JP6789945B2 - クロストーク低減のためのグランドビアのクラスタ化 - Google Patents

クロストーク低減のためのグランドビアのクラスタ化 Download PDF

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Publication number
JP6789945B2
JP6789945B2 JP2017530112A JP2017530112A JP6789945B2 JP 6789945 B2 JP6789945 B2 JP 6789945B2 JP 2017530112 A JP2017530112 A JP 2017530112A JP 2017530112 A JP2017530112 A JP 2017530112A JP 6789945 B2 JP6789945 B2 JP 6789945B2
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package substrate
ground
package
vias
interconnect structure
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Japanese (ja)
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JP2017539090A (ja
JP2017539090A5 (enExample
Inventor
チェン，ジグオ
アユグン，ケマル
ジャン，ユー
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インテル コーポレイション
インテル コーポレイション
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Priority claimed from US14/575,956 external-priority patent/US9230900B1/en
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Publication of JP2017539090A5 publication Critical patent/JP2017539090A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP2017530112A 2014-12-18 2015-12-03 クロストーク低減のためのグランドビアのクラスタ化 Active JP6789945B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US14/575,956 2014-12-18
US14/575,956 US9230900B1 (en) 2014-12-18 2014-12-18 Ground via clustering for crosstalk mitigation
US14/943,880 2015-11-17
US14/943,880 US9515017B2 (en) 2014-12-18 2015-11-17 Ground via clustering for crosstalk mitigation
PCT/US2015/063822 WO2016099936A1 (en) 2014-12-18 2015-12-03 Ground via clustering for crosstalk mitigation

Publications (3)

Publication Number Publication Date
JP2017539090A JP2017539090A (ja) 2017-12-28
JP2017539090A5 JP2017539090A5 (enExample) 2018-12-27
JP6789945B2 true JP6789945B2 (ja) 2020-11-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017530112A Active JP6789945B2 (ja) 2014-12-18 2015-12-03 クロストーク低減のためのグランドビアのクラスタ化

Country Status (7)

Country Link
US (8) US9515017B2 (enExample)
EP (5) EP4220709B1 (enExample)
JP (1) JP6789945B2 (enExample)
KR (3) KR102669054B1 (enExample)
CN (4) CN119560479A (enExample)
SG (1) SG11201704038WA (enExample)
WO (1) WO2016099936A1 (enExample)

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Also Published As

Publication number Publication date
EP3951867A1 (en) 2022-02-09
US20240105572A1 (en) 2024-03-28
CN119560479A (zh) 2025-03-04
EP3483932B1 (en) 2021-01-13
US12482733B2 (en) 2025-11-25
EP3799118A2 (en) 2021-03-31
US11901280B2 (en) 2024-02-13
CN107004668B (zh) 2020-05-19
EP3234993B1 (en) 2021-05-26
CN107004668A (zh) 2017-08-01
KR20240093805A (ko) 2024-06-24
EP3234993A1 (en) 2017-10-25
KR102863843B1 (ko) 2025-09-23
US20220130742A1 (en) 2022-04-28
US20180315688A1 (en) 2018-11-01
JP2017539090A (ja) 2017-12-28
SG11201704038WA (en) 2017-07-28
US20160181189A1 (en) 2016-06-23
EP3234993A4 (en) 2018-08-08
US20190333848A1 (en) 2019-10-31
US10854539B2 (en) 2020-12-01
US11742275B2 (en) 2023-08-29
KR102669054B1 (ko) 2024-05-23
US10396022B2 (en) 2019-08-27
US11244890B2 (en) 2022-02-08
EP3799118B1 (en) 2025-09-24
EP3951867B1 (en) 2025-09-24
EP3483932A3 (en) 2019-08-28
EP3483932A2 (en) 2019-05-15
KR20230021764A (ko) 2023-02-14
US10026682B2 (en) 2018-07-17
WO2016099936A1 (en) 2016-06-23
CN110085567B (zh) 2025-01-07
US9515017B2 (en) 2016-12-06
US20210057321A1 (en) 2021-02-25
EP3799118A3 (en) 2021-10-06
CN119560478A (zh) 2025-03-04
EP4220709A3 (en) 2023-08-09
CN110085567A (zh) 2019-08-02
KR102494739B1 (ko) 2023-02-01
US20230014579A1 (en) 2023-01-19
EP4220709A2 (en) 2023-08-02
US20170148714A1 (en) 2017-05-25
KR20170097005A (ko) 2017-08-25
EP4220709B1 (en) 2025-01-29

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