JP6873354B1 - 粘着シート - Google Patents
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- JP6873354B1 JP6873354B1 JP2021514641A JP2021514641A JP6873354B1 JP 6873354 B1 JP6873354 B1 JP 6873354B1 JP 2021514641 A JP2021514641 A JP 2021514641A JP 2021514641 A JP2021514641 A JP 2021514641A JP 6873354 B1 JP6873354 B1 JP 6873354B1
- Authority
- JP
- Japan
- Prior art keywords
- adhesive sheet
- pressure
- sensitive adhesive
- gas
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims abstract description 109
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 109
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 132
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000002834 transmittance Methods 0.000 claims abstract description 24
- 230000004888 barrier function Effects 0.000 claims description 46
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 31
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- 238000012545 processing Methods 0.000 claims description 19
- 238000006073 displacement reaction Methods 0.000 claims description 17
- 230000001678 irradiating effect Effects 0.000 claims description 8
- 238000007689 inspection Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000005755 formation reaction Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 230000008439 repair process Effects 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 156
- 239000010410 layer Substances 0.000 description 152
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 88
- -1 2- (4,6-bis (2,4-dimethylphenyl) -1,3,5-triazine-2-yl) -5-hydroxyphenyl Chemical group 0.000 description 85
- 239000000178 monomer Substances 0.000 description 53
- 239000003431 cross linking reagent Substances 0.000 description 44
- 150000001875 compounds Chemical class 0.000 description 21
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- 125000000524 functional group Chemical group 0.000 description 16
- 239000003999 initiator Substances 0.000 description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 14
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 description 10
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- 239000004593 Epoxy Substances 0.000 description 9
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- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 8
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 8
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- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 8
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- 150000003839 salts Chemical class 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 6
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- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
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- 239000004014 plasticizer Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000012964 benzotriazole Substances 0.000 description 5
- 230000008033 biological extinction Effects 0.000 description 5
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- 238000002309 gasification Methods 0.000 description 5
- 125000000623 heterocyclic group Chemical group 0.000 description 5
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- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229940113165 trimethylolpropane Drugs 0.000 description 5
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 4
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 4
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- 125000003700 epoxy group Chemical group 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
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- 239000000758 substrate Substances 0.000 description 4
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- SITYOOWCYAYOKL-UHFFFAOYSA-N 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-(3-dodecoxy-2-hydroxypropoxy)phenol Chemical compound OC1=CC(OCC(O)COCCCCCCCCCCCC)=CC=C1C1=NC(C=2C(=CC(C)=CC=2)C)=NC(C=2C(=CC(C)=CC=2)C)=N1 SITYOOWCYAYOKL-UHFFFAOYSA-N 0.000 description 3
- VMRIVYANZGSGRV-UHFFFAOYSA-N 4-phenyl-2h-triazin-5-one Chemical compound OC1=CN=NN=C1C1=CC=CC=C1 VMRIVYANZGSGRV-UHFFFAOYSA-N 0.000 description 3
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 229920002367 Polyisobutene Polymers 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 3
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- 239000003963 antioxidant agent Substances 0.000 description 3
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- 229940088516 cipro Drugs 0.000 description 3
- DIOIOSKKIYDRIQ-UHFFFAOYSA-N ciprofloxacin hydrochloride Chemical compound Cl.C12=CC(N3CCNCC3)=C(F)C=C2C(=O)C(C(=O)O)=CN1C1CC1 DIOIOSKKIYDRIQ-UHFFFAOYSA-N 0.000 description 3
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- 239000011737 fluorine Substances 0.000 description 3
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- 125000000542 sulfonic acid group Chemical group 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
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- 230000004580 weight loss Effects 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 2
- OLFNXLXEGXRUOI-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-phenylpropan-2-yl)phenol Chemical compound C=1C(N2N=C3C=CC=CC3=N2)=C(O)C(C(C)(C)C=2C=CC=CC=2)=CC=1C(C)(C)C1=CC=CC=C1 OLFNXLXEGXRUOI-UHFFFAOYSA-N 0.000 description 2
- UZUNCLSDTUBVCN-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-6-(2-phenylpropan-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound C=1C(C(C)(C)CC(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C(O)C=1C(C)(C)C1=CC=CC=C1 UZUNCLSDTUBVCN-UHFFFAOYSA-N 0.000 description 2
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- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
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- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
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- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
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- 238000000227 grinding Methods 0.000 description 2
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- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 2
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- Adhesive Tapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
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Abstract
本発明の粘着シートは、レーザー光照射によりガスを発生するガス発生層を備え、該ガス発生層のナノインデンテーション法による弾性率Er(gas)[単位:MPa]と厚みh(gas)[単位:μm]が、下記式(1)を満たす。
Log(Er(gas)×106)≧8.01×h(gas)−0.116・・・(1)
1つの実施形態においては、上記粘着シートは、波長360nmの光透過率が、0%〜35%である。
1つの実施形態においては、上記粘着シートは、波長380nmの光透過率が、10%〜100%である。
Description
Log(Er(gas)×106)≧8.01×h(gas)−0.116・・・(1)
1つの実施形態においては、上記粘着シートは、波長360nmの光透過率が、0%〜40%である。
1つの実施形態においては、上記粘着シートは、波長380nmの光透過率が、10%〜100%である。
1つの実施形態においては、上記ガス発生層が、紫外線吸収剤を含み、該紫外線吸収剤の最大吸収波長が、360nm以下である。
1つの実施形態においては、上記ガス発生層が、活性エネルギー線硬化型組成物の硬化物である。
1つの実施形態においては、上記ガス発生層が、アクリル系ポリマーを含む。
1つの実施形態においては、上記粘着シートは、上記ガス発生層の少なくとも片側にガスバリア層を備え、該ガスバリア層のナノインデンテーション法による弾性率が、0.1MPa〜100MPaである。
1つの実施形態においては、上記ガスバリア層の厚みが、0.1μm〜50μmである。
1つの実施形態においては、上記バリア層が、粘着性を示す。
1つの実施形態においては、上記粘着シートは、波長500nmの光透過率が、70%〜100%である。
1つの実施形態においては、上記粘着シートは、ヘイズ値が、50%以下である。
1つの実施形態においては、上記粘着シートの表面が、レーザー光照射により、変形する。
1つの実施形態においては、上記粘着シートの表面が、レーザー光照射により、凸状に変形する。
1つの実施形態においては、上記粘着シートへのレーザー光照射による該粘着シート表面の水平変位が、50μm以下である。
本発明の別の局面によれば、電子部品の処理方法が提供される。この電子部品の処理方法は、上記粘着シート上に電子部品を貼着すること、および、該粘着シートにレーザー光を照射して該粘着シートから該電子部品を剥離することを含む。
1つの実施形態においては、上記電子部品の剥離が、位置選択的に行われる。
1つの実施形態においては、上記電子部品の処理方法は、上記粘着シートに上記電子部品を貼着した後、該粘着シートから該電子部品を剥離する前に、該電子部品に所定の処理を行うことを含む。
1つの実施形態においては、上記処理が、グラインド加工、ダイシング加工、ダイボンディング、ワイヤーボンディング、エッチング、蒸着、モールディング、回路形成、検査、検品、洗浄、転写、配列、リペアまたはデバイス表面の保護である。
1つの実施形態においては、上記粘着シートから前記電子部品を剥離した後、電子部品を別のシートに配置することを含む。
図1(a)は、本発明の1つの実施形態による粘着シートの概略断面図である。この実施形態による粘着シート100は、ガス発生層10を備える。図1(b)は、本発明の別の実施形態による粘着シートの概略断面図である。この実施形態による粘着シート200は、ガス発生層10の少なくとも片面に配置されたガスバリア層20をさらに備える。図1(a)に示すように、粘着シート100は、ガス発生層10の片面に基材30をさらに備えていてもよい。また、図1(b)に示すように、ガス発生層10とガスバリア層20を備える場合、粘着シート200は、ガス発生層10のガスバリア層20とは反対側に、基材30をさらに備えていてもよい。また、粘着シートは、本発明の効果が得られる限り、任意の適切なその他の層をさらに含んでいてもよい。1つの実施形態においては、上記粘着シートは、ガス発生層のガスバリア層とは反対側に配置された粘着剤層をさらに備え得る。粘着剤層の形態は限定されず、硬化型の粘着剤層であってもよく、感圧型の粘着剤層であってもよい。図示していないが、本発明の粘着シートは、使用に供するまでの間、粘着面を保護する目的で、ガス発生層またはガスバリア層の外側に剥離ライナーが設けられていてもよい。
ガス発生層は、紫外線吸収可能な層であり得る。代表的には、ガス発生層は、紫外線吸収剤を含む。紫外線吸収剤を含むことにより、レーザー光を吸収してガス化し得るガス発生層を形成することができる。
Log(Er(gas)×106)≧8.01×h(gas)−0.116・・・(1)
本発明においては、ガス発生層が上記式(1)を満足するように構成されていることにより、ガス発生層から発生したガスによる過度な変形が防止され、レーザー光照射により良好に粘着シートが変形する。このようなガス発生層を形成することにより、過度な変形を防止する層として厚いバリア層を配置することなく、微小な範囲での表面変形を生じさせることができる。より具体的には、ガス発生層単体で表面変形させたり、ガスバリア層を柔軟に構成させることができる。
Log(Er(gas)×106)≧7.66×h(gas)−0.092・・・(2)
Log(Er(gas)×106)≧7.52×h(gas)−0.081・・・(3)
このような範囲であれば、上記効果がより顕著となる。
Log(Er(gas)×106)≦47.675×h(gas)−0.519・・・(4)
紫外線吸収剤としては、紫外線(例えば、波長360nm以下)を吸収する化合物であれば、任意の適切な紫外線吸収剤が用いられ得る。紫外線吸収剤としては、例えば、ベンゾトリアゾール系紫外線吸収剤、ベンゾフェノン系紫外線吸収剤、トリアジン系紫外線吸収剤、サリチレート系紫外線吸収剤、シアノアクリレート系紫外線吸収剤等が挙げられる。なかでも好ましくは、トリアジン系紫外線吸収剤またはベンゾトリアゾール系紫外線吸収剤であり、特に好ましくはトリアジン系紫外線吸収剤である。特に、バインダー樹脂としてアクリル系ポリマーを用いる場合に、アクリル系ポリマーとの相溶性が高いことから、トリアジン系紫外線吸収剤は好ましく用いられ得る。トリアジン系紫外線吸収剤は、水酸基を有する化合物から構成されていることがより好ましく、ヒドロキシフェニルトリアジン系化合物から構成された紫外線吸収剤(ヒドロキシフェニルトリアジン系紫外線吸収剤)であることが特に好ましい。
活性エネルギー線硬化型組成物を用いることにより、好ましく弾性率が調整されたガス発生層を形成することができる。
上記ガスバリア層のナノインデンテーション法による弾性率は、好ましくは0.1MPa〜100MPaであり、より好ましくは0.2MPa〜50MPaであり、さらに好ましくは0.3MPa〜35MPaである。
上記基材のガス発生層とは反対側に配置される粘着剤層を構成する粘着剤としては、本発明の効果が得られる限りにおいて、任意の適切な粘着剤が用いられ得る。上記粘着剤としては、例えば、アクリル系粘着剤、シリコーン系粘着剤、ビニルアルキルエーテル系粘着剤、ポリエステル系粘着剤、ポリアミド系粘着剤、ウレタン系粘着剤、フッ素系粘着剤、スチレン−ジエンブロック共重合体系粘着剤、活性エネルギー線硬化型粘着剤等が挙げられる。中でも好ましくは、アクリル系粘着剤、ゴム系粘着剤またはシリコーン系粘着剤であり、より好ましくはアクリル系粘着剤である。
上記基材は、任意の適切な樹脂から構成され得る。該樹脂としては、例えば、ポリエチレン系樹脂、ポリプロピレン系樹脂、ポリブテン系樹脂、ポリメチルペンテン系樹脂等のポリオレフィン系樹脂、ポリウレタン系樹脂、ポリエステル系樹脂、ポリイミド系樹脂、ポリエーテルケトン系樹脂、ポリスチレン系樹脂、ポリ塩化ビニル系樹脂、ポリ塩化ビニリデン系樹脂、フッ素系樹脂、シリコン系樹脂、セルロース系樹脂、アイオノマー樹脂等が挙げられる。なかでも好ましくはポリオレフィン系樹脂である。
本発明の粘着シートは、任意の適切な方法により製造することができる。本発明の粘着シートは、例えば、所定の基材上に直接、活性エネルギー線硬化型組成物および紫外線吸収剤を含むガス発生層形成用組成物を塗工(塗布、硬化)してガス発生層を形成して得られ得る。また、粘着シートが、ガスバリア層を備える場合、当該ガス発生層上に粘着剤Aを含むガスバリア層形成用組成物を塗工して、粘着シートを得てもよい。また、各層を別々に形成した後に貼り合わせて粘着シートを形成してもよい。
本発明の電子部品の処理方法は、上記粘着シートに電子部品を貼着すること、および、当該粘着シートにレーザー光を照射して、当該粘着シートから電子部品を剥離することを含む。電子部品としては、例えば、半導体チップ、LEDチップ、MLCC等が挙げられる。
粘着シートのガスバリア層(実施例17においてはガス発生層)をSUS304BAに貼着して、当該粘着シートの対する粘着力を、JIS Z 0237:2000に準じた方法(貼り合わせ条件:2kgローラー1往復、引張速度:300mm/min、剥離角度180°、測定温度:23℃)により、測定した。また、粘着シートのガスバリア層(実施例17においてはガス発生層)をステンレス板などの支持体に貼り付け固定し、基材のガス発生層とは反対側に配置される粘着剤層をポリエチレンテレフタレートフィルム(東レ社製、商品名「ルミラーS10」、厚み:25μm)に貼着して、粘着剤層の粘着力を、JIS Z 0237:2000に準じた方法(貼り合わせ条件:2kgローラー1往復、引張速度:300mm/min、剥離角度180°、測定温度:23℃)により、測定した。
粘着シートを、分光光度計(商品名「UV−VIS紫外可視分光光度計 SolidSpec3700」、島津製作所社製)にセットして、入射光がサンプルのガスバリア層側に垂直に入射するようにして、300nm〜800nmの波長領域の光透過率を測定した。得られた透過スペクトルの360nm、380nmおよび500nmの波長における透過率を抽出した。
粘着シートの粘着剤層側を、ガラス板(松波硝子社製、大型スライドグラスS9112(標準大型白縁磨No.2))を貼り合わせて測定サンプルを得た。測定サンプルのガラス板側から、波長355nm、ビーム径約20μmφのUVレーザー光を用いて、0.80mW出力、周波数40kHzでパルススキャンして、ガス発生層からガスを発生させた。このような操作により生じた粘着シート表面(ガスバリア層表面、実施例17においてはガス発生層表面)の形状変化を観察した。
粘着シートの粘着剤層側にガラス板(松波硝子社製、大型スライドグラスS9112(標準大型白縁磨No.2))を貼り合わせて測定サンプルを得た。測定サンプルのガラス板側から、波長355nm、ビーム径約20μmφのUVレーザー光を用いて、0.80mW出力、周波数40kHzでパルススキャンして、ガス発生層からガスを発生させた。パルススキャンした任意の1スポットに対応するガスバリア層表面(実施例17においてはガス発生層表面)を、レーザー光照射から1分後、共焦点レーザー顕微鏡により観察して、垂直変位Yと水平変位X(直径;半値全幅)を測定した。
変位Yが1μm以上である場合、剥離性が優れ(表中、〇);変位Yが0.6μm以上1μm未満である場合、剥離性が良好であり(表中、△);変位Yが0.6μm未満である場合、剥離性が不十分である(表中、×)。変位Xが50μm以下である場合、剥離の位置選択性が優れ(表中、〇);変位Xが50μmを超える場合、剥離の位置選択性が不十分である(表中、×)。
ヘイズメーター(商品名「HAZE METER HM−150」,村上色彩技術研究所製)を使用して、粘着シートのヘイズ値を測定した。
紫外線吸収剤について、10%重量減少温度を測定した。
示差熱分析装置(TA Instruments社製、商品名「Discovery TGA」)を用いて、粘着シートを昇温温度10℃/分、N2雰囲気下、流量は25ml/分とし、重量が10%減少する温度を測定した。
(6)弾性率
ナノインデンター(Hysitron Inc社製Triboindenter TI−950)を用いて、所定温度(25℃)における単一押し込み法により、押し込み速度約500nm/sec、引き抜き速度約500nm/sec、押し込み深さ約1500nmの測定条件で、弾性率を測定した。
酢酸エチル中に、2−エチルヘキシルアクリレート95重量部と、アクリル酸5重量部と、重合開始剤として過酸化ベンゾイル0.15重量部とを加えた後、70℃に加熱してアクリル系共重合体(アクリルポリマーI)の酢酸エチル溶液を得た。
トルエン中に、2−エチルヘキシルアクリレート100重量部と、2−ヒドロキシエチルアクリレート12.6重量部と、重合開始剤として過酸化ベンゾイル0.25重量部とを加えた後、窒素ガス気流下60℃で重合反応を行い、これにメタクリロイルオキシエチルイソシアネート13.5部を加えて付加反応させることで、炭素―炭素二重結合を有するアクリル系共重合体(アクリルポリマーII)のトルエン溶液を得た。
(ガスバリア層形成用の粘着剤A(1)の調製)
アクリル系ポリマーIを100重量部含むアクリル系ポリマーの酢酸エチル溶液Iに、エポキシ系架橋剤(三菱ガス社製、商品名「TETRAD−C」)1重量部、イソシアネート架橋剤(日本ポリウレタン社製、商品名「コロネートL」)3重量部を加え、ガスバリア層形成用の粘着剤A(1)を調製した。
(ガス発生層形成用組成物の調製)
アクリル系ポリマーIIを100重量部含むアクリル系ポリマーのトルエン溶液Iに、イソシアネート系架橋剤(日本ポリウレタン社製、商品名「コロネートL」)0.2重量部と、光重合開始剤(BASF社製、商品名「Irgacure127」)3重量部と、紫外線吸収剤(BASF社製、商品名「Tinuvin400」)20重量部を加え、ガス発生層形成用組成物(1)を調製した。
(粘着剤(2)の調製)
アクリル系ポリマーIを100重量部含むアクリル系ポリマーの酢酸エチル溶液Iに、エポキシ系架橋剤(三菱ガス社製、商品名「TETRAD−C」)2重量部を加え、粘着剤(2)を調製した。
(粘着シート)
ポリエチレンテレフタレートフィルム(東レ社製、商品名「ルミラーS10」、厚み:50μm)の一方の面に、粘着剤(2)を溶剤揮発(乾燥)後の厚みが10μmとなるようにして、塗工して粘着剤層を形成した。
次いで、上記ポリエチレンテレフタレートフィルム(東レ社製、商品名「ルミラーS10」、厚み:50μm)の他方の面に、ガス発生層形成用組成物(1)を溶剤揮発(乾燥)後の厚みが10μmとなるよう塗工して、ガス発生層の前駆層を形成した。
次いで、ガスバリア層形成用の粘着剤A(1)を、シリコーン離型剤処理面付きポリエチレンテレフタレートフィルム(東レ社製、商品名「セラピール」厚み:38μm)に、溶剤揮発(乾燥)後の厚みが10μmとなるよう塗工して、ガスバリア層を形成した。
次いで、ガス発生層の前駆層とガスバリア層とを積層して、シリコーン離型剤処理面付きポリエチレンテレフタレートフィルムとポリエチレンテレフタレートフィルムに挟まれた粘着シート前駆体(ガスバリア層/ガス発生層/基材)を得た。この粘着シート前駆体のガスバリア層側のシリコーン離型剤処理面付きポリエチレンテレフタレートフィルム越しに、500mJ/cm2の紫外線を照射して、粘着シートを得た。上記紫外線照射は、紫外線照射装置(日東精機社製、商品名「UM−810」)を用いて、高圧水銀灯の紫外線(特性波長:365nm、積算光量:500mJ/cm2、照射エネルギー:70W/cm2、照射時間:7.1秒)をガス発生層に照射して行った。
得られた粘着シートを上記評価(1)〜(6)に供した。結果を表1に示す。
ガスバリア層の厚み、ガス発生層の厚み、紫外線吸収剤の配合量、架橋剤の配合量を表1のとおりとしたこと以外は、実施例1と同様にして、粘着シートを得た。得られた粘着シートを上記評価(1)〜(6)に供した。結果を表1〜4に示す。なお、実施例10〜13および17、ならびに比較例3〜5は、ガス発生層への紫外線照射をせずに、当該ガス発生層を形成した。
実施例1と同様にして、ガス発生層形成用組成物(1)を調製した。
実施例1と同様にして、粘着剤(2)を調製した。
ポリエチレンテレフタレートフィルム(東レ社製、商品名「ルミラーS10」、厚み:50μm)の一方の面に、粘着剤(2)を溶剤揮発(乾燥)後の厚みが10μmとなるようにして、塗工して粘着剤層を形成した。ポリエチレンテレフタレートフィルム(東レ社製、商品名「ルミラーS10」、厚み:50μm)の他方の面に、ガス発生層形成用組成物(1)を溶剤揮発(乾燥)後の厚みが10μmとなるよう塗工して、ガス発生層の前駆層を形成した。
このようにして得られた粘着シートを上記評価(1)〜(6)に供した。結果を表3に示す。
20 ガスバリア層
100、200 粘着シート
Claims (19)
- レーザー光照射によりガスを発生するガス発生層を備え、
該ガス発生層のナノインデンテーション法による弾性率Er(gas)[単位:MPa]と厚みh(gas)[単位:μm]が、下記式(1)を満たす、粘着シート。
Log(Er(gas)×106)≧8.01×h(gas)−0.116・・・(1) - 波長360nmの光透過率が、0%〜40%である、請求項1に記載の粘着シート。
- 波長380nmの光透過率が、10%〜100%である、請求項1または2に記載の粘着シート。
- 前記ガス発生層が、紫外線吸収剤を含み、
該紫外線吸収剤の最大吸収波長が、360nm以下である、
請求項1から3のいずれかに記載の粘着シート。 - 前記ガス発生層が、活性エネルギー線硬化型組成物の硬化物である、請求項1から4のいずれかに記載の粘着シート。
- 前記ガス発生層が、アクリル系ポリマーを含む、請求項1から5のいずれかに記載の粘着シート。
- 前記ガス発生層の少なくとも片側にガスバリア層を備え、
該ガスバリア層のナノインデンテーション法による弾性率が、0.1MPa〜100MPaである、
請求項1から6のいずれかに記載の粘着シート。 - 前記ガスバリア層の厚みが、0.1μm〜50μmである、請求項7に記載の粘着シート。
- 前記バリア層が、粘着性を示す、請求項1から8のいずれかに記載の粘着シート。
- 波長500nmの光透過率が、70%〜100%である、請求項1から9のいずれかに記載の粘着シート。
- ヘイズ値が、50%以下である、請求項1から10のいずれかに記載の粘着シート。
- 前記粘着シートの表面が、レーザー光照射により、変形する、請求項1から11のいずれかに記載の粘着シート。
- 前記粘着シートの表面が、レーザー光照射により、凸状に変形する、請求項12に記載の粘着シート。
- 前記粘着シートへのレーザー光照射による該粘着シート表面の水平変位が、50μm以下である、請求項12または13のいずれかに記載の粘着シート。
- 請求項1から14のいずれかに記載の粘着シート上に電子部品を貼着すること、および、該粘着シートにレーザー光を照射して該粘着シートから該電子部品を剥離することを含む、電子部品の処理方法。
- 前記電子部品の剥離が、位置選択的に行われる、請求項15に記載の電子部品の処理方法。
- 前記粘着シートに前記電子部品を貼着した後、該粘着シートから該電子部品を剥離する前に、
該電子部品に所定の処理を行うことを含む、
請求項15または16に記載の電子部品の処理方法。 - 前記処理が、グラインド加工、ダイシング加工、ダイボンディング、ワイヤーボンディング、エッチング、蒸着、モールディング、回路形成、検査、検品、洗浄、転写、配列、リペアまたはデバイス表面の保護である、請求項17に記載の電子部品の処理方法。
- 前記粘着シートから前記電子部品を剥離した後、電子部品を別のシートに配置することを含む、請求項15から18のいずれかに記載の電子部品の処理方法。
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Application Number | Priority Date | Filing Date | Title |
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JP2019237687 | 2019-12-27 | ||
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JP2003342540A (ja) * | 2002-05-28 | 2003-12-03 | Asahi Kasei Corp | 半導体加工用粘着シート |
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JP2010202833A (ja) * | 2009-03-05 | 2010-09-16 | Sekisui Chem Co Ltd | 電子部品加工用粘着テープ |
JP2018141086A (ja) * | 2017-02-28 | 2018-09-13 | 日東電工株式会社 | 粘着テープ |
JP2018182276A (ja) * | 2017-04-17 | 2018-11-15 | 日東電工株式会社 | ダイシングダイボンドフィルム |
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JP3594853B2 (ja) | 1999-11-08 | 2004-12-02 | 日東電工株式会社 | 加熱剥離型粘着シート |
JP2004186200A (ja) * | 2002-11-29 | 2004-07-02 | Sekisui Chem Co Ltd | 半導体チップの製造方法 |
JP2005097507A (ja) * | 2003-09-02 | 2005-04-14 | Sekisui Chem Co Ltd | 粘着テープ |
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JP2003342540A (ja) * | 2002-05-28 | 2003-12-03 | Asahi Kasei Corp | 半導体加工用粘着シート |
JP2010129699A (ja) * | 2008-11-26 | 2010-06-10 | Nitto Denko Corp | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP2010202833A (ja) * | 2009-03-05 | 2010-09-16 | Sekisui Chem Co Ltd | 電子部品加工用粘着テープ |
JP2018141086A (ja) * | 2017-02-28 | 2018-09-13 | 日東電工株式会社 | 粘着テープ |
JP2018182276A (ja) * | 2017-04-17 | 2018-11-15 | 日東電工株式会社 | ダイシングダイボンドフィルム |
JP2019070104A (ja) * | 2017-10-06 | 2019-05-09 | 積水化学工業株式会社 | 表面保護フィルム |
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EP4345143A1 (en) * | 2022-09-27 | 2024-04-03 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet |
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EP4083156A4 (en) | 2024-02-21 |
US20220372349A1 (en) | 2022-11-24 |
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