SG11202100826TA - Method for manufacturing glass substrate and method for manufacturing magnetic disk - Google Patents
Method for manufacturing glass substrate and method for manufacturing magnetic diskInfo
- Publication number
- SG11202100826TA SG11202100826TA SG11202100826TA SG11202100826TA SG11202100826TA SG 11202100826T A SG11202100826T A SG 11202100826TA SG 11202100826T A SG11202100826T A SG 11202100826TA SG 11202100826T A SG11202100826T A SG 11202100826TA SG 11202100826T A SG11202100826T A SG 11202100826TA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- glass substrate
- magnetic disk
- manufacturing glass
- manufacturing magnetic
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/739—Magnetic recording media substrates
- G11B5/73911—Inorganic substrates
- G11B5/73921—Glass or ceramic substrates
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/007—Other surface treatment of glass not in the form of fibres or filaments by thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
- B23K2103/54—Glass
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/74—Record carriers characterised by the form, e.g. sheet shaped to wrap around a drum
- G11B5/82—Disk carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2018/028269 WO2020021705A1 (ja) | 2018-07-27 | 2018-07-27 | ガラス基板の製造方法及び磁気ディスクの製造方法 |
| PCT/JP2019/029530 WO2020022510A1 (ja) | 2018-07-27 | 2019-07-26 | ガラス基板の製造方法及び磁気ディスクの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202100826TA true SG11202100826TA (en) | 2021-03-30 |
Family
ID=69181399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202100826TA SG11202100826TA (en) | 2018-07-27 | 2019-07-26 | Method for manufacturing glass substrate and method for manufacturing magnetic disk |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12084376B2 (https=) |
| JP (3) | JP6836694B2 (https=) |
| CN (1) | CN112512741B (https=) |
| MY (1) | MY207144A (https=) |
| SG (1) | SG11202100826TA (https=) |
| WO (2) | WO2020021705A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6783401B2 (ja) * | 2018-01-31 | 2020-11-11 | Hoya株式会社 | 円盤形状のガラス素板の製造方法、及び磁気ディスク用ガラス基板の製造方法 |
| US12479751B2 (en) * | 2020-03-31 | 2025-11-25 | Hoya Corporation | Method for producing glass plate, and laminate |
| US11270724B1 (en) * | 2021-03-04 | 2022-03-08 | Western Digital Technologies, Inc. | Glass substrates for heat assisted magnetic recording (HAMR) and methods and apparatus for use with the glass substrates |
| WO2022211074A1 (ja) * | 2021-03-31 | 2022-10-06 | Hoya株式会社 | 円環状ガラス基板の製造方法、円環状ガラス基板、及び磁気ディスク用ガラス基板の製造方法 |
| JP2024123284A (ja) * | 2021-07-05 | 2024-09-11 | Hoya株式会社 | ガラス基板の製造方法及び円盤状ガラス基板 |
| CN119952308A (zh) * | 2025-02-24 | 2025-05-09 | 武汉华日科仪激光科技有限公司 | 一种玻璃码盘的激光加工方法和系统 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2785906B2 (ja) * | 1994-02-14 | 1998-08-13 | 日本板硝子株式会社 | ガラス板の切断方法 |
| US6829910B1 (en) * | 2000-04-25 | 2004-12-14 | Asahi Glass Company, Ltd. | Removal of enclosed glass parts after cutting using heating and cooling techniques |
| JP4786783B2 (ja) | 2000-08-18 | 2011-10-05 | 日本板硝子株式会社 | ガラス板の切断方法及び記録媒体用ガラス円盤 |
| JP4225375B2 (ja) | 2002-03-01 | 2009-02-18 | Ｈｏｙａ株式会社 | ガラス基板の製造方法 |
| JP5126351B2 (ja) | 2009-12-25 | 2013-01-23 | 旭硝子株式会社 | 円盤状ガラス基板及び円盤状ガラス基板の製造方法 |
| DE112011105635T5 (de) * | 2011-09-21 | 2014-08-28 | Raydiance, Inc. | Systeme und Verfahren zum Vereinzeln von Materialien |
| JP5574392B1 (ja) | 2012-09-28 | 2014-08-20 | Ｈｏｙａ株式会社 | 磁気ディスク用ガラス基板、磁気ディスク |
| JP6140047B2 (ja) | 2013-09-30 | 2017-05-31 | Hoya株式会社 | 磁気ディスク用ガラス基板の製造方法 |
| US10017410B2 (en) | 2013-10-25 | 2018-07-10 | Rofin-Sinar Technologies Llc | Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses |
| US11053156B2 (en) | 2013-11-19 | 2021-07-06 | Rofin-Sinar Technologies Llc | Method of closed form release for brittle materials using burst ultrafast laser pulses |
| US10391588B2 (en) * | 2015-01-13 | 2019-08-27 | Rofin-Sinar Technologies Llc | Method and system for scribing brittle material followed by chemical etching |
| JP7292006B2 (ja) * | 2015-03-24 | 2023-06-16 | コーニング インコーポレイテッド | ディスプレイガラス組成物のレーザ切断及び加工 |
| JP6654813B2 (ja) | 2015-06-02 | 2020-02-26 | 川崎重工業株式会社 | 面取り加工装置および面取り加工方法 |
| DE102015111490A1 (de) | 2015-07-15 | 2017-01-19 | Schott Ag | Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement |
| MY188163A (en) | 2015-12-28 | 2021-11-24 | Hoya Corp | Annular glass blank, method for manufacturing annular glass blank, method for manufacturing annular glass substrate, and method for manufacturing magnetic-disk glass substrate |
| EP3452418B1 (en) * | 2016-05-06 | 2022-03-02 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
| JP2021516159A (ja) | 2019-02-12 | 2021-07-01 | ハンズ レーザー テクノロジー インダストリー グループ カンパニー リミテッド | 硬脆材料製品の加工方法、装置及びシステム |
-
2018
- 2018-07-27 WO PCT/JP2018/028269 patent/WO2020021705A1/ja not_active Ceased
-
2019
- 2019-07-26 JP JP2020532520A patent/JP6836694B2/ja active Active
- 2019-07-26 SG SG11202100826TA patent/SG11202100826TA/en unknown
- 2019-07-26 US US17/263,019 patent/US12084376B2/en active Active
- 2019-07-26 CN CN201980049738.8A patent/CN112512741B/zh active Active
- 2019-07-26 MY MYPI2021000409A patent/MY207144A/en unknown
- 2019-07-26 WO PCT/JP2019/029530 patent/WO2020022510A1/ja not_active Ceased
-
2021
- 2021-02-05 JP JP2021017765A patent/JP7458335B2/ja active Active
-
2024
- 2024-03-18 JP JP2024042075A patent/JP7727036B2/ja active Active
- 2024-08-29 US US18/819,335 patent/US20240425403A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240425403A1 (en) | 2024-12-26 |
| CN112512741B (zh) | 2023-08-11 |
| JP7458335B2 (ja) | 2024-03-29 |
| JP6836694B2 (ja) | 2021-03-03 |
| WO2020022510A1 (ja) | 2020-01-30 |
| JPWO2020022510A1 (ja) | 2021-03-11 |
| JP2024079731A (ja) | 2024-06-11 |
| WO2020021705A1 (ja) | 2020-01-30 |
| US12084376B2 (en) | 2024-09-10 |
| JP2021075459A (ja) | 2021-05-20 |
| CN112512741A (zh) | 2021-03-16 |
| US20210230042A1 (en) | 2021-07-29 |
| MY207144A (en) | 2025-01-31 |
| JP7727036B2 (ja) | 2025-08-20 |
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