JP6836694B2 - ガラス基板の製造方法及び磁気ディスクの製造方法 - Google Patents

ガラス基板の製造方法及び磁気ディスクの製造方法 Download PDF

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Publication number
JP6836694B2
JP6836694B2 JP2020532520A JP2020532520A JP6836694B2 JP 6836694 B2 JP6836694 B2 JP 6836694B2 JP 2020532520 A JP2020532520 A JP 2020532520A JP 2020532520 A JP2020532520 A JP 2020532520A JP 6836694 B2 JP6836694 B2 JP 6836694B2
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Prior art keywords
glass substrate
line
manufacturing
glass
base plate
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JP2020532520A
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Japanese (ja)
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JPWO2020022510A1 (ja
Inventor
修平 東
修平 東
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Hoya Corp
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Hoya Corp
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Publication of JPWO2020022510A1 publication Critical patent/JPWO2020022510A1/ja
Priority to JP2024042075A priority patent/JP7727036B2/ja
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62Record carriers characterised by the selection of the material
    • G11B5/73Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
    • G11B5/739Magnetic recording media substrates
    • G11B5/73911Inorganic substrates
    • G11B5/73921Glass or ceramic substrates
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04Cutting or splitting in curves, especially for making spectacle lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222Scoring using a focussed radiation beam, e.g. laser
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C21/00Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/007Other surface treatment of glass not in the form of fibres or filaments by thermal treatment
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/076Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic materials other than metals or composite materials
    • B23K2103/54Glass
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/74Record carriers characterised by the form, e.g. sheet shaped to wrap around a drum
    • G11B5/82Disk carriers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2020532520A 2018-07-27 2019-07-26 ガラス基板の製造方法及び磁気ディスクの製造方法 Active JP6836694B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021017765A JP7458335B2 (ja) 2018-07-27 2021-02-05 ガラス基板の製造方法及び磁気ディスクの製造方法
JP2024042075A JP7727036B2 (ja) 2018-07-27 2024-03-18 ガラス基板、ガラス基板の製造方法及び磁気ディスク用ガラス基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2018/028269 WO2020021705A1 (ja) 2018-07-27 2018-07-27 ガラス基板の製造方法及び磁気ディスクの製造方法
JPPCT/JP2018/028269 2018-07-27
PCT/JP2019/029530 WO2020022510A1 (ja) 2018-07-27 2019-07-26 ガラス基板の製造方法及び磁気ディスクの製造方法

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JP2021017765A Division JP7458335B2 (ja) 2018-07-27 2021-02-05 ガラス基板の製造方法及び磁気ディスクの製造方法

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JP6836694B2 true JP6836694B2 (ja) 2021-03-03
JPWO2020022510A1 JPWO2020022510A1 (ja) 2021-03-11

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JP2020532520A Active JP6836694B2 (ja) 2018-07-27 2019-07-26 ガラス基板の製造方法及び磁気ディスクの製造方法
JP2021017765A Active JP7458335B2 (ja) 2018-07-27 2021-02-05 ガラス基板の製造方法及び磁気ディスクの製造方法
JP2024042075A Active JP7727036B2 (ja) 2018-07-27 2024-03-18 ガラス基板、ガラス基板の製造方法及び磁気ディスク用ガラス基板の製造方法

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JP2021017765A Active JP7458335B2 (ja) 2018-07-27 2021-02-05 ガラス基板の製造方法及び磁気ディスクの製造方法
JP2024042075A Active JP7727036B2 (ja) 2018-07-27 2024-03-18 ガラス基板、ガラス基板の製造方法及び磁気ディスク用ガラス基板の製造方法

Country Status (6)

Country Link
US (2) US12084376B2 (https=)
JP (3) JP6836694B2 (https=)
CN (1) CN112512741B (https=)
MY (1) MY207144A (https=)
SG (1) SG11202100826TA (https=)
WO (2) WO2020021705A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6783401B2 (ja) * 2018-01-31 2020-11-11 Hoya株式会社 円盤形状のガラス素板の製造方法、及び磁気ディスク用ガラス基板の製造方法
US12479751B2 (en) * 2020-03-31 2025-11-25 Hoya Corporation Method for producing glass plate, and laminate
US11270724B1 (en) * 2021-03-04 2022-03-08 Western Digital Technologies, Inc. Glass substrates for heat assisted magnetic recording (HAMR) and methods and apparatus for use with the glass substrates
WO2022211074A1 (ja) * 2021-03-31 2022-10-06 Hoya株式会社 円環状ガラス基板の製造方法、円環状ガラス基板、及び磁気ディスク用ガラス基板の製造方法
JP2024123284A (ja) * 2021-07-05 2024-09-11 Hoya株式会社 ガラス基板の製造方法及び円盤状ガラス基板
CN119952308A (zh) * 2025-02-24 2025-05-09 武汉华日科仪激光科技有限公司 一种玻璃码盘的激光加工方法和系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2785906B2 (ja) * 1994-02-14 1998-08-13 日本板硝子株式会社 ガラス板の切断方法
US6829910B1 (en) * 2000-04-25 2004-12-14 Asahi Glass Company, Ltd. Removal of enclosed glass parts after cutting using heating and cooling techniques
JP4786783B2 (ja) 2000-08-18 2011-10-05 日本板硝子株式会社 ガラス板の切断方法及び記録媒体用ガラス円盤
JP4225375B2 (ja) 2002-03-01 2009-02-18 Hoya株式会社 ガラス基板の製造方法
JP5126351B2 (ja) 2009-12-25 2013-01-23 旭硝子株式会社 円盤状ガラス基板及び円盤状ガラス基板の製造方法
DE112011105635T5 (de) * 2011-09-21 2014-08-28 Raydiance, Inc. Systeme und Verfahren zum Vereinzeln von Materialien
JP5574392B1 (ja) 2012-09-28 2014-08-20 Hoya株式会社 磁気ディスク用ガラス基板、磁気ディスク
JP6140047B2 (ja) 2013-09-30 2017-05-31 Hoya株式会社 磁気ディスク用ガラス基板の製造方法
US10017410B2 (en) 2013-10-25 2018-07-10 Rofin-Sinar Technologies Llc Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses
US11053156B2 (en) 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses
US10391588B2 (en) * 2015-01-13 2019-08-27 Rofin-Sinar Technologies Llc Method and system for scribing brittle material followed by chemical etching
JP7292006B2 (ja) * 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
JP6654813B2 (ja) 2015-06-02 2020-02-26 川崎重工業株式会社 面取り加工装置および面取り加工方法
DE102015111490A1 (de) 2015-07-15 2017-01-19 Schott Ag Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement
MY188163A (en) 2015-12-28 2021-11-24 Hoya Corp Annular glass blank, method for manufacturing annular glass blank, method for manufacturing annular glass substrate, and method for manufacturing magnetic-disk glass substrate
EP3452418B1 (en) * 2016-05-06 2022-03-02 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
JP2021516159A (ja) 2019-02-12 2021-07-01 ハンズ レーザー テクノロジー インダストリー グループ カンパニー リミテッド 硬脆材料製品の加工方法、装置及びシステム

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Publication number Publication date
US20240425403A1 (en) 2024-12-26
CN112512741B (zh) 2023-08-11
JP7458335B2 (ja) 2024-03-29
WO2020022510A1 (ja) 2020-01-30
JPWO2020022510A1 (ja) 2021-03-11
JP2024079731A (ja) 2024-06-11
SG11202100826TA (en) 2021-03-30
WO2020021705A1 (ja) 2020-01-30
US12084376B2 (en) 2024-09-10
JP2021075459A (ja) 2021-05-20
CN112512741A (zh) 2021-03-16
US20210230042A1 (en) 2021-07-29
MY207144A (en) 2025-01-31
JP7727036B2 (ja) 2025-08-20

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