JP6837715B2 - Cutting method - Google Patents

Description

The present invention relates to a cutting method for cutting a plate-shaped workpiece such as a semiconductor wafer, a package substrate, a glass substrate or a ceramic substrate.

In the device chip manufacturing process, a grid-like division schedule line called a street is set on the surface of a wafer made of silicon or a compound semiconductor, and devices such as ICs and LSIs are formed in each region partitioned by the division schedule line. Will be done. These wafers are cut along the planned split line and split into individual device chips.

Cutting is performed, for example, by a cutting device equipped with a cutting blade. The cutting blade has an annular shape with a hole in the center, and an appropriate cutting blade is selected according to the type of workpiece and the processing content and mounted on the cutting unit. The cutting unit has a columnar spindle that serves as an axis of rotation, and the cutting blade is mounted on the spindle by inserting the spindle into the hole.

The cutting edge of the cutting blade is composed of abrasive grains and a binder that holds the abrasive grains. When the abrasive grains are appropriately exposed from the binder, the abrasive grains come into contact with the workpiece, so that the workpiece can be cut appropriately. Then, when the work piece is cut, the cutting ability of the cutting blade is maintained above a certain level by the action of the spontaneously-generated blade in which new abrasive grains are exposed one after another from the binder due to the consumption of the cutting edge. Is done.

However, depending on the processing conditions of the cutting process, it may be difficult for the spontaneously generating blade to be actively performed, and the cutting ability of the cutting blade may easily decrease. In that case, after performing the cutting process a predetermined number of times, the cutting blade is dressed to encourage spontaneous blade generation. Dressing is carried out by having the target cutting blade cut the dressing board. When the dressing board is cut, the cutting blade is properly consumed, the abrasive grains are appropriately exposed from the binder, and the state is suitable for cutting again.

Japanese Unexamined Patent Publication No. 2006-218571 Japanese Unexamined Patent Publication No. 8-88202

However, while the cutting blade is dressed, the workpiece cannot be cut by the cutting blade. Also, a dressing board must be prepared for dressing. Therefore, the cost of cutting by the cutting blade increases, and the efficiency of cutting decreases.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a method for cutting a workpiece capable of promoting the action of a spontaneously-generated blade while performing cutting with a cutting blade.

According to one aspect of the present invention, it is a method of cutting a work piece by cutting a work piece with a cutting blade in which abrasive grains are fixed with a binder, and a protective member to be attached to the work piece is attached. A dressing abrasive grain attachment step in which dressing abrasive grains for dressing the cutting blade are sprayed and attached to the surface, and the protective member to which the dressing abrasive grains are attached to the attachment surface are attached to the workpiece. The cutting of the work piece is characterized by comprising a sticking step for cutting the work piece and a division step for dividing the work piece by cutting the work piece while cutting the cutting blade into the protective member. The method is provided.

In one aspect of the present invention, in the dressing abrasive adhering step, the abrasive grain size contained in the cutting blade, the type of the binder, and the type of the dressing abrasive grains based on the type of workpiece And the spraying conditions may be selected, and the dressing abrasive grains may be sprayed and adhered to the sticking surface of the protective member under the spraying conditions. Further, the protective member is an adhesive tape that supports the workpiece in the opening of the annular frame, and in the dressing abrasive grain attachment step, the protection of the region between the workpiece and the annular frame. The dressing abrasive grains may be adhered to the sticking surface of the member. Further, in the dressing abrasive grain attachment step, the dressing abrasive grains are sprayed and adhered to the sticking surface of the protective member by passing through the opening of the mask having an opening, and in the sticking step, the protective member is attached. May be attached to the work piece, and then the protective member may be pressed by a pressing roller from the surface side opposite to the attachment surface.

In the cutting method according to one aspect of the present invention, dressing abrasive grains for dressing the cutting blade are attached to the attachment surface of the protective member to be attached to the workpiece. When the work piece is cut by a cutting blade to divide the work piece, the work piece is cut while the cutting blade is cut into the protective member.

Then, during the cutting process of the workpiece, the cutting edge of the cutting blade hits the dressing abrasive grains adhering to the sticking surface, the cutting blade is dressed, and the spontaneous blade generation of the cutting blade is promoted. Therefore, it is not necessary to prepare a dressing board for dressing the cutting blade, and it is not necessary to stop the cutting process by the cutting device for performing the dressing, so that the efficiency of the cutting process can be improved.

Further, in the cutting method according to one aspect of the present invention, the type and abrasive grains of the dressing abrasive to be attached to the protective member are selected according to the type of the workpiece, the type of the cutting blade, the degree of dressing required, and the like. it can. Therefore, the dressing content can be determined in detail according to the situation, and the dressing content can be easily switched according to the change in the situation, so that the cutting blade can be dressed appropriately.

As described above, according to the present invention, there is provided a method for cutting a workpiece that can promote the action of a self-generated blade while performing cutting with a cutting blade.

It is a schematic diagram explaining the dressing abrasive grain attachment step and the attachment step. FIG. 2A is a perspective view schematically showing a work piece and a protective member after the sticking step, and FIG. 2B schematically shows a work piece and a protective member after the sticking step. It is a partial cross-sectional view shown. It is a partial cross-sectional view which shows typically the division step. FIG. 4A is a perspective view schematically showing a work piece and a protective member after the attachment step, and FIG. 4B is a partial cross-sectional view schematically showing the division step. 5 (A) is a partial cross-sectional view schematically explaining the protective member preparation step, and FIG. 5 (B) is a partial cross-sectional view schematically explaining the abrasive grain attachment step, and FIG. 5 (C) is a partial cross-sectional view. ) Is a partial cross-sectional view schematically explaining the sticking step. FIG. 6A is a partial cross-sectional view schematically explaining the frame attaching step, and FIG. 6B is a partial cross-sectional view schematically explaining the division step.

An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. First, the protective member attaching device in which the dressing abrasive grain attaching step and the attaching step in the cutting method according to the present embodiment are carried out will be described with reference to FIG.

FIG. 1 is a schematic view illustrating a dressing abrasive grain attachment step and a protective member attachment device 2 in which the attachment step is carried out. The protective member attaching device 2 includes a supply roller for supplying a film-shaped protective member (dicing tape) 14, a take-up roller arranged parallel to the supply roller and winding the protective member 14. have.

A protective member roll (dicing tape roll) 4 formed by winding the protective member 14 in a cylindrical shape is mounted on the supply roller. The protective member 14 supplied from the supply roller is taken up by the take-up roller to become a take-up roll 6.

An abrasive grain injection unit 8 that supplies the dressing abrasive grains 12 to the protective member 14 supplied from the supply roller is provided between the supply roller and the take-up roller. On the take-up roller side of the abrasive grain injection unit 8, a feed roller 16 that sends the protective member 14 to the take-up roller side and a pressing roller 18 that presses the protective member 14 upward are arranged in this order. Below the abrasive grain injection unit 8, a mask 10 that defines the injection range of the dressing abrasive grains 12 by the abrasive grain injection unit 8 is arranged.

The abrasive grain injection unit 8 has a function of spraying the dressing abrasive grains 12 to a predetermined region (sprayed region) of the protective member 14 in cooperation with the mask 10 having the opening 10a. The abrasive grain injection unit 8 sprays a predetermined amount of dressing abrasive grains 12 so that the distribution becomes uniform within the predetermined region defined by the mask 10. For example, the dressing abrasive grains 12 are blown off by a high-pressure gas or the like and uniformly sprayed on the predetermined region of the protective member 14.

The type and size of the dressing abrasive grains 12 to be sprayed, the amount to be sprayed, and the like can be selected according to the content of the planned dressing. For example, the selection can be made based on the size and type of abrasive grains contained in the cutting blade, the type of binder, the type of the workpiece, and the like, and the selection can be made according to the actual conditions of the cutting blade and cutting process.

For example, when it is desired to actively consume the cutting blade, _{a white random (WA) abrasive grain made of alumina (Al 2} O ₃ ) or a particle size larger than the abrasive particle size of the cutting blade, for example, 20 μm to 50 μm. Use the dressing abrasive grains of.

If the cutting blade is to be consumed lightly, silicon carbide abrasive grains or dressing abrasive grains having a particle size similar to that of the cutting blade are used. For example, an abrasive grain having a particle size of about 30 μm may be used for a cutting blade for cutting glass. Further, as a cutting blade for cutting a silicon wafer, abrasive grains having a particle size of about 5 μm may be used.

The protective member 14 is, for example, a strip-shaped plastic dicing tape, which is provided on a base material arranged radially outside in a cylindrically wound state and on the inner surface of the base material. It has an adhesive layer and. The protective member roll 4 is mounted on the supply roller so that the adhesive layer of the protective member 14 supplied from the supply roller faces upward. The surface (upper surface) of the pressure-sensitive adhesive layer is a sticking surface to be stuck to the work piece.

The protective member 14 is pulled out from the protective member roll 4 and used, and after being cut out according to the shape of the frame 9 described later, an unnecessary portion is taken up by a take-up roller to become a take-up roll 6. The protective member 14 is fed by the feed roller 16 between the protective member roll 4 and the take-up roll 6 so as not to be loosened.

Next, the workpiece (workpiece) of the cutting method according to the present embodiment will be described. The work piece 1 is schematically shown in the perspective view of FIG. 2 (A). A plurality of scheduled division lines (streets) 3 are set on the surface 1a of the workpiece 1 in a grid pattern, and devices 5 such as ICs and LSIs are set in each region partitioned by the plurality of scheduled division lines 3. Is formed.

When the workpiece 1 is finally divided along the planned division line 3, individual device chips are formed. The workpiece 1 is, for example, a wafer such as silicon, sapphire, or SiC (silicon carbide), or a substrate such as glass or quartz.

Next, the cutting method according to the present embodiment will be described. In the cutting method, a dressing abrasive grain attachment step is carried out in which the dressing abrasive grains 12 for dressing the cutting blade are attached to the attachment surface of the protective member 14 to be attached to the workpiece 1. Next, a sticking step of sticking the protective member 14 to the work piece 1 is performed. Then, the workpiece 1 to which the protective member 14 is attached to the back surface 1b is transferred to a cutting device, and the workpiece 1 is cut while cutting the cutting blade into the protective member 1, thereby cutting the workpiece 1. A division step for dividing 1 is performed.

First, the dressing abrasive grain attachment step will be described. The dressing abrasive grain attaching step is carried out in the protective member attaching device 2 described above. The protective member 14 is sent out from the protective member roll 4 with the sticking surface facing upward. Then, a predetermined region (sprayed region) of the protective member 14 is arranged below the abrasive grain injection unit 8, and the dressing abrasive grain 12 is ejected from the abrasive grain injection unit 8.

A part of the dressing abrasive grains 12 ejected from the abrasive grain injection unit 8 is blocked by the mask 10 and does not reach the protective member 14, but another part passes through the opening 10a of the mask 10 and the protective member 14 is attached. Reach the landing surface. Then, the dressing abrasive grains are attached to the sprayed area. The sprayed region may be deformed according to the content of the dressing, and is formed, for example, in a size corresponding to the planar shape of the workpiece 1 or larger than the planar shape of the workpiece 1. ..

Next, a sticking step of sticking the protective member 14 to the work piece 1 will be described. The sticking step is carried out in the protective member sticking device 2 following the dressing abrasive grain sticking step. When the feed roller 16 is operated and the protective member 14 is wound by the take-up roller, the dressing abrasive grains 11 adhering to the protective member 14 are moved in the direction of the take-up roll 6. Then, the workpiece 1 with the back surface 1b facing downward is attached to the sprayed area on the attachment surface of the protective member 14.

Next, an annular frame 9 having an opening 9a having an inner peripheral diameter larger than the outer peripheral diameter of the workpiece 1 is prepared, and the attachment surface of the protective member 14 is provided so that the workpiece 1 is housed inside the opening 9a. The frame 9 is attached to. Then, while rotating the pressing roller 18 in the direction of the arrow 18a in FIG. 1, the pressing roller 18 is moved in the direction of the arrow 18b in FIG. 1 from the surface side (base material side) opposite to the attachment surface of the protective member 14. Press the protective member 14. Then, the adhesive force of the protective member 14 to the workpiece 1 and the frame 9 can be increased.

Then, the protective member 14 is cut between the opening 9a of the frame 9 and the outer peripheral edge of the frame 9 along the frame 9 over one circumference. Then, as shown in FIG. 2A, the workpiece 1 can be attached to the frame 9 via the protective member 7 stretched on the annular frame 9. FIG. 2A is a perspective view schematically showing the workpiece 1 mounted on the frame 9. Further, FIG. 2B is a cross-sectional view schematically showing the workpiece 1 mounted on the frame 9.

As shown in FIGS. 2A and 2B, the work piece 1 and the protective member 7 stretched on the frame 9 adhered to the adhesive layer 7b of the protective member 7. The dressing abrasive grains 11 are arranged.

Next, the workpiece 1 to which the protective member 7 is attached to the back surface 1b is transferred to a cutting device, and the workpiece 1 is cut while cutting the cutting blade into the protective member 7, thereby cutting the workpiece 1. A division step for dividing 1 is performed. FIG. 3 is a partial cross-sectional view schematically illustrating a division step performed by the cutting device 20.

The cutting device 20 includes a cutting unit 22, a chuck table 24, and a clamp 26. The surface (upper surface) of the chuck table 24 is a holding surface 24a that sucks and holds the workpiece 1. The holding surface 24a is connected to a suction source (not shown) through a flow path (not shown) formed inside the chuck table 24. A clamp 26 for fixing the workpiece 1 is provided around the chuck table 24.

The chuck table 24 is supported by a chuck table moving mechanism (not shown), and can move in a direction parallel to the holding surface 24a by the action of the chuck table moving mechanism. When the chuck table 24 moves relative to the cutting unit 22, the workpiece 1 held on the chuck table 24 is processed or indexed. Further, the chuck table 24 can rotate around an axis perpendicular to the holding surface 24a, and the machining feed direction can be changed.

The cutting unit 22 includes a spindle 22a and an annular cutting blade 22b mounted on one end side of the spindle 22a. A rotary drive source (not shown) such as a motor is connected to the other end side of the spindle 22a, and the rotary drive source rotates the spindle 22a. Then, when the spindle 22a rotates, the cutting blade 22b is rotated.

The cutting blade 22b has a disk-shaped base, and a substantially circular mounting hole penetrating the base is provided in the central portion of the base. The cutting blade 22b is fixed to one end of the spindle 22a by passing the spindle 22a through the mounting hole. An annular cutting edge for cutting into the workpiece 1 is fixed to the outer peripheral portion of the base.

The cutting edge of the cutting blade 22b is composed of abrasive grains and a binder that holds the abrasive grains. When the abrasive grains are appropriately exposed from the binder, the abrasive grains come into contact with the workpiece 1, so that the workpiece 1 can be cut appropriately. Then, when the cutting process of the workpiece 1 is performed, the cutting ability of the cutting blade is maintained by the action of the spontaneously generating blade in which new abrasive grains are exposed one after another from the binder due to the consumption of the cutting edge. However, when the cutting blade 22b is used for a long time and is consumed, dressing is required to maintain a sufficient cutting ability.

When starting to use the cutting blade 22b, the dressing board is first cut to appropriately expose the abrasive grains from the cutting edge binder, and the cutting blade 22b is a perfect circle with respect to the spindle 22a. It is desirable to be.

In the dividing step, first, the workpiece 1 with the surface 1a facing upward is placed on the holding surface 24a of the chuck table 24 of the cutting device 20 via the protective member 7. Then, the frame 9 is fixed by the clamp 26, and a negative pressure is applied from the chuck table 24 to suck and hold the workpiece 1 on the chuck table 24.

Next, the chuck table moving mechanism (not shown) is operated to align the relative positions of the cutting blade 22b and the workpiece 1 so that the workpiece 1 can be cut along the scheduled division line 3. Then, the cutting blade 22b is rotated by rotating the spindle 22a, and the cutting blade 22b is lowered to a height position where the cutting edge of the cutting blade 22b cuts into the protective member 7 on the back surface 1b side of the workpiece 1. Next, the workpiece 1 is processed and fed to proceed with the cutting process. Then, the workpiece 1 is divided along the scheduled division line 3.

When the cutting edge of the rotating cutting blade 22b reaches the protective member 7 due to the cutting process by the cutting blade 22b, the cutting edge of the cutting blade 22b comes into contact with the dressing abrasive grains 11 adhering to the protective member 7. Then, the cutting blade 22b is dressed.

According to the cutting method according to the present embodiment, the cutting blade 22b is dressed by the dressing abrasive grains 11 while the workpiece 1 is being cut by the cutting blade 22b. Therefore, the cutting performance of the cutting blade 22b is maintained, and it is not necessary to separately dress the cutting blade 22b. That is, it is not necessary to stop the cutting device 20 to perform the dressing of the cutting blade 22b, and it is not necessary to prepare a dressing board for performing the dressing, so that the efficiency of the cutting process can be improved.

Further, according to the cutting method according to the present embodiment, the dressing abrasive is based on the type and size of the abrasive grains contained in the cutting blade 22, the type of the binder used for the cutting blade 22, the type of the workpiece 1, and the like. Grain 11 can be selected. Therefore, the dressing content can be determined in detail according to the situation, and the dressing content can be easily switched according to the change in the situation, so that the cutting blade can be dressed appropriately.

For example, even if the dressing abrasive grains 11 are mixed with the raw material in advance to form the protective member 7, dressing can be performed during the cutting process. However, in this case, in order to finely select the dressing conditions according to the situation of the cutting blade 22, it is necessary to prepare various protective members 7 corresponding to each dressing conditions, which is costly. In addition, the protective member 7 must be appropriately switched according to the dressing conditions to be implemented, which is troublesome.

On the other hand, according to the cutting method according to the present embodiment, by determining the type of dressing abrasive grains 11 and the spraying conditions, dressing can be performed under various conditions according to the state of the cutting blade. Since dressing under various conditions can be realized depending on the spraying conditions, it is not necessary to prepare as many protective members 7 as there are dressing conditions, and the types of dressing abrasive grains 11 to be prepared can be relatively small. Further, changing the spraying conditions of the dressing abrasive grains 11 is less troublesome than switching the protective member 7. Therefore, the efficiency of cutting is increased.

After the work piece 1 is cut along one scheduled division line 3, the work piece 1 is indexed and fed to cut the work piece 1 one after another. Then, after cutting along the scheduled division lines 3 arranged in parallel, the chuck table 24 is rotated by a quarter to change the machining feed direction. Then, when the cutting process is performed along all the scheduled division lines 3, the workpiece is divided into individual device chips.

The present invention is not limited to the description of the above-described embodiment, and can be implemented with various modifications. For example, in the above embodiment, the case where the dressing abrasive grains 11 are sprayed over the entire surface of the back surface 1b of the workpiece 1 has been described, but the sprayed region of the dressing abrasive grains 11 of the protective member 7 is this. Not limited to.

For example, as shown in FIGS. 4 (A) and 4 (B), the dressing abrasive grains 11 are not arranged between the workpiece 1 and the protective member 7, and the outer peripheral edge of the workpiece 1 is provided. The dressing abrasive grains 11 may be sprayed so as to surround the dressing abrasive grains 11. In order to make the area surrounding the outer peripheral edge of the work piece 1 the area to be sprayed by the dressing abrasive grains 11, the mask 10 arranged below the abrasive grain injection unit 8 of the protective member attaching device 2 has the shape of the opening 10a. May be changed and used.

FIG. 4A schematically shows the workpiece and the protective member after the attachment step in which the protective member on which the dressing abrasive grains 11 are sprayed so as to surround the outer peripheral edge of the workpiece 1 is attached to the workpiece. It is a perspective view shown in. When the dressing abrasive grains 11 are sprayed in this way, the dressing abrasive grains 11 do not exist between the workpiece 1 and the protective member 7, so that the workpiece 1 is strongly attached to the sticking surface of the protective member 7. Be dressed.

FIG. 4B is a cross-sectional view schematically showing the division step. As shown in FIG. 4B, the cutting blade 22b included in the cutting device 20 is not dressed at the same time as the work piece 1 is cut. However, if necessary, the protective member 7 on the outer side of the workpiece 1 can be cut to bring it into contact with the dressing abrasive grains 11, and the cutting blade 22b can be dressed. Since the cutting blade 22b can be dressed without stopping the dividing step of cutting the workpiece 1, the processing efficiency is high and the productivity is good even in this case.

Further, in the above embodiment, the protective member 7 made of an adhesive tape such as a dicing tape is used, but the protective member 7 is not limited to this. For example, the workpiece 1 may be supported by a protective member formed by discharging the liquid resin onto a flat table, and in that case, the dressing abrasive grains 11 may be sprayed on the liquid resin discharged on the table. Good.

FIG. 5A is a cross-sectional view schematically showing a protective member preparation step for forming a protective member (liquid resin) 7c made of a liquid resin. In the protective member preparation step, the liquid resin used as the material for the protective member 7c is discharged from the nozzle 30 and the liquid resin is discharged onto the table 28 to form the protective member 7c. At this time, the planar shape of the protective member 7c is made substantially the same as the planar shape of the workpiece 1 to be placed on the protective member 7c later.

After the protective member preparation step, an abrasive grain attachment step is performed. FIG. 5B is a cross-sectional view schematically illustrating the abrasive grain attachment step. In the abrasive grain attachment step, the dressing abrasive grains 12a are sprayed on the upper surface of the protective member 7c formed in the protective member preparation step. For spraying the dressing abrasive grains 12a, an abrasive grain injection unit 8a similar to the abrasive grain injection unit 8 provided in the protective member attaching device 2 described above is used.

After the abrasive grain attachment step, the attachment step is carried out. FIG. 5C is a cross-sectional view schematically illustrating the attachment step. In the attaching step, the workpiece 1 is attached onto the protective member 7c to which the dressing abrasive grains 11 are attached to the upper surface. The workpiece 1 is pressed toward the protective member 7c from above the protective member 7c while being directed in a direction parallel to the upper surface of the table 28.

Then, the dressing abrasive grains 12a are embedded in the protective member 7c, the contact area between the back surface 1b of the workpiece 1 and the protective member 7c is increased, and the workpiece 1 is strongly adhered to the protective member 7c. .. After that, the protective member 7c is solidified by being irradiated with ultraviolet rays.

After the sticking step, the frame sticking step is carried out. FIG. 6A is a cross-sectional view schematically illustrating the frame attaching step. In the frame attaching step, the protective member 7c to which the workpiece 1 is attached is attached onto the adhesive layer 7f of the tape 7d attached to the annular frame 9b. Then, the workpiece 1 is attached to the annular frame 9b via the protective member 7c and the tape 7d. The annular frame 9b is configured in the same manner as the above-mentioned frame 9. Further, the tape 7d has a base material 7e and an adhesive layer 7f.

After the frame attachment step, a division step is performed. FIG. 6B is a cross-sectional view schematically illustrating the division step. In the dividing step, the cutting device 20 described above is used. First, the workpiece 1 mounted on the frame 9b is placed on the holding surface 24a of the chuck table 24 of the cutting device 20, the frame 9b is clamped by the clamp 26, and a negative pressure is applied from the chuck table 24. The workpiece 1 is sucked and held on the chuck table 24.

The chuck table 24 and the cutting unit 22 are relatively moved so that the workpiece 1 is divided along the planned division line of the workpiece 1. Next, the cutting blade 22b is rotated by rotating the spindle 22a, and the cutting blade 22b is lowered so as to be at a height position at which the rotating cutting blade 22b cuts into the protective member 7c. Then, by moving the chuck table 24 to process and feed the workpiece 1, the workpiece 1 is cut and the workpiece 1 is divided.

When cutting the workpiece 1, the cutting edge of the rotating cutting blade 22b cuts into the protective member 7c. Then, the cutting blade 22b is dressed because it comes into contact with the dressing abrasive grains 11 arranged on the upper surface of the protective member 7c.

In this way, when the division step is performed, it is not necessary to stop the cutting device 20 and perform dressing separately, and it is not necessary to prepare a dressing board or the like for dressing. Therefore, the efficiency of cutting can be improved. Further, the type of dressing abrasive grains 11 and the abrasive grains to be attached to the protective member 7c can be selected according to the type of the cutting blade 22b and the degree of dressing required. Therefore, the content of the dressing can be determined in detail, and the cutting blade 22b can be dressed appropriately.

In addition, the structure, method, etc. according to the above-described embodiment can be appropriately modified and implemented as long as the scope of the object of the present invention is not deviated.

1 Work piece 1a Front surface 1b Back surface 3 Scheduled division line 5 Device 7,14 Protective member (dicing tape)
7a, 7e Base material 7b, 7f Adhesive material layer 7c Protective member (liquid resin)
7d tape 9,9b frame 9a opening 11,12,12a dressing abrasive grains 2 protective member affixing device 4 protective member roll (dicing tape roll)
6 Take-up roll 8,8a Abrasive grain injection unit 10 Mask 10a Opening 16 Feed roller 18 Pressing roller 18a, 18b Arrow 20 Cutting device 22 Cutting unit 22a Spindle 22b Cutting blade 24 Chuck table 24a Holding surface 26 Clamp 28 units 30 Nozzle

Claims (4)

It is a cutting method of a work piece that cuts a work piece with a cutting blade in which abrasive grains are fixed with a binder.
A dressing abrasive grain attachment step in which dressing abrasive grains for dressing the cutting blade are sprayed and attached to the attachment surface of the protective member to be attached to the work piece.
A sticking step of sticking the protective member to which the dressing abrasive grains are attached to the sticking surface to the work piece, and
A method for cutting a work piece, which comprises a division step of dividing the work piece by cutting the work piece while cutting the cutting blade into the protective member. In the dressing abrasive adhering step, the abrasive grain size contained in the cutting blade, the type of the binder, and, selects the type and spraying conditions of the dressing abrasive grains based on the type of the workpiece, The method for cutting a work piece according to claim 1 , wherein the dressing abrasive grains are sprayed and adhered to the sticking surface of the protective member under the spraying conditions. The protective member is an adhesive tape that supports the workpiece in the opening of the annular frame.
The dressing abrasive grain attachment step according to claim 1 or 2, wherein the dressing abrasive grain is attached to the attachment surface of the protective member in the region between the workpiece and the annular frame. The method for cutting an workpiece according to any one. In the dressing abrasive grain attachment step, the dressing abrasive grains are sprayed and attached to the sticking surface of the protective member by passing through the opening of the mask having an opening.
The attachment step is characterized in that, after the protective member is attached to the work piece, the protective member is pressed by a pressing roller from a surface side opposite to the attachment surface. The method for cutting a workpiece according to any one of claims 2.