JP6803018B2 - ガラス用エッチング液およびガラス基板製造方法 - Google Patents
ガラス用エッチング液およびガラス基板製造方法 Download PDFInfo
- Publication number
- JP6803018B2 JP6803018B2 JP2019039390A JP2019039390A JP6803018B2 JP 6803018 B2 JP6803018 B2 JP 6803018B2 JP 2019039390 A JP2019039390 A JP 2019039390A JP 2019039390 A JP2019039390 A JP 2019039390A JP 6803018 B2 JP6803018 B2 JP 6803018B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- glass
- glass substrate
- etching solution
- planned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005530 etching Methods 0.000 title claims description 258
- 239000011521 glass Substances 0.000 title claims description 136
- 239000000758 substrate Substances 0.000 title claims description 78
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 42
- 239000003112 inhibitor Substances 0.000 claims description 35
- 238000012986 modification Methods 0.000 claims description 29
- 230000004048 modification Effects 0.000 claims description 28
- 239000008139 complexing agent Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000007795 chemical reaction product Substances 0.000 claims description 2
- 239000002585 base Substances 0.000 description 36
- 239000000463 material Substances 0.000 description 36
- 239000004973 liquid crystal related substance Substances 0.000 description 30
- 238000005520 cutting process Methods 0.000 description 15
- 238000012545 processing Methods 0.000 description 14
- 239000010408 film Substances 0.000 description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 12
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000002253 acid Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 8
- 238000001039 wet etching Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 239000007921 spray Substances 0.000 description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 238000005553 drilling Methods 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 239000000908 ammonium hydroxide Substances 0.000 description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 4
- 239000004327 boric acid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000002407 reforming Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- XROWMBWRMNHXMF-UHFFFAOYSA-J titanium tetrafluoride Chemical compound [F-].[F-].[F-].[F-].[Ti+4] XROWMBWRMNHXMF-UHFFFAOYSA-J 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 229910017855 NH 4 F Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- MBAKFIZHTUAVJN-UHFFFAOYSA-I hexafluoroantimony(1-);hydron Chemical compound F.F[Sb](F)(F)(F)F MBAKFIZHTUAVJN-UHFFFAOYSA-I 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Surface Treatment Of Glass (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019039390A JP6803018B2 (ja) | 2019-03-05 | 2019-03-05 | ガラス用エッチング液およびガラス基板製造方法 |
PCT/JP2020/003902 WO2020179312A1 (ja) | 2019-03-05 | 2020-02-03 | ガラス用エッチング液およびガラス基板製造方法 |
CN202080032093.XA CN113767075B (zh) | 2019-03-05 | 2020-02-03 | 玻璃用蚀刻液及玻璃基板制造方法 |
TW109104688A TWI832970B (zh) | 2019-03-05 | 2020-02-14 | 玻璃用蝕刻液及玻璃基板製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019039390A JP6803018B2 (ja) | 2019-03-05 | 2019-03-05 | ガラス用エッチング液およびガラス基板製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020155033A Division JP7251704B2 (ja) | 2020-09-16 | 2020-09-16 | ガラス用エッチング液およびガラス基板製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020142941A JP2020142941A (ja) | 2020-09-10 |
JP6803018B2 true JP6803018B2 (ja) | 2020-12-23 |
Family
ID=72337377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019039390A Active JP6803018B2 (ja) | 2019-03-05 | 2019-03-05 | ガラス用エッチング液およびガラス基板製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6803018B2 (zh) |
CN (1) | CN113767075B (zh) |
TW (1) | TWI832970B (zh) |
WO (1) | WO2020179312A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6840403B2 (ja) * | 2019-05-24 | 2021-03-10 | 株式会社Nsc | 平面ガラスアンテナおよびその製造方法 |
CN112777941A (zh) * | 2021-01-13 | 2021-05-11 | 赣州帝晶光电科技有限公司 | 一种ag防眩玻璃蚀刻工艺制备方法 |
KR102596623B1 (ko) * | 2021-10-01 | 2023-11-01 | 주식회사 에스이에이 | 반응 속도 조절이 가능한 기판 식각 장치 |
CN115432919A (zh) * | 2022-10-25 | 2022-12-06 | 深圳市益铂晶科技有限公司 | 一种玻璃激光切割的浸蚀裂片方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW434196B (en) * | 1997-06-25 | 2001-05-16 | Ibm | Selective etching of silicate |
FR2832706B1 (fr) * | 2001-11-28 | 2004-07-23 | Saint Gobain | Substrat transparent muni d'une electrode |
JP2005179132A (ja) * | 2003-12-22 | 2005-07-07 | Nishiyama Stainless Chem Kk | ガラスエッチング液、ガラスエッチング方法、フラットパネルディスプレイ用ガラス基板及びフラットパネルディスプレイ |
US20070256703A1 (en) * | 2006-05-03 | 2007-11-08 | Asahi Glass Company, Limited | Method for removing contaminant from surface of glass substrate |
JP2008041676A (ja) * | 2006-08-01 | 2008-02-21 | Fuji Electric Holdings Co Ltd | シリコン半導体基板のエッチング方法とこの方法に用いるエッチング装置 |
JP2011178642A (ja) * | 2010-03-03 | 2011-09-15 | Nippon Sheet Glass Co Ltd | 貫通電極付きガラス板の製造方法および電子部品 |
JP6077756B2 (ja) * | 2012-04-06 | 2017-02-08 | 株式会社フジクラ | 微細構造体の形成方法 |
KR101908575B1 (ko) * | 2013-04-01 | 2018-10-17 | 호야 칸데오 옵트로닉스 가부시키가이샤 | 근적외선 흡수 유리 및 그 제조 방법 |
TWI705946B (zh) * | 2014-09-05 | 2020-10-01 | 美商康寧公司 | 玻璃物品及改善玻璃物品可靠性的方法 |
TW201704177A (zh) * | 2015-06-10 | 2017-02-01 | 康寧公司 | 蝕刻玻璃基板的方法及玻璃基板 |
JP2018049199A (ja) * | 2016-09-23 | 2018-03-29 | Hoya株式会社 | 局所ウェットエッチング装置及びフォトマスク用基板の製造方法 |
JP6519045B2 (ja) * | 2017-05-24 | 2019-05-29 | 株式会社Nsc | ガラスパネル製造方法および液晶パネル製造方法 |
WO2018216712A1 (ja) * | 2017-05-24 | 2018-11-29 | 株式会社Nsc | 透明性薄膜付ガラスパネル製造方法、透明性薄膜付液晶パネル製造方法、ガラスパネル製造方法、および液晶パネル製造方法 |
-
2019
- 2019-03-05 JP JP2019039390A patent/JP6803018B2/ja active Active
-
2020
- 2020-02-03 WO PCT/JP2020/003902 patent/WO2020179312A1/ja active Application Filing
- 2020-02-03 CN CN202080032093.XA patent/CN113767075B/zh active Active
- 2020-02-14 TW TW109104688A patent/TWI832970B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2020179312A1 (ja) | 2020-09-10 |
CN113767075B (zh) | 2023-11-03 |
JP2020142941A (ja) | 2020-09-10 |
TW202043441A (zh) | 2020-12-01 |
CN113767075A (zh) | 2021-12-07 |
TWI832970B (zh) | 2024-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6803018B2 (ja) | ガラス用エッチング液およびガラス基板製造方法 | |
CN106132627B (zh) | 用于对脆性材料进行划割并随后进行化学蚀刻的方法和系统 | |
TW201936309A (zh) | 複合材之斷開方法 | |
US20090013724A1 (en) | Glass Processing Method Using Laser and Processing Device | |
US20210114925A1 (en) | Crack-free glass substrate cutting and thinning method | |
JP6911288B2 (ja) | ガラスの加工方法 | |
JP2005219960A (ja) | ガラスの切断分離方法、フラットパネルディスプレイ用ガラス基板、フラットパネルディスプレイ | |
JP5942558B2 (ja) | 微小空洞形成方法 | |
WO2018216712A1 (ja) | 透明性薄膜付ガラスパネル製造方法、透明性薄膜付液晶パネル製造方法、ガラスパネル製造方法、および液晶パネル製造方法 | |
JP2014069981A (ja) | 基板加工装置及び基板加工方法 | |
JP7251704B2 (ja) | ガラス用エッチング液およびガラス基板製造方法 | |
JP7176695B2 (ja) | ガラス基板製造方法 | |
JP6519045B2 (ja) | ガラスパネル製造方法および液晶パネル製造方法 | |
JP2019109411A (ja) | 液晶パネル製造方法 | |
JP6501093B1 (ja) | 透明性薄膜付ガラスパネル製造方法および透明性薄膜付液晶パネル製造方法 | |
CN112105984B (zh) | 液晶面板制造方法 | |
JP2019120738A (ja) | 液晶パネル製造方法 | |
JP2010005629A (ja) | Si基板のレーザ加工方法 | |
JP6519044B2 (ja) | 液晶パネル製造方法 | |
WO2018135565A1 (ja) | 液晶パネル製造方法 | |
JP6534105B2 (ja) | 液晶パネル製造方法 | |
JP7058870B2 (ja) | 液晶パネル製造方法 | |
KR20240108694A (ko) | 타일링용 디스플레이 패널 제조를 위한 절단 방법 | |
JP2021011406A (ja) | ガラス構造体およびその製造方法 | |
JP2019159178A (ja) | 液晶パネルおよび液晶パネル製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190417 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200203 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20200203 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20200212 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200317 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200515 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200721 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200910 |
|
C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20200910 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20200923 |
|
C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20200928 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201117 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201117 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6803018 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |