JP6886591B2 - 粘着シート及び電子機器 - Google Patents
粘着シート及び電子機器 Download PDFInfo
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- JP6886591B2 JP6886591B2 JP2016077260A JP2016077260A JP6886591B2 JP 6886591 B2 JP6886591 B2 JP 6886591B2 JP 2016077260 A JP2016077260 A JP 2016077260A JP 2016077260 A JP2016077260 A JP 2016077260A JP 6886591 B2 JP6886591 B2 JP 6886591B2
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- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
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- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- LRDFRRGEGBBSRN-UHFFFAOYSA-N isobutyronitrile Chemical compound CC(C)C#N LRDFRRGEGBBSRN-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical class COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
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- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- QRWZCJXEAOZAAW-UHFFFAOYSA-N n,n,2-trimethylprop-2-enamide Chemical compound CN(C)C(=O)C(C)=C QRWZCJXEAOZAAW-UHFFFAOYSA-N 0.000 description 1
- DFENKTCEEGOWLB-UHFFFAOYSA-N n,n-bis(methylamino)-2-methylidenepentanamide Chemical compound CCCC(=C)C(=O)N(NC)NC DFENKTCEEGOWLB-UHFFFAOYSA-N 0.000 description 1
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- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
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- 239000004033 plastic Substances 0.000 description 1
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- 229920002492 poly(sulfone) Polymers 0.000 description 1
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- 229920006289 polycarbonate film Polymers 0.000 description 1
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- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
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- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
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Description
サンプル注入量:100μl
溶離液:THF
流速:1.0ml/分
測定温度:40℃
本カラム:TSKgel GMHHR−H(20)2本
ガードカラム:TSKgel HXL−H
検出器:示差屈折計
スタンダードポリスチレン分子量:1万〜2000万(東ソー株式会社製)
本明細書において、「歪み量100%における応力−歪み曲線に基づく引張強さ」は「歪み量100%における応力−歪み曲線に基づく応力」と読み替えるものとする。
攪拌機、還流冷却管、窒素導入管、温度計を備えた反応容器に、n−ブチルアクリレート 75.94質量部、2−エチルヘキシルアクリレート5質量部、シクロヘキシルアクリレート15質量部、アクリル酸4質量部、4−ヒドロキシブチルアクリレート0.06質量部、及び、酢酸エチル200質量部を仕込み、攪拌下、窒素を吹き込みながら65℃まで昇温させた。
GPC法による分子量の測定は、東ソー株式会社製GPC装置(HLC−8329GPC)を用いて測定される、スタンダードポリスチレン換算値である。
サンプル注入量:100μl
溶離液:THF(テトラヒドロフラン)
流速:1.0ml/分
測定温度:40℃
本カラム:TSKgel GMHHR−H(20)2本
ガードカラム:TSKgel HXL−H
検出器:示差屈折計
スタンダードポリスチレン分子量:1万〜2000万(東ソー株式会社製)
前記n−ブチルアクリレートの使用量を75.94質量部から56.94質量部に変更し、2−エチルヘキシルアクリレートの使用量を5質量部から40質量部に変更し、アクリル酸の使用量を4質量部から3質量部に変更し、シクロヘキシルアクリレートの使用量を10質量部から0質量部に変更したこと以外は、調整例1と同様の方法で重量平均分子量133万のアクリル重合体(A−2)溶液(不揮発分33質量%)を得た。
攪拌機、還流冷却管、窒素導入管、温度計を備えた反応容器に、n−ブチルアクリレート 93質量部、アクリル酸3.5質量部、酢酸ビニル3.4質量部、ヒドロキシエチルアクリレート0.1質量部、及び、酢酸エチル100質量部を仕込み、攪拌下、窒素を吹き込みながら72℃まで昇温させた。
攪拌機、還流冷却器、温度計、滴下漏斗及び窒素ガス導入口を備えた反応容器に、n−ブチルアクリレート60質量部、2−エチルヘキシルアクリレート35.95質量部、アクリル酸4.0質量部、4−ヒドロキシブチルアクリレート0.05質量部と、重合開始剤として2,2’−アゾビスイソブチルニトリル0.2質量部とを、酢酸エチル50質量部及びn−ヘキサン20質量部の混合溶剤に溶解し、それらを70℃で8時間重合させることによって、重量平均分子量70万のアクリル重合体(B−2)溶液を得た。
容器に、前記アクリル重合体(A−1)100質量部に対して、重合ロジンエステル系粘着付与樹脂D−125(荒川化学工業株式会社)5質量部と石油系粘着付与樹脂FTR6125(三井化学株式会社製)15質量部とを混合攪拌したのち、酢酸エチルを加えることによって固形分31質量%の粘着剤溶液を得た。
粘着剤層の厚さを19μmから22μmに変更し、かつ、ポリエチレンテレフタレートフィルムの厚さを12μmから6μmに変更したこと以外は、実施例1と同様の方法で粘着シート(P−2)を得た。
バーノックD−40の配合量を1.3質量部から0.9質量部に変更すること以外は、実施例1と同様の方法で粘着剤(p−2)及び粘着シート(P−3)を得た。
前記アクリル重合体(A−1)溶液の代わりに、前記アクリル重合体(A−2)溶液を使用し、バーノックD−40の配合量を1.3質量部から2.0質量部に変更する以外は、実施例1と同様の方法で粘着剤(p−3)及び粘着シート(P−4)を得た。
本明細書において、実施例4は参考例1とする。
粘着剤層の厚さを22μmから12μmに変更すること以外は、実施例2と同様の方法で粘着シート(P−5)を得た。
前記粘着剤(p−1)を粘着剤(p−2)に変更する以外は、実施例5と同様の方法で粘着シート(P−6)を得た。
粘着剤層の厚さを19μmから37.5μmに変更し、かつ、ポリエチレンテレフタレートフィルムの厚さを12μmから25μmに変更すること以外は、実施例1と同様の方法で粘着シート(P−7)を得た。
粘着剤層の厚さを38μmから25μmに変更し、かつ、ポリエチレンテレフタレートフィルムの厚さを12μmから50μmに変更すること以外は、実施例1と同様の方法で粘着シート(P−8)を得た。
容器に、前記アクリル重合体(B−1)100質量部に対して、スーパーエステルA100(荒川化学工業株式会社製、重合ロジンエステル系粘着付与樹脂)20質量部とFTR6100(三井化学株式会社製、石油系粘着付与樹脂)20質量部とを混合攪拌したのち、酢酸エチルを加えることによって固形分40質量%の粘着剤溶液を得た。
前記アクリル重合体(B−1)溶液の代わりに、前記アクリル重合体(B−2)溶液を使用し、バーノックD−40の配合量を1.24質量部から2.1質量部に変更すること以外は、比較例1と同様の方法で粘着剤(q−2)及び粘着シート(Q−2)を得た。
任意の剥離ライナーの片面に、前記粘着剤を塗工し、80℃で3分間乾燥し、40℃で48時間エージングすることによって、厚さ50μmの粘着剤層を形成した。次に、この粘着剤層を厚さ約400μmになるまで積層することによって、標線間隔2cm、幅1cmの試験片を作成した。
温度23℃及び相対湿度50%RHの環境下、実施例及び比較例で作製した粘着シートの一方の粘着剤層表面(片面)を、厚さ25μmのポリエチレンテレフタレートフィルムで裏打ちした後、長さ120mm及び幅20mmの長方形に裁断した。
温度23℃及び相対湿度50%RHの環境下、ポリイミドフィルム(東レ・デュポン(株)カプトン300H、厚み:75μm)を、長さ方向40mm及び幅方向20mmの長方形に裁断した。
[保持力の測定方法]
温度23℃及び相対湿度50%RHの環境下、長さ方向25mmおよび幅方向25mmの大きさに裁断した粘着シートをステンレス板に貼付した。
2 ポリイミドフィルム
3 ポリイミドフィルムの折り目
4 ステンレス板
5 おもり
Claims (4)
- 折り曲げられたフレキシブルプリント配線板の固定に使用する粘着シートであって、
前記粘着シートが、基材の片面または両面に、歪み量100%における応力−歪み曲線に基づく最大応力が8.4N/cm2以上である粘着剤層(A)を有し、
前記粘着剤層(A)はアクリル重合体(a1)及び架橋剤(a3)を含有し、
前記粘着剤層(A)のゲル分率が20質量%〜70質量%であり、
前記アクリル重合体(a1)は脂肪族環式構造を有し、重量平均分子量が98万〜300万であり、
前記アクリル重合体(a1)は単量体成分として、水酸基を有するビニル単量体を0.01質量%〜0.2質量%、酸基を有するビニル単量体を1質量%〜30質量%、およびアルキル基の炭素原子数が4〜12であるアルキル(メタ)アクリレートを50質量%〜98質量%含み、
前記基材が、ポリエチレンテレフタレートフィルム、または、不織布であり、
前記粘着シートの総厚が10μm〜200μmである
ことを特徴とする粘着シート。 - 前記粘着剤層(A)が1μm〜100μmの範囲の厚さを有するものである請求項1に記載の粘着シート。
- 前記アクリル重合体(a1)が、ビニル単量体成分の重合体であって、前記ビニル単量体成分の全量に対する、(メタ)アクリル単量体以外のビニル単量体の含有量が合計5質量%以下、及び、ホモポリマーのガラス転移温度が100℃以上のアルキル(メタ)アクリレートの含有割合が合計1質量%以下である請求項1または2に記載の粘着シート。
- 請求項1〜3のいずれか1項に記載の粘着シートによって、前記フレキシブルプリント配線板が湾曲または屈曲された状態で他の部材に固定された構成を有することを特徴とする電子機器。
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