JP6822869B2 - Peeling device - Google Patents

Description

The present invention relates to a peeling device for peeling a protective tape attached to a wafer via a peeling tape.

When grinding a wafer, a protective tape is attached to the surface of the wafer to protect the device. The wafer is carried into a grinding device, and the back surface of the wafer is ground with a grinding wheel. After grinding the wafer, the wafer is carried into the tape mounter. A ring frame is attached to the back surface of the wafer via a dicing tape, and the wafer and the ring frame are integrated.

The wafer integrated with the ring frame is carried into the peeling device. The wafer is sucked and held on the holding table via the ring frame with the surface to which the protective tape is attached facing up. Then, a release tape is attached to the outer edge of the protective tape (see, for example, Patent Document 1). The clamping means of the peeling device clamps the front end of the peeling tape attached to the upper surface of the protective tape, and the clamping means pulls the peeling tape in the direction of winding up the protective tape from the wafer, so that the protective tape is peeled from the wafer. .. The protective tape peeled from the wafer is discarded when the clamp of the peeling tape in the clamping means is released.

Japanese Unexamined Patent Publication No. 2012-028478

By the way, the release tape is formed by applying an adhesive to the base material. Therefore, when the release tape is clamped by the clamp means of the release device, the surface of the release tape on the adhesive side sticks to the clamp means, and even if the clamp is released, the release tape does not separate from the clamp means, and the protective tape There is a problem that it is difficult to discard.

The present invention has been made in view of this point, and one of the objects of the present invention is to provide a peeling device capable of easily separating the surface of the peeling tape on the adhesive side from the clamping means.

The peeling device according to one aspect of the present invention is a peeling device for peeling the protective tape from the waiha by pulling the peeling tape attached to the protective tape attached to one surface of the waiha in a direction away from the waiha. Consists of an adhesive and a base material, a holding table that sucks and holds the other surface of the wafer, a clamping means that clamps the release tape, and a roll-shaped release tape that is pulled out from the outer circumference to form a holding table. It is provided with a release tape attaching means for attaching to a protective tape attached to a held wafer and a cutting means for cutting the release tape attached to the protective tape to a predetermined length, and the clamping means is an adhesive. A base portion having a contact surface on which irregularities are formed, a suction portion that sucks and holds the opposite surface of the surface on which the adhesive is applied to the base material, and a suction portion that moves forward and backward in the direction of approaching and separating from the base portion. The base portion is provided with a plurality of pores opening in the contact surface and an air ejection means for ejecting air from the pores, and the peeling tape clamped by the clamping means is pulled and protected from the wafer. When the clamping means releases the release tape after the tape is peeled off, air is ejected from the base portion and the suction portion that sucks and holds the base material is moved in a direction away from the base portion to separate the adhesive from the base portion. After that, the release tape is separated from the suction part, and the release tape and the protective tape are discarded.

According to this configuration, the base portion of the clamping means that contacts the surface of the release tape on the adhesive side has irregularities on the contact surface with the adhesive, so that the contact area between the base portion and the release tape becomes small. , The adhesive side surface of the release tape does not easily adhere to the base. Further, when the release tape is separated from the clamping means, air is ejected from the pores formed on the contact surface, and the surface of the release tape on the base material side is suction-held by the suction portion so that the suction portion is released from the base portion. Be separated. As a result, the surface of the release tape on the adhesive side can be easily separated from the base portion, and the release tape to which the protective tape is attached can be easily discarded. Further, since the release tape is attached to the outer edge of the protective tape and cut to a predetermined length for use, compared with the case where the release tape is attached to the protective tape over the entire length of the protective tape. , The amount of release tape used can be minimized.

According to the present invention, the surface of the release tape on the adhesive side can be easily separated from the clamping means.

It is a perspective view of the peeling apparatus of this embodiment. It is a side view of the clamp means which concerns on this embodiment. It is an operation transition diagram of the peeling operation of the protective tape by the peeling device of this embodiment. It is an operation transition diagram of the peeling operation of the protective tape by the peeling device of this embodiment. It is an operation transition diagram of the peeling operation of the protective tape by the peeling device of this embodiment. It is an operation transition diagram of the discarding operation of the peeling tape by the peeling apparatus of this embodiment.

Hereinafter, the peeling device of the present embodiment will be described with reference to the attached drawings. FIG. 1 is a perspective view of the peeling device of the present embodiment. In the following description, a configuration for peeling the protective tape from the wafer using a dedicated peeling device will be described, but the present invention is not limited to this configuration. For example, the peeling device may be incorporated in another processing device.

As shown in FIG. 1, the peeling device 1 attaches the peeling tape T2 to the protective tape T1 on the surface (one side) of the wafer W on the holding table 10, and pulls the peeling tape T2 to protect the wafer W from the wafer W. It is configured to peel off the tape T1. A large number of devices are formed on the surface of the wafer W, and the protective tape T1 on the surface of the wafer W protects the devices when the back surface of the wafer W is ground. Further, the protective tape T1 is, for example, a sheet base material having the same shape as the wafer W coated with an ultraviolet curable resin, and has an optimum thickness and adhesive strength according to the type of the wafer W, grinding conditions, and the like. It is used. The release tape T2 is configured by applying the adhesive A to the base material S (see FIG. 2).

The wafer W may be a plate-shaped work having a protective tape T1 adhered to its surface, for example, a semiconductor wafer having a semiconductor device formed on a semiconductor substrate, or an optical device formed on an inorganic material substrate. It may be an optical device wafer. Further, the wafer W may be a semiconductor substrate before forming a semiconductor device or an inorganic material substrate before forming an optical device. Further, the wafer W may be carried into the peeling device 1 while being supported by the ring frame via the dicing tape, or may be carried into the peeling device 1 while being attached to the substrate.

The base 21 of the peeling device 1 is provided with a horizontal moving means 20 for moving the holding table 10 in the horizontal direction. The horizontal moving means 20 has a pair of guide rails 22 arranged on the base 21, and a motor-driven slider 23 slidably installed on the pair of guide rails 22. A holding table 10 for holding the back surface (the other surface) of the wafer W is attached to the upper surface of the slider 23. A ball screw 24 is screwed into the slider 23, and the holding table 10 is moved in the horizontal direction along the guide rail 22 by rotationally driving the drive motor 25 connected to one end of the ball screw 24.

A holding surface 11 is formed on the holding table 10 of the peeling device 1 by a porous ceramic material. The holding surface 11 is connected to a suction source (not shown) through a flow path in the table, and is created a negative pressure by the suction force from the suction source. Above the holding table 10, a release tape supply means 30 for pulling out the strip-shaped release tape T2 from the outer circumference of the tape roll R and supplying it to the protective tape T1 is provided. The release tape supply means 30 forms a supply path for the release tape T2 by the feeding reel 31 on which the tape roll R is mounted, a pair of driven rollers 32a and 32b for guiding the release tape T2, and a pair of delivery rollers 33a and 33b. doing.

A braking mechanism (not shown) is connected to the feeding reel 31, and back tension is applied to the peeling tape T2 drawn from the tape roll R. The back tension is adjusted to such a strength that the release tape T2 does not loosen while the release tape T2 is being pulled out and the pulling out is stopped. The pair of driven rollers 32a and 32b drive and rotate the release tape T2 drawn from the tape roll R, and the release tape T2 is folded back to apply tension. The pair of feeding rollers 33a and 33b pull out the release tape T2 from the tape roll R and feed it toward the clamping means 40 that sandwiches the release tape T2.

The clamp means 40 is configured so that the movable plate 43 is separated or brought close to the base portion 42 by the advancing / retreating means 41. The clamping means 40 clamps the front end of the release tape T2 by bringing the movable plate 43 downward toward the base portion 42, and separates the movable plate 43 upward from the base portion 42 to separate the front end of the release tape T2. I'm releasing.

Further, between the pair of feeding rollers 33a and 33b and the clamping means 40, a peeling tape sticking means 50 for pressing and sticking the peeling tape T2 against the protective tape T1 and a peeling tape sticking means 50 for sticking the peeling tape T2. A cutting means 60 for cutting the tape T2 to a predetermined length is provided. The release tape attaching means 50 is configured by attaching a pressing portion 51 that can be moved in the vertical direction by the pressing driving portion 53. The pressing portion 51 is attached to the tip of a rod protruding downward from the pressing driving portion 53, and is formed in a rectangular parallelepiped shape.

Further, the rail base 71 located above the holding table 10 is provided with horizontal moving means 70 for moving the clamping means 40 and the pressing portion 51 in the horizontal direction. The horizontal moving means 70 has a pair of guide rails 72 arranged on the rail base 71, and a motor-driven slider 73 slidably installed on the pair of guide rails 72. A clamp means 40 and a pressing portion 51 are attached to the lower portion of the slider 73. A ball screw 74 is screwed into the slider 73, and a drive motor 75 connected to one end of the ball screw 74 is rotationally driven to move the clamping means 40 and the pressing portion 51 in the horizontal direction along the guide rail 72. Will be done.

The cutting means 60 is configured such that the cutter driving unit 61 causes the disk-shaped cutter 62 to cross the release tape T2 on the cutter base 63. The cutter 62 is attached to the tip of a rod protruding from the cutter drive unit 61 in the width direction of the release tape T2 via an L-shaped member 65. On the upper surface of the cutter base 63, a relief groove 66 (see FIG. 3) that escapes from the cutting edge of the cutter 62 when the release tape T2 is cut is formed in the width direction of the release tape T2. With the release tape T2 attached to the protective tape T1, the cutter 62 reciprocates along the relief groove 66 to cut the release tape T2 to a predetermined length. The roller surface of the driven roller 32a, the roller surface of the feeding roller 33b, and the upper surface of the cutter base 63 are subjected to surface unevenness processing such as plasma coating and Teflon (registered trademark) coating. The surface unevenness processing is not limited to coating, and plasma processing, embossing processing, or rough surface processing may be performed. By applying such surface treatment to the portion of the release tape T2 that comes into contact with the adhesive A, it is possible to prevent the contact portion from sticking to the adhesive A.

In the peeling device 1 configured in this way, the peeling tape T2 is pulled out by the clamping means 40, and the peeling tape T2 is crimped to the protective tape T1 at the tip of the pressing portion 51 of the peeling tape attaching means 50. Then, after the release tape T2 is cut by the cutting means 60, the holding table 10 holding the wafer W and the clamp means 40 holding the release tape T2 are relatively moved in the horizontal direction to move the protective tape T1 from the surface of the wafer W. Is torn off.

The peeling device 1 of the present embodiment is provided with a control unit (not shown) that controls various operations. The control unit is composed of a processor, a memory, and the like that execute various processes. The memory is composed of one or a plurality of storage media such as ROM (Read Only Memory) and RAM (Random Access Memory) depending on the intended use. For example, a program for controlling various processes of the peeling device 1 is stored in the memory.

Here, when the clamping means clamps the release tape and pulls out the release tape, the adhesive side of the release tape comes into contact with the base portion and the release tape is sandwiched. For this reason, there is a problem that the release tape sticks to the upper surface of the base portion that comes into contact with the surface of the release tape on the adhesive side, and the release tape is difficult to separate from the clamping means even if the clamp is released. For this reason, unevenness is formed on the upper surface of the base portion to reduce the contact area of the release tape with the adhesive side surface, and air is ejected from the holes formed on the upper surface of the base portion to blow air from the base portion and the release tape. The configuration to separate from was examined. However, there is a problem that the release tape does not partially separate from the upper surface of the base portion, or the cut release tape sticks to the side surface of the base portion. Therefore, in the present embodiment, irregularities and pores for ejecting air are formed on the upper surface and side surfaces of the base portion, and when the clamp of the clamping means is released, air is ejected from the upper surface and side surfaces of the base portion. At the same time, the base material of the release tape is sucked and held by the suction part while being separated from the base part, and the surface on the adhesive side is separated from the base part.

Hereinafter, the configuration of the clamping means will be described in detail with reference to FIG. FIG. 2 is a side view of the clamping means according to the present embodiment. FIG. 2A shows a state in which the clamping means is clamping the release tape, and FIG. 2B shows a state in which the clamping means is releasing the clamp.

As shown in FIG. 2, the clamp means 40 switches between clamping and releasing the release tape T2 by bringing the movable plate 43 into contact with the base portion 42 of the clamp main body 47 by the advancing / retreating means 41. The upper wall 46 of the clamping means 40 is fixed to the advancing / retreating means 41, the side wall 45 extends from the upper wall 46 along the advancing / retreating direction of the movable plate 43, and the bottom of the side wall 45 faces the movable plate 43. Is provided with a base portion 42.

The movable plate 43 is attached to the tip of a rod protruding downward from the advancing / retreating means 41. A pair of suction cups 44 serving as suction cups are provided on the lower surface of the movable plate 43 via support columns. A flow path (see FIG. 3) communicates with the movable plate 43, the support column, and the suction cup 44, and the flow path is connected to the suction source 91 (see FIG. 3) and the air ejection means 92 via the joint portion 48. To.

Further, the upper surface 42a and the side surface 42b of the base portion 42 are formed with irregularities, and the upper surface 42a is a contact surface with which the surface of the release tape T2 on the adhesive A side comes into contact. Further, a plurality of pores 42c are formed on the upper surface 42a and the side surface 42b of the base portion 42, and the pores 42c communicate with the flow path (see FIG. 3) formed in the base portion 42 to flow. The road is connected to the air ejection means 92 via the joint portion 49.

As shown in FIG. 2A, when the release tape T2 is clamped by the clamping means 40, the suction cup 44 is brought closer to the base portion 42 by the advancing / retreating means 41. In the release tape T2, the surface on the adhesive A side is in contact with the upper surface 42a of the base portion 42, and the surface opposite to the surface on which the adhesive A of the base material S is applied, that is, the surface on the base material S side of the base material S is By being pressed by the suction cup 44, the front end of the release tape T2 is sandwiched by the clamping means 40. The flow path of the movable plate 43 is connected to the suction source 91, and the surface of the release tape T2 on the base material S side is sucked by the suction cup 44 due to the negative pressure generated in the suction cup 44.

As shown in FIG. 2B, when the release tape T2 is not clamped by the clamping means 40, the suction cup 44 is separated from the base portion 42 by the advancing / retreating means 41. At this time, air is ejected from the pores 42c of the base portion 42 connected to the air ejection means 92 while the surface on the base material S side is sucked and held by the suction cup 44. As a result, the surface of the release tape T2 on the adhesive A side is separated from the base portion 42. Then, the flow path of the movable plate 43 is connected to the air ejection means 92, and air is ejected from the suction cup 44, so that the release tape T2 is separated from the suction cup 44.

By forming irregularities on the base portion 42 of the clamping means 40, the contact area between the base portion 42 and the surface of the release tape T2 on the adhesive A side becomes smaller, and the contact area between the base portion 42 and the release tape T2 on the adhesive A side becomes smaller. The surface is hard to adhere. Further, when the clamp of the release tape T2 in the clamping means 40 is released, air is ejected from the pores 42c formed in the base portion 42, and the surface of the release tape T2 on the base material S side is sucked and held by the suction cup 44. In this state, the suction cup 44 is separated from the base portion 42 by the advancing / retreating means 41. As a result, the surface on the adhesive A side is separated from the base portion 42, and the release tape T2 can be easily separated from the clamping means 40.

Next, the sticking operation by the peeling device will be described with reference to FIGS. 3 to 6. 3 to 5 are operation transition diagrams of the protective tape peeling operation by the peeling device of the present embodiment. FIG. 6 is an operation transition diagram of the operation of discarding the release tape by the release device of the present embodiment. The sticking operation of this embodiment is only an example, and can be changed as appropriate.

As shown in FIG. 3A, when the wafer W is held on the holding table 10, the release tape T2 is sent from the tape roll R toward the clamping means 40 by the pair of feeding rollers 33a and 33b. Further, the clamp means 40 and the release tape attaching means 50 are brought close to the release tape T2.

The front end of the release tape T2 is positioned on the base portion 42 of the clamping means 40, and the suction cup 44 provided on the movable plate 43 is brought closer to the base portion 42 by the advancing / retreating means 41. The surface of the release tape T2 on the adhesive A side is in contact with the upper surface 42a of the base portion 42, and the surface on the base material S side is pressed by the suction cup 44, so that the front end of the release tape T2 is clamped. In this initial state, the tip of the pressing portion 51 of the release tape attaching means 50 is separated upward from the release tape T2, and the wafer W is held on the holding table 10 at a position deviated from directly below the release tape T2. ..

The joint portion 48 of the movable plate 43 is connected to a pipe communicating with the suction source 91 and the air ejection means 92, and the pipe is bifurcated. One pipe is connected to the suction source 91 via the on-off valve 96, and the other pipe is connected to the air ejection means 92 via the on-off valve 95. The joint portion 49 of the base portion 42 is connected to a pipe communicating with the air ejection means 92, and an on-off valve 97 is provided in the middle of the pipe. When the tip of the pressing portion 51 of the release tape attaching means 50 is separated upward from the release tape T2, the on-off valve 96 is closed, the suction of the release tape T2 of the suction cup 44 is stopped, and the on-off valve 95 is It is closed and the supply of air from the air ejection means 92 to the suction cup 44 is stopped, and the on-off valve 97 is closed and the supply of air to the pores 42c of the base portion 42 is stopped.

As shown in FIG. 3B, the holding table 10 is positioned below the release tape T2, and the release tape T2 is pulled out by the clamping means 40. Back tension acts on the release tape T2 to suppress slackening of the tape. Further, the pressing portion 51 of the release tape attaching means 50 is moved integrally with the clamping means 40, and the pressing portion 51 is positioned directly above the outer edge portion of the protective tape T1 attached to the wafer W.

As shown in FIG. 4A, with the pressing portion 51 positioned directly above the outer edge portion of the protective tape T1, the pressing portion 51 moves downward and the release tape T2 is pressed against the outer edge portion of the protective tape T1. As a result, the release tape T2 is attached to the outer edge of the protective tape T1 by the pressing portion 51. At this time, the on-off valve 96 is opened and the suction cup 44 sucks and holds the release tape T2. Since the release tape T2 is clamped by the clamping means 40 while being sucked and held by the suction cup 44, it is stably clamped by the clamping means 40. The on-off valve 96 may be closed as long as the release tape T2 is stably clamped by the clamping means 40.

As shown in FIG. 4B, the cutter 62 of the cutting means 60 reciprocates along the relief groove 66 of the cutter base 63 with the release tape T2 attached to the protective tape T1. As a result, the release tape T2 is cut. Since the release tape T2 is attached to the outer edge of the protective tape T1 and cut into strips of a predetermined length for use, the release tape T2 is attached to the protective tape T1 over the entire length of the protective tape T1. The amount of the release tape T2 used can be minimized as compared with the case of

As shown in FIG. 5A, the pressing portion 51 is moved upward, and the clamping means 40 and the holding table 10 are relatively moved in the horizontal direction. The release tape T2 clamped by the clamping means 40 is pulled from the wafer W in the direction of winding up the protective tape T1. As a result, the protective tape T1 starts to be peeled from the wafer W via the peeling tape T2. At this time, the surface of the release tape T2 on the adhesive A side may adhere to the side surface 42b of the base portion 42.

As shown in FIG. 5B, the holding table 10 is moved away from the clamping means 40, and the protective tape T1 is peeled off from the wafer W. The peeled protective tape T1 is suspended by the clamping means 40 via the peeling tape T2 clamped by the clamping means 40. The side surface 42b of the base portion 42 is in contact with the surface of the release tape T2 on the adhesive A side.

As shown in FIG. 6A, the suction cup 44 provided on the movable plate 43 is separated from the base portion 42 by the advancing / retreating means 41. At this time, with the on-off valve 96 open, the on-off valve 97 is opened and air is supplied to the pores 42c of the base portion 42. As a result, the surface of the release tape T2 on the base material S side is separated from the base portion 42 while being sucked and held by the suction cup 44, and air is ejected from the pores 42c, so that the surface of the release tape T2 on the adhesive A side is released. Is separated from the upper surface 42a and the side surface 42b of the base portion 42.

As shown in FIG. 6B, the on-off valve 96 is closed to stop the suction of the release tape T2 of the suction cup 44, the on-off valve 95 is opened, and the connection destination of the joint portion 48 is the air ejection means 92 from the suction source 91. Can be switched to. As a result, air is ejected from the suction cup 44, the surface of the release tape T2 on the base material S side is separated from the suction cup 44, and the release tape T2 and the protective tape T1 are discarded in the disposal box. At this time, since air is ejected from the pores 42c, it is possible to prevent the release tape T2 and the protective tape T1 separated from the suction cup 44 from reattaching to the base portion 42.

In the clamping means 40, since the upper surface 42a of the base portion 42 is uneven, the contact area between the base portion 42 and the release tape T2 becomes small, and the surface of the release tape T2 on the adhesive A side is the base portion 42. It is difficult to adhere to the contact surface. Further, when the clamp of the release tape T2 in the clamping means 40 is released, as shown in FIG. 6A, air is ejected from the pores 42c formed in the upper surface 42a, and the release tape T2 is on the base material S side. The surface is sucked and held by the suction cup 44, and the suction cup 44 is separated from the base portion 42. As a result, the surface on the adhesive A side is separated from the upper surface 42a, so that the surface on the adhesive A side can be easily separated from the base portion 42.

Further, the base portion 42 has irregularities and pores 42c formed not only on the upper surface 42a but also on the side surface 42b. Therefore, it is difficult for the surface on the adhesive A side to adhere to the side surface 42b due to the unevenness. Further, as shown in FIG. 5, even if the surface of the release tape T2 on the adhesive A side adheres to the side surface 42b when the protective tape T1 is peeled off from the wafer W with the cut release tape T2, the pores of the side surface 42b By sucking and holding the surface on the base material S side with the suction cup 44 while ejecting air from the 42c and separating the suction cup 44 from the base portion 42, the surface on the adhesive A side can be easily separated from the side surface 42b as well. .. After being separated from the base portion 42 by the suction cup 44, the release tape T2 is separated from the suction cup 44 by the air ejected from the suction cup 44, and is easily discarded together with the protective tape T1.

As described above, according to the peeling device 1 of the present embodiment, the base portion 42 of the clamping means 44 that comes into contact with the surface of the peeling tape T2 on the adhesive A side has irregularities formed on the contact surface with the adhesive A. Therefore, the contact area between the base portion 42 and the release tape T2 becomes small, and the surface of the release tape T2 on the adhesive A side is unlikely to adhere to the base portion 42. Further, when the release tape T2 is separated from the clamping means 44, air is ejected from the pores 42c formed on the contact surface, and the surface of the release tape T2 on the base material S side is sucked and held by the suction cup 44 to be a base. The suction cup 44 is separated from the portion 42. As a result, the surface of the release tape T2 on the adhesive A side can be easily separated from the base portion 42, and the release tape T2 to which the protective tape T1 is attached can be easily discarded. Further, since the release tape T2 is attached to the outer edge of the protective tape T1 and cut to a predetermined length for use, the release tape T2 is attached to the protective tape T1 over the entire length of the protective tape T1. Compared with the case, the amount of the release tape T2 used can be minimized.

For example, in the present embodiment, the side surface 42b and the upper surface 42a of the base portion 42 of the clamp means 40 are configured to have irregularities, but the present invention is not limited to this. If the surface of the release tape T2 on the adhesive A side is hard to adhere to, the side surface 42b and the upper surface 42a of the base portion 42 may be configured to be subjected to Teflon coating, rough surface processing, or the like.

Further, in the present embodiment, the surface of the release tape T2 on the base material S side is suction-held by the suction cup 44 of the clamp means 40, but the present invention is not limited to this. If the surface of the release tape T2 on the base material S side can be suction-held and the release tape T2 can be separated from the base portion 42, the surface of the release tape T2 on the base material S side may be suction-held by a porous member or the like.

Moreover, although each embodiment of the present invention has been described, as another embodiment of the present invention, each of the above embodiments may be combined in whole or in part.

Moreover, the embodiment of the present invention is not limited to each of the above-described embodiments, and may be variously modified, replaced, or modified without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by the advancement of technology or another technology derived from it, it may be carried out by using that method. Therefore, the scope of claims covers all embodiments that may be included within the scope of the technical idea of the present invention.

In the present embodiment, the configuration in which the present invention is applied to a peeling device for peeling a protective tape attached to a wafer has been described, but it is also possible to apply the present invention to a cluster provided with a peeling device.

As described above, the present invention has the effect that the surface of the release tape on the adhesive side can be easily separated from the clamping means, and in particular, the release that peels off the protective tape that protects the device when grinding the wafer. Useful for equipment.

1 Peeling device 10 Holding table 40 Clamping means 41 Advancing / retreating means 42 Base part 42a Top surface 42b Side surface 42c Pore 44 Sucker (suction part)
50 Peeling tape sticking means 51 Pressing part 60 Cutting means 92 Air blowing means A Adhesive S Base material T1 Protective tape T2 Peeling tape W Wafer

Claims (1)

A peeling device that pulls a release tape attached to a protective tape attached to one surface of a wafer in a direction away from the wafer to release the protective tape from the wafer.
The release tape is composed of an adhesive and a base material.
A holding table that sucks and holds the other surface of the wafer, a clamping means that clamps the release tape, and the release tape wound in a roll shape is pulled out from the outer periphery and attached to the wafer held on the holding table. A means for attaching a release tape to be attached to the protective tape and a cutting means for cutting the release tape attached to the protective tape to a predetermined length are provided.
The clamping means includes a base portion having a contact surface on which an unevenness with which the adhesive comes into contact is formed, a suction portion that sucks and holds the opposite surface of the surface on which the adhesive is applied to the base material, and the suction portion. Is provided with an advancing / retreating means for advancing / retreating in the direction of approaching and separating from the base portion.
The base portion includes a plurality of pores that open in the contact surface, and an air ejection means for ejecting air from the pores.
When the clamping means pulls the release tape clamped and peels the protective tape from the wafer, and then the clamping means releases the release tape, air is ejected from the base portion and the base material is sucked and held. A peeling device that moves the suction portion in a direction away from the base portion to separate the adhesive from the base portion, then separates the release tape from the suction portion, and discards the release tape and the protective tape.

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