JP6860933B2 - 電解ニッケル（合金）めっき液 - Google Patents
電解ニッケル（合金）めっき液 Download PDFInfo
- Publication number
- JP6860933B2 JP6860933B2 JP2018518251A JP2018518251A JP6860933B2 JP 6860933 B2 JP6860933 B2 JP 6860933B2 JP 2018518251 A JP2018518251 A JP 2018518251A JP 2018518251 A JP2018518251 A JP 2018518251A JP 6860933 B2 JP6860933 B2 JP 6860933B2
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- plating solution
- electrolytic
- electrolytic nickel
- pyridinium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims description 138
- 238000007747 plating Methods 0.000 title claims description 112
- 229910052759 nickel Inorganic materials 0.000 title claims description 68
- 229910045601 alloy Inorganic materials 0.000 title description 13
- 239000000956 alloy Substances 0.000 title description 13
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 29
- 125000004432 carbon atom Chemical group C* 0.000 claims description 26
- -1 N-substituted carbonyl pyridinium compound Chemical class 0.000 claims description 25
- 125000000217 alkyl group Chemical group 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 22
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 15
- 150000003839 salts Chemical class 0.000 claims description 14
- 238000009713 electroplating Methods 0.000 claims description 11
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 150000002815 nickel Chemical class 0.000 claims description 9
- 125000002947 alkylene group Chemical group 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000006174 pH buffer Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 150000004820 halides Chemical class 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- 125000003277 amino group Chemical group 0.000 claims description 6
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 3
- 150000001450 anions Chemical class 0.000 claims description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004327 boric acid Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 3
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 3
- UMXSWZIKKAZRTE-UHFFFAOYSA-N 1-pyridin-1-ium-1-ylpropan-2-one Chemical compound CC(=O)C[N+]1=CC=CC=C1 UMXSWZIKKAZRTE-UHFFFAOYSA-N 0.000 claims description 2
- IGDWJIQHPFTNGW-UHFFFAOYSA-N 2-[1-(dimethylcarbamoyl)pyridin-1-ium-4-yl]ethanesulfonic acid;hydroxide Chemical compound [OH-].CN(C)C(=O)[N+]1=CC=C(CCS(O)(=O)=O)C=C1 IGDWJIQHPFTNGW-UHFFFAOYSA-N 0.000 claims description 2
- ZJVYOVDSOZMWFU-UHFFFAOYSA-O 2-pyridin-1-ium-1-ylacetamide Chemical compound NC(=O)C[N+]1=CC=CC=C1 ZJVYOVDSOZMWFU-UHFFFAOYSA-O 0.000 claims description 2
- HMHYMVIXYCISRO-UHFFFAOYSA-O 2-pyridin-1-ium-1-ylacetohydrazide Chemical compound NNC(=O)C[N+]1=CC=CC=C1 HMHYMVIXYCISRO-UHFFFAOYSA-O 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 2
- NICWIOZJYAGTGJ-UHFFFAOYSA-N [OH-].C(N)(=O)C[N+]1=CC=C(C=C1)CCS(=O)(=O)O Chemical compound [OH-].C(N)(=O)C[N+]1=CC=C(C=C1)CCS(=O)(=O)O NICWIOZJYAGTGJ-UHFFFAOYSA-N 0.000 claims description 2
- SKTXLQRDPWAZOL-UHFFFAOYSA-N [OH-].C(N)(=O)[N+]1=CC=C(C=C1)CCS(=O)(=O)O Chemical compound [OH-].C(N)(=O)[N+]1=CC=C(C=C1)CCS(=O)(=O)O SKTXLQRDPWAZOL-UHFFFAOYSA-N 0.000 claims description 2
- JAUNGCPWVJWFFA-UHFFFAOYSA-N [OH-].CN(C(=O)[N+]1=CC=C(C=C1)CC(C)S(=O)(=O)O)C Chemical compound [OH-].CN(C(=O)[N+]1=CC=C(C=C1)CC(C)S(=O)(=O)O)C JAUNGCPWVJWFFA-UHFFFAOYSA-N 0.000 claims description 2
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 claims description 2
- RCGNHGCURFGYGT-UHFFFAOYSA-N n,n-dimethylpyridin-1-ium-1-carboxamide Chemical compound CN(C)C(=O)[N+]1=CC=CC=C1 RCGNHGCURFGYGT-UHFFFAOYSA-N 0.000 claims description 2
- 229940078494 nickel acetate Drugs 0.000 claims description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 2
- UQPSGBZICXWIAG-UHFFFAOYSA-L nickel(2+);dibromide;trihydrate Chemical compound O.O.O.Br[Ni]Br UQPSGBZICXWIAG-UHFFFAOYSA-L 0.000 claims description 2
- HZPNKQREYVVATQ-UHFFFAOYSA-L nickel(2+);diformate Chemical compound [Ni+2].[O-]C=O.[O-]C=O HZPNKQREYVVATQ-UHFFFAOYSA-L 0.000 claims description 2
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 claims description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 2
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 claims description 2
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 claims description 2
- VGTPKLINSHNZRD-UHFFFAOYSA-N oxoborinic acid Chemical compound OB=O VGTPKLINSHNZRD-UHFFFAOYSA-N 0.000 claims description 2
- UGZVCHWAXABBHR-UHFFFAOYSA-O pyridin-1-ium-1-carboxamide Chemical compound NC(=O)[N+]1=CC=CC=C1 UGZVCHWAXABBHR-UHFFFAOYSA-O 0.000 claims description 2
- 239000011975 tartaric acid Substances 0.000 claims description 2
- 235000002906 tartaric acid Nutrition 0.000 claims description 2
- UPPLJLAHMKABPR-UHFFFAOYSA-H 2-hydroxypropane-1,2,3-tricarboxylate;nickel(2+) Chemical compound [Ni+2].[Ni+2].[Ni+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O UPPLJLAHMKABPR-UHFFFAOYSA-H 0.000 claims 1
- RNEWBGAUOHSITB-UHFFFAOYSA-N [OH-].C(N)(=O)[N+]1=CC=C(C=C1)CC(C)S(=O)(=O)O Chemical compound [OH-].C(N)(=O)[N+]1=CC=C(C=C1)CC(C)S(=O)(=O)O RNEWBGAUOHSITB-UHFFFAOYSA-N 0.000 claims 1
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 claims 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- OENLEHTYJXMVBG-UHFFFAOYSA-N pyridine;hydrate Chemical compound [OH-].C1=CC=[NH+]C=C1 OENLEHTYJXMVBG-UHFFFAOYSA-N 0.000 claims 1
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 claims 1
- 239000000243 solution Substances 0.000 description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 8
- 238000001000 micrograph Methods 0.000 description 8
- 239000000654 additive Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000004220 aggregation Methods 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 0 CC*[N+](CC)[O-] Chemical compound CC*[N+](CC)[O-] 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- PHRIYVTYVBBUAY-UHFFFAOYSA-N N,N-diethylpyridin-1-ium-1-carboxamide Chemical compound C(C)N(C(=O)[N+]1=CC=CC=C1)CC PHRIYVTYVBBUAY-UHFFFAOYSA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229940006460 bromide ion Drugs 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-M iodide Chemical compound [I-] XMBWDFGMSWQBCA-UHFFFAOYSA-M 0.000 description 1
- 229940006461 iodide ion Drugs 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000006179 pH buffering agent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/18—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016099184 | 2016-05-18 | ||
| JP2016099184 | 2016-05-18 | ||
| PCT/JP2017/017832 WO2017199835A1 (ja) | 2016-05-18 | 2017-05-11 | 電解ニッケル（合金）めっき液 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2017199835A1 JPWO2017199835A1 (ja) | 2019-03-14 |
| JP6860933B2 true JP6860933B2 (ja) | 2021-04-21 |
Family
ID=60325868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018518251A Active JP6860933B2 (ja) | 2016-05-18 | 2017-05-11 | 電解ニッケル（合金）めっき液 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6860933B2 (zh) |
| KR (1) | KR102354192B1 (zh) |
| CN (1) | CN109154093B (zh) |
| TW (1) | TWI726101B (zh) |
| WO (1) | WO2017199835A1 (zh) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4383073A (en) * | 1981-08-20 | 1983-05-10 | The Dow Chemical Company | Cationic resin curable with acid catalyzed cross-linkers |
| US5547832A (en) * | 1992-07-07 | 1996-08-20 | Eastman Kodak Company | Method for hardening photographic materials |
| ATE465283T1 (de) * | 2008-02-29 | 2010-05-15 | Atotech Deutschland Gmbh | Pyrophosphat-basiertes bad zur abscheidung von zinn-legierungsschichten |
| EP2801640A1 (en) * | 2013-05-08 | 2014-11-12 | ATOTECH Deutschland GmbH | Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy |
| WO2014204620A1 (en) * | 2013-06-17 | 2014-12-24 | Applied Materials, Inc. | Method for copper plating through silicon vias using wet wafer back contact |
| JP6214355B2 (ja) * | 2013-11-25 | 2017-10-18 | 日本高純度化学株式会社 | 電解金めっき液及びそれを用いて得られた金皮膜 |
-
2017
- 2017-05-11 WO PCT/JP2017/017832 patent/WO2017199835A1/ja active Application Filing
- 2017-05-11 KR KR1020187032988A patent/KR102354192B1/ko active IP Right Grant
- 2017-05-11 JP JP2018518251A patent/JP6860933B2/ja active Active
- 2017-05-11 CN CN201780030115.7A patent/CN109154093B/zh active Active
- 2017-05-16 TW TW106116109A patent/TWI726101B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109154093B (zh) | 2020-11-27 |
| KR20190008232A (ko) | 2019-01-23 |
| JPWO2017199835A1 (ja) | 2019-03-14 |
| TW201807261A (zh) | 2018-03-01 |
| WO2017199835A1 (ja) | 2017-11-23 |
| CN109154093A (zh) | 2019-01-04 |
| TWI726101B (zh) | 2021-05-01 |
| KR102354192B1 (ko) | 2022-01-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5568250B2 (ja) | 銅を充填する方法 | |
| JP4816901B2 (ja) | 電気銅めっき浴 | |
| JP2015029027A (ja) | プリント配線板 | |
| JP5578697B2 (ja) | 銅充填方法 | |
| JP6079150B2 (ja) | めっきによる貫通孔の銅充填方法 | |
| KR20150078689A (ko) | 피리디늄계 평탄제를 포함한 구리 도금액 및 이를 이용한 구리 도금 방법 | |
| KR20150079077A (ko) | 퀴놀리늄계 평탄제를 포함하는 구리 도금액 및 이를 이용한 구리 도금 방법 | |
| JP2014225521A (ja) | プリント配線板 | |
| JPWO2006018872A1 (ja) | 銅めっき用添加剤およびこれを用いる電子回路基板の製造方法 | |
| JP2004250791A (ja) | 電気めっき組成物 | |
| JP7021781B2 (ja) | 電解ニッケル（合金）めっき液 | |
| JP6860933B2 (ja) | 電解ニッケル（合金）めっき液 | |
| KR20150047057A (ko) | 구리 도금액 및 이를 이용한 구리 도금 방법 | |
| JP2014224304A (ja) | プリント基板用銅メッキ液組成物およびこれを用いたビアホール充填方法 | |
| KR102277675B1 (ko) | 브롬 이온을 포함한 구리 전해도금용 전해질 용액 및 이를 이용한 구리 전해도금 방법 | |
| KR101754913B1 (ko) | 요오드 이온을 포함한 구리 전해도금용 전해질 용액 및 이를 이용한 구리 전해도금 방법 | |
| JP4354139B2 (ja) | 配線基板の製造方法 | |
| JP2002302789A (ja) | 電解質 | |
| JP2006339483A (ja) | 配線基板の製造方法及び配線基板 | |
| JP2018115391A (ja) | 基板めっき用組成物及びこれを用いためっき方法 | |
| KR102445575B1 (ko) | 도금용 평활제, 이를 포함하는 도금용 조성물 및 구리 배선의 형성방법 | |
| KR20230099459A (ko) | 구리 도금 조성물 | |
| JP2005307259A (ja) | 埋め込み用硫酸銅めっき液及びそれを用いた銅めっき方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200501 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210224 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210322 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6860933 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |