JP6841613B2 - 発光装置の作製方法、発光装置、モジュール、及び電子機器 - Google Patents
発光装置の作製方法、発光装置、モジュール、及び電子機器 Download PDFInfo
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- JP6841613B2 JP6841613B2 JP2016146159A JP2016146159A JP6841613B2 JP 6841613 B2 JP6841613 B2 JP 6841613B2 JP 2016146159 A JP2016146159 A JP 2016146159A JP 2016146159 A JP2016146159 A JP 2016146159A JP 6841613 B2 JP6841613 B2 JP 6841613B2
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- light emitting
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- emitting device
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015150777 | 2015-07-30 | ||
| JP2015150777 | 2015-07-30 | ||
| JP2016119834 | 2016-06-16 | ||
| JP2016119834 | 2016-06-16 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021023876A Division JP2021093366A (ja) | 2015-07-30 | 2021-02-18 | 発光装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017228512A JP2017228512A (ja) | 2017-12-28 |
| JP2017228512A5 JP2017228512A5 (enExample) | 2019-09-05 |
| JP6841613B2 true JP6841613B2 (ja) | 2021-03-10 |
Family
ID=57883090
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016146159A Expired - Fee Related JP6841613B2 (ja) | 2015-07-30 | 2016-07-26 | 発光装置の作製方法、発光装置、モジュール、及び電子機器 |
| JP2021023876A Withdrawn JP2021093366A (ja) | 2015-07-30 | 2021-02-18 | 発光装置の作製方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021023876A Withdrawn JP2021093366A (ja) | 2015-07-30 | 2021-02-18 | 発光装置の作製方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US9917282B2 (enExample) |
| JP (2) | JP6841613B2 (enExample) |
| KR (1) | KR102632066B1 (enExample) |
| CN (1) | CN108738377B (enExample) |
| TW (2) | TWI757241B (enExample) |
| WO (1) | WO2017017553A1 (enExample) |
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| KR102288354B1 (ko) * | 2015-08-10 | 2021-08-11 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치의 제조 방법 |
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| TWI626738B (zh) | 2017-04-06 | 2018-06-11 | 宏碁股份有限公司 | 顯示裝置及其製造方法 |
| CN107357459B (zh) * | 2017-07-12 | 2021-01-29 | 业成科技(成都)有限公司 | 可挠曲结构 |
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| KR102448682B1 (ko) * | 2017-09-25 | 2022-09-29 | 삼성전자주식회사 | 지문인식 패키지 및 그 제조방법 |
| KR102507761B1 (ko) * | 2017-12-19 | 2023-03-07 | 엘지디스플레이 주식회사 | 표시장치 |
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| CN108762561B (zh) * | 2018-05-25 | 2021-01-15 | 京东方科技集团股份有限公司 | 触控显示面板及其制造方法、驱动方法、触控显示装置 |
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| KR102642331B1 (ko) | 2019-07-03 | 2024-03-04 | 삼성전자주식회사 | 마이크로 led 디스플레이 모듈 및 이를 제조하는 방법 |
| CN114450801B (zh) * | 2019-09-25 | 2025-08-26 | 三星显示有限公司 | 显示装置及其制造方法 |
| CN111128036A (zh) * | 2019-10-23 | 2020-05-08 | 中国电子科技集团公司第五十五研究所 | 一种用于提高自发光显示器件发光亮度均匀性的方法 |
| CN112860091A (zh) * | 2019-11-26 | 2021-05-28 | 英属维尔京群岛商天材创新材料科技股份有限公司 | 触控面板及其制作方法 |
| KR102293405B1 (ko) * | 2020-02-24 | 2021-08-26 | 연세대학교 산학협력단 | 스트레처블 발광소재를 이용한 유기전계 발광소자 및 그 제조방법 |
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| CN111710794B (zh) | 2014-10-17 | 2024-06-28 | 株式会社半导体能源研究所 | 发光装置、模块、电子设备以及发光装置的制造方法 |
| CN104538564B (zh) * | 2015-01-30 | 2017-02-15 | 合肥京东方光电科技有限公司 | 一种封装装置 |
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| CN108738377A (zh) | 2018-11-02 |
| US20200388795A1 (en) | 2020-12-10 |
| KR102632066B1 (ko) | 2024-02-02 |
| TW201712901A (zh) | 2017-04-01 |
| US20180175332A1 (en) | 2018-06-21 |
| US20190074485A1 (en) | 2019-03-07 |
| US11411208B2 (en) | 2022-08-09 |
| TW202044624A (zh) | 2020-12-01 |
| WO2017017553A1 (en) | 2017-02-02 |
| US10804503B2 (en) | 2020-10-13 |
| KR20180035217A (ko) | 2018-04-05 |
| JP2021093366A (ja) | 2021-06-17 |
| US9917282B2 (en) | 2018-03-13 |
| US20170033323A1 (en) | 2017-02-02 |
| JP2017228512A (ja) | 2017-12-28 |
| CN108738377B (zh) | 2020-11-10 |
| US10135037B2 (en) | 2018-11-20 |
| TWI757241B (zh) | 2022-03-11 |
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