JP6815875B2 - Wiring boards and electronic component storage packages and electronic devices - Google Patents

Description

The present invention relates to a wiring board capable of firmly joining leads to a part of the surface of a conductor layer having a large surface area, a package for storing electronic components using the same, and an electronic device using the same.

Conventionally, as a method of joining leads while forming a meniscus made of a metal brazing material or solder that melts by heat at a desired position on the surface of a conductor layer having a large surface area, for example, JP-A-4-56157 (Patent Document 1). ) Is known.
However, when the technique disclosed in Patent Document 1 described above is adopted, there are the following problems.
This problem will be described with reference to FIG. FIG. 14 is a conceptual diagram of a wiring board according to the prior art.
As shown in FIG. 14, in the wiring board 30 according to the prior art, the conductor layer 32 having a large surface area is bonded to the main surface of the insulating plate 31, and the surface of the conductor layer 32 is located at a desired position on the surface thereof. In order to partition the desired region of the above, for example, a strip-shaped insulating layer 33 which is a flow blocking member formed by sintering a ceramic paste is laminated, and a metal brazing material or the like is joined in the region surrounded by the insulating layer 33. The leads 36 are joined onto the conductor layer 32 via the material 34.
In this case, when the bonding material 34 is melted, the bonding material 34 liquefied in the region surrounded by the insulating layer 33 wets and travels through the end surface 32a of the conductor layer 32, and the region surrounded by the insulating layer 33. It wets and spreads to the outside (see the two arrows in FIG. 14), and the meniscus 35 formed around the joint portion of the lead 36 becomes poor, causing a problem that the joint strength of the lead 36 decreases.
Further, when the end surface 32a of the conductor layer 32 forms a part of the cut surface or the fracture surface 31b, the cut surface or the fracture surface 31b including the end surface 32a does not exist at the time of forming the band-shaped insulating layer 33, so that the joint is formed. There was no way to prevent the material 34 from getting wet on the end face 32a.

Japanese Unexamined Patent Publication No. 4-56157

The present invention has been made in response to such conventional circumstances, and the surface of a conductor layer having a large surface area joined to the main surface of a wiring board is surrounded by a band-shaped flow blocking material, and then the inner region thereof is formed. When a lead or a flexible substrate is joined using a heat-melting bonding material, a wiring board capable of reliably preventing a decrease in the bonding strength of the lead, a package for storing electronic components using the wiring board, and a package for storing the lead are used. The purpose is to provide electronic devices.

In order to solve the above problems, the wiring substrate according to the first invention is a conductor provided in a region including a flat plate-shaped insulating plate, a main surface of the insulating plate, and at least a part of the edge of the insulating plate. It has a layer, a lead bonded on the conductor layer, a bonding material for bonding the conductor layer and the lead, and an insulating layer for regulating the wet spread of the bonding material on the surface of the conductor layer. The conductor layer is provided with a slit that reaches the edge of the insulating plate and the insulating plate is exposed, and the surface of the conductor layer is joined by the insulating layer. A first region, a second region in which the bonding material is wet and spread including at least a part of the edge of the insulating plate, and a third region forming a region other than the first region and the second region. The first region is connected to the slit, and the first region or the slit exists between the second region and the third region, and the first to third regions are , It is characterized by having an electrical connection.
In the first invention of the above configuration, the insulating plate acts as an insulator. Further, this insulator has an action of repelling the liquefied bonding material and preventing the bonding material from spreading on the surface of the insulating plate. Further, the conductor layer acts as a lead pad for joining the leads, and also has the wettability of the liquefied bonding material, and has an action of enabling the wet spread. Further, the lead has an action of transmitting an electric signal from the outside to the conductor layer. Further, the bonding material has an action of liquefying by heat and bonding the leads at a desired position on the surface of the conductor layer. In addition, the insulating layer has the property of repelling the liquefied bonding material, like the insulating plate. Further, the slit is a main surface of the insulating plate having a property of repelling the liquefied bonding material between the second region and the third region in the conductor layer arranged near the edge of the insulating plate. It has the effect of exposing a part of it.
Further, the second region on the surface of the conductor layer is a region that wets and spreads when the bonding material is liquefied, and has an action of forming a meniscus by the bonding material in this second region.
The second region in the first invention is fractionated from the third region by a region in which the slits are connected in series with the first region to which the insulating layer is joined on the surface of the conductor layer. ing. Further, since both the first region and the insulating plate exposed from the bottom of the slit have a property of repelling the molten joint material, the molten joint material moves from the second region to the third region. It is prevented from getting wet and spreading.
Further, since the first to third regions have an electrical connection with each other, the conductor layer has an effect of exerting a desired function as an integral body. The function of this purpose is, for example, when the conductor layer in the first invention is used as a ground layer, it is transmitted to a signal line arranged as needed on the wiring board of the first invention. This is an action of preventing a high-frequency signal from leaking to the outside and preventing noise from entering the signal line from the outside.

The wiring board according to the second invention is the wiring board according to the first invention, wherein the edge has a fracture surface or a cut surface having a region in which an insulating plate and a conductor layer are laminated at least in a part thereof. It is characterized by having.
The fact that the edge of the wiring board has a fracture surface or a cut surface having a region in which an insulating plate and a conductor layer are laminated is provided at least in a part thereof as in the second invention of the above configuration. In the manufacturing method, it means that the end face of the conductor layer arranged on the edge of the wiring board, which is the second invention, cannot be covered with the insulating layer.
To explain this more specifically, a paste body to be a conductor layer is printed and coated on an insulating plate, and then a paste body to be an insulating layer is printed and coated on the insulating plate, and fired or the like as necessary. When the second invention is produced by cutting or breaking an insulating plate having a conductor layer and an insulating layer to separate and separate the second invention after the heat treatment of the above, the wiring board according to the second invention is the same. At least a part of the edge is provided with a fracture surface or a cut surface having a region in which an insulating plate and a conductor layer are laminated. In the case of manufacturing the second invention as described above, it is not realistic to form a new insulating layer on the surface of the wiring board after being divided and separated.
When the second invention does not have a slit, the second region and the third region are in contact with each other on the end surface (side surface) of the conductor layer arranged on the edge of the wiring board. Therefore, it is not possible to prevent the molten bonding material from spreading from the second region to the third region. (See the long dashed arrow in FIG. 14).
On the other hand, in the second invention, in the end surface (side surface) of the conductor layer arranged on the edge of the wiring board, a slit (more specifically) is provided between the second region and the third region. Since the surface of the insulator that is exposed from the bottom of the slit) is interposed, the bonding material melted from the second region to the third region does not wet and spread along the end surface of the conductor layer.
Further, in the second invention, the fact that the edge of the wiring board is a fracture surface or a cut surface having a region in which the insulating plate and the conductor layer are laminated at least in a part thereof is the main component of the insulating plate. This means that the conductor layer can be formed up to the edge position on the surface side. This has the effect of maximizing the surface area of the conductor layer on the upper surface of the wiring board, which is the second invention.

The wiring board according to the third invention is the wiring board according to the first or second invention, in which the width of the first region is the same as or larger than the width of the slit, and the width of the slit is 0.05 mm or more. It is characterized by being.
In the third invention having the above configuration, in addition to the same action as that of the first or second invention described above, the width of the first region is made equal to or larger than the width of the slit, and the slit. By setting the width of the above to 0.05 mm or more, the liquefied bonding material on the slit bridges and has an effect of more reliably preventing the wet spread from the second region to the third region.

The wiring board according to the fourth invention is the wiring board according to any one of the first to third inventions, wherein the connection portion between the first region and the slit is inside the edge. is there.
The fourth invention having the above configuration has the same action as that of the first to third inventions described above. Further, the fact that the connection portion between the first region and the slit exists inside the edge of the insulating plate means that the entire hollow portion of the slit is not filled with the insulating layer, and the end portion of the insulating layer. Means that has not reached the edge of the insulating plate.
In this case, when the wiring board according to the fourth invention is manufactured by dividing a large number of wiring boards into individual pieces, it prevents the force at the time of breaking the insulating plate from directly acting on the insulating layer. Has an action. As a result, when a large number of wiring boards are divided and separated into individual pieces to manufacture the fourth invention, it is possible to prevent a problem that a part of the insulating layer in the fourth invention is peeled off or missing. It has the effect of.

The wiring board according to the fifth invention is the wiring board according to any one of the first to fourth inventions, from the end where the connection portion between the first region and the slit is joined to the second region of the lead. It is characterized in that it is located near the edge.
In the fifth invention having the above configuration, in addition to the same actions as those of the first to fourth inventions described above, the arrangement position of the connection portion between the first region and the slit is set to the second region of the lead. By arranging it at a position closer to the edge than the end joined to the conductor layer, it has an effect of making the length of the slit formed in the conductor layer shorter than the length of the lead joined to the conductor layer. As a result, the length of the slit formed in the conductor layer can be made sufficiently long. In this case, the formation of the slit has the effect of reliably fractionating the second region, and has the effect of suppressing the change in the electrical characteristics of the conductor layer to an unfavorable situation.

The wiring board according to the sixth invention is the wiring board according to any one of the first to fifth inventions, the ground layer made of a conductor layer and at least one second region forming a part of the ground layer. And at least one island-like conductor that is joined to the main surface of the insulating plate and is formed independently of the ground layer with a first lead that is joined via a joining material on each second region. It has a second conductor layer and a second lead bonded onto the second conductor layer via a bonding material, and all the second regions and the second conductor layer have a second conductor layer. It is in contact with the edge edge, and the first lead and the second lead are arranged in parallel with each other.
In the sixth invention having the above configuration, each of the first to fifth inventions described above is described by a ground layer (conductor layer; corresponding to the first conductor layer) and a ground wire (corresponding to the first conductor layer) bonded to the ground layer. As a wiring board including a first lead), a signal line (second lead), and a second conductor layer (signal line joining pad) for joining the signal line (second lead). It was identified. In the sixth invention as described above, in addition to the same operations as those of the first to fifth inventions described above, the first region on the surface of the ground layer and the formation position of the slit are appropriately set. , The plane shape and area of the second conductor layer and the plane shape and area of the second region in the ground layer are made the same or approximate.
This has the effect of making or approximating the joint strength of the first lead (ground wire) and the second lead (signal wire).

The wiring board according to the seventh invention is joined to the wiring board according to the sixth invention described above on the second region and on the second conductor layer in place of the first and second leads. It is characterized by having a third conductor layer, and a flat plate-shaped flexible insulating material in which a plurality of three conductor layers are joined to the main surface thereof.
A seventh invention having the above configuration specifies, in the sixth invention described above, a wiring board in which the first and second leads are replaced with flexible boards. Such a seventh invention has the same action as that of the sixth invention. Therefore, according to the seventh invention, the action of making the bonding strength of the third conductor layer, which is an alternative to the first and second leads, and the ground layer or the second conductor layer equal to or similar to each other. Has.

The electronic component storage package according to the eighth invention includes a wiring board according to any one of the first to seventh inventions, an electronic component mounting portion provided on the main surface or the back surface of the insulating plate, and the electronic component. It is characterized by having a frame body joined to an insulating plate so as to surround the mounting portion.
In the electronic component storage package according to the eighth invention of the above configuration, the wiring board has the same operation as each of the first to seventh inventions. Further, the electronic component mounting portion in the wiring board of the eighth invention has the function of supporting and fixing the electronic component and radiating the heat generated from the electronic component to the outside through the insulating plate when the electronic component is mounted. Further, the frame has the function of forming a cavity for accommodating electronic components together with the wiring board.
Then, according to the electronic component storage package of the eighth invention, the electronic component in which the bonding strength of the first lead or the third conductor layer with respect to the first conductor layer or the ground layer is sufficiently maintained. It has the function of providing a storage package.

The electronic component storage package according to the ninth invention is a frame body joined to a metal bottom plate, an electronic component mounting portion provided on the main surface of the bottom plate, and the bottom plate so as to surround the electronic component mounting portion. It is characterized by having at least one wiring board according to any one of the first to seventh inventions fitted in the frame body.
In the electronic component storage package according to the ninth invention of the above configuration, the wiring board has the same operation as each of the first to seventh inventions. Further, the electronic component mounting portion of the metal bottom plate has the function of supporting and fixing the electronic component and dissipating the heat generated from the electronic component when the electronic component is mounted to the outside via the metal plate. Further, the frame body has an function of forming a cavity for accommodating electronic components together with a bottom plate and supporting and fixing at least one wiring board.
Then, according to the electronic component storage package according to the ninth invention, the bonding strength of the first lead or the third conductor layer with respect to the first conductor layer or the ground layer is sufficiently maintained. It has the function of enabling the manufacture of packages for storing electronic components.

The electronic device according to the tenth invention includes an electronic component storage package according to the eighth or ninth invention, an electronic component mounted on an electronic component mounting portion, and a lid bonded onto a frame body. It is characterized by having.
In the electronic device according to the tenth invention having the above configuration, the electronic component storage package has the same action as that according to the eighth or ninth invention. Further, the electronic component has an effect of exerting the desired function in the electronic device according to the tenth invention when an electric signal is transmitted to the electronic component by utilizing its electronic engineering characteristics. .. In addition, the lid has the function of sealing the cavity in which the electronic component is housed while maintaining the airtight state.
Then, according to the electronic device according to the tenth invention, the electronic device in which the bonding strength of the first lead or the third conductor layer with respect to the first conductor layer or the ground layer is sufficiently maintained. Will be able to be manufactured.

According to the first invention as described above, the bonding material supplied to the second region of the conductor layer (first conductor layer) wets the surface of the conductor layer and travels to the third region. It is possible to surely prevent the outflow. Therefore, the entire amount of the bonding material supplied to the second region can be used for forming the meniscus at the peripheral edge of the bonding portion of the lead (first lead). As a result, it is possible to reliably prevent a decrease in bonding strength when a lead (first lead) is bonded to the second region on the conductor layer (first conductor layer) using a bonding material. it can.
As a result, it is possible to efficiently produce a wiring board in which the bonding strength of the leads (first leads) to the conductor layer (first conductor layer) is sufficiently maintained.
Therefore, according to the first invention, it is possible to increase the joining reliability of the leads (first leads) on the wiring board, thereby increasing the yield at the time of manufacturing a highly reliable product.
Therefore, according to the first invention, a product having high reliability can be provided at a low price.

In the second invention, in addition to the same effect as that of the first invention, a large number of wiring boards, which are formed by arranging a plurality of wiring boards according to the second invention in a grid pattern, are individually divided into individual pieces. Even when the wiring board of the above is manufactured, it is surely prevented that the bonding material supplied to the second region wets the surface of the conductor layer (first conductor layer) and flows out to the third region. can do.
In this case, a highly reliable wiring board can be manufactured more efficiently. Therefore, according to the second invention, a highly reliable product can be provided at a lower price.
Further, according to the second invention, the conductor layer formed on the main surface side of the insulating plate is formed by allowing the conductor layer joined to the main surface side of the insulating plate to reach the edge of the insulating plate. The surface area can be maximized. As a result, while maximizing the effect of providing the conductor layer, the conductor layer joined to the main surface side of the insulating plate reaches the edge of the insulating plate with the external dimensions of the second invention at that time. It can be made smaller than when it is not.
Therefore, according to the second invention, it is possible to reduce the size while maintaining the performance of the product.

In the third invention, in addition to the same effect as that of the first or second invention, the width of the first region and the width of the slit are both set to 0.05 mm or more, so that the liquefied bonding material is the first. It is possible to bridge over the region 1 or the slit to prevent it from spreading from the second region to the third region.
Therefore, according to the third invention, a decrease in bonding strength when a lead (first lead) is bonded to a second region on the conductor layer (first conductor layer) using a bonding material. Can be prevented more reliably.
As a result, according to the third invention, it is possible to manufacture a wiring board having higher reliability than the first and second inventions. Therefore, according to the third invention, a product having higher reliability can be provided at a low price.

In the fourth invention, in addition to the same effects as those of the first to third inventions, it is possible to prevent peeling or chipping of a part of the insulating layer during the production of the fourth invention. ..
Therefore, according to the fourth invention, it is possible to reduce the risk that the product becomes defective during manufacturing. As a result, according to the fourth invention, it is possible to increase the non-defective rate at the time of manufacturing the product, thereby increasing the productivity of the product.

In the fifth invention, in addition to the same effects as those of the first to fourth inventions, the length of the slit formed in the conductor layer can be made sufficiently long. As a result, by forming the slit in the conductor layer, it is possible to suppress the deterioration of the electrical characteristics of the conductor layer.
Therefore, according to the fifth invention, it is possible to provide a product having higher reliability.

In the sixth invention, in addition to the same effects as those of the first to fifth inventions, the bonding strength of the first lead (ground wire) to the first conductor layer (ground layer) and the second The second lead (signal line) bonding strength to the conductor layer (signal line bonding pad) of the above can be made the same or similar.
In this case, it is possible to manufacture and provide a wiring board for optical communication or high frequency signal transmission with higher reliability.

The seventh invention is formed by replacing the first lead (ground wire) and the second lead (signal wire) in the sixth invention with a third conductor layer in the flexible substrate. Therefore, according to the seventh invention, the bonding strength of each third conductor layer in the flexible substrate with respect to the first conductor layer (ground layer) or the second conductor layer (signal line bonding pad). Can be the same or similar.
In this case, it is possible to manufacture and provide a wiring board for optical communication or high frequency signal transmission with higher reliability.

In the eighth or ninth invention, the wiring board has the same effect as that of the wiring board according to each of the first to seventh inventions.
Then, according to the eighth or ninth invention, in the wiring board, the bonding strength of the first lead or the third conductor layer with respect to the first conductor layer or the ground layer is sufficiently maintained, and the reliability is maintained. It is possible to manufacture and provide a highly reliable package for storing electronic components.
Further, since the yield at the time of manufacturing the individual wiring boards can be increased, the manufacturing cost of the electronic component storage package according to the eighth or ninth invention can be reduced.
Therefore, according to the eighth or ninth invention, a highly reliable product can be produced at low cost.

In the tenth invention, the electronic component storage package has the same effect as that of the eighth or ninth invention.
According to such a tenth invention, a highly reliable electronic device can be manufactured and provided efficiently and inexpensively.

It is a conceptual diagram of the wiring board which concerns on Example 1 of this invention. It is a conceptual diagram which shows the state which does not have a lead in the wiring board which concerns on Example 1 of this invention. It is a conceptual diagram which shows the state which does not have a lead in the wiring board which concerns on the modification of Example 1 of this invention. It is a main part conceptual diagram of the wiring board which concerns on other modification of Example 1 of this invention. It is a conceptual diagram of the wiring board which concerns on Example 2 of this invention. It is a conceptual diagram of the flexible substrate used for the wiring board which concerns on Example 3 of this invention. It is a conceptual diagram of the wiring board which concerns on Example 3 of this invention. It is a flowchart which shows the manufacturing process of the wiring board which concerns on this invention. It is a conceptual diagram of the conductor layer forming process in the manufacturing process of the wiring board which concerns on this invention. It is a conceptual diagram of the insulating layer formation process in the manufacturing process of the wiring board which concerns on this invention. It is a partial conceptual diagram of the wiring board after the process of dividing and individualizing the wiring board which concerns on this invention. (A) is a conceptual diagram of the electronic component storage package according to the fourth embodiment of the present invention, and (b) is a side view showing a usage state of the electronic component storage package and the electronic device according to the fourth embodiment of the present invention. .. (A) is a plan view of the electronic component storage package according to the fifth embodiment of the present invention, (b) is a sectional view of the electronic component storage package and the electronic device according to the fifth embodiment of the present invention, and (c). It is a back view of the electronic component storage package and the electronic device which concerns on Example 5 of this invention. It is a conceptual diagram of the wiring board which concerns on the prior art.

A wiring board according to an embodiment of the present invention, a package for storing electronic components using the same, and an electronic device using the same will be described in detail with reference to Examples 1 to 5.

First, the wiring board according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2.
FIG. 1 is a conceptual diagram of a wiring board according to a first embodiment of the present invention. Further, FIG. 2 is a conceptual diagram showing a state in which the wiring board according to the first embodiment of the present invention is not provided with leads.
As shown in FIG. 1, the main wiring board 1A according to the first embodiment, a flat insulating plate 2, the first conductor layer 3 to be bonded to the main surface to Q ₁ the insulating plate 2, the The surface of the first lead 8a bonded onto the first conductor layer 3, the bonding material 4 joining the first conductor layer 3 and the first lead 8a, and the surface of the first conductor layer 3. It is composed of an insulating layer 6 which is arranged on the board and regulates the wet spread of the bonding material 4.
Further, the first conductor layer 3 of the wiring board 1A according to the first embodiment includes a slit 7 that reaches the edge 2a of the insulating plate 2 and exposes the upper surface 2c of the insulating plate 2 from the bottom thereof. ing.
Further, in the wiring board 1A according to the first embodiment, the surface of the first conductor layer 3 has a first region 3a (a region hatched in FIG. 2) to which the insulating layer is bonded and an insulating plate. It is composed of a second region 3b including at least a part of the edge 2a of 2 and the bonding material 4 wet and spreading, and a third region 3c forming a region other than the first region 3a and the second region 3b. As shown in FIGS. 1 and 2, a first region 3a or a slit 7 exists seamlessly between the second region 3b and the third region 3c.
The "surface" of the first conductor layer 3 in the present invention is the entire surface region of the first conductor layer 3 that is not bonded to the insulating plate 2, that is, the upper surface of the first conductor layer 3. , A concept that includes all sides and end faces. Further, in the first conductor layer 3 according to the present invention, in the second region 3b and the third region 3c, as shown in FIGS. 1 and 2, the first region 3a and the slit 7 are connected in series. Although the first conductor layer 3 is a thick layered body, the first to third regions 3a to 3c have an electrical connection with each other.

Further, in the wiring board 1A as described above, the insulating plate 2, the first conductor layer 3, the insulating layer 6, and the bonding material 4 are each a ceramic sintered body, a metal paste sintered body, and a ceramic paste sintered body. And, when composed of a metal brazing material or solder that melts and liquefies by heat, both the insulating plate 2 and the insulating layer 6 have a property of repelling the liquefied bonding material 4 and hindering its wet spread. (Hereinafter, the wiring board 1A made of the combination of the above materials is referred to as "type A").
In the above-mentioned type A wiring substrate 1A, as the main components of the ceramic sintered body and the ceramic paste sintered body, for example, conventionally known ceramic materials (for example, alumina, zirconia-containing alumina, aluminum nitride, various glass ceramics, etc. (Silicon nitride, etc.) can be used. Further, as the main component of the metal paste sintered body, a conventionally known metal paste material (for example, molybdenum, tungsten, etc.) can be used. Further, as the metal brazing material, for example, a conventionally known material containing silver or copper can be used, and as a solder, for example, a conventionally known material containing lead or tin can be used.
Further, in FIG. 1, the case where the wiring board 1A is a ceramic single-layer board is described as an example, but the wiring board 1A can be replaced with a ceramic multilayer board. In this case, the insulating plate 2 is composed of a laminate of a plurality of insulating plates 2, and an internal conductor layer made of the same material as the first conductor layer 3 or an internal conductive layer thereof, if necessary, between the layers of the laminated body. A via conductor that electrically connects the body layers in the thickness direction of the insulating plate 2 may be provided.
In addition, also in the wiring board according to the modification shown below and the wiring board according to another embodiment, instead of the insulating plate 2, a plurality of layers of insulating plates 2 and an inside provided between them as needed. It can be replaced with a ceramic multilayer substrate including a conductor layer and a via conductor.

Further, in the wiring board 1A as described above, each of the insulating plate 2, the first conductor layer 3, the insulating layer 6, and the bonding material 4 is melted and liquefied by the resin substrate, the copper wiring, the solder resist, and heat. Even when composed of solder, both the insulating plate 2 and the insulating layer 6 have a property of repelling the liquefied bonding material 4 and hindering its wet spread (hereinafter, wiring board 1A made of a combination of the above materials). Is called "Type B").
In the above-mentioned type B wiring board 1B, as the material of the resin substrate and the copper wiring, for example, a conventionally known copper-clad laminate can be used. Further, as the main component of the solder resist, for example, a conventionally known epoxy resin can be used. In addition, as the solder, for example, conventionally known lead- and tin-containing solders can be used.

As described above, in the wiring board 1A according to the first embodiment, as shown in FIGS. 1 and 2, melted between the second region 3b and the third region 3c on the surface of the first conductor layer 3. There is a first region 3a (insulating layer 6) or a slit 7 (upper surface 2c of the insulating plate 2) having a property of repelling the bonding material 4.
Since the wiring board 1A according to the first embodiment has the above configuration, when the bonding material 4 supplied to the second region 3b is melted by heat and liquefied, the second region 3b It is possible to realize a state in which there is no path (see FIG. 14) that wets and spreads from the third region 3c to the third region.
As a result, at the time of joining the first lead 8a, all the joining materials 4 can be pooled on the second region 3b, so that all the joining materials 4 supplied to the second region 3b are the first. It can be used to form the meniscus 5 at the periphery of the joint portion of the lead 8a of 1 (see FIG. 1).
Therefore, according to the wiring board 1A according to the first embodiment, it is possible to reliably prevent a decrease in the joining strength of the first lead 8a when the first lead 8a is joined. As a result, according to the wiring board 1A according to the first embodiment, it is possible to manufacture and provide a wiring board having higher reliability as compared with the prior art (Patent Document 1).

Further, in the wiring board 1A according to the first embodiment shown in FIGS. 1 and 2, the minimum value W ₁ of the width of the first region 3a is set to be the same as or larger than the minimum value of the width W ₂ of the slit 7. It is preferable to set the value of W ₁ or W ₂ to 0.05 mm or more.
In this case, when the bonding material 4 is supplied to the second region 3b of the first conductor layer 3, the molten and liquefied bonding material 4 gets over the first region 3a or the slit 7 and becomes a third. It is possible to preferably prevent the region 3c from getting wet and spreading.

Further, in the wiring board 1A according to the first embodiment, the length L of the slit 7 from the edge 2a of the insulating plate 2 may be 0.1 mm or more.
This is because when the wiring board 1A according to the first embodiment is manufactured by dividing a large number of wiring boards 1A in which a plurality of wiring boards 1A are arranged in a grid pattern into individual pieces, the individual wiring boards 1A are manufactured. This is because an error of about 0.1 mm occurs in the cutting position for splitting and the split groove forming position for breaking. In this case, if the length L of the slit 7 is shorter than the predicted error value of 0.1 mm, the portion to be the slit 7 is cut off during the manufacturing of the wiring board 1A according to the first embodiment, which is the purpose. In some cases, the wiring board 1A can not be manufactured. When the slit 7 is not formed, the liquefied bonding material 4 wets the end surface (side surface) of the first conductor layer 3 and travels from the second region 3b to the third, especially at the edge 2a of the insulating plate 2. It becomes impossible to prevent the region 3c from getting wet and spreading. Therefore, the length L of the slit 7 is preferably set to 0.1 mm or more. The specification of the length L of the slit 7 is the same in the other examples described later.

Further, in the wiring board 1A according to the first embodiment shown in FIGS. 1 and 2, the purpose of filling the hollow portion of the slit 7 with the insulating layer 6 is formed at the end portion of the slit 7 not arranged on the edge 2a side. The end face P ₁ (see FIG. 2) of the first conductor layer 3 is covered with the insulating layer 6, whereby the first region 3a can be formed on the end face P ₁ . As a result, the first region 3a (insulating layer 6) or the slit 7 (upper surface 2c of the insulating plate 2) can be arranged seamlessly between the second region 3b and the third region 3c.
On the other hand, when the end face P ₁ shown in FIG. 2 is not covered with the insulating layer 6, that is, when the first region 3a is not formed on the end face P ₁ , the molten bonding material 4 is the end face P. there is a possibility that the second area 3b down along wet ₁ results in erosion in third region 3c.
Therefore, when the first conductor layer 3 in the present invention has a slit 7, the end face P ₁ at the end of the slit 7 which is disposed inside the insulating plate 2, previously completely covered by an insulating layer 6 There is a need.

Further, for the same reason, the second region 3b of the end faces of the first conductor layer 3 formed on the upper surface 2c of the insulating plate 2 (excluding those arranged on the edge 2a). When it is necessary to cover with an insulating layer 6 also end face P ₂ present in the boundary of the third region 3c _(see FIG. 2). That is, since the end face P ₂ is covered with the insulating layer 6, a state in which the first region 3a or the slit 7 is seamlessly present between the second region 3b and the third region 3c is realized. Will be done.
In this case, a separate slit (not shown) is provided on the boundary between the second region 3b and the third region 3c, and the other slit on the side arranged inside the first conductor layer 3 is provided. by keeping filled with insulating layer 6 on the end portion, it can be eliminated routes bonding material 4 was melted as in the end face P ₁ previously described with possibility of flowing out.
Further, for example, as shown in FIG. 2, the same effect can be exhibited by arranging the insulating layer 6 so that the end portion of the insulating layer 6 protrudes from the region where the first conductor layer 3 is not formed. be able to.
In the manufacturing process of the wiring board 1A according to the first embodiment, since the insulating layer 6 before firing or curing is in the form of a paste, the insulating layer 6 is formed so as to protrude from the first conductor layer 3 onto the insulating plate 2. It is easy to apply the paste body. Therefore, it is possible to be formed the first region 3a and the end face P ₂ in this portion by coating with an insulating layer 6.
As described above, according to the wiring board 1A according to the first embodiment, it is possible to surely prevent the liquefied bonding material 4 from spreading from the second region 3b to the third region 3c.
In the specification of the present application, the case where the upper surface and the end surface (side surface) of the first conductor layer 3 can be clearly distinguished is described as an example, but in the actual product, the upper surface of the first conductor layer 3 is described. It may not be possible to clearly distinguish the end face or side surface. Therefore, in the present specification, the "upper surface" of the first conductor layer 3 and the "end surface" or "side surface" are not clearly distinguished, and are simply referred to as the "surface" of the first conductor layer 3.

In FIG. 14, if the end surface 32a arranged on the edge 31a of the insulating plate 31 and on the extension line of the insulating layer 33 can be covered with the insulating layer 33, the first embodiment shown in FIGS. It is not necessary to provide the slit 7 at the boundary between the second region 3b and the third region 3c in the first conductor layer 3 arranged on the edge 2a of the insulating plate 2 as in the wiring board 1A according to the above. ..
However, when the wiring board 1A according to the first embodiment is manufactured by dividing and separating a large number of wiring boards 1A in which a plurality of wiring boards 1A are arranged in a grid pattern, the edge 2a is a cut surface or a broken surface. Since it forms a part of the cross section 2b, the insulating layer 6 cannot be provided on the end surface (side surface) of the first conductor layer 3 arranged on the edge 2a of the insulating plate 2.
That is, as will be described in detail in the latter stage, since the edge 2a does not exist when the paste body to be the insulating layer 6 is applied, the end face (side surface) of the first conductor layer 3 formed on the edge 2a. ), It is impossible to apply the paste body to be the insulating layer 6.
In view of these circumstances, as a result of diligent research, the inventor found a region (in the insulating layer 6 or the insulating plate 2) between the second region 3b and the third region 3c that repels the molten and liquefied bonding material 4. He came up with the idea of providing a slit 7 as a means of allowing the upper surface 2c) to exist seamlessly.

Incidentally, if as mentioned above, the end face P ₁ at the end of the slit 7 is not disposed on the edge 2a side of the insulating plate 2 is covered by an insulating layer 6, all of the hollow portion of the slit 7 It is not necessary to fill with the insulating layer 6.
This means that in the wiring board 1A according to the first embodiment, the position of the end portion 6a of the insulating layer 6 housed in the slit 7 does not have to coincide with the position of the edge 2a of the insulating plate 2. Means.
More specifically, as described above, the insulating plate 2 itself has extremely low wettability with the bonding material 4 and has a property of repelling the liquefied bonding material 4. Therefore, instead of filling the entire hollow portion of the slit 7 with the insulating layer 6, even if a part of the upper surface 2c of the insulating plate 2 is exposed from the bottom of the slit 7, the liquefied bonding material 4 is repelled. The wet spread can be prevented.

On the other hand, even when the second region 3b and the third region 3c of the first conductor layer 3 are separated only by the slit 7, the liquefied bonding material 4 from the second region 3b to the third region 3c It is possible to reliably prevent the spread of wetness. However, in this case, the second region 3b and the third region 3c no longer have an electrical connection, and the first conductor layer 3 constituting the second region 3b has a desired function ( For example, it does not function as a ground layer), which is not preferable.
Therefore, in the wiring board 1A according to the first embodiment, the second region 3b and the third region 3c need to be reliably separated on the surface of the first conductor layer 3, but even in that case. The second region 3b and the third region 3c need to have an electrical connection.
In view of such circumstances, in the wiring board 1A according to the first embodiment, in addition to the slit 7, the second region 3b and the third region 3c are separated on the surface of the first conductor layer 3. The first region 3a is used.
This also applies to the inventions of Examples 2 to 5 shown below.

Next, the wiring board according to the modified example of the first embodiment will be described in detail with reference to FIG.
FIG. 3 is a conceptual diagram showing a state in which a lead is not provided in the wiring board according to the modified example of the first embodiment. The same parts as those shown in FIGS. 1 and 2 are designated by the same reference numerals, and the description of their configurations will be omitted.
As shown in FIG. 3, in the wiring board 1A ′ according to the modified example of the first embodiment, the position of the end portion 6a of the insulating layer 6 housed in the slit 7 coincides with the edge 2a of the insulating plate 2. It is in a non-existent state.
Also in the wiring board 1A'related to the modified example of the first embodiment, there is a region in which the slit 7 and the first region 3a are connected in series between the second region 3b and the third region 3c. It exists seamlessly.
That is, a part of the surface of the first conductor layer 3 is divided by a region in which the slit 7 and the first region 3a are connected in series to form the second region 3b.

Also in the case of the wiring board 1A ′ according to the modified example of the first embodiment, the second region 3b and the third region 3c are connected by the slit 7 and the first region 3a in series. By being fractionated, it is possible to reliably prevent the wet spread of the liquefied bonding material 4 from the second region 3b to the third region 3c. As a result, it is possible to reliably prevent a decrease in bonding strength when the first lead 8a (not shown) is bonded to the surface of the first conductor layer 3 by the bonding material 4.
In the wiring board 1A'corresponding to the modified example of the first embodiment, the minimum value of the width W ₁ of the insulating layer 6 is set to be the same as or larger than the minimum value of the width W ₂ of the slit 7. Moreover, the value of W ₁ or W ₂ may be set to be 0.05 mm or more. In this case, it is possible to preferably prevent the liquefied bonding material 4 in the second region 3b from bridging the slit 7 or the insulating layer 6 and spreading wet in the third region 3c.

Further, also in the wiring board 1A'according to the modified example of the first embodiment, the second region 3b and the third region of the first conductor layer 3 arranged at positions other than the edge 2a of the insulating plate 2 when forming the first region 3a between 3c, that is, has been described as an example a case of coating with an insulating layer 6 a region P ₂ shown in FIG. 3, the area P shown in FIG. 3 The same effect can be exhibited by forming a slit different from the slit 7 shown in FIG. ₂ and connecting the other slit 7 and the first region 3a in series. ..
Also in this case, it is possible to prevent the bonding material 4 that has liquefied the edge portion (end face or side surface) of the first conductor layer 3 from being transmitted wet and spreading from the second region 3b to the third region 3c. Yes (see the arrow on the top of the page in FIG. 14).

Further, in a state where the entire hollow portion of the slit 7 as shown in FIG. 3 is not filled with the insulating layer 6, the connecting portion 28 between the first region 3a and the slit 7 in the first conductor layer 3 is an insulating plate. It is in a state of being located inside the edge 2a of 2.
In this case, when the wiring board 1A according to the first embodiment is manufactured by dividing a large number of wiring boards into individual pieces, a part of the insulating layer 6 is lost due to the impact when the insulating plate 2 is broken. It can be prevented from being peeled off or peeled off. In this case, it is possible to reduce the risk that the product becomes defective when the wiring board 1A according to the first embodiment is manufactured.
This also applies to the inventions of Examples 2 to 5 shown below.

Further, the connection portion 28 between the first region 3a and the slit 7 described above is arranged at a position closer to the edge 2a of the insulating plate 2 than the end of the first lead 8a joined to the second region 3b. May (selective required component).
In this case, the length of the slit 7 not filled with the insulating layer 6 can be made shorter than the length of the first lead 8a of the portion joined to the first conductor layer 3. As a result, the length of the slit 7 in which the insulating layer 6 formed in the first conductor layer 3 is not filled can be required and sufficient. In this case, it is possible to prevent the electrical characteristics of the conductor layer from being impaired.

Further, the wiring board 1B according to another modification of the first embodiment will be described in detail with reference to FIG.
FIG. 4 is a conceptual diagram of a main part of a wiring board according to another modification of the first embodiment of the present invention. The same parts as those shown in FIGS. 1 to 3 are designated by the same reference numerals, and the description of their configurations will be omitted.
In the wiring boards 1A and 1A ′ according to the first embodiment and the modified examples thereof, the surface of the corner portion of the first conductor layer 3 arranged on the upper surface 2c of the insulating plate 2 is formed by the slit 7 and the first. The case where the second region 3b is formed by partitioning the region 3a by a region formed by connecting the regions 3a in series without a break has been described as an example. However, the second region 3b of the first conductor layer 3 is in contact with the edge 2a of the insulating plate 2 and at an arbitrary position on the surface of the first conductor layer 3 having no corners. It can also be formed.
Specifically, as shown in FIG. 4, two slits in which the surface of the first conductor layer 3 which is in contact with the edge 2a of the insulating plate 2 and has no corners is in contact with the edge 2a. 7 may be provided, and the ends of the two slits 7 may be connected in series by the first region 3a and partitioned by a strip-shaped region.
In FIG. 4, the case where the entire hollow portion of the slit 7 is filled with the insulating layer 6 is described as an example, but the end faces P ₁ and P ₁ of the first conductor layer 3 in FIG. 4 are insulated. if it is completely covered with a layer 6 on the end face P _1, P ₁ than the first region 3a is formed, it is not necessary to satisfy all of the hollow portions of the slits 7, 7 with an insulating layer 6.

Then, also in the wiring board 1B according to the other modification of the first embodiment, the slit 7 or the first one is formed between the second region 3b and the third region 3c in the first conductor layer 3. Since the region 3a exists seamlessly, it is possible to reliably prevent the wet spread of the liquefied bonding material 4 from the second region 3b to the third region 3c.
According to the wiring board 1B according to the other modification of the first embodiment, the bonding strength is reduced at a desired position on the first conductor layer 3 in contact with the edge 2a of the insulating plate 2. The first lead 8a can be joined without any need.
Therefore, according to the wiring board 1B according to the other modification of the first embodiment, the joining reliability is high while increasing the degree of freedom in setting the joining position of the first lead 8a on the first conductor layer 3. A wiring board can be manufactured and provided.

Next, the wiring board according to the second embodiment will be described in detail with reference to FIG.
FIG. 5 is a conceptual diagram of a wiring board according to a second embodiment of the present invention. The same parts as those shown in FIGS. 1 to 4 are designated by the same reference numerals, and the description of their configurations will be omitted.
As shown in FIG. 5, the wiring board 1C according to the second embodiment has a ground layer composed of the first conductor layer 3 according to any one of 1A, 1A', and 1B according to the first embodiment, and the ground layer. Insulation with at least one second region 3b forming a part of (first conductor layer 3) and a first lead 8a bonded on each second region 3b via a bonding material 4. is joined to the main surface to Q ₁ plate 2, a ground layer (first conductive layer 3) at least one is formed independently of the island-shaped second conductive layer 9, the second conductor It has a second lead 8b bonded via a bonding material 4 on the layer 9.
Further, in the wiring board 1C according to the second embodiment, all of the second region 3b and the second conductor layer 9 are in contact with the edge 2a of the insulating plate 2, and the first leads 8a and the first lead 8a are in contact with each other. The leads 8b of 2 are arranged parallel to each other.
In the wiring board 1C according to the second embodiment, a meniscus 5 made of a liquefied bonding material 4 is formed on the peripheral edge of the bonding portion of the second lead 8b bonded on the surface of the second conductor layer 9. Has been done.
The wiring board 1C according to the second embodiment is an invention of a wiring board for high-frequency signal transmission including any one of 1A, 1A', and 1B according to the first embodiment as a part of its configuration. It was identified.
Therefore, in the wiring board 1C according to the second embodiment, the first lead 8a connected to the ground layer (first conductor layer 3) is a ground wire, and the second lead 8b, which is a signal line, is joined. The second conductor layer 9 for this purpose is a signal line joining pad.

Such implementation in the wiring substrate 1C according to Example 2, since the second conductive layer 9 is formed independently in an island shape on the main surface to Q ₁ insulating plate 2, the second conductor When the bonding material 4 is liquefied on the layer 9, the bonding material 4 does not wet and spread outside the second conductor layer 9.
Further, a slit 7 or a first region 3a exists between the second region 3b and the third region 3c in the ground layer (first conductor layer 3) in the wiring board 1C according to the second embodiment. Since the second region 3b is separated from the third region 3c, the liquefied bonding material 4 is the second when the first lead 8a is bonded to the second region 3b of the ground layer. It does not wet and spread from the region 3b of the above to the third region 3c.
Therefore, in the wiring board 1C according to the second embodiment, the area of the second region 3b and the surface area of the second conductor layer 9 are the same or similar, and are the same as the first lead 8a and the second lead 8b ( By using the same or similar volume of the bonding material 4 supplied on the second region 3b and the second conductor layer 9, the first lead 8a and the first lead 8a are used. The joint strength of the leads 8b of 2 can be approximated with the same or with high accuracy.
Further, in the wiring board 1C according to the second embodiment, by having the ground layer (first conductor layer 3), the high frequency signal transmitted to the signal line (second lead 8b) is prevented from leaking to the outside. While preventing it, it is possible to prevent noise from entering the signal line (second lead 8b) from the outside. Further, the signal line (second lead 8b) has an effect of transmitting a high frequency signal from the outside to the wiring board 1C according to the second embodiment.
Therefore, according to the wiring board 1C according to the second embodiment, it is possible to manufacture and provide a wiring board for high frequency signals having high reliability.

Subsequently, the wiring board according to the third embodiment will be described in detail with reference to FIGS. 6 and 7.
The wiring board 1D according to the third embodiment replaces the first lead 8a and the second lead 8b in the wiring board 1C according to the second embodiment with a flexible substrate.
Here, the flexible substrate used for the wiring board according to the third embodiment will be described with reference to FIG. FIG. 6 is a conceptual diagram of a flexible substrate used for the wiring board according to the third embodiment of the present invention. The same parts as those shown in FIGS. 1 to 5 are designated by the same reference numerals, and the description of their configurations will be omitted.
As shown in FIG. 6, the flexible substrate 10 includes a sheet-like flexible insulating material 11 having a flexible synthetic resin, formed of a metal film is deposited on the main surface Q ₁ side of the flexible insulating sheet 11 It is composed of a plurality of thin line-shaped third conductor layers 12.

FIG. 7 is a conceptual diagram of the wiring board according to the third embodiment of the present invention. The same parts as those shown in FIGS. 1 to 6 are designated by the same reference numerals, and the description of their configurations will be omitted.
As shown in FIG. 7, the wiring board 1D according to the third embodiment is formed on the second region 3b of the first conductor layer 3 joined to the insulating plate 2 by the flexible insulating plate 11 via the bonding material 4. The third conductor layer 12 is also formed by joining the third conductor layer 12 of the flexible insulating plate 11 to the second conductor layer 9 via the joining material 4.
According to the wiring board 1D according to the third embodiment, the surface area of the second conductor layer 9 and the surface area of the second region 3b are made the same or similar to each other, and the surface area is on the second region 3b and the second region 3b. By making the volume of the bonding material 4 supplied on the conductor layer 9 the same or similar, and further unifying the width of each third conductor layer 12 to a desired width, each of the flexible insulating plate materials 11 The bonding strength of the third conductor layer 12 of the above can be the same or similar. As a result, the joining reliability of the flexible insulating plate 11 to the first conductor layer 3 can be improved.
Further, in the wiring board 1D according to the third embodiment, by using the flexible insulating plate material 11 instead of the first lead 8a and the second lead 8b, the distance between the third conductor layers 12 and the second The distance between the conductor layers 9 or the distance between the second conductor layer 9 and the first conductor layer 3 (ground layer) can be narrower than when the leads 8a and 8b are provided.
Therefore, according to the wiring board 1D according to the third embodiment, it is possible to manufacture and provide a smaller and more reliable wiring board.

As the material constituting the flexible insulating plate material 11 of the flexible substrate 10 shown in FIGS. 6 and 7, for example, polyethylene terephthalate or the like is used. Further, as a material of the metal foil constituting the third conductor layer 12, for example, copper or the like is used.
Further, in order to join the flexible substrate 10 as shown in FIG. 6 to the insulating plate 2 which does not have the first lead 8a and the second lead 8b as shown in FIG. 2 or FIG. A non-liquefied bonding material 4 on the second region 3b of the first conductor layer 3 as shown in FIG. 3 and on the second conductor layer 9 not shown in FIG. 2 or FIG. The flexible substrate 10 is further placed on the individual second region 3b and the second conductor layer 9 with the individual third conductor layer 12 facing each other.
Thereafter, (see FIGS. 6 and 7) from the rear surface Q ₂ side of the flexible insulating plate 11, and each of the bonding material 4 by the action of heat and pressure, liquefied by melting the bonding material 4, liquefied bonding material 4 joins the third conductor layer 12 on the second region 3b of the first conductor layer 3 and the other third conductor layer 12 on the second conductor layer 9. doing.
At this time, since the bonding material 4 liquefied in the second region 3b of the first conductor layer 3 does not wet and spread in the third region 3c, the bonding material 4 supplied to the second region 3b All can be used for bonding with the third conductor layer 12.

Further, a method for manufacturing the wiring boards 1A, 1A'to 1D according to the present invention will be described with reference to FIGS. 8 to 11.
In particular, here, the first conductor layer 3, the second conductor layer 9, and the insulating layer 6 are provided, and the first lead 8a and the second lead 8b, or the flexible substrate 10 are joined. The manufacturing process of the wiring board before the operation will be described.
FIG. 8 is a flowchart showing a manufacturing process of the wiring board according to the present invention. Further, FIGS. 9 to 11 are partial conceptual diagrams illustrating each step of the manufacturing process of the wiring board according to the present invention. The same parts as those shown in FIGS. 1 to 7 are designated by the same reference numerals, and the description of their configurations will be omitted.
Further, here, after the method 29a for manufacturing the wiring board according to the type A described above is described with reference to FIGS. 8 to 11, the type B is described with reference to the differences from the method 29a for manufacturing the wiring board according to the type A. The manufacturing method 29b of the wiring board will be described.

Production process 29a of a wiring board according to the type A of the present invention, as shown in FIGS. 8 to 11, the main surface to Q ₁ before sintering of the insulating plate 2 and comprising a large-sized sheet after firing the insulating plate 2 ' A conductor layer forming step (step S01; see FIG. 9) of printing and coating the conductive paste 3'which becomes the metal paste sintered body (first conductor layer 3 or second conductor layer 9) after firing. After that, a step of forming an insulating layer (step S02; see FIG. 10) in which a ceramic paste 6'which becomes an insulating layer 6 after firing is printed and applied onto the insulating plate 2'before firing, and a first conductor layer after firing. Divided individualization step (step S03; see FIG. 11) in which the large-sized insulating plate 2 provided with the third and second conductor layers 9 and the insulating layer 6 is divided and individualized to obtain individual wiring substrates. And, at least.

Step S1 in the manufacturing process 29a of a wiring board according to the type A of the present invention, as shown in FIG. 9, for example, the main surface to Q ₁ sheet before firing the insulating plate 2 'in large format consisting of a ceramic green sheet or the like This is a step of printing and applying conductive paste 3'which becomes a metal paste sintered body (first conductor layer 3 or second conductor layer 9) to a plurality of places after firing. Further, when the conductive paste 3'is printed and applied, the slit 7 is formed by providing the non-formed region of the conductive paste 3'. The position indicated by the long broken line in FIG. 9 is the planned cutting or breaking position R in the subsequent division / individualization step (step S03).
When the insulating plate 2 after firing is cut by a laser or the like in the subsequent step S03, the insulating plate 2 is cut along the dividing groove (not shown) for breaking formed on the insulating plate 2. When 2 is broken, an error of about 0.1 mm occurs when the cut surface is formed or the dividing groove is formed. Therefore, if the length L of the slit 7 (see FIGS. 2 and 3 above) from the planned cutting or breaking position R in the insulating plate 2 after firing is shorter than 0.1 mm, the type after division and individualization There is a possibility that the slit 7 does not remain on the wiring board according to A.
Therefore, in this step S01, the pre-firing insulating plate 2'and the conductive paste 3'are fired so that the length L of the slit 7 from the planned cutting or breaking position R in the insulating plate 2 after firing is 0.1 mm or more. It is necessary to determine the length L of the slit 7 in consideration of shrinkage.
As described above, the length L of the slit 7 may be set to a value larger than the amount of error that occurs when the insulating plate 2 is cut or when the split groove for breaking is formed. Therefore, if the material of the wiring board to be manufactured is not ceramic, it is predicted that the amount of error assumed when cutting the insulating plate 2 or forming the dividing groove for breaking is different, and the length L of the slit 7 is L. The minimum value of may not be 0.1 mm.

The subsequent step of forming the insulating layer in step S02 is a step of printing and applying the ceramic paste 6', which becomes the insulating layer 6 when the pre-firing insulating plate 2'is fired, onto the pre-firing insulating plate 2'.
In this step S02, as shown in FIG. 10, a paste body (ceramic paste 6') containing a ceramic powder material is printed and coated on the pre-baking insulating plate 2'on which the conductive paste 3'is printed and coated. ..
Further, since this ceramic paste 6'is a paste body having appropriate fluidity and viscosity, it is only necessary to print and apply the ceramic paste 6'so as to cover the slit 7 formed of the non-formed region of the conductive paste 3'. , The hollow portion of the slit 7 can be filled with the ceramic paste 6'.
At this time, the end faces of the conductive paste 3'formed at the ends of the slit 7 located in the direction away from the planned cutting or breaking position R on the pre-firing insulating plate 2'(end faces P ₁ , P in FIGS. 2 and 3). Since it is sufficient that (see ₂ ) is covered with the ceramic paste 6', it is not necessary that all the hollow portions of the slit 7 are filled with the ceramic paste 6'.
Then, on the surface of the conductive paste 3', the region to which the ceramic paste 6'is bonded becomes the first region 3a after firing, and the slit 7 and the ceramic paste 6'are partitioned by a region formed in series. The region becomes the second region 3b after firing, and the regions other than the first region 3a and the second region 3b become the third region 3c. The conductive paste 3'is fired to become a metal paste sintered body, and the one made of this metal paste sintered body is the first conductor layer 3 and the second conductor layer 9.

As is clear from FIG. 10, in the method 29a for manufacturing the wiring board according to the type A of the present invention, the edge of the pre-firing insulating plate 2'(post-firing insulating plate 2) is used when the ceramic paste 6'is printed and applied. 2a does not exist. Therefore, the end face (side surface) of the conductive paste 3'arranged on the edge 2a does not naturally exist, and the ceramic paste is placed on the end face (side surface) of the conductive paste 3'arranged on the edge 2a. It is impossible to apply 6'.

Although not particularly shown in FIG. 8, in the method 29a for manufacturing a wiring substrate according to type A of the present invention, pre-baking insulation in which conductive paste 3'and ceramic paste 6'are printed and applied after step S02. It has a firing step of firing the plate 2'to obtain an insulating plate 2 having a metal paste sintered body (first conductor layer 3, second conductor layer 9) and an insulating layer 6.
Further, in the method 29a for manufacturing a wiring board according to type A of the present invention, before the firing step, a dividing groove (FIG. 9) is formed at a planned cutting or breaking position R on the pre-firing insulating plate 2'shown in FIGS. 9 and 10. It may have a split groove forming step of forming (not shown).
Further, when the wiring substrate according to the type A of the present invention is particularly a ceramic multilayer substrate, the method 29a for manufacturing the wiring substrate according to the type A of the present invention is further performed before the above-mentioned dividing groove forming step and firing step are performed. There are a step of arranging the conductive paste 3'which becomes a via conductor at a desired position after firing and a step of laminating and integrating the pre-firing insulating plate 2'which arranges the conductive paste 3'which becomes a via conductor. doing.

Then, in the dividing and individualizing step of step S03, the first conductor layer 3, the second conductor layer 9, and the insulating layer 6 are formed at a plurality of places on the large-sized insulating plate 2 after firing. A piece-shaped type A as shown in FIG. 11 by cutting or breaking a large number of wiring boards (not shown) at the planned cutting or breaking position R shown in FIGS. 9 and 10. (For example, wiring board 1A) can be obtained.
In addition, in the insulator layer forming step of the previous step S02, by appropriately adjusting the arrangement position of the ceramic paste 6'in the slit 7, the wiring board according to the type A as shown in FIG. 3 (for example, the wiring board 1A). ´) can also be manufactured.
Finally, the first leads 8a and the first lead 8a and the first lead 8a and the first lead 8a and the first lead 8a and the first lead 8a and the second By joining the leads 8b of No. 2 or the flexible substrate 10 (see FIG. 6), the final wiring boards 1A, 1A'to 1D according to the present invention can be obtained.

According to the method 29a for manufacturing a wiring board according to Type A of the present invention as described above, the insulating plate 2, the first conductor layer 3, and the insulating layer 6 are each a ceramic sintered body and a metal paste sintered body. , The wiring board (for example, wiring boards 1A, 1A' to 1D) according to the type A of the present invention, which is a ceramic paste sintered body, can be manufactured efficiently and while increasing the non-defective rate at the time of manufacturing. Further, in the wiring board according to the present invention (for example, wiring boards 1A, 1A' to 1D) manufactured by the manufacturing method 29a of the wiring board according to the type A of the present invention, the first leads 8a or the flexible substrate 10 are joined. Since the bonding material 4 used in the above does not wet and spread from the second region 3b to the third region 3c and flow away, it is possible to reliably prevent a decrease in the bonding strength of the first lead 8a or the flexible substrate 10. Can be done.
Further, in the wiring board according to the type A of the present invention, each of the insulating plate 2, the first conductor layer 3, and the insulating layer 6 is composed of a ceramic sintered body, a metal paste sintered body, and a ceramic paste sintered body. By doing so, it is possible to provide a wiring board having particularly excellent heat dissipation and high strength.
In addition, when the wiring board according to the type A of the present invention is a ceramic multilayer board, the wiring circuit can be housed in the thick portion of the insulating plate 2, so that a compact and high-performance wiring board can be manufactured. ..
Therefore, according to the method 29a for manufacturing a wiring board according to the type A of the present invention, a highly reliable wiring board (for example, wiring boards 1A, 1A'to 1D) can be manufactured and provided.

Subsequently, the manufacturing method 29b of the wiring board according to the type B of the present invention will be described with reference to FIGS. 8 to 11.
In the wiring board (for example, wiring boards 1A, 1A' to 1D) according to the type B of the present invention, as described above, each of the insulating plate 2, the first conductor layer 3, and the insulating layer 6 is It consists of a resin substrate, copper wiring, and solder resist. According to the wiring board according to the type B of the present invention (for example, wiring boards 1A, 1A'to 1D), the insulating plate 2, the first conductor layer 3 and the second conductor layer 9, and It is not necessary to carry out a firing step to obtain each of the insulating layers 6. That is, in the method 29b for manufacturing a wiring board according to the type B of the present invention, each of the first conductor layer 3, the second conductor layer 9, and the insulating layer 6 can be directly formed.
The appearance of the product to be manufactured in steps S01 to 03 of the method 29b for manufacturing the wiring board according to the type B of the present invention is the same as that shown in FIGS. 9 to 11.

In step S01 in the method 29b for manufacturing a wiring board according to the type B of the present invention, the first conductor layer 3 and the second conductor layer 9 are formed at a plurality of places on the large-sized insulating plate 2 made of synthetic resin. It is a process to do.
In the method 29b for manufacturing a wiring board according to type B of the present invention, an etching resist is printed on a portion of the copper-clad laminate where the copper foil remains, and the copper foil on the portion where the etching resist is not printed is removed by etching. , The first conductor layer 3 and the second conductor layer 9 are formed. At this time, the slit 7 is formed by forming the non-formed region of the copper foil.
In step S01 of the wiring board manufacturing method 29b according to the type B of the present invention, the pre-baking insulating plate 2'and the conductive paste 3'in FIG. 9 are respectively the insulating plate 2 and the copper wiring (first conductive). It is composed of a body layer 3 and a second conductor layer 9).

The next step S02 is a step of forming the insulating layer 6 on the first conductor layer 3 and the slit 7 formed on the insulating plate 2.
In the method 29b for manufacturing a wiring board according to type B of the present invention, the insulating layer 6 is formed by printing and applying an epoxy resin solder resist on the first conductor layer 3 and the slit 7 on the insulating plate 2. Will be done.
In step S02 of the wiring board manufacturing method 29b according to the type B of the present invention, the pre-baking insulating plate 2', the conductive paste 3'and the ceramic paste 6'in FIG. 10 are respectively the insulating plate 2 and the copper wiring (the first). It is composed of the conductor layer 3 of 1 and the second conductor layer 9) and the solder resist (insulating layer 6).

In the final step S02, the first conductor layer 3, the second conductor layer 9, and the large-sized insulating plate 2 provided with the insulating layer 6 are cut into pieces by cutting with a laser or the like. , A wiring board (for example, a wiring board 1A) according to a piece-shaped type B having an appearance as shown in FIG. 11 can be obtained.
Finally, on the second region 3b and the second conductor layer 9 of the wiring board (for example, the wiring board 1A) according to the type B as shown in FIG. 11, the first first is interposed via the bonding material 4. By joining the lead 8a, the second lead 8b, or the flexible substrate 10 (see FIG. 6), the final wiring board according to the present invention is obtained.

According to the method 29b for manufacturing a wiring board according to the type B of the present invention, the insulating plate 2, the first conductor layer 3, and the insulating layer 6 are resin substrates, copper wirings, and solder resists, respectively. The wiring board according to the type B of the present invention (for example, wiring boards 1A, 1A'to 1D) can be manufactured efficiently and while increasing the non-defective rate at the time of manufacturing. Further, in the wiring board according to the present invention (for example, wiring boards 1A, 1A'to 1D) manufactured by the method 29b for manufacturing a wiring board according to type B of the present invention, the first leads 8a or the flexible substrate 10 are joined. Since the bonding material 4 used for the above does not wet and spread from the second region 3b to the third region 3c and flow away, the bonding strength of the first lead 8a or the flexible substrate 10 does not decrease. Therefore, according to the method 29b for manufacturing a wiring board according to the type B of the present invention, a highly reliable wiring board (for example, wiring boards 1A, 1A'to 1D) can be manufactured and provided.
Further, since the wiring board according to the type B of the present invention uses the insulating plate 2 made of synthetic resin, the wiring board according to the type A is inferior to the wiring board according to the type A as described above in terms of heat resistance. Unlike a wiring board, it is not necessary to perform a firing process at the time of manufacturing, so that there is another merit that the manufacturing cost can be reduced.

Next, with reference to FIGS. 12 and 13, an electronic component storage package using the wiring board according to the present invention and an electronic device using the same will be described in detail.
FIG. 12A is a conceptual diagram of the electronic component storage package according to the fourth embodiment of the present invention, and FIG. 12B shows the usage state of the electronic component storage package and the electronic device according to the fourth embodiment of the present invention. It is a side view. The same parts as those shown in FIGS. 1 to 11 are designated by the same reference numerals, and the description of their configurations will be omitted.
Electronic component storing package 13A according to the fourth embodiment of the present invention, as shown in FIG. 12 (a), the wiring substrate 1C according to the type A of the present invention, an electronic provided on a rear surface Q ₂ of the insulating plate 2 It has at least a component mounting portion 16 and a frame body 14a joined to the insulating plate 2 so as to surround the electronic component mounting portion 16.
The electronic component storage package 13A according to the fourth embodiment is provided with the wiring board 1C having high joining reliability of the first lead 8a to provide a highly reliable electronic component storage package. Can be done.

In the electronic component storing package 13A according to the fourth embodiment shown in FIG. 12, has been described an example in which the back surface Q ₂ of the wiring substrate 1C is provided an electronic component mounting portion 16, the wiring substrate 1C when used upside down, as well as providing an electronic component mounting portion 16 on the main surface Q ₁ of the wiring substrate 1C, it may be joined to the frame 14a in the main surface Q ₁ side.
Further, in the electronic component storage package 13A according to the fourth embodiment, the flexible substrate 10 as shown in FIG. 6 may be provided instead of the first lead 8a and the second lead 8b.
In either case, a highly reliable package for storing electronic components can be provided.
Further, in the electronic component storage package 13A according to the fourth embodiment, as shown in FIG. 12B, a cavity composed of the frame body 14a and the wiring board 1C is sealed in the upper opening of the frame body 14a. A seal ring 15 (selective essential component) for making the lid 17 seam weldable may be provided.

Further, as shown in FIG. 12B, the electronic device 27A according to the fourth embodiment of the present invention includes the electronic component storage package 13A according to the fourth embodiment and the electronic components mounted on the electronic component mounting portion 16. It has at least (not shown) and a lid 17 joined on the frame 14a.
In such an electronic device 27A according to the fourth embodiment, the reliability of the electronic device 27A can be improved by using the wiring board 1C according to the present invention.
In the electronic device 27A according to the fourth embodiment as shown in FIG. 12B, for example, a bonding material (not shown) such as solder is placed on the motherboard 19 provided with the fourth conductor layer 20. It is used by joining through.
Incidentally, as shown in FIG. 12 (b), includes a heat sink 18 to the electronic apparatus 27A according to the fourth embodiment, the first conductor layer 3 to be bonded to the main surface to Q ₁ wiring substrate 1C (ground layer) You may be. In this case, it can be radiated to the outside of the heat efficiently electronic component storing package 13A from the electronic components mounted on the electronic component mounting portion 16 provided on a rear surface Q ₂ of the wiring substrate 1C.

Finally, the electronic component storage package according to the fifth embodiment will be described.
FIG. 13A is a plan view of the electronic component storage package according to the fifth embodiment of the present invention, and FIG. 13B is a sectional view of the electronic component storage package and the electronic device according to the fifth embodiment of the present invention. , (C) are back views of the electronic component storage package and the electronic device according to the fifth embodiment of the present invention. The same parts as those shown in FIGS. 1 to 12 are designated by the same reference numerals, and the description of the configuration thereof will be omitted.
As shown in FIGS. 13 (a) to 13 (c), the electronic component storage package 13B according to the fifth embodiment of the present invention includes a metal bottom plate 21 and an electronic component mounting portion provided on the main surface of the bottom plate 21. 16, a frame body 14b joined to the bottom plate 21 so as to surround the electronic component mounting portion 16, and at least one wiring board 1C according to the type A of the present invention fitted in the frame body 14b. It is something that you have.
The electronic component storage package 13B according to the fifth embodiment is provided with the wiring board 1C having high joining reliability of the first lead 8a to provide a highly reliable electronic component storage package. Can be done.
Further, in the electronic component storage package 13B according to the fifth embodiment, the flexible substrate 10 as shown in FIG. 6 may be provided instead of the first lead 8a and the second lead 8b.
In this case as well, it is possible to suitably prevent a decrease in the bonding strength of the third conductor layer 12 bonded to the second region 3b of the first conductor layer 3, so that highly reliable electronic component storage can be performed. Package 13B can be provided.
Further, in the electronic component storage package 13B according to the fifth embodiment, as shown in FIGS. 13A and 13B, a metal lid 17 can be seam-welded to the upper opening of the frame 14b. The seal ring 15 may be provided (selective essential component).

Further, the electronic device 27B according to the fifth embodiment of the present invention is the electronic component 22 directly or indirectly mounted on the electronic component storage package 13B according to the fifth embodiment and the electronic component mounting portion 16 as described above. And a lid 17 which is provided on the frame body 14b and for airtightly sealing the cavity composed of the bottom plate 21 and the frame body 14b.
The electronic device 27B according to the fifth embodiment can provide a highly reliable electronic device by providing the highly reliable electronic component storage package 13B.

In the electronic device 27B according to the fifth embodiment, as shown in FIG. 13C, the joint portion of the first lead 8a and the second lead 8b is exposed from the notch 24 formed in the bottom plate 21. It may be fitted to the frame body 14b in the state of being fitted (selective essential component). By having such a structure, when the wiring board 1C according to the present invention is fitted to the frame body 14b, the warp of the bottom plate caused by the difference in the expansion coefficient between the bottom plate and the frame body when the electronic component generates heat. The amount can be reduced.
Further, in the electronic device 27B according to the fifth embodiment, the electronic component 22 may be mounted directly on the electronic component mounting portion 16 of the bottom plate 21, but as shown in FIG. 13B, the Peltier element 25 and the mounting substrate The electronic component 22 may be mounted on the electronic component mounting portion 16 via the 26 (selective essential component). In this case, the cooling effect of the electronic component 22 by the Peltier element 25 is exerted, and it is possible to suitably suppress the occurrence of a problem due to the heat generated by the electronic component 22 itself. As a result, a more reliable electronic device can be provided.
Further, the electronic device 27B according to the fifth embodiment may include a metal fixing member 23 on the frame body 14b as shown in FIGS. 13 (a) to 13 (c) (selective essential component). By providing such a metal fixing member 23, it becomes possible to connect a coaxial cable, an optical fiber, or the like to the electronic component storage package 13B according to the fifth embodiment.
In addition, the electronic component storage package 13B and the electronic device 27B according to the fifth embodiment may be provided with fixing protrusions 21a for screwing at the corners of the bottom plate 21 (selective essential component). In this case, the electronic device 27B according to the fifth embodiment can be used in a state of being screwed and fixed to a wiring board (not shown) such as a motherboard, for example. As a result, when the electronic device 27B according to the fifth embodiment is used, it has an effect that the electronic device 27B can be suitably suppressed from being detached from the wiring board such as the motherboard.

As described above, the present invention reduces the bonding strength when a lead or a flexible substrate is bonded to a desired position on a conductor layer (ground layer) having a large surface area to be bonded on an insulating plate via a bonding material. A wiring board capable of suitably preventing the above, a package for storing electronic components using the same, and an electronic device using the same, which can be used particularly in the technical fields related to optical semiconductors and high-frequency elements. ..

1A, 1A', 1B, 1C, 1D ... Wiring board 2 ... Insulation plate 2'... Insulation plate before firing 2a ... Edge edge 2b ... End face 2c ... Top surface 3 ... First conductor layer (ground layer) 3'... Conductive Paste 3a ... 1st region 3b ... 2nd region 3c ... 3rd region 4 ... Bonding material 5 ... Meniscus 6 ... Insulation layer 6'... Ceramic paste 7 ... Slit 8a ... 1st lead 8b ... 2nd lead 9 ... Second conductor layer 10 ... Flexible substrate 11 ... Flexible insulating plate material 12 ... Third conductor layer 13A, 13B ... Electronic component storage package 14a, 14b ... Frame body 15 ... Seal ring 16 ... Electronic component mounting part 17 ... lid 18 ... heat sink 19 ... motherboard 20 ... fourth conductor layer 21 ... bottom plate 21a ... fixing protrusions 22 ... electronic components 23 ... metal fixing member 23a ... through holes 24 ... notch 25 ... Perche element 26 ... Mounting board 27A, 27B ... Electronic device 28 ... Connection part 29a, 29b ... Wiring board manufacturing method 30 ... Wiring board 31 ... Insulation plate 31a ... Edge edge 31b ... End face 32 ... Conductor layer 32a ... End face 33 ... Insulation layer 34 ... Bonding material 35 ... Meniscus 36 ... Lead W ₁ ... Insulation layer width W ₂ ... Slit width L ... Slit length P ₁ , P ₂ ... End face Q ₁ ... Main surface Q ₂ ... Back surface R ... Scheduled to be cut or broken position

Claims (10)

A flat-shaped insulating plate, a conductor layer bonded to the main surface of the insulating plate and provided in a region including at least a part of the edge of the insulating plate, and a lead bonded on the conductive layer. A wiring board having a bonding material that joins the conductor layer and the lead, and an insulating layer that regulates the wet spread of the bonding material on the surface of the conductor layer.
The conductive layer includes a slit wherein the insulating plate said edge to reach vital before Symbol insulating plates are bare, and the end face formed on the not on the edge of the insulating plate the upper main surface, the Equipped with
The surface of the conductor layer includes a first region to which the insulating layer is bonded and a second region including at least a part of the edge of the insulating plate and the bonding material is wet and spread. It is composed of a first region and a third region forming a region other than the second region.
The first region includes the end face existing at the boundary between the second region and the third region, and is connected to the slit.
The first region or the slit exists between the second region and the third region.
The first to third regions are wiring boards characterized by having an electrical connection. The wiring board according to claim 1, wherein the edge has a fracture surface or a cut surface having a region in which the insulating plate and the conductor layer are laminated at least in a part thereof. The width of the first region is equal to or greater than the width of the slit.
The wiring board according to claim 1 or 2, wherein the width of the slit is 0.05 mm or more. A flat-shaped insulating plate, a conductor layer bonded to the main surface of the insulating plate and provided in a region including at least a part of the edge of the insulating plate, and a lead bonded on the conductive layer. A wiring board having a bonding material that joins the conductor layer and the lead, and an insulating layer that regulates the wet spread of the bonding material on the surface of the conductor layer.
The conductor layer includes a slit that reaches the edge of the insulating plate and the insulating plate is exposed.
The surface of the conductor layer includes a first region to which the insulating layer is bonded and a second region including at least a part of the edge of the insulating plate and the bonding material is wet and spread. It is composed of a first region and a third region forming a region other than the second region.
The first region is connected to the slit and
The first region or the slit exists between the second region and the third region.
Connecting portions of the slit and the first region, Ri inside near from the end edge,
The first to third regions are wiring boards characterized by having an electrical connection . A flat-shaped insulating plate, a conductor layer bonded to the main surface of the insulating plate and provided in a region including at least a part of the edge of the insulating plate, and a lead bonded on the conductive layer. A wiring board having a bonding material that joins the conductor layer and the lead, and an insulating layer that regulates the wet spread of the bonding material on the surface of the conductor layer.
The conductor layer includes a slit that reaches the edge of the insulating plate and the insulating plate is exposed.
The surface of the conductor layer includes a first region to which the insulating layer is bonded and a second region including at least a part of the edge of the insulating plate and the bonding material is wet and spread. It is composed of a first region and a third region forming a region other than the second region.
The first region is connected to the slit and
The first region or the slit exists between the second region and the third region.
The connecting portion of the first region and the slit, Ri located near closer to the edge than the edge which is joined to the second region of the lead,
The first to third regions are wiring boards characterized by having an electrical connection . The ground layer made of the conductor layer and
With at least one of the second regions forming part of the ground layer,
With the first lead bonded via the joining material on each of the second regions,
With at least one island-shaped second conductor layer bonded to the main surface of the insulating plate and formed independently of the ground layer,
It has a second lead, which is bonded to the second conductor layer via the bonding material, and has.
All the second regions and the second conductor layer are in contact with the edge.
The wiring board according to any one of claims 1 to 5, wherein the first lead and the second lead are arranged in parallel with each other. With a third conductor layer bonded on the second region and on the second conductor layer in place of the first and second leads.
The wiring board according to claim 6, wherein the plurality of third conductor layers have a flat plate-shaped flexible insulating material bonded to the main surface thereof. The wiring board according to any one of claims 1 to 7.
An electronic component mounting portion provided on the main surface or the back surface of the insulating plate, and
A package for storing electronic components, which comprises a frame body joined to the insulating plate so as to surround the electronic component mounting portion. With a metal bottom plate
An electronic component mounting portion provided on the main surface of the bottom plate and
A frame body joined to the bottom plate so as to surround the electronic component mounting portion, and
A package for storing electronic components, comprising the wiring board according to any one of claims 1 to 7, which is fitted in the frame. The electronic component storage package according to claim 8 or 9.
The electronic components mounted on the electronic component mounting unit and
An electronic device comprising a lid body joined on the frame body.

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