JP6792554B2 - 研磨砥粒、研磨スラリーおよび硬脆材の研磨方法、ならびに硬脆材の製造方法 - Google Patents

研磨砥粒、研磨スラリーおよび硬脆材の研磨方法、ならびに硬脆材の製造方法 Download PDF

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Publication number
JP6792554B2
JP6792554B2 JP2017524834A JP2017524834A JP6792554B2 JP 6792554 B2 JP6792554 B2 JP 6792554B2 JP 2017524834 A JP2017524834 A JP 2017524834A JP 2017524834 A JP2017524834 A JP 2017524834A JP 6792554 B2 JP6792554 B2 JP 6792554B2
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Japan
Prior art keywords
polishing
particles
alumina
abrasive grains
brittle material
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JP2017524834A
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English (en)
Japanese (ja)
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JPWO2016204248A1 (ja
Inventor
哲平 梶野
哲平 梶野
裕謙 尾崎
裕謙 尾崎
譲 齋藤
譲 齋藤
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2017524834A 2015-06-18 2016-06-16 研磨砥粒、研磨スラリーおよび硬脆材の研磨方法、ならびに硬脆材の製造方法 Active JP6792554B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015123152 2015-06-18
JP2015123152 2015-06-18
PCT/JP2016/067994 WO2016204248A1 (ja) 2015-06-18 2016-06-16 研磨砥粒、研磨スラリーおよび硬脆材の研磨方法、ならびに硬脆材の製造方法

Publications (2)

Publication Number Publication Date
JPWO2016204248A1 JPWO2016204248A1 (ja) 2018-05-24
JP6792554B2 true JP6792554B2 (ja) 2020-11-25

Family

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JP2017524834A Active JP6792554B2 (ja) 2015-06-18 2016-06-16 研磨砥粒、研磨スラリーおよび硬脆材の研磨方法、ならびに硬脆材の製造方法

Country Status (3)

Country Link
JP (1) JP6792554B2 (zh)
TW (1) TW201711798A (zh)
WO (1) WO2016204248A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102425278B1 (ko) * 2018-05-16 2022-07-27 닛폰세이테츠 가부시키가이샤 도금 강재

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4595383B2 (ja) * 2003-05-19 2010-12-08 住友化学株式会社 微粒αアルミナの製造法
JP2007055888A (ja) * 2005-07-25 2007-03-08 Sumitomo Chemical Co Ltd 微粒αアルミナ
UA99909C2 (ru) * 2007-01-15 2012-10-25 Сейнт-Гобейн Серамикс Энд Пластик, Инк. Керамический зернистый материал и способ его получения
SG185033A1 (en) * 2010-04-28 2012-11-29 Baikowski Japan Co Ltd Sapphire polishing slurry and sapphire polishing method
TWI605112B (zh) * 2011-02-21 2017-11-11 Fujimi Inc 研磨用組成物
KR101593357B1 (ko) * 2012-04-10 2016-02-11 스미또모 가가꾸 가부시끼가이샤 알루미나의 제조 방법

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JPWO2016204248A1 (ja) 2018-05-24
TW201711798A (zh) 2017-04-01
WO2016204248A1 (ja) 2016-12-22

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