JP6860510B2 - パワー半導体モジュール用のばね要素 - Google Patents

パワー半導体モジュール用のばね要素 Download PDF

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Publication number
JP6860510B2
JP6860510B2 JP2017566357A JP2017566357A JP6860510B2 JP 6860510 B2 JP6860510 B2 JP 6860510B2 JP 2017566357 A JP2017566357 A JP 2017566357A JP 2017566357 A JP2017566357 A JP 2017566357A JP 6860510 B2 JP6860510 B2 JP 6860510B2
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JP
Japan
Prior art keywords
contact
component
spring element
contact portion
power semiconductor
Prior art date
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Active
Application number
JP2017566357A
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English (en)
Japanese (ja)
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JP2018520517A5 (https=
JP2018520517A (ja
Inventor
ドゥガル，フランク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Schweiz AG
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ABB Schweiz AG
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Publication date
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Publication of JP2018520517A publication Critical patent/JP2018520517A/ja
Publication of JP2018520517A5 publication Critical patent/JP2018520517A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Springs (AREA)
  • Die Bonding (AREA)
  • Connecting Device With Holders (AREA)
JP2017566357A 2015-06-22 2016-06-20 パワー半導体モジュール用のばね要素 Active JP6860510B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15173145 2015-06-22
EP15173145.2 2015-06-22
PCT/EP2016/064223 WO2016207118A1 (en) 2015-06-22 2016-06-20 Spring element for a power semiconductor module

Publications (3)

Publication Number Publication Date
JP2018520517A JP2018520517A (ja) 2018-07-26
JP2018520517A5 JP2018520517A5 (https=) 2019-07-04
JP6860510B2 true JP6860510B2 (ja) 2021-04-14

Family

ID=53476749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017566357A Active JP6860510B2 (ja) 2015-06-22 2016-06-20 パワー半導体モジュール用のばね要素

Country Status (5)

Country Link
US (1) US10573620B2 (https=)
EP (1) EP3311406B1 (https=)
JP (1) JP6860510B2 (https=)
CN (1) CN107949908B (https=)
WO (1) WO2016207118A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113097764B (zh) * 2020-01-08 2022-06-24 富士康(昆山)电脑接插件有限公司 导电端子
DE102020111526B3 (de) * 2020-04-28 2021-06-02 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Einpresskontaktelement
US11877937B2 (en) * 2020-10-16 2024-01-23 Accenture Global Solutions Limited Springs with strain feedback
EP4239211A4 (en) * 2020-10-28 2024-06-12 NHK Spring Co., Ltd. SPRING ELEMENT
EP4071791A1 (en) 2021-04-09 2022-10-12 Hitachi Energy Switzerland AG Spring element for a press contact in a power semiconductor module, and method for manufacturing the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2725847C3 (de) * 1977-06-08 1980-05-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Anordnung zur Druckkontaktierung einer Halbleiterscheibe
DE19843309A1 (de) 1998-09-22 2000-03-23 Asea Brown Boveri Kurzschlussfestes IGBT Modul
DE19903245A1 (de) * 1999-01-27 2000-08-03 Asea Brown Boveri Leistungshalbleitermodul
TW547797U (en) * 2002-01-11 2003-08-11 Hon Hai Prec Ind Co Ltd Socket connector
CN100583566C (zh) * 2003-08-22 2010-01-20 Abb瑞士有限公司 用于功率半导体模块中的接触设备的压力接触弹簧
JP2007173198A (ja) * 2005-11-25 2007-07-05 Hitachi Cable Ltd 電気コンタクト及びメス端子
US20090179315A1 (en) * 2008-01-14 2009-07-16 Armand Vincent Jereza Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same
EP2503595A1 (en) 2011-02-18 2012-09-26 ABB Research Ltd. Power semiconductor module and method of manufacturing a power semiconductor module
JP5529208B2 (ja) * 2011-08-25 2014-06-25 トヨタ自動車株式会社 パワーモジュールの構造及び成形方法
JP2013102065A (ja) * 2011-11-09 2013-05-23 Meidensha Corp 半導体モジュール及び電極部材
KR101443980B1 (ko) * 2012-11-27 2014-09-23 삼성전기주식회사 접속핀 및 이를 갖는 전력 모듈 패키지
EP2827366A1 (en) 2013-07-18 2015-01-21 ABB Technology AG Power semiconductor module
JP6372997B2 (ja) * 2013-12-03 2018-08-15 株式会社エンプラス 電気部品用ソケット

Also Published As

Publication number Publication date
US20180122768A1 (en) 2018-05-03
CN107949908B (zh) 2020-04-17
EP3311406B1 (en) 2019-01-02
EP3311406A1 (en) 2018-04-25
CN107949908A (zh) 2018-04-20
WO2016207118A1 (en) 2016-12-29
JP2018520517A (ja) 2018-07-26
US10573620B2 (en) 2020-02-25

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