer 54 to the RFID tag 52 when the blade 12 is removed from the spindle 14 or when the processing section 18 finishes processing. For example, when the dicing device 10 is equipped with a detection device that detects the position of the blade edge of the blade 12, the outer diameter φ1 and the protrusion amount a of the blade portion 48 are calculated from the detection results of the detection device, and the latest It is written in the RFID tag 52 as blade information. As a result, the latest outer diameter φ1 and the protrusion amount a are updated and written in the RFID tag 52 of the blade 12 at any time. Further, the history of the outer diameter φ1 and the protrusion amount “a” may be written in the RFID tag 52 of the blade 12 every time processing is completed. As a result, the number of times the blade 12 is replaced and the amount of wear of the blade 12 due to one use can be ascertained, and this information can be used for maintenance of the blade 12 and the like.

  In the dicing device 10 according to the present embodiment, the latest blade information is stored in the RFID 52 of the blade 12, and therefore, based on the blade information read by the reader / writer 54 without using another detection device. It is possible to instantly determine whether or not the blade 12 can be used.

  FIG. 7 is a flowchart showing another example of the operation of the dicing apparatus 10 of the present embodiment, showing a process of judging whether or not the blade 12 can be used based on the blade information read by the reader / writer 54. It is a thing. In the dicing device 10, the minimum value (minimum protrusion amount) of the protrusion amount a of the blade portion 48 is set in advance as a reference value (threshold value) for determining whether or not the blade 12 can be used. The minimum value of the protrusion amount a of the blade portion 48 may be set by the user via an input unit (not shown).

  As shown in FIG. 7, first, before the blade 12 is attached to the spindle 14 or after the blade 12 is attached to the spindle 14, the blade information stored in the RFID tag 52 is read by the reader / writer 54 (step S200). At this time, the blade information read by the reader / writer 54 is stored in the RAM 56 of the control unit 26.

  Next, the control unit 26 functions as the determination unit of the present invention, and compares the protrusion amount (current protrusion amount) a of the blade unit 48 included in the blade information read by the reader / writer 54 with the above-described minimum protrusion amount. By comparison, it is determined whether the current protrusion amount a is larger than the minimum protrusion amount (S210).

  When it is determined in step S210 that the current protrusion amount a is larger than the minimum protrusion amount, the control unit 26 determines that the blade 12 is usable (step S220). In this case, the processing by the processing unit 18 is set to a practicable state. On the other hand, when it is determined that the current protrusion amount a is smaller than the minimum protrusion amount (or equal to or smaller than the minimum protrusion amount), it is determined that the blade 12 cannot be used (step S230). In this case, the processing by the processing unit 18 is set to an unexecutable state, and a message indicating that the blade 12 needs to be replaced is displayed on the monitor (not shown).

  With the above, the processing shown in the flowchart ends.

  As described above, according to the dicing apparatus 10 of the present embodiment, the blade 12 is provided with the RFID tag 52, and the blade information stored in the RFID tag 52 (the outer diameter φ1, the thickness t, and the protrusion amount a of the blade portion 48). Etc.) is automatically read, and processing is performed based on the read blade information. Further, since the latest blade information is written in the RFID tag 52 of the blade 12, it is not necessary to acquire the latest blade information again when the blade 12 is reused as a used blade. Therefore, it is possible to reduce the labor and time required for the blade information input operation when replacing or reusing the blade 12, and it is possible to prevent a decrease in throughput due to the replacement of the blade 12. As a result, the operating time of the dicing device 10 can be increased and the overall throughput can be improved.

  Further, in the dicing device 10 of the present exemplary embodiment, since the latest blade information is stored in the RFID 52 of the blade 12, the blade information read by the reader / writer 54 is used without using another detection device. Based on this, it is possible to instantly determine whether or not the blade 12 is usable. That is, since it is automatically determined in the dicing apparatus 10 whether the blade 12 is usable, the burden of the confirmation work on the user can be reduced.

  Further, in the dicing apparatus 10 of the present embodiment, since the blade 12 is provided with the RFID tag 52 as a readable / writable storage medium, the blade information includes the outer diameter φ1, the thickness t, the protrusion amount a, and the like of the blade portion 48. In addition, history information of the use process (use time, identification symbol for identifying the used dicing device, defect information of the dicing device) can be written in the RFID tag 52.

  In addition, since the reader / writer 54 can read and write blade information in a non-contact manner with the reader / writer 54, it is possible to read and write blade information even in an environment where cutting water, cooling water, and cutting powder scatter.

  W ... Work, 10 ... Dicing device, 12 ... Blade, 14 ... Spindle, 16 ... Work table, 18 ... Processing part, 20 ... Washing part, 22 ... Load port, 24 ... Conveying device, 26 ... Control part, 28 ... X Base, 30 ... X guide, 32 ... Linear motor, 34 ... X table, 36 ... Rotating table, 38 ... Y base, 40 ... Y guide, 42 ... Y table, 44 ... Z table, 46 ... Mounting hole, 48 ... Blade Part, 50 ... Hub, 52 ... RFID tag, 54 ... Reader / writer, 56 ... RAM

Claims (3)

A processing unit that cuts the work by the blade while moving the work and the blade relatively,
A read / write means capable of reading and writing blade information on the RFID tag provided on the blade,
The RFID tag is controlled through the read / write means while controlling the processing part based on the blade information read by the read / write means, and the latest blade information at the end or midway of the cutting processing by the processing part. Control means for writing to
A dicing device equipped with. Based on the blade information read by the read / write means, further comprises a determination means for determining whether the blade is usable,
The dicing device according to claim 1. The blade information includes at least one information of the outer diameter of the blade portion of the blade, the thickness of the blade portion, and the protrusion amount of the blade portion,
The dicing device according to claim 1.

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