JP6902053B2 - 照射硬化レンズを備える処理チャンバ - Google Patents

照射硬化レンズを備える処理チャンバ Download PDF

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Publication number
JP6902053B2
JP6902053B2 JP2018560940A JP2018560940A JP6902053B2 JP 6902053 B2 JP6902053 B2 JP 6902053B2 JP 2018560940 A JP2018560940 A JP 2018560940A JP 2018560940 A JP2018560940 A JP 2018560940A JP 6902053 B2 JP6902053 B2 JP 6902053B2
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JP
Japan
Prior art keywords
substrate
processing chamber
lens
lenses
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2018560940A
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English (en)
Japanese (ja)
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JP2019518594A5 (enExample
JP2019518594A (ja
Inventor
オルランド トレホ，
オルランド トレホ，
ランプラカッシュ サンカラクリッシュナン，
ランプラカッシュ サンカラクリッシュナン，
ツァ−ジン グン，
ツァ−ジン グン，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
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Applied Materials Inc
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Publication date
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Publication of JP2019518594A publication Critical patent/JP2019518594A/ja
Publication of JP2019518594A5 publication Critical patent/JP2019518594A5/ja
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
    • H01L21/02348—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light treatment by exposure to UV light
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0095—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with ultraviolet radiation

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Surface Treatment Of Optical Elements (AREA)
JP2018560940A 2016-05-26 2017-05-26 照射硬化レンズを備える処理チャンバ Expired - Fee Related JP6902053B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/165,930 US10541159B2 (en) 2016-05-26 2016-05-26 Processing chamber with irradiance curing lens
US15/165,930 2016-05-26
PCT/US2017/034622 WO2017205714A1 (en) 2016-05-26 2017-05-26 Processing chamber with irradiance curing lens

Publications (3)

Publication Number Publication Date
JP2019518594A JP2019518594A (ja) 2019-07-04
JP2019518594A5 JP2019518594A5 (enExample) 2020-07-09
JP6902053B2 true JP6902053B2 (ja) 2021-07-14

Family

ID=60411566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018560940A Expired - Fee Related JP6902053B2 (ja) 2016-05-26 2017-05-26 照射硬化レンズを備える処理チャンバ

Country Status (5)

Country Link
US (1) US10541159B2 (enExample)
JP (1) JP6902053B2 (enExample)
KR (1) KR102171712B1 (enExample)
CN (1) CN109155234B (enExample)
WO (1) WO2017205714A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117242560A (zh) * 2021-04-29 2023-12-15 应用材料公司 用于快速热处理腔室的窗

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4755654A (en) * 1987-03-26 1988-07-05 Crowley John L Semiconductor wafer heating chamber
JPH03277774A (ja) * 1990-03-27 1991-12-09 Semiconductor Energy Lab Co Ltd 光気相反応装置
JP3115822B2 (ja) * 1996-06-04 2000-12-11 松下電子工業株式会社 紫外線照射装置およびその照射方法
US6809012B2 (en) * 2001-01-18 2004-10-26 Semiconductor Energy Laboratory Co., Ltd. Method of making a thin film transistor using laser annealing
US6547422B2 (en) * 2001-08-08 2003-04-15 Prokia Technology Co., Ltd. Illuminating module for a display apparatus
US6879777B2 (en) 2002-10-03 2005-04-12 Asm America, Inc. Localized heating of substrates using optics
US6862404B1 (en) * 2003-09-08 2005-03-01 Wafermasters Focused photon energy heating chamber
US8980769B1 (en) * 2005-04-26 2015-03-17 Novellus Systems, Inc. Multi-station sequential curing of dielectric films
US8137465B1 (en) * 2005-04-26 2012-03-20 Novellus Systems, Inc. Single-chamber sequential curing of semiconductor wafers
JP2007229682A (ja) 2006-03-03 2007-09-13 Harison Toshiba Lighting Corp 紫外線照射装置
US7909595B2 (en) * 2006-03-17 2011-03-22 Applied Materials, Inc. Apparatus and method for exposing a substrate to UV radiation using a reflector having both elliptical and parabolic reflective sections
JP2007317991A (ja) * 2006-05-29 2007-12-06 Advanced Lcd Technologies Development Center Co Ltd 半導体装置の製造方法並びに薄膜トランジスタ
US7851232B2 (en) * 2006-10-30 2010-12-14 Novellus Systems, Inc. UV treatment for carbon-containing low-k dielectric repair in semiconductor processing
JP5282669B2 (ja) 2009-06-12 2013-09-04 ウシオ電機株式会社 光照射装置
US8309421B2 (en) * 2010-11-24 2012-11-13 Applied Materials, Inc. Dual-bulb lamphead control methodology
WO2013055365A1 (en) 2011-10-14 2013-04-18 Crucible Intellectual Property Llc Containment gate for inline temperature control melting
KR20130112549A (ko) 2012-04-04 2013-10-14 박흥균 자외선 경화장치용 광학모듈
US9905444B2 (en) 2012-04-25 2018-02-27 Applied Materials, Inc. Optics for controlling light transmitted through a conical quartz dome
US9287154B2 (en) * 2012-06-01 2016-03-15 Taiwan Semiconductor Manufacturing Co., Ltd. UV curing system for semiconductors
JP6197641B2 (ja) * 2013-12-26 2017-09-20 ウシオ電機株式会社 真空紫外光照射処理装置

Also Published As

Publication number Publication date
US20170345649A1 (en) 2017-11-30
WO2017205714A1 (en) 2017-11-30
CN109155234A (zh) 2019-01-04
KR20180136577A (ko) 2018-12-24
CN109155234B (zh) 2023-08-22
US10541159B2 (en) 2020-01-21
JP2019518594A (ja) 2019-07-04
KR102171712B1 (ko) 2020-10-29

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