JP6877346B2 - 表示基板を製造するための方法、表示基板及び表示装置 - Google Patents

表示基板を製造するための方法、表示基板及び表示装置 Download PDF

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JP6877346B2
JP6877346B2 JP2017535372A JP2017535372A JP6877346B2 JP 6877346 B2 JP6877346 B2 JP 6877346B2 JP 2017535372 A JP2017535372 A JP 2017535372A JP 2017535372 A JP2017535372 A JP 2017535372A JP 6877346 B2 JP6877346 B2 JP 6877346B2
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base
light emitting
organic light
pixel
pixel definition
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JP2019514152A (ja
JP2019514152A5 (enExample
Inventor
凡 ▲楊▼
凡 ▲楊▼
坤 郭
坤 郭
天一 承
天一 承
毅 ▲張▼
毅 ▲張▼
玉清 ▲楊▼
玉清 ▲楊▼
利▲満▼ 彭
利▲満▼ 彭
岩 ▲呉▼
岩 ▲呉▼
文斌 ▲楊▼
文斌 ▲楊▼
▲祺▼ ▲劉▼
▲祺▼ ▲劉▼
▲韋▼霖 ▲頼▼
▲韋▼霖 ▲頼▼
▲亮▼▲亮▼ ▲劉▼
▲亮▼▲亮▼ ▲劉▼
智勇 ▲陽▼
智勇 ▲陽▼
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Physical Vapour Deposition (AREA)
JP2017535372A 2016-04-08 2017-01-10 表示基板を製造するための方法、表示基板及び表示装置 Active JP6877346B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201610218186.7 2016-04-08
CN201610218186.7A CN105655382B (zh) 2016-04-08 2016-04-08 显示基板制作方法、显示基板和显示装置
PCT/CN2017/070715 WO2017173874A1 (zh) 2016-04-08 2017-01-10 显示基板制作方法、显示基板和显示装置

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JP2019514152A JP2019514152A (ja) 2019-05-30
JP2019514152A5 JP2019514152A5 (enExample) 2020-01-23
JP6877346B2 true JP6877346B2 (ja) 2021-05-26

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US (1) US10084028B2 (enExample)
EP (1) EP3444845B1 (enExample)
JP (1) JP6877346B2 (enExample)
KR (1) KR101920587B1 (enExample)
CN (1) CN105655382B (enExample)
WO (1) WO2017173874A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105655382B (zh) 2016-04-08 2019-10-18 京东方科技集团股份有限公司 显示基板制作方法、显示基板和显示装置
JP7232882B2 (ja) * 2017-03-29 2023-03-03 天馬微電子有限公司 Ｏｌｅｄ表示装置の製造方法、マスク及びマスクの設計方法
JP2018170152A (ja) * 2017-03-29 2018-11-01 Ｔｉａｎｍａ Ｊａｐａｎ株式会社 Ｏｌｅｄ表示装置の製造方法、マスク及びマスクの設計方法
CN111384089A (zh) * 2018-12-29 2020-07-07 北京小米移动软件有限公司 显示面板和终端
CN111384092B (zh) * 2018-12-29 2024-01-30 北京小米移动软件有限公司 终端和有机发光二极管显示面板的制作方法
CN111381705B (zh) * 2018-12-29 2024-05-24 北京小米移动软件有限公司 一种终端
CN111244330A (zh) * 2020-01-15 2020-06-05 武汉华星光电半导体显示技术有限公司 蒸镀方法、蒸镀装置以及显示装置
KR20240030154A (ko) * 2022-08-30 2024-03-07 엘지이노텍 주식회사 Oled 화소 증착을 위한 증착용 마스크

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
JP4053209B2 (ja) * 2000-05-01 2008-02-27 三星エスディアイ株式会社 有機ｅｌディスプレイの製造方法
KR100525819B1 (ko) 2003-05-06 2005-11-03 엘지전자 주식회사 유기 이엘 디스플레이 패널 제조용 새도우 마스크
JP2009026828A (ja) * 2007-07-17 2009-02-05 Toshiba Matsushita Display Technology Co Ltd 有機ｅｌ表示装置
JP2011054290A (ja) 2009-08-31 2011-03-17 Hitachi Displays Ltd 蒸着マスク及びその製造方法並びに自発光表示装置の製造方法
KR101588899B1 (ko) * 2009-09-17 2016-01-27 엘지디스플레이 주식회사 유기전계발광표시장치
US8894458B2 (en) * 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8669192B2 (en) * 2011-01-18 2014-03-11 Sharp Kabushiki Kaisha Vapor deposition device, vapor deposition method, organic EL element and organic EL display device
KR20140081314A (ko) 2012-12-21 2014-07-01 삼성디스플레이 주식회사 발광 표시 장치 및 그 제조 방법
KR101427593B1 (ko) * 2013-04-26 2014-08-07 삼성디스플레이 주식회사 유기 발광 표시 장치
KR20150067624A (ko) * 2013-12-10 2015-06-18 삼성디스플레이 주식회사 유기발광표시장치
KR102205401B1 (ko) * 2014-01-14 2021-01-21 삼성디스플레이 주식회사 유기발광표시장치
CN104752490B (zh) * 2015-04-16 2016-04-06 京东方科技集团股份有限公司 一种有机发光二极管显示面板及其制作方法、显示装置
CN105070651B (zh) * 2015-08-17 2018-11-06 广东聚华印刷显示技术有限公司 像素界定层结构和oled器件的制备方法
CN105154823B (zh) * 2015-09-07 2017-12-08 信利（惠州）智能显示有限公司 蒸镀掩膜板及其制作方法
CN105655382B (zh) 2016-04-08 2019-10-18 京东方科技集团股份有限公司 显示基板制作方法、显示基板和显示装置

Also Published As

Publication number Publication date
WO2017173874A1 (zh) 2017-10-12
US10084028B2 (en) 2018-09-25
US20180090548A1 (en) 2018-03-29
JP2019514152A (ja) 2019-05-30
EP3444845A4 (en) 2019-12-11
KR20170129679A (ko) 2017-11-27
KR101920587B1 (ko) 2018-11-20
CN105655382A (zh) 2016-06-08
CN105655382B (zh) 2019-10-18
EP3444845B1 (en) 2022-08-10
EP3444845A1 (en) 2019-02-20

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