JP6822432B2 - ウェーハの片面研磨方法 - Google Patents

ウェーハの片面研磨方法 Download PDF

Info

Publication number
JP6822432B2
JP6822432B2 JP2018031159A JP2018031159A JP6822432B2 JP 6822432 B2 JP6822432 B2 JP 6822432B2 JP 2018031159 A JP2018031159 A JP 2018031159A JP 2018031159 A JP2018031159 A JP 2018031159A JP 6822432 B2 JP6822432 B2 JP 6822432B2
Authority
JP
Japan
Prior art keywords
polishing
wafer
slurry
water
soluble polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018031159A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019145750A (ja
Inventor
勝久 杉森
勝久 杉森
和明 小佐々
和明 小佐々
洋三 佐藤
洋三 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Corp
Original Assignee
Sumco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Corp filed Critical Sumco Corp
Priority to JP2018031159A priority Critical patent/JP6822432B2/ja
Priority to TW108100506A priority patent/TWI724361B/zh
Priority to TW110108285A priority patent/TWI763358B/zh
Priority to CN201910125815.5A priority patent/CN110181390B/zh
Publication of JP2019145750A publication Critical patent/JP2019145750A/ja
Application granted granted Critical
Publication of JP6822432B2 publication Critical patent/JP6822432B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2018031159A 2018-02-23 2018-02-23 ウェーハの片面研磨方法 Active JP6822432B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018031159A JP6822432B2 (ja) 2018-02-23 2018-02-23 ウェーハの片面研磨方法
TW108100506A TWI724361B (zh) 2018-02-23 2019-01-07 晶圓的單面研磨方法
TW110108285A TWI763358B (zh) 2018-02-23 2019-01-07 晶圓的單面研磨方法
CN201910125815.5A CN110181390B (zh) 2018-02-23 2019-02-20 晶片的单面抛光方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018031159A JP6822432B2 (ja) 2018-02-23 2018-02-23 ウェーハの片面研磨方法

Publications (2)

Publication Number Publication Date
JP2019145750A JP2019145750A (ja) 2019-08-29
JP6822432B2 true JP6822432B2 (ja) 2021-01-27

Family

ID=67713612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018031159A Active JP6822432B2 (ja) 2018-02-23 2018-02-23 ウェーハの片面研磨方法

Country Status (3)

Country Link
JP (1) JP6822432B2 (zh)
CN (1) CN110181390B (zh)
TW (2) TWI724361B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6780800B1 (ja) * 2020-04-09 2020-11-04 信越半導体株式会社 ウェーハの研磨方法及び研磨装置
JP7380492B2 (ja) * 2020-09-04 2023-11-15 信越半導体株式会社 研磨用組成物及びウェーハの加工方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3575942B2 (ja) * 1997-02-28 2004-10-13 株式会社東芝 半導体装置の製造方法
JP2002184733A (ja) * 2000-12-18 2002-06-28 Hitachi Ltd 処理方法、測定方法及び半導体装置の製造方法
US6685757B2 (en) * 2002-02-21 2004-02-03 Rodel Holdings, Inc. Polishing composition
CN100468646C (zh) * 2005-02-02 2009-03-11 联华电子股份有限公司 化学机械研磨方法
JP5042778B2 (ja) * 2007-10-31 2012-10-03 信越半導体株式会社 ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置
DE112009002112B4 (de) * 2008-08-29 2023-01-05 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
DE102009051007B4 (de) * 2009-10-28 2011-12-22 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
US8932952B2 (en) * 2010-04-30 2015-01-13 Sumco Corporation Method for polishing silicon wafer and polishing liquid therefor
JP5691796B2 (ja) * 2011-04-26 2015-04-01 株式会社Sumco 研磨装置、および、研磨方法
JP6206360B2 (ja) * 2014-08-29 2017-10-04 株式会社Sumco シリコンウェーハの研磨方法
WO2016117485A1 (ja) * 2015-01-19 2016-07-28 株式会社荏原製作所 バフ研磨処理における研磨量のシミュレーション方法およびバフ研磨装置
JP6394569B2 (ja) * 2015-11-06 2018-09-26 信越半導体株式会社 ウェーハの研磨方法及び研磨装置
JP6443370B2 (ja) * 2016-03-18 2018-12-26 信越半導体株式会社 両面研磨装置用のキャリアの製造方法およびウェーハの両面研磨方法
JP6579056B2 (ja) * 2016-07-29 2019-09-25 株式会社Sumco ウェーハの両面研磨方法

Also Published As

Publication number Publication date
CN110181390B (zh) 2021-07-13
JP2019145750A (ja) 2019-08-29
TW201936321A (zh) 2019-09-16
TWI724361B (zh) 2021-04-11
TW202130458A (zh) 2021-08-16
TWI763358B (zh) 2022-05-01
CN110181390A (zh) 2019-08-30

Similar Documents

Publication Publication Date Title
JP6010043B2 (ja) ポリシリコンの研磨用組成物及び研磨方法
US8741009B2 (en) Polishing composition containing polyether amine
JP6273281B2 (ja) サファイア表面を研磨する方法
TWI484007B (zh) 拋光大塊矽之組合物及方法
JP6291026B2 (ja) サファイアの表面を研磨する方法
KR20180002629A (ko) 연마용 조성물
JP6822432B2 (ja) ウェーハの片面研磨方法
JP6506913B2 (ja) 研磨用組成物及び研磨方法
TWI814722B (zh) 研磨用組成物及研磨方法
JP6010020B2 (ja) バルクシリコンの研磨組成物及び研磨方法
JP5939578B2 (ja) 研磨用組成物およびそれを用いた研磨方法
WO2016190128A1 (ja) 研磨方法及び組成調整剤
JP2019179837A (ja) 研磨用組成物および研磨方法
JPWO2019116833A1 (ja) 研磨用組成物および研磨方法
JP6829192B2 (ja) 研磨方法
TWI646181B (zh) 用於硏磨矽晶圓之化學機械硏磨組成物及其相關方法
JP2021057453A (ja) 研磨用組成物
KR101753022B1 (ko) 실리콘 웨이퍼 연마용 조성물
JP2018174321A (ja) 研磨用組成物および研磨方法
JP2004031992A (ja) 表面平坦化が施された半導体ウェハおよび半導体装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200225

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20201202

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20201208

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20201221

R150 Certificate of patent or registration of utility model

Ref document number: 6822432

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250