JP6843341B2 - 半田付け評価方法およびその装置 - Google Patents

半田付け評価方法およびその装置 Download PDF

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JP6843341B2
JP6843341B2 JP2016207423A JP2016207423A JP6843341B2 JP 6843341 B2 JP6843341 B2 JP 6843341B2 JP 2016207423 A JP2016207423 A JP 2016207423A JP 2016207423 A JP2016207423 A JP 2016207423A JP 6843341 B2 JP6843341 B2 JP 6843341B2
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soldering
solder
heat transfer
substrate
hole
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JP2018067698A5 (enExample
JP2018067698A (ja
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満男 海老澤
満男 海老澤
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And Co Ltd
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2016207423A 2016-10-23 2016-10-23 半田付け評価方法およびその装置 Active JP6843341B2 (ja)

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JP2018067698A5 JP2018067698A5 (enExample) 2019-11-21
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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7018795B2 (ja) * 2018-03-23 2022-02-14 三菱電機株式会社 溶融はんだの入熱量評価方法および計測基板ならびにフローはんだ付け装置
JP7196478B2 (ja) * 2018-09-10 2022-12-27 株式会社デンソー スリーブはんだ付け装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6141461U (ja) * 1984-08-13 1986-03-17 日立電子株式会社 自動はんだ付けロボツト
JPS61156896A (ja) * 1984-12-28 1986-07-16 三菱電機株式会社 半田付け方法
JPH0560711A (ja) * 1991-09-04 1993-03-12 Fujitsu Ltd 銅粉充填の欠陥検査方法

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