JP6874979B2 - レーザー式はんだ付け方法及びレーザー式はんだ付け装置 - Google Patents

レーザー式はんだ付け方法及びレーザー式はんだ付け装置 Download PDF

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JP6874979B2
JP6874979B2 JP2017082254A JP2017082254A JP6874979B2 JP 6874979 B2 JP6874979 B2 JP 6874979B2 JP 2017082254 A JP2017082254 A JP 2017082254A JP 2017082254 A JP2017082254 A JP 2017082254A JP 6874979 B2 JP6874979 B2 JP 6874979B2
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soldering
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solder
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寛史 河野
寛史 河野
享史 占部
享史 占部
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株式会社ジャパンユニックス
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JP2017082254A 2017-04-18 2017-04-18 レーザー式はんだ付け方法及びレーザー式はんだ付け装置 Active JP6874979B2 (ja)

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JP7239151B2 (ja) * 2018-12-14 2023-03-14 株式会社ジャパンユニックス レーザー式はんだ付け装置及びはんだ付け方法
CN114713925B (zh) * 2022-02-16 2024-05-14 深圳市鹏汇激光科技有限公司 激光焊锡控制方法、装置、系统及计算机可读存储介质
CN116140735B (zh) * 2023-02-13 2025-09-09 广州大学 一种激光软钎焊设备焊接过程中的温度控制方法

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JPH06285625A (ja) * 1993-04-06 1994-10-11 Hitachi Ltd 自動ろう付け装置
JP5378874B2 (ja) * 2009-05-11 2013-12-25 三菱電機株式会社 レーザはんだ付け装置及びレーザはんだ付け方法

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