JP6860334B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6860334B2
JP6860334B2 JP2016236918A JP2016236918A JP6860334B2 JP 6860334 B2 JP6860334 B2 JP 6860334B2 JP 2016236918 A JP2016236918 A JP 2016236918A JP 2016236918 A JP2016236918 A JP 2016236918A JP 6860334 B2 JP6860334 B2 JP 6860334B2
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Prior art keywords
metal layer
semiconductor chip
semiconductor device
semiconductor
electrode
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JP2016236918A
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Japanese (ja)
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JP2018093114A (ja
JP2018093114A5 (https=
Inventor
達郎 刀禰館
達郎 刀禰館
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Toshiba Corp
Toshiba Electronic Devices and Storage Corp
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Toshiba Corp
Toshiba Electronic Devices and Storage Corp
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Priority to JP2016236918A priority Critical patent/JP6860334B2/ja
Priority to US15/688,572 priority patent/US20180158762A1/en
Publication of JP2018093114A publication Critical patent/JP2018093114A/ja
Publication of JP2018093114A5 publication Critical patent/JP2018093114A5/ja
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2016236918A 2016-12-06 2016-12-06 半導体装置 Active JP6860334B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016236918A JP6860334B2 (ja) 2016-12-06 2016-12-06 半導体装置
US15/688,572 US20180158762A1 (en) 2016-12-06 2017-08-28 Semiconductor device

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Application Number Priority Date Filing Date Title
JP2016236918A JP6860334B2 (ja) 2016-12-06 2016-12-06 半導体装置

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JP2018093114A JP2018093114A (ja) 2018-06-14
JP2018093114A5 JP2018093114A5 (https=) 2019-03-14
JP6860334B2 true JP6860334B2 (ja) 2021-04-14

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Publication number Priority date Publication date Assignee Title
JP7059914B2 (ja) * 2018-12-12 2022-04-26 株式会社デンソー 半導体モジュール
JP7103256B2 (ja) * 2019-02-13 2022-07-20 株式会社デンソー 半導体装置
EP3955277A1 (en) * 2020-08-10 2022-02-16 Infineon Technologies AG Semiconductor device and method for fabricating the same
CN116806368A (zh) * 2021-01-29 2023-09-26 华为技术有限公司 集成电路封装件及其制备方法和终端
JP7704699B2 (ja) * 2022-03-09 2025-07-08 株式会社東芝 半導体装置

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US8169062B2 (en) * 2002-07-02 2012-05-01 Alpha And Omega Semiconductor Incorporated Integrated circuit package for semiconductior devices with improved electric resistance and inductance
JP2005158871A (ja) * 2003-11-21 2005-06-16 Denso Corp パッケージ型半導体装置
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