JP6797911B2 - スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 - Google Patents

スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 Download PDF

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JP6797911B2
JP6797911B2 JP2018522424A JP2018522424A JP6797911B2 JP 6797911 B2 JP6797911 B2 JP 6797911B2 JP 2018522424 A JP2018522424 A JP 2018522424A JP 2018522424 A JP2018522424 A JP 2018522424A JP 6797911 B2 JP6797911 B2 JP 6797911B2
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group
parts
resin
atom
chemically amplified
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JPWO2017212963A1 (ja
Inventor
祐作 高嶋
祐作 高嶋
拓人 中尾
拓人 中尾
秀基 木村
秀基 木村
智幸 柴垣
智幸 柴垣
篤志 白石
篤志 白石
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San Apro KK
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San Apro KK
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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C381/00Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
    • C07C381/12Sulfonium compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols
    • C08K5/375Thiols containing six-membered aromatic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/18Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2018522424A 2016-06-09 2017-05-29 スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 Active JP6797911B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016115210 2016-06-09
JP2016115210 2016-06-09
PCT/JP2017/019855 WO2017212963A1 (fr) 2016-06-09 2017-05-29 Sel de sulfonium, générateur de photo-acide, composition curable et composition de résistance.

Publications (2)

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JPWO2017212963A1 JPWO2017212963A1 (ja) 2019-04-04
JP6797911B2 true JP6797911B2 (ja) 2020-12-09

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JP2018522424A Active JP6797911B2 (ja) 2016-06-09 2017-05-29 スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物

Country Status (3)

Country Link
JP (1) JP6797911B2 (fr)
KR (1) KR102272225B1 (fr)
WO (1) WO2017212963A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107698477B (zh) * 2016-08-08 2020-05-12 常州强力电子新材料股份有限公司 一种新型阳离子型光引发剂及其制备方法和应用
WO2019208443A1 (fr) * 2018-04-23 2019-10-31 住友ベークライト株式会社 Composition de résine photosensible pour films de protection contre les chocs, dispositif à semi-conducteur, procédé de fabrication de dispositif à semi-conducteur, et dispositif électronique
JP7174044B2 (ja) * 2018-05-25 2022-11-17 サンアプロ株式会社 スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物
JP7230383B2 (ja) * 2018-09-13 2023-03-01 株式会社レゾナック 感光性樹脂組成物、感光性フィルム、デバイス及びレジストパターンの形成方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1516512A (en) 1974-05-02 1978-07-05 Gen Electric Chalcogenium salts
JP2742594B2 (ja) 1988-12-29 1998-04-22 広栄化学工業株式会社 光重合触媒およびそれを含有する硬化性組成物
JPH09118663A (ja) 1995-08-22 1997-05-06 Nippon Soda Co Ltd 新規スルホニウム塩化合物、重合開始剤、該化合物を含有する硬化性組成物および硬化方法
DK199901098A (da) 1998-08-18 2000-02-19 Ciba Sc Holding Ag Sylfonyloximer til i-linie-fotoresists med høj følsomhed og høj resisttykkelse
JP2008077057A (ja) 2006-08-21 2008-04-03 Jsr Corp 感光性絶縁樹脂組成物及びその硬化物並びにそれを備える電子部品
JPWO2008117619A1 (ja) 2007-03-26 2010-07-15 Jsr株式会社 感光性絶縁樹脂組成物
JP5367572B2 (ja) * 2007-08-07 2013-12-11 株式会社Adeka 芳香族スルホニウム塩化合物
JP5208573B2 (ja) * 2008-05-06 2013-06-12 サンアプロ株式会社 スルホニウム塩、光酸発生剤、光硬化性組成物及びこの硬化体
JP5576139B2 (ja) 2009-02-20 2014-08-20 サンアプロ株式会社 スルホニウム塩,光酸発生剤,光硬化性組成物,及びその硬化体
US8980968B2 (en) * 2010-02-05 2015-03-17 Canon Kabushiki Kaisha Photosensitive resin composition, method for producing structure, and liquid discharge head
JP2011201803A (ja) 2010-03-25 2011-10-13 San Apro Kk オニウムボレート塩、光酸発生剤及び感光性樹脂組成物
JP5787720B2 (ja) * 2010-12-16 2015-09-30 キヤノン株式会社 感光性ネガ型樹脂組成物
JP6120574B2 (ja) * 2012-01-31 2017-04-26 キヤノン株式会社 感光性ネガ型樹脂組成物、微細構造体、微細構造体の製造方法及び液体吐出ヘッド
JP2014205624A (ja) * 2013-04-11 2014-10-30 サンアプロ株式会社 オニウムボレート塩系酸発生剤

Also Published As

Publication number Publication date
KR20190017757A (ko) 2019-02-20
JPWO2017212963A1 (ja) 2019-04-04
WO2017212963A1 (fr) 2017-12-14
KR102272225B1 (ko) 2021-07-01

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