CN112512741B - 玻璃基板的制造方法以及磁盘的制造方法 - Google Patents

玻璃基板的制造方法以及磁盘的制造方法 Download PDF

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Publication number
CN112512741B
CN112512741B CN201980049738.8A CN201980049738A CN112512741B CN 112512741 B CN112512741 B CN 112512741B CN 201980049738 A CN201980049738 A CN 201980049738A CN 112512741 B CN112512741 B CN 112512741B
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China
Prior art keywords
glass substrate
glass
heating
peripheral portion
producing
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CN201980049738.8A
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English (en)
Chinese (zh)
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CN112512741A (zh
Inventor
东修平
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Hoya Corp
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Hoya Corp
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
    • G11B5/739—Magnetic recording media substrates
    • G11B5/73911—Inorganic substrates
    • G11B5/73921—Glass or ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/007—Other surface treatment of glass not in the form of fibres or filaments by thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/74—Record carriers characterised by the form, e.g. sheet shaped to wrap around a drum
    • G11B5/82—Disk carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
CN201980049738.8A 2018-07-27 2019-07-26 玻璃基板的制造方法以及磁盘的制造方法 Active CN112512741B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2018/028269 WO2020021705A1 (ja) 2018-07-27 2018-07-27 ガラス基板の製造方法及び磁気ディスクの製造方法
JPPCT/JP2018/028269 2018-07-27
PCT/JP2019/029530 WO2020022510A1 (ja) 2018-07-27 2019-07-26 ガラス基板の製造方法及び磁気ディスクの製造方法

Publications (2)

Publication Number Publication Date
CN112512741A CN112512741A (zh) 2021-03-16
CN112512741B true CN112512741B (zh) 2023-08-11

Family

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Application Number Title Priority Date Filing Date
CN201980049738.8A Active CN112512741B (zh) 2018-07-27 2019-07-26 玻璃基板的制造方法以及磁盘的制造方法

Country Status (6)

Country Link
US (2) US12084376B2 (https=)
JP (3) JP6836694B2 (https=)
CN (1) CN112512741B (https=)
MY (1) MY207144A (https=)
SG (1) SG11202100826TA (https=)
WO (2) WO2020021705A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6783401B2 (ja) * 2018-01-31 2020-11-11 Hoya株式会社 円盤形状のガラス素板の製造方法、及び磁気ディスク用ガラス基板の製造方法
US12479751B2 (en) * 2020-03-31 2025-11-25 Hoya Corporation Method for producing glass plate, and laminate
US11270724B1 (en) * 2021-03-04 2022-03-08 Western Digital Technologies, Inc. Glass substrates for heat assisted magnetic recording (HAMR) and methods and apparatus for use with the glass substrates
WO2022211074A1 (ja) * 2021-03-31 2022-10-06 Hoya株式会社 円環状ガラス基板の製造方法、円環状ガラス基板、及び磁気ディスク用ガラス基板の製造方法
JP2024123284A (ja) * 2021-07-05 2024-09-11 Hoya株式会社 ガラス基板の製造方法及び円盤状ガラス基板
CN119952308A (zh) * 2025-02-24 2025-05-09 武汉华日科仪激光科技有限公司 一种玻璃码盘的激光加工方法和系统

Citations (4)

* Cited by examiner, † Cited by third party
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JP2003252638A (ja) * 2002-03-01 2003-09-10 Nippon Sheet Glass Co Ltd ガラス基板の製造方法、及び該製造方法により製造されたガラス基板、並びに該ガラス基板を備える情報記録媒体
US6829910B1 (en) * 2000-04-25 2004-12-14 Asahi Glass Company, Ltd. Removal of enclosed glass parts after cutting using heating and cooling techniques
CN104690428A (zh) * 2013-11-19 2015-06-10 罗芬-新纳技术公司 使用突发超快激光脉冲为脆性材料释放闭型部的方法
CN106098085A (zh) * 2012-09-28 2016-11-09 Hoya株式会社 磁盘用玻璃基板、磁盘以及圆环状的玻璃坯板

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JP2785906B2 (ja) * 1994-02-14 1998-08-13 日本板硝子株式会社 ガラス板の切断方法
JP4786783B2 (ja) 2000-08-18 2011-10-05 日本板硝子株式会社 ガラス板の切断方法及び記録媒体用ガラス円盤
JP5126351B2 (ja) 2009-12-25 2013-01-23 旭硝子株式会社 円盤状ガラス基板及び円盤状ガラス基板の製造方法
DE112011105635T5 (de) * 2011-09-21 2014-08-28 Raydiance, Inc. Systeme und Verfahren zum Vereinzeln von Materialien
JP6140047B2 (ja) 2013-09-30 2017-05-31 Hoya株式会社 磁気ディスク用ガラス基板の製造方法
US10017410B2 (en) 2013-10-25 2018-07-10 Rofin-Sinar Technologies Llc Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses
US10391588B2 (en) * 2015-01-13 2019-08-27 Rofin-Sinar Technologies Llc Method and system for scribing brittle material followed by chemical etching
JP7292006B2 (ja) * 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
JP6654813B2 (ja) 2015-06-02 2020-02-26 川崎重工業株式会社 面取り加工装置および面取り加工方法
DE102015111490A1 (de) 2015-07-15 2017-01-19 Schott Ag Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement
MY188163A (en) 2015-12-28 2021-11-24 Hoya Corp Annular glass blank, method for manufacturing annular glass blank, method for manufacturing annular glass substrate, and method for manufacturing magnetic-disk glass substrate
EP3452418B1 (en) * 2016-05-06 2022-03-02 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
JP2021516159A (ja) 2019-02-12 2021-07-01 ハンズ レーザー テクノロジー インダストリー グループ カンパニー リミテッド 硬脆材料製品の加工方法、装置及びシステム

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6829910B1 (en) * 2000-04-25 2004-12-14 Asahi Glass Company, Ltd. Removal of enclosed glass parts after cutting using heating and cooling techniques
JP2003252638A (ja) * 2002-03-01 2003-09-10 Nippon Sheet Glass Co Ltd ガラス基板の製造方法、及び該製造方法により製造されたガラス基板、並びに該ガラス基板を備える情報記録媒体
CN106098085A (zh) * 2012-09-28 2016-11-09 Hoya株式会社 磁盘用玻璃基板、磁盘以及圆环状的玻璃坯板
CN104690428A (zh) * 2013-11-19 2015-06-10 罗芬-新纳技术公司 使用突发超快激光脉冲为脆性材料释放闭型部的方法

Also Published As

Publication number Publication date
US20240425403A1 (en) 2024-12-26
JP7458335B2 (ja) 2024-03-29
JP6836694B2 (ja) 2021-03-03
WO2020022510A1 (ja) 2020-01-30
JPWO2020022510A1 (ja) 2021-03-11
JP2024079731A (ja) 2024-06-11
SG11202100826TA (en) 2021-03-30
WO2020021705A1 (ja) 2020-01-30
US12084376B2 (en) 2024-09-10
JP2021075459A (ja) 2021-05-20
CN112512741A (zh) 2021-03-16
US20210230042A1 (en) 2021-07-29
MY207144A (en) 2025-01-31
JP7727036B2 (ja) 2025-08-20

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