JP6808281B2 - 置換シクロペンタジエニルコバルト錯体及びその製造方法、コバルト含有薄膜及びその作製方法 - Google Patents
置換シクロペンタジエニルコバルト錯体及びその製造方法、コバルト含有薄膜及びその作製方法 Download PDFInfo
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- JP6808281B2 JP6808281B2 JP2016239566A JP2016239566A JP6808281B2 JP 6808281 B2 JP6808281 B2 JP 6808281B2 JP 2016239566 A JP2016239566 A JP 2016239566A JP 2016239566 A JP2016239566 A JP 2016239566A JP 6808281 B2 JP6808281 B2 JP 6808281B2
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- Prior art keywords
- cobalt
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- thin film
- diene
- sccm
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- 239000010941 cobalt Substances 0.000 title claims description 149
- 229910017052 cobalt Inorganic materials 0.000 title claims description 149
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 title claims description 148
- 239000010409 thin film Substances 0.000 title claims description 127
- 238000004519 manufacturing process Methods 0.000 title claims description 52
- ZSEHKBVRLFIMPB-UHFFFAOYSA-N cobalt;cyclopenta-1,3-diene Chemical class [Co].C=1C=C[CH-]C=1 ZSEHKBVRLFIMPB-UHFFFAOYSA-N 0.000 title 1
- 150000004700 cobalt complex Chemical class 0.000 claims description 93
- 239000007789 gas Substances 0.000 claims description 68
- 238000006243 chemical reaction Methods 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 39
- 125000004432 carbon atom Chemical group C* 0.000 claims description 38
- 125000000217 alkyl group Chemical group 0.000 claims description 23
- 150000001993 dienes Chemical class 0.000 claims description 20
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 18
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 13
- 238000005229 chemical vapour deposition Methods 0.000 claims description 11
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 claims description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 10
- 238000007740 vapor deposition Methods 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 7
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 5
- 238000000354 decomposition reaction Methods 0.000 claims description 5
- 229910052744 lithium Inorganic materials 0.000 claims description 5
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 125000003944 tolyl group Chemical group 0.000 claims description 3
- 239000000463 material Substances 0.000 description 134
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 78
- -1 5- silyloxycyclopentadienyl Chemical group 0.000 description 74
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 63
- 239000000203 mixture Substances 0.000 description 60
- 239000000758 substrate Substances 0.000 description 54
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 48
- 239000012159 carrier gas Substances 0.000 description 46
- ZCSHNCUQKCANBX-UHFFFAOYSA-N lithium diisopropylamide Chemical compound [Li+].CC(C)[N-]C(C)C ZCSHNCUQKCANBX-UHFFFAOYSA-N 0.000 description 40
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 39
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 33
- 239000007788 liquid Substances 0.000 description 33
- 239000000243 solution Substances 0.000 description 33
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 32
- 239000010408 film Substances 0.000 description 31
- 238000003756 stirring Methods 0.000 description 29
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 28
- 239000000725 suspension Substances 0.000 description 26
- 230000015572 biosynthetic process Effects 0.000 description 24
- 239000003085 diluting agent Substances 0.000 description 22
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 22
- 238000002441 X-ray diffraction Methods 0.000 description 21
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 20
- ATMPMEZIXCBUHT-UHFFFAOYSA-N cobalt;triphenylphosphane Chemical compound [Co].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 ATMPMEZIXCBUHT-UHFFFAOYSA-N 0.000 description 19
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 18
- 238000004821 distillation Methods 0.000 description 18
- 238000005160 1H NMR spectroscopy Methods 0.000 description 16
- 238000000231 atomic layer deposition Methods 0.000 description 16
- 239000000706 filtrate Substances 0.000 description 16
- 239000002904 solvent Substances 0.000 description 15
- 229910021529 ammonia Inorganic materials 0.000 description 14
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 14
- YHQGMYUVUMAZJR-UHFFFAOYSA-N α-terpinene Chemical compound CC(C)C1=CC=C(C)CC1 YHQGMYUVUMAZJR-UHFFFAOYSA-N 0.000 description 14
- DBKDYYFPDRPMPE-UHFFFAOYSA-N lithium;cyclopenta-1,3-diene Chemical compound [Li+].C=1C=C[CH-]C=1 DBKDYYFPDRPMPE-UHFFFAOYSA-N 0.000 description 13
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 12
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 12
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 12
- OKJPEAGHQZHRQV-UHFFFAOYSA-N Triiodomethane Natural products IC(I)I OKJPEAGHQZHRQV-UHFFFAOYSA-N 0.000 description 12
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cis-cyclohexene Natural products C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 12
- 238000001914 filtration Methods 0.000 description 12
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 11
- 239000000047 product Substances 0.000 description 10
- 239000012495 reaction gas Substances 0.000 description 10
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 8
- NGXYCDIMVFWIKL-UHFFFAOYSA-N CC1=CC(=CC1)O[Si](C)(C)C Chemical compound CC1=CC(=CC1)O[Si](C)(C)C NGXYCDIMVFWIKL-UHFFFAOYSA-N 0.000 description 7
- WSTYNZDAOAEEKG-UHFFFAOYSA-N Mayol Natural products CC1=C(O)C(=O)C=C2C(CCC3(C4CC(C(CC4(CCC33C)C)=O)C)C)(C)C3=CC=C21 WSTYNZDAOAEEKG-UHFFFAOYSA-N 0.000 description 7
- FLILUVGNNJPQAV-UHFFFAOYSA-N cyclopenta-1,3-diene;lithium Chemical compound [Li].C1C=CC=C1 FLILUVGNNJPQAV-UHFFFAOYSA-N 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 125000002524 organometallic group Chemical group 0.000 description 7
- 230000001590 oxidative effect Effects 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 6
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 6
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 238000000746 purification Methods 0.000 description 6
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 6
- YKFLAYDHMOASIY-UHFFFAOYSA-N γ-terpinene Chemical compound CC(C)C1=CCC(C)=CC1 YKFLAYDHMOASIY-UHFFFAOYSA-N 0.000 description 6
- RCJMVGJKROQDCB-UHFFFAOYSA-N 1,3-dimethyl-1,3-butadiene Natural products CC=CC(C)=C RCJMVGJKROQDCB-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- DVAUOETWBJBGOD-UHFFFAOYSA-N [Co].CC(C)P(C(C)C)C(C)C Chemical compound [Co].CC(C)P(C(C)C)C(C)C DVAUOETWBJBGOD-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- OKCASTGIQUIGNR-UHFFFAOYSA-N cobalt trimethylphosphane Chemical compound [Co].CP(C)C OKCASTGIQUIGNR-UHFFFAOYSA-N 0.000 description 5
- RKCDNESWRKQIOK-UHFFFAOYSA-N cobalt;triethylphosphane Chemical compound [Co].CCP(CC)CC RKCDNESWRKQIOK-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 125000004122 cyclic group Chemical group 0.000 description 5
- 239000002198 insoluble material Substances 0.000 description 5
- SKTCDJAMAYNROS-UHFFFAOYSA-N methoxycyclopentane Chemical compound COC1CCCC1 SKTCDJAMAYNROS-UHFFFAOYSA-N 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 125000005918 1,2-dimethylbutyl group Chemical group 0.000 description 4
- 239000004912 1,5-cyclooctadiene Substances 0.000 description 4
- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 description 4
- 125000005916 2-methylpentyl group Chemical group 0.000 description 4
- 125000005917 3-methylpentyl group Chemical group 0.000 description 4
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 4
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 4
- DUIBUMWLFHVBLL-UHFFFAOYSA-N [Co].CCCP(CCC)CCC Chemical compound [Co].CCCP(CCC)CCC DUIBUMWLFHVBLL-UHFFFAOYSA-N 0.000 description 4
- 150000001350 alkyl halides Chemical class 0.000 description 4
- JLSUVGRFSPRBDC-UHFFFAOYSA-N cobalt;tributylphosphane Chemical compound [Co].CCCCP(CCCC)CCCC JLSUVGRFSPRBDC-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 4
- 125000004850 cyclobutylmethyl group Chemical group C1(CCC1)C* 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 4
- 125000004851 cyclopentylmethyl group Chemical group C1(CCCC1)C* 0.000 description 4
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- IIEWJVIFRVWJOD-UHFFFAOYSA-N ethylcyclohexane Chemical compound CCC1CCCCC1 IIEWJVIFRVWJOD-UHFFFAOYSA-N 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 4
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 4
- 229940087305 limonene Drugs 0.000 description 4
- 235000001510 limonene Nutrition 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 4
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- PMJHHCWVYXUKFD-UHFFFAOYSA-N penta-1,3-diene Chemical compound CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 4
- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 4
- 230000035484 reaction time Effects 0.000 description 4
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 4
- NURJXHUITUPBOD-UHFFFAOYSA-N tris(2-methylpropyl) phosphite Chemical compound CC(C)COP(OCC(C)C)OCC(C)C NURJXHUITUPBOD-UHFFFAOYSA-N 0.000 description 4
- RCJMVGJKROQDCB-SNAWJCMRSA-N (3e)-2-methylpenta-1,3-diene Chemical compound C\C=C\C(C)=C RCJMVGJKROQDCB-SNAWJCMRSA-N 0.000 description 3
- VYXHVRARDIDEHS-UHFFFAOYSA-N 1,5-cyclooctadiene Chemical compound C1CC=CCCC=C1 VYXHVRARDIDEHS-UHFFFAOYSA-N 0.000 description 3
- BOGRNZQRTNVZCZ-UHFFFAOYSA-N 3-methylpenta-1,3-diene Chemical compound CC=C(C)C=C BOGRNZQRTNVZCZ-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910019001 CoSi Inorganic materials 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- UVELLBLWIDPECU-UHFFFAOYSA-N [Co].CP(C1=CC=CC=C1)C.CP(C1=CC=CC=C1)C.CP(C1=CC=CC=C1)C Chemical compound [Co].CP(C1=CC=CC=C1)C.CP(C1=CC=CC=C1)C.CP(C1=CC=CC=C1)C UVELLBLWIDPECU-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000012043 crude product Substances 0.000 description 3
- XUNKHNWDKFQQGW-UHFFFAOYSA-N cyclopenta-1,4-dien-1-yloxy(trimethyl)silane Chemical compound C[Si](C)(C)OC1=CCC=C1 XUNKHNWDKFQQGW-UHFFFAOYSA-N 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- HVTICUPFWKNHNG-UHFFFAOYSA-N iodoethane Chemical compound CCI HVTICUPFWKNHNG-UHFFFAOYSA-N 0.000 description 3
- 229910052743 krypton Inorganic materials 0.000 description 3
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052754 neon Inorganic materials 0.000 description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- NJJINPLVGVUXTF-UHFFFAOYSA-N tributan-2-yl phosphite Chemical compound CCC(C)OP(OC(C)CC)OC(C)CC NJJINPLVGVUXTF-UHFFFAOYSA-N 0.000 description 3
- XTTGYFREQJCEML-UHFFFAOYSA-N tributyl phosphite Chemical compound CCCCOP(OCCCC)OCCCC XTTGYFREQJCEML-UHFFFAOYSA-N 0.000 description 3
- BDZBKCUKTQZUTL-UHFFFAOYSA-N triethyl phosphite Chemical compound CCOP(OCC)OCC BDZBKCUKTQZUTL-UHFFFAOYSA-N 0.000 description 3
- CYTQBVOFDCPGCX-UHFFFAOYSA-N trimethyl phosphite Chemical compound COP(OC)OC CYTQBVOFDCPGCX-UHFFFAOYSA-N 0.000 description 3
- DYDZGRPIHWEPJJ-UHFFFAOYSA-N trimethyl-(2-methyl-5-trimethylsilyloxycyclopenta-1,4-dien-1-yl)oxysilane Chemical compound CC1=C(C(=CC1)O[Si](C)(C)C)O[Si](C)(C)C DYDZGRPIHWEPJJ-UHFFFAOYSA-N 0.000 description 3
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 3
- QOPBTFMUVTXWFF-UHFFFAOYSA-N tripropyl phosphite Chemical compound CCCOP(OCCC)OCCC QOPBTFMUVTXWFF-UHFFFAOYSA-N 0.000 description 3
- 238000005292 vacuum distillation Methods 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- QMFJIJFIHIDENY-UHFFFAOYSA-N 1-Methyl-1,3-cyclohexadiene Chemical compound CC1=CC=CCC1 QMFJIJFIHIDENY-UHFFFAOYSA-N 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- ARUAYSANQMCCEN-UHFFFAOYSA-N 2,3,4,5-tetramethylcyclopent-2-en-1-one Chemical compound CC1C(C)C(=O)C(C)=C1C ARUAYSANQMCCEN-UHFFFAOYSA-N 0.000 description 2
- WGLLSSPDPJPLOR-UHFFFAOYSA-N 2,3-dimethylbut-2-ene Chemical compound CC(C)=C(C)C WGLLSSPDPJPLOR-UHFFFAOYSA-N 0.000 description 2
- RYPKRALMXUUNKS-UHFFFAOYSA-N 2-Hexene Natural products CCCC=CC RYPKRALMXUUNKS-UHFFFAOYSA-N 0.000 description 2
- WWUVJRULCWHUSA-UHFFFAOYSA-N 2-methyl-1-pentene Chemical compound CCCC(C)=C WWUVJRULCWHUSA-UHFFFAOYSA-N 0.000 description 2
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical compound CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 2
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- QTBFPMKWQKYFLR-UHFFFAOYSA-N isobutyl chloride Chemical compound CC(C)CCl QTBFPMKWQKYFLR-UHFFFAOYSA-N 0.000 description 1
- KXUHSQYYJYAXGZ-UHFFFAOYSA-N isobutylbenzene Chemical compound CC(C)CC1=CC=CC=C1 KXUHSQYYJYAXGZ-UHFFFAOYSA-N 0.000 description 1
- 125000005921 isopentoxy group Chemical group 0.000 description 1
- ULYZAYCEDJDHCC-UHFFFAOYSA-N isopropyl chloride Chemical compound CC(C)Cl ULYZAYCEDJDHCC-UHFFFAOYSA-N 0.000 description 1
- FMKOJHQHASLBPH-UHFFFAOYSA-N isopropyl iodide Chemical compound CC(C)I FMKOJHQHASLBPH-UHFFFAOYSA-N 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- AHNJTQYTRPXLLG-UHFFFAOYSA-N lithium;diethylazanide Chemical compound [Li+].CC[N-]CC AHNJTQYTRPXLLG-UHFFFAOYSA-N 0.000 description 1
- XBEREOHJDYAKDA-UHFFFAOYSA-N lithium;propane Chemical compound [Li+].CC[CH2-] XBEREOHJDYAKDA-UHFFFAOYSA-N 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 229940102396 methyl bromide Drugs 0.000 description 1
- DVSDBMFJEQPWNO-UHFFFAOYSA-N methyllithium Chemical compound C[Li] DVSDBMFJEQPWNO-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- OWKFQWAGPHVFRF-UHFFFAOYSA-N n-(diethylaminosilyl)-n-ethylethanamine Chemical compound CCN(CC)[SiH2]N(CC)CC OWKFQWAGPHVFRF-UHFFFAOYSA-N 0.000 description 1
- VYIRVGYSUZPNLF-UHFFFAOYSA-N n-(tert-butylamino)silyl-2-methylpropan-2-amine Chemical compound CC(C)(C)N[SiH2]NC(C)(C)C VYIRVGYSUZPNLF-UHFFFAOYSA-N 0.000 description 1
- SNMVRZFUUCLYTO-UHFFFAOYSA-N n-propyl chloride Chemical compound CCCCl SNMVRZFUUCLYTO-UHFFFAOYSA-N 0.000 description 1
- PVWOIHVRPOBWPI-UHFFFAOYSA-N n-propyl iodide Chemical compound CCCI PVWOIHVRPOBWPI-UHFFFAOYSA-N 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 125000005484 neopentoxy group Chemical group 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 235000013842 nitrous oxide Nutrition 0.000 description 1
- QTYUSOHYEPOHLV-UHFFFAOYSA-N octa-1,3-diene Chemical compound CCCCC=CC=C QTYUSOHYEPOHLV-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- QMMOXUPEWRXHJS-UHFFFAOYSA-N pent-2-ene Chemical compound CCC=CC QMMOXUPEWRXHJS-UHFFFAOYSA-N 0.000 description 1
- QYZLKGVUSQXAMU-UHFFFAOYSA-N penta-1,4-diene Chemical compound C=CCC=C QYZLKGVUSQXAMU-UHFFFAOYSA-N 0.000 description 1
- 125000004115 pentoxy group Chemical group [*]OC([H])([H])C([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- NHKJPPKXDNZFBJ-UHFFFAOYSA-N phenyllithium Chemical compound [Li]C1=CC=CC=C1 NHKJPPKXDNZFBJ-UHFFFAOYSA-N 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- ZJMWRROPUADPEA-UHFFFAOYSA-N sec-butylbenzene Chemical compound CCC(C)C1=CC=CC=C1 ZJMWRROPUADPEA-UHFFFAOYSA-N 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- RKSOPLXZQNSWAS-UHFFFAOYSA-N tert-butyl bromide Chemical compound CC(C)(C)Br RKSOPLXZQNSWAS-UHFFFAOYSA-N 0.000 description 1
- NBRKLOOSMBRFMH-UHFFFAOYSA-N tert-butyl chloride Chemical compound CC(C)(C)Cl NBRKLOOSMBRFMH-UHFFFAOYSA-N 0.000 description 1
- BCNZYOJHNLTNEZ-UHFFFAOYSA-N tert-butyldimethylsilyl chloride Chemical compound CC(C)(C)[Si](C)(C)Cl BCNZYOJHNLTNEZ-UHFFFAOYSA-N 0.000 description 1
- 125000005922 tert-pentoxy group Chemical group 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- OJYSADKQSSFJPT-UHFFFAOYSA-N trimethyl-(2,3,4,5-tetramethylcyclopenta-1,4-dien-1-yl)oxysilane Chemical compound CC1C(C)=C(C)C(O[Si](C)(C)C)=C1C OJYSADKQSSFJPT-UHFFFAOYSA-N 0.000 description 1
- GIRKRMUMWJFNRI-UHFFFAOYSA-N tris(dimethylamino)silicon Chemical compound CN(C)[Si](N(C)C)N(C)C GIRKRMUMWJFNRI-UHFFFAOYSA-N 0.000 description 1
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F15/00—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
- C07F15/06—Cobalt compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F17/00—Metallocenes
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F17/00—Metallocenes
- C07F17/02—Metallocenes of metals of Groups 8, 9 or 10 of the Periodic System
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F19/00—Metal compounds according to more than one of main groups C07F1/00 - C07F17/00
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28097—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a metallic silicide
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising silicides
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- H—ELECTRICITY
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76889—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances by forming silicides of refractory metals
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4966—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2
- H01L29/4975—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2 being a silicide layer, e.g. TiSi2
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
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- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Composite Materials (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Memories (AREA)
Description
一般式(1)
製造方法1
一般式(3)のR9、R10、R11及びXの定義について説明する。R9、R10及びR11で表される炭素数1〜6のアルキル基としては、直鎖状、分岐状及び環状のいずれでも良く、具体的にはメチル基、エチル基、プロピル基、イソプロピル基、シクロプロピル基、ブチル基、イソブチル基、sec−ブチル基、tert−ブチル基、シクロブチル基、ペンチル基、1−エチルプロピル基、1−メチルブチル基、2−メチルブチル基、イソペンチル基、ネオペンチル基、tert−ペンチル基、シクロペンチル基、シクロブチルメチル基、ヘキシル基、1−メチルペンチル基、2−メチルペンチル基、3−メチルペンチル基、4−メチルペンチル基、1,1−ジメチルブチル基、1,2−ジメチルブチル基、1,3−ジメチルブチル基、2,2−ジメチルブチル基、2,3−ジメチルブチル基、3,3−ジメチルブチル基、シクロヘキシル基、シクロペンチルメチル基、1−シクロブチルエチル基、2−シクロブチルエチル基などを例示することが出来る。
なお、本明細書中では簡略のため(5)及び(5a)〜(5d)の全てを包括して一般式(5)で示すこととする。
のが好ましい。該不活性ガスとして具体的には、ヘリウム、ネオン、アルゴン、クリプトン、キセノン、窒素ガスなどを例示することが出来る。安価な点で、窒素ガス又はアルゴンが好ましい。
1H NMR(500MHz,C6D6,δ/ppm):6.06(m,1H),5.09(m,1H),2.64(m,2H),1.79(s,3H),0.21(s,9H).
参考例2
1H NMR(400MHz,CDCl3,δ/ppm):4.85(t,J=2.1Hz,1H),2.47(d,J=2.1Hz,2H),1.70(s,3H),0.13(s,9H),0.08(s,9H).
参考例3
1H NMR(500MHz,C6D6,δ/ppm):2.39(q,J=7.3Hz,1H),1.81(s,3H),1.80(s,3H),1.74(s,3H),1.06(s,9H),0.98(d,J=7.3Hz,3H),0.15(s,6H).
実施例1
1H−NMR(400MHz,C6D6,δ/ppm)4.91(m,1H),4.68(br,1H),4.56(br,1H),4.17(br,1H),2.08(br,3H),1.59(s,3H),1.51(brs,2H),0.15(s,9H),0.01(br,2H).
13C−NMR(100MHz,C6D6,δ/ppm):93.4,87.4,79.1,74.4,72.2,70.4,38.0,35.8,30.5,22.9,14.2,0.16.
実施例2
1H−NMR(400MHz,C6D6,δ/ppm)4.46(br,1H),4.43(br,1H),4.08(br,1H),2.08(s,3H),2.05(s,3H)1.61(br,2H),1.57(s,3H),0.16(s,9H),−0.10(br,1H),−0.15(br,1H).
13C−NMR(100MHz,C6D6,δ/ppm):90.4,90.3,86.6,74.7,72.5,70.2,39.4,38.2,30.5,19.8,19.7,13.8,0.2.
実施例3
1H−NMR(400MHz,C6D6,δ/ppm)4.44(br,1H),4.34(br,1H),4.03(br,1H),3.43(br,1H),1.83(s,3H),1.37(br,3H),1.25(br,1H),0.94(br,3H),0.15(br,1H),−0.05(s,9H),−0.33(br,1H).
13C−NMR(100MHz,C6D6,δ/ppm):90.8,86.8,83.0,77.2,73.7,72.4,67.3,46.8,38.3,23.1,19.0,14.2,0.10.
実施例4
1H−NMR(400MHz,C6D6,δ/ppm)4.87(br,1H),4.60(br,1H),3.92(br,1H),3.30(m,2H),3.20(m,2H),2.57(m,4H),1.85(m,4H),1.24(s,3H),0.11(s,9H).
13C−NMR(100MHz,C6D6,δ/ppm):88.2,78.4,76.0,74.4,67.9,67.1,32.9,32.3,12.4,0.20.
実施例5
1H−NMR(400MHz,C6D6,δ/ppm)5.15(br,1H),4.57(br,1H),4.33(br,1H),3.30(br,2H),2.64(s,4H)1.18(s,3H),0.95(br,2H),0.10(s,9H).
13C−NMR(100MHz,C6D6,δ/ppm):85.8,75.8,74.8,72.1,55.0,44.3,28.9,28.5,12.4,0.2.
実施例6
1H−NMR(400MHz,C6D6,δ/ppm)4.60(br,1H),3.82(br,1H),2.08(s,3H),2.04(s,3H),1.71(br,1H),1.62(s,3H),1.59(br,1H),0.25(s,9H),0.23(s,9H),−0.17(br,1H),−0.26(br,1H).
13C−NMR(100MHz,C6D6,δ/ppm):116.5,113.0,90.3,89.7,77.6,65.6,62.2,40.0,36.1,18.6,17.9,10.0,0.99,0.50.
実施例7
1H−NMR(400MHz,C6D6,δ/ppm)1.92(s,6H),1.81(s,6H),1.79(s,6H),1.22(br,2H),1.01(s,9H),0.05(s,6H),−0.33(br,2H).
実施例8
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
X線が検出された。
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
ビス(エチルシクロペンタジエニル)コバルト(Co(η5−C5H4CH2CH3)2)を材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。成膜条件は以下の通りである。
1H−NMR(400MHz,C6D6,δ/ppm):6.39−6.42(m,1H),6.20−6.22(m,1H),5.22−5.24(m,1H),2.74(m,2H),0.19(s,9H).
参考例5
1H−NMR(400MHz,C6D6,δ/ppm):5.95(m,1H),5.20(m,1H),2.72(m,2H),1.96(brs,3H),0.20(s,9H).
参考例6
1H−NMR(400MHz,C6D6,δ/ppm):2.40(q,J=7.2Hz,1H),1.81(s,3H),1.79(s,3H),1.74(s,3H),0.98(d,J=7.2Hz,3H),0.20(s,9H).
実施例10
1H−NMR(400MHz,C6D6,δ):4.48(m,2H),4.16(m,2H),2.09(s,6H),1.80(brs,2H),0.14(s,9H),−0.21(brs,2H).
13C−NMR(100MHz,C6D6,δ):126.8,91.3,74.0,71.4,37.1,20.0,0.13.
実施例11
1H−NMR(400MHz,C6D6,δ):4.97(m,1H),4.73(m,1H),4.52(m,1H),4.17(m,1H),4.05(m,1H),2.08(s,3H),1.83(br,1H),1.72(br,1H),0.14(s,9H),−0.07(br,1H),−0.17(br,1H).
13C−NMR(100MHz,C6D6,δ):127.3,94.1,78.9,73.6,73.0,71.1,70.5,36.5,33.0,23.1,0.09.
実施例12
1H−NMR(400MHz,C6D6,δ):4.56−4.89(m,2H),4.00−4.24(m,2H),2.02(s,3H),1.79(br,1H),1.72(brs,4H),0.15(s,9H),−0.11(br,1H),−0.18(br,1H).
実施例13
1H−NMR(400MHz,C6D6,δ):4.33(m,1H),1.93(s,3H),1.90(s,3H),1.87(s,3H),1.73(s,3H),1.66(s,3H),1.41(m,1H),1.24(br,1H),0.14(brs,9H),−0.16(m,1H),−0.23(br,1H).
実施例14
1H−NMR(400MHz,C6D6,δ):4.68(br,1H),4.57(br,1H),3.55(br,1H),2.11(brs,3H),1.79(br,1H),1.74(br,1H),1.70(brs,3H),0.25(brs,18H),0.00(br,1H),−0.14(br,1H).
実施例15
1H−NMR(400MHz,C6D6,δ/ppm)4.97(m,1H),4.88(m,1H),4.80(m,1H),4.36(m,1H),4.02(m,1H),2.89(m,1H),2.71(m,1H),1.73(s,3H),1.68−1.78(m,2H),1.60−1.95(m,2H),0.15(s,9H).
実施例16
実施例11で合成した(η5−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例11で合成した(η5−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例1で合成した(η5−3−メチル−1−トリメチルシリルオキシシクロペンタジエニル)(η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例14で合成した[η5−1−メチル−2,3−ビス(トリメチルシリルオキシ)シクロペンタジエニル](η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例14で合成した[η5−1−メチル−2,3−ビス(トリメチルシリルオキシ)シクロペンタジエニル](η4−2−メチルブタ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例15で合成した(η5−1−メチル−3−トリメチルシリルオキシシクロペンタジエニル)(η4−シクロヘキサ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例15で合成した(η5−1−メチル−3−トリメチルシリルオキシシクロペンタジエニル)(η4−シクロヘキサ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例15で合成した(η5−1−メチル−3−トリメチルシリルオキシシクロペンタジエニル)(η4−シクロヘキサ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
実施例15で合成した(η5−1−メチル−3−トリメチルシリルオキシシクロペンタジエニル)(η4−シクロヘキサ−1,3−ジエン)コバルトを材料に用いてコバルト含有薄膜を熱CVD法により作製した。薄膜作製のために使用した装置の概略を図1に示した。薄膜作製条件は以下の通りである。
2 恒温槽
3 反応チャンバー
4 基板
5 反応ガス導入口
6 希釈ガス導入口
7 キャリアガス導入口
8 マスフローコントローラー
9 マスフローコントローラー
10 マスフローコントローラー
11 油回転式ポンプ
12 排気
Claims (9)
- 一般式(1)
- R3、R4及びR5が各々独立に水素原子又はメチル基である請求項1に記載のコバルト錯体。
- R6、R7及びR8が各々独立に炭素数1〜4のアルキル基である請求項1又は2に記載のコバルト錯体。
- 一般式(3)
- 一般式(1)
- 化学反応に基づく気相蒸着法が化学気相蒸着法である、請求項5に記載のコバルト含有薄膜の作製方法。
- 化学反応に基づく気相蒸着法において分解ガスを用いることを特徴とする、請求項5又は6に記載のコバルト含有薄膜の作製方法。
- 分解ガスとして還元性ガスを用いる、請求項7に記載のコバルト含有薄膜の作製方法。
- コバルト含有薄膜が金属コバルト薄膜である請求項5〜8のいずれかに記載のコバルト含有薄膜の作製方法。
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JP2016540753A (ja) * | 2013-11-19 | 2016-12-28 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッド | コバルト触媒並びにヒドロシリル化及び脱水素シリル化のためのそれらの使用 |
US9997362B2 (en) * | 2014-04-07 | 2018-06-12 | Entegris, Inc. | Cobalt CVD |
WO2015190420A1 (ja) | 2014-06-09 | 2015-12-17 | 東ソー株式会社 | コバルト錯体及びその製造方法、コバルト含有薄膜及びその作製方法 |
JP6824189B2 (ja) * | 2014-12-19 | 2021-02-03 | ダウ シリコーンズ コーポレーション | 配位子成分、関連する反応生成物、活性化反応生成物、ヒドロシリル化触媒、及び配位子成分を含むヒドロシリル化硬化性組成物、及びそれを調製するための関連する方法 |
JP6501544B2 (ja) * | 2015-02-10 | 2019-04-17 | 東ソー株式会社 | 第4族金属錯体、その製造方法、第4族金属含有薄膜の作製方法 |
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CN108473521B (zh) | 2021-03-12 |
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WO2017104619A1 (ja) | 2017-06-22 |
US10336782B2 (en) | 2019-07-02 |
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