JP6842616B2 - 凹部フィーチャ内での膜のボトムアップ式付着のための方法 - Google Patents
凹部フィーチャ内での膜のボトムアップ式付着のための方法 Download PDFInfo
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- JP6842616B2 JP6842616B2 JP2018515543A JP2018515543A JP6842616B2 JP 6842616 B2 JP6842616 B2 JP 6842616B2 JP 2018515543 A JP2018515543 A JP 2018515543A JP 2018515543 A JP2018515543 A JP 2018515543A JP 6842616 B2 JP6842616 B2 JP 6842616B2
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- 239000002019 doping agent Substances 0.000 claims description 30
- 238000005530 etching Methods 0.000 claims description 28
- 239000003989 dielectric material Substances 0.000 claims description 23
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 13
- 150000002739 metals Chemical class 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 11
- ITWBWJFEJCHKSN-UHFFFAOYSA-N 1,4,7-triazonane Chemical compound C1CNCCNCCN1 ITWBWJFEJCHKSN-UHFFFAOYSA-N 0.000 claims description 10
- 229910004541 SiN Inorganic materials 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 10
- 229910004166 TaN Inorganic materials 0.000 claims description 10
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 229910052732 germanium Inorganic materials 0.000 claims description 10
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 229910003468 tantalcarbide Inorganic materials 0.000 claims description 10
- 150000004767 nitrides Chemical class 0.000 claims description 5
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- 230000003213 activating effect Effects 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000000137 annealing Methods 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052785 arsenic Inorganic materials 0.000 claims description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 229910052716 thallium Inorganic materials 0.000 claims description 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 2
- 239000010408 film Substances 0.000 description 100
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 9
- 229910010413 TiO 2 Inorganic materials 0.000 description 9
- 238000000231 atomic layer deposition Methods 0.000 description 8
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- 239000002243 precursor Substances 0.000 description 6
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- 238000001459 lithography Methods 0.000 description 3
- 229910052914 metal silicate Inorganic materials 0.000 description 3
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- 229910052760 oxygen Inorganic materials 0.000 description 3
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- H01L21/3105—After-treatment
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- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
- H01L21/76831—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers in via holes or trenches, e.g. non-conductive sidewall liners
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- H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/3085—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by their behaviour during the process, e.g. soluble masks, redeposited masks
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- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
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- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
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- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
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Description
Claims (16)
- 処理方法であって、
a) 底部及び側壁を有する凹部フィーチャを含む基板を提供する工程と、
b) 前記底部上及び前記側壁上に膜を付着させる工程と、
c) 前記底部にある前記膜をマスク層で覆う工程と、
d) 前記膜を前記側壁からエッチングする工程と、
e) 前記マスク層を除去して、前記底部にある前記膜を露出させる工程と、を含み、
前記凹部フィーチャが前記膜で完全に充填されるまで前記工程b)から前記工程e)を繰り返す工程をさらに含む、方法。 - 前記底部及び前記側壁は、同じ材料を含む、請求項1に記載の方法。
- 前記材料は、シリコン、ゲルマニウム、シリコンゲルマニウム、誘電体材料、金属、及び金属含有材料からなる群から選択される、請求項2に記載の方法。
- 前記材料が、SiO2、SiON、SiN、high−k材料、low−k材料、及びultra−low−k材料からなる群から選択される誘電体材料である、請求項2に記載の方法。
- 前記材料が、Cu、Al、Ta、Ru、TaN、TaC、及びTaCNからなる群から選択される金属又は金属含有材料である、請求項2に記載の方法。
- 前記底部及び前記側壁は、異なる材料を含む、請求項1に記載の方法。
- 処理方法であって、
a) 底部及び側壁を有する凹部フィーチャを含む基板を提供する工程と、
b) 前記底部上及び前記側壁上に膜を付着させる工程と、
c) 前記膜を気相プラズマで処理して、前記底部上の前記膜よりも速くエッチングするために前記側壁上の前記膜の全体を活性化する工程と、
d) 処理された前記膜を前記側壁からエッチングする工程と、を含み、
前記凹部フィーチャが前記膜で完全に充填されるまで前記工程b)から前記工程d)を繰り返す工程をさらに含む、方法。 - 前記底部及び前記側壁は、同じ材料を含む、請求項7に記載の方法。
- 前記底部及び前記側壁は、異なる材料を含む、請求項7に記載の方法。
- 処理方法であって、
a) 底部及び側壁を有する凹部フィーチャを含む基板を提供する工程と、
b)前記底部上及び前記側壁上に膜を付着させる工程と、
c) 前記底部にある前記膜をマスク層で覆う工程と、
d) 前記凹部フィーチャにドーパント膜を付着させる工程と、
e) 前記基板をアニールして、前記ドーパント膜からドーパントを前記側壁上の前記膜に拡散させて、前記底部上の前記膜よりも速くエッチングするために前記側壁上の前記膜を活性化する工程と、
f) 前記ドーパント膜及び前記膜を前記側壁からエッチングする工程と、
g) 前記底部上の前記膜から前記マスク層を除去する工程と、を含む方法。 - 前記膜が前記凹部フィーチャ内で所望の厚さになるまで前記工程b)から前記工程g)を少なくとも1回繰り返す工程をさらに含む、請求項10に記載の方法。
- 前記凹部フィーチャが前記膜で完全に充填されるまで前記工程b)から前記工程g)を繰り返す工程をさらに含む、請求項10に記載の方法。
- 前記底部及び前記側壁は、同じ材料を含む、請求項10に記載の方法。
- 前記底部及び前記側壁は、異なる材料を含む、請求項10に記載の方法。
- 前記ドーパントは、ホウ素(B)、アルミニウム(Al)、ガリウム(Ga)、インジウム(In)、タリウム(Tl)、窒素(N)、リン(P)、ヒ素(As)、アンチモン(Sb)、及びビスマス(Bi)からなる群から選択される、請求項10に記載の方法。
- 前記ドーパント膜は、酸化物層、窒化物層、酸窒化物層、又はそれらの組み合わせを含む、請求項10に記載の方法。
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