JP6802234B2 - レーザ発振器の監視制御システム - Google Patents
レーザ発振器の監視制御システム Download PDFInfo
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
- H01S3/1305—Feedback control systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/30—Testing of optical devices, constituted by fibre optics or optical waveguides
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
- H01S3/067—Fibre lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
- H01S3/131—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
- H01S3/1312—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation by controlling the optical pumping
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0014—Monitoring arrangements not otherwise provided for
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Description
なお、ビーム分配器8のミラーに汚れや傷などの異常がある場合にも、同様に、散乱光強度が上がり、クリーニング等が必要であることが分かる。
このため、図3及び図4に示すように、第一の閾値S2と第二の閾値S3は、a×レーザ出力指令+bとして定めてもよい。すなわち、標準散乱光強度(標準指令値):S(PC)を初期状態で求め、△Sa(PC)=S(PC)+(a1×PC+b1)、△Sb(PC)=S(PC)−(a2×PC+b2)、a1,a2≧0、b1,b2≧0として、第一の閾値S2と第二の閾値S3をそれぞれ設定してもよい。
上記のように設定を行えば、第三の閾値を超えることをなくすことができる。
2 レーザキャビティ(LC)
3 フィードファイバ
4 ビームコンバイナ
5 プロセスファイバ
6 加工ヘッド
7 カプラ
8 ビーム分配器
9 CNC(コンピュータ数値制御装置)
10 フォトダイオード(散乱光検出部)
11 レンズ
12 レンズ
20 散乱光検出部
21 制御部
22 正常散乱光算出部
23 第一の閾値設定部
24 第二の閾値設定部
25 第三の閾値設定部
26 警告部
27 レーザ出力抑制部
A レーザ発振器(ファイバレーザ発振器)
B レーザ発振器の監視制御システム
S1 正常指標値
S2 第一の閾値
S3 第二の閾値
S4 第三の閾値
Claims (7)
- ファイバレーザ発振器のプロセスファイバの入力端面での散乱光強度を検出する散乱光検出部と、
コンピュータ数値制御装置からのレーザ出力指令値、及び前記散乱光検出部の検出結果に基づいてレーザ出力値を制御する制御部と、
正常時の前記レーザ出力指令値と前記散乱光強度との関係を示す正常指標値を求める正常散乱光算出部と、
前記プロセスファイバの入力端面における汚れ及び/又は傷に起因した異常時の前記レーザ出力指令値と前記散乱光強度との関係を示す第一の閾値を前記正常指標値よりも大きい値に設定する第一の閾値設定部と、
前記プロセスファイバの入力端面に向けて集光するレンズと前記プロセスファイバのコアとの光軸ずれに起因した異常時の前記レーザ出力指令値と前記散乱光強度との関係を示す第二の閾値を前記正常指標値よりも小さい値に設定する第二の閾値設定部と、
部品が破損するレベルの異常時の前記散乱光強度を示す第三の閾値を前記第一の閾値以上の値に設定する第三の閾値設定部と、を備え、
前記制御部が、前記散乱光検出部で検出した前記散乱光強度と、前記第一の閾値、前記第二の閾値、前記第三の閾値とに基づいてレーザ出力値を制御するように構成されている、レーザ発振器の監視制御システム。 - 前記第一の閾値を上回る前記散乱光強度が検出された場合と、前記第二の閾値を下回る前記散乱光強度が検出された場合と、前記第三の閾値に達する前記散乱光強度が検出された場合に、それぞれ警告を発する警告部を備える、請求項1に記載のレーザ発振器の監視制御システム。
- 前記第一の閾値設定部は、前記正常指標値の前記散乱光強度に、第1の正の定数である散乱光強度値を加えて前記第一の閾値を設定し、
前記第二の閾値設定部は、前記正常指標値の前記散乱光強度に、第2の正の定数である散乱光強度値を差し引いて前記第二の閾値を設定する、請求項1または請求項2に記載のレーザ発振器の監視制御システム。 - 前記レーザ出力指令値と前記散乱光強度との関係において、前記正常指標値の前記散乱光強度をS(PC)、レーザ出力指令値をPCとし、a1、a2、b1、b2を正の定数としたとき、
前記第一の閾値設定部は、前記第一の閾値をS(PC)+(a1×S(PC)+b1)として設定し、
前記第二の閾値設定部は、前記第二の閾値をS(PC)−(a2×S(PC)+b2)として設定する、請求項1または請求項2に記載のレーザ発振器の監視制御システム。 - 前記レーザ出力指令値と前記散乱光強度との関係において、前記第一の閾値に達するときの前記散乱光強度をS(PCF)、前記第一の閾値に達するときのレーザ出力指令値をPCFとしたとき、
前記散乱光強度が前記第一の閾値を超えた場合に、警告を発するとともに、最大レーザ出力指令値のクランプ指令値M1を、PCF×(前記第三の閾値/S(PCF))で求まるクランプ指令値M2に引き下げて設定するレーザ出力抑制部を備える、請求項1から請求項4のいずれか一項に記載のレーザ発振器の監視制御システム。 - 前記レーザ出力指令値と前記散乱光強度との関係において、定格の最大レーザ出力指令値(PCM)での前記第一の閾値と一致するように、前記第三の閾値が設定されている、請求項1から請求項5のいずれか一項に記載のレーザ発振器の監視制御システム。
- 前記クランプ指令値M1が定格の最大レーザ出力指令値(PCM)で設定されている、請求項5または請求項6に記載のレーザ発振器の監視制御システム。
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JP2018193255A JP6802234B2 (ja) | 2018-10-12 | 2018-10-12 | レーザ発振器の監視制御システム |
CN201910959473.7A CN111048979B (zh) | 2018-10-12 | 2019-10-10 | 激光振荡器的监视控制系统 |
US16/598,944 US11081854B2 (en) | 2018-10-12 | 2019-10-10 | Laser oscillator monitoring control system |
DE102019215633.9A DE102019215633B4 (de) | 2018-10-12 | 2019-10-11 | Laseroszillatorüberwachungssteuersystem |
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JP (1) | JP6802234B2 (ja) |
CN (1) | CN111048979B (ja) |
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US20220123515A1 (en) * | 2019-02-27 | 2022-04-21 | Fujikura Ltd. | Laser device |
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WO2022030408A1 (ja) | 2020-08-07 | 2022-02-10 | 株式会社アマダ | レーザ発振器、レーザ加工機、及び誘導ラマン散乱抑制方法 |
JP7333772B2 (ja) * | 2020-08-31 | 2023-08-25 | 三菱電機株式会社 | ガスレーザ装置 |
CN114764190B (zh) * | 2021-01-11 | 2024-02-09 | 深圳市大族数控科技股份有限公司 | 激光加工设备自动校正方法及计算机设备 |
CN113790783A (zh) * | 2021-09-16 | 2021-12-14 | 四川蜀羊防水材料有限公司 | 一种沥青卷材产品厚度和重量控制方法及系统 |
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US20220123515A1 (en) * | 2019-02-27 | 2022-04-21 | Fujikura Ltd. | Laser device |
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CN111048979B (zh) | 2024-02-20 |
US11081854B2 (en) | 2021-08-03 |
US20200119515A1 (en) | 2020-04-16 |
DE102019215633B4 (de) | 2024-05-29 |
CN111048979A (zh) | 2020-04-21 |
DE102019215633A1 (de) | 2020-04-16 |
JP2020061512A (ja) | 2020-04-16 |
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