JP6845452B1 - はんだ接合不良抑制剤、フラックスおよびソルダペースト - Google Patents

はんだ接合不良抑制剤、フラックスおよびソルダペースト Download PDF

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Publication number
JP6845452B1
JP6845452B1 JP2020061211A JP2020061211A JP6845452B1 JP 6845452 B1 JP6845452 B1 JP 6845452B1 JP 2020061211 A JP2020061211 A JP 2020061211A JP 2020061211 A JP2020061211 A JP 2020061211A JP 6845452 B1 JP6845452 B1 JP 6845452B1
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Japan
Prior art keywords
mass
solder
flux
present
inhibitor
Prior art date
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Active
Application number
JP2020061211A
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English (en)
Japanese (ja)
Other versions
JP2021159921A (ja
Inventor
智子 永井
智子 永井
和順 ▲高▼木
和順 ▲高▼木
愛 浅見
愛 浅見
善範 ▲高▼木
善範 ▲高▼木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP2020061211A priority Critical patent/JP6845452B1/ja
Priority to PCT/JP2021/009755 priority patent/WO2021200010A1/ja
Priority to CN202180003711.2A priority patent/CN113905847B/zh
Application granted granted Critical
Publication of JP6845452B1 publication Critical patent/JP6845452B1/ja
Priority to TW110110487A priority patent/TWI748901B/zh
Publication of JP2021159921A publication Critical patent/JP2021159921A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2020061211A 2020-03-30 2020-03-30 はんだ接合不良抑制剤、フラックスおよびソルダペースト Active JP6845452B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020061211A JP6845452B1 (ja) 2020-03-30 2020-03-30 はんだ接合不良抑制剤、フラックスおよびソルダペースト
PCT/JP2021/009755 WO2021200010A1 (ja) 2020-03-30 2021-03-11 はんだ接合不良抑制剤、フラックスおよびソルダペースト
CN202180003711.2A CN113905847B (zh) 2020-03-30 2021-03-11 焊料接合不良抑制剂、焊剂和焊膏
TW110110487A TWI748901B (zh) 2020-03-30 2021-03-24 焊料接合不良抑制劑、焊劑和焊膏

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020061211A JP6845452B1 (ja) 2020-03-30 2020-03-30 はんだ接合不良抑制剤、フラックスおよびソルダペースト

Publications (2)

Publication Number Publication Date
JP6845452B1 true JP6845452B1 (ja) 2021-03-17
JP2021159921A JP2021159921A (ja) 2021-10-11

Family

ID=74860775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020061211A Active JP6845452B1 (ja) 2020-03-30 2020-03-30 はんだ接合不良抑制剤、フラックスおよびソルダペースト

Country Status (4)

Country Link
JP (1) JP6845452B1 (zh)
CN (1) CN113905847B (zh)
TW (1) TWI748901B (zh)
WO (1) WO2021200010A1 (zh)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS496022B1 (zh) * 1969-08-11 1974-02-12
US4165244A (en) * 1977-10-21 1979-08-21 Jacobs Norman L Soldering flux and method of using same
JPS5984842A (ja) * 1982-11-06 1984-05-16 Agency Of Ind Science & Technol シクロヘキサン環をもつジヒドロキシトリカルボン酸及びトリカルボン酸エステル
MY138347A (en) * 2000-11-29 2009-05-29 Senju Metal Industry Co Solder paste
US7767032B2 (en) * 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
US8071715B2 (en) * 2007-01-31 2011-12-06 Georgia-Pacific Chemicals Llc Maleated and oxidized fatty acids
JP6204007B2 (ja) * 2012-09-13 2017-09-27 株式会社タムラ製作所 フラックス組成物、ソルダーペースト組成物及びプリント配線基板
JP6215633B2 (ja) * 2013-09-30 2017-10-18 株式会社タムラ製作所 ロジン含有量を低減させたはんだ付け用フラックスおよびはんだペースト組成物
JP6392574B2 (ja) * 2014-07-30 2018-09-19 株式会社タムラ製作所 フラックス組成物、はんだ組成物、および電子基板の製造方法
CN105458552B (zh) * 2015-12-31 2018-07-17 深圳市兴鸿泰锡业有限公司 一种自动锡焊用高性能焊锡丝助焊剂及其制备方法
WO2017122341A1 (ja) * 2016-01-15 2017-07-20 千住金属工業株式会社 フラックス
JP6531958B2 (ja) * 2017-04-17 2019-06-19 千住金属工業株式会社 フラックス組成物及びソルダペースト組成物
JP6824208B2 (ja) * 2018-02-26 2021-02-03 株式会社タムラ製作所 フラックス及びソルダペースト

Also Published As

Publication number Publication date
TW202138470A (zh) 2021-10-16
JP2021159921A (ja) 2021-10-11
CN113905847A (zh) 2022-01-07
WO2021200010A1 (ja) 2021-10-07
CN113905847B (zh) 2023-09-01
TWI748901B (zh) 2021-12-01

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