JP6840140B2 - 電気接点用のクラッド材及び該クラッド材の製造方法 - Google Patents
電気接点用のクラッド材及び該クラッド材の製造方法 Download PDFInfo
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- 239000000463 material Substances 0.000 title claims description 304
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 238000000034 method Methods 0.000 title description 9
- 238000009792 diffusion process Methods 0.000 claims description 47
- 239000000956 alloy Substances 0.000 claims description 39
- 229910045601 alloy Inorganic materials 0.000 claims description 38
- 238000001556 precipitation Methods 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 30
- 230000032683 aging Effects 0.000 claims description 28
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 27
- 238000005304 joining Methods 0.000 claims description 16
- 238000012545 processing Methods 0.000 claims description 12
- 238000000137 annealing Methods 0.000 claims description 10
- 238000001953 recrystallisation Methods 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910017827 Cu—Fe Inorganic materials 0.000 claims description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910017937 Ag-Ni Inorganic materials 0.000 claims description 2
- 229910017984 Ag—Ni Inorganic materials 0.000 claims description 2
- 229910017532 Cu-Be Inorganic materials 0.000 claims description 2
- 229910002482 Cu–Ni Inorganic materials 0.000 claims description 2
- 229910017873 Cu—Ni—Si—Mg Inorganic materials 0.000 claims description 2
- 229910017885 Cu—Pt Inorganic materials 0.000 claims description 2
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 2
- 229910002668 Pd-Cu Inorganic materials 0.000 claims description 2
- 229910018885 Pt—Au Inorganic materials 0.000 claims description 2
- 229910000861 Mg alloy Inorganic materials 0.000 claims 1
- 229910001297 Zn alloy Inorganic materials 0.000 claims 1
- 238000005253 cladding Methods 0.000 claims 1
- 238000003483 aging Methods 0.000 description 32
- 239000010949 copper Substances 0.000 description 31
- 238000011282 treatment Methods 0.000 description 23
- 239000000203 mixture Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000470 constituent Substances 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- 238000004881 precipitation hardening Methods 0.000 description 6
- 238000005096 rolling process Methods 0.000 description 6
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000921 elemental analysis Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- C22C5/06—Alloys based on silver
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
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- C22C5/06—Alloys based on silver
- C22C5/08—Alloys based on silver with copper as the next major constituent
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- C22C9/02—Alloys based on copper with tin as the next major constituent
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- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
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- H01H1/023—Composite material having a noble metal as the basic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/025—Composite material having copper as the basic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/04—Co-operating contacts of different material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
- H01H11/042—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion by mechanical deformation
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Description
接点材料の構成材料としては、導電性と耐磨耗性を考慮してAg合金が適用される。本発明においてAg合金とは、Ag(銀)を必須元素として含む合金であり、主成分がAgであることに限定されない。但し、接点材料としての導電性確保の観点から、Ag濃度が10質量%以上95質量%以下のAg合金が好ましい。そして、Ag合金を構成する元素としては、Agに、Cu、Ni、Pd、Au、Ptからなる群から選択される少なくとも1の元素である。
基材には、Cu系の析出型時効硬化材が適用される。Cu系の析出型時効硬化材とは、時効処理後にCu又はCu合金が母相を構成し、ここに添加元素に応じた析出相が分散するようになっている材料である。即ち、Cuを必須構成元素とする析出型時効硬化材料である。Cu系材料を適用するのは、母相となるCu又はCu合金の導電性を重視するからである。
本発明に係る電気接点用クラッド材は、上記した接点材料と基材とがクラッドされてなる。そして、本発明は、接点材料と基材との接合界面における拡散領域の幅(厚さ)を規定する。ここで、接合領域の意義をより詳細に定義すると、接点材料と基材との接合界面で、接点材料中のAg濃度を基準(100%)としたとき、Ag濃度が95%以下5%以上となっている合金領域が拡散領域である。この拡散領域は、接点材料(Ag合金)の構成元素と基材(Cu系析出型時効硬化材)の構成元素の双方から構成される合金層であり、その組成は連続的に変化している。そして、電気特性も好ましいものではなく導電率も低い。
本発明に係るクラッド材について、基材に対する接点材料の形状は特に限定されず、オーバーレイ、インレイ、エッジレイのいずれであっても良い。スイッチやブレーカー等の開閉接点の用途においては、インレイ型のクラッド材の適用例が多く、本発明はこの形式に良好に対応できる。但し、いずれの形式であっても、全ての接合界面で拡散領域の幅が規定内にあることが要求される。例えば、インレイ型のクラッド材では、接点材料が基材に埋め込まれた状態で接合されおり接点材料の三方に接合界面が存在する。本発明では、それら三方の接合界面における接合領域が2.0μm以下であることを要する。
以上説明した本発明に係る電気接点用のクラッド材においては、基材となるCu系の析出型時効硬化材の特性が十分に発揮されている。その結果、本発明は、高強度と高導電率との双方において好適な電気接点となる。本発明に係るクラッド材の引張強度と導電率は、引張強度で400〜1200MPaであり、導電率が20〜90%IACSであるものが好ましい。これらの特性は、クラッド材の基材の種類によるので、より具体的には、上記した高強度のCu系析出型時効硬化材(コルソン系合金、ベリリウム銅系合金等)を適用したものでは、引張強度で600〜1200MPaであり、導電率が20〜50%IACSであるものが好ましい。また、中強度のCu系析出型時効硬化材(Cu−Fe系合金、Cu−Fe−Ni系合金、Cu-Sn-Cr-Zn系合金、Cu-Cr-Mg系合金等)を適用したものでは、引張強度で400〜700MPaであり、導電率が60〜90%IACSであるものが好ましい。
次に、本発明に係る電気接点用のクラッド材の製造方法について説明する。上記したように、クラッド材の製造方法としては、接点材料と基材とを接合する工程と、接合後のクラッド材を目的とする形状・寸法に加工する工程を含み、基材として析出型時効硬化材を適用する場合には、更に、時効硬化のための熱処理工程が追加される。
Claims (5)
- Ag合金からなる接点材料と、前記接点材料を支持するCu系の析出型時効硬化材からなる基材とで構成される電気接点用のクラッド材の製造方法であって、
時効硬化済みの前記基材と、前記接点材料とを接合して粗クラッド材を製造する工程と、
前記粗クラッド材を、前記基材の再結晶温度を基準に−200℃以上−100℃以下の範囲内で焼鈍熱処理する工程と、
熱処理後の前記粗クラッド材を加工する工程と、を含む電気接点用のクラッド材の製造方法。 - 前記接点材料を構成するAg合金として、Ag濃度が10質量%以上95質量%以下のAg合金であって、Ni、Pd、Cu、Au、Ptからなる群から選択される少なくとも1の元素を含むAg合金を使用する請求項1記載の電気接点用のクラッド材の製造方法。
- 前記接点材料を構成するAg合金として、Ag−Cu−Ni系合金、Ag−Ni系合金、Ag−Pd系合金、Ag-Pd-Cu系合金、Ag-Pd-Cu-Pt-Au系合金、Ag-Au-Cu-Pt系合金のいずれかを使用する請求項2記載の電気接点用のクラッド材の製造方法。
- 前記Cu系の析出型時効硬化材として、Cu−Ni−Si系合金、Cu−Ni−Si−Mg系合金、Cu−Be系合金、Cu−Fe系合金、Cu−Fe−Ni系合金、Cu−Sn−Cr−Zn系合金、Cu−Cr−Mg系合金のいずれかを使用する請求項1〜請求項3のいずれかに記載の電気接点用のクラッド材の製造方法。
- 前記時効硬化済みの基材と前記接点材料とを接合して粗クラッド材を製造し、
前記粗クラッド材を前記焼鈍熱処理し、
前記焼鈍熱処理後の粗クラッド材を加工してクラッド材にすることにより、
前記クラッド材の前記接点材料と前記基材との接合界面における、Ag及びCuを含む拡散領域の幅を2.0μm以下にする請求項1〜請求項4のいずれかに記載の電気接点用のクラッド材の製造方法。
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KR20220133242A (ko) * | 2020-01-28 | 2022-10-04 | 마테리온 코포레이션 | 충전 단자용 은 합금 클래드 구조물 및 이의 제조 방법 |
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JPS6016049B2 (ja) * | 1976-06-29 | 1985-04-23 | 田中貴金属工業株式会社 | 電気接点材料の製造方法 |
JPH03162553A (ja) | 1989-11-22 | 1991-07-12 | Nippon Mining Co Ltd | 曲げ加工性の良好な高強度高導電銅合金の製造方法 |
JP3061077B2 (ja) * | 1991-10-24 | 2000-07-10 | 田中貴金属工業株式会社 | 複合電気接点材料の製造方法 |
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CN102842448A (zh) | 2011-06-24 | 2012-12-26 | 三菱综合材料C.M.I.株式会社 | 复合触点的制造方法 |
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TW201812032A (zh) | 2018-04-01 |
CN109155208B (zh) | 2021-03-09 |
CN109155208A (zh) | 2019-01-04 |
KR20180124141A (ko) | 2018-11-20 |
US11094478B2 (en) | 2021-08-17 |
KR102071356B1 (ko) | 2020-01-30 |
TWI654322B (zh) | 2019-03-21 |
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